CN105072873B - Electronic installation - Google Patents

Electronic installation Download PDF

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Publication number
CN105072873B
CN105072873B CN201510506079.XA CN201510506079A CN105072873B CN 105072873 B CN105072873 B CN 105072873B CN 201510506079 A CN201510506079 A CN 201510506079A CN 105072873 B CN105072873 B CN 105072873B
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CN
China
Prior art keywords
fin
flow
electronic installation
fan
air
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Application number
CN201510506079.XA
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Chinese (zh)
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CN105072873A (en
Inventor
林奇成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qisda Optronics Suzhou Co Ltd
Qisda Corp
Original Assignee
Qisda Optronics Suzhou Co Ltd
Qisda Corp
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Priority to CN201510506079.XA priority Critical patent/CN105072873B/en
Publication of CN105072873A publication Critical patent/CN105072873A/en
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Publication of CN105072873B publication Critical patent/CN105072873B/en
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00Projectors or projection-type viewers; Accessories therefor
    • G03B21/14Details
    • G03B21/16Cooling; Preventing overheating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures

Abstract

The present invention provides a kind of electronic installation, can promote heat dissipation, comprising:Thermal source, at least one fin, fan and diversion member;At least one fin is arranged at around the thermal source, and at least one fin respectively has multiple radiating fins, wherein forming multiple ventilating ducts between the plurality of radiating fin;The fan to should at least one fin set, to provide the air-flow vertical with the plurality of ventilating duct;The diversion member to should fan set, the air-flow is imported into the plurality of ventilating duct in the way of the plurality of ventilating duct of out of plumb.

Description

Electronic installation
Technical field
The present invention is on a kind of projection arrangement, especially with respect to a kind of electricity with high efficiency Natural Heat Convection mechanism Sub-device.
Background technology
The power of projector, because the requirement of brightness is done bigger and bigger, and the efficiency of light emitting diode fails relative lifting, i.e., It is that in the case of smaller power, existing product all needs to do forced heat radiation with fan, and in the case of power increase, heat The problem of effect, is just even more serious.
When the use power of light emitting diode is increasing, its heating efficiency will also be increased with using power.It is right For general small projector, because three colors (R/G/B) light source is usually placed in three sides of light hydrid component, cause small-sized The integral heat sink efficiency of projector will also be affected because of the limitation in space.
Therefore, how effective radiating effectively is reached using inner space, inner member configuration, so that projection arrangement still may be used Run well the important issue without anxiety, actually projection arrangement heat dissipation design.
The content of the invention
It is an object of the invention to provide a kind of electronic installation, to promote heat dissipation.
In a first aspect, the present invention provides a kind of electronic installation, comprising:Thermal source, at least one fin, fan and water conservancy diversion Element;At least one fin is arranged at around the thermal source, and at least one fin respectively has multiple radiating fins, wherein Multiple ventilating ducts are formed between the plurality of radiating fin;The fan to should at least one fin set, with provide it is many with this The vertical air-flow of individual ventilating duct;The diversion member to should fan set, by the air-flow with the plurality of ventilating duct of out of plumb Mode imports the plurality of ventilating duct.
Preferably, the fan sucks the air-flow from outside the electronic installation, and to be inhaled parallel to the direction of the plurality of ventilating duct Enter the air-flow and provide the air-flow to the diversion member.
It is each provided with preferably, the diversion member is included in multiple flow deflectors, the plurality of ventilating duct in the plurality of flow deflector At least one flow deflector, and the plurality of flow deflector is respectively coupled to the plurality of heat radiating fin adjacent with the plurality of ventilating duct of correspondence Piece.
Preferably, the diversion member additionally comprises a connecting piece, the plurality of flow deflector be connected to the same side of the connection sheet and It is arranged at intervals.
Preferably, the plurality of ventilating duct at least one be provided with least two water conservancy diversion in the plurality of flow deflector Piece, the wind direction of at least two flow deflectors along the fan is stepped to be set.
Preferably, the diversion member is arc flow deflector, and there are the arc flow deflector multiple coupling aperture to be respectively coupled to The plurality of radiating fin of the plurality of fin.
Preferably, the electronic installation is projection arrangement, and the thermal source is optical-mechanical system.
Preferably, the diversion member couples at least one fin, the air-flow is set to enter the plurality of with 45 degree of angular direction Ventilating duct.
Preferably, also including:Housing, the housing has top plate and bottom plate, and the top plate has multiple top air vents, and the bottom Plate has multiple bottom air vents;Via the plurality of ventilating duct, accordingly straight line connects the plurality of bottom ventilation to the plurality of top air vent Hole.
Preferably, the fan is arranged at the opposite side of at least one fin.
Compared with prior art, the electronic installation that the present invention is provided, it is by fan and conducting element so that air-flow is with optimal The ventilating duct that the angle of change enters between radiating fin, and then enhance heat dissipation.
Brief description of the drawings
Figure 1A is the stereogram of the projection arrangement of one embodiment of the invention;
Figure 1B does not illustrate the explosive view of side plate for the projection arrangement shown in Figure 1A;
Fig. 1 C do not illustrate the top view of top plate for the projection arrangement shown in Figure 1A;
Fig. 2A is the configuration schematic diagram of the top plate, bottom plate and fin of the projection arrangement shown in Figure 1A;
Fig. 2 B are the schematic diagram of the optical-mechanical system of the projection arrangement shown in Figure 1A;
Fig. 3 A have the partial schematic diagram of thermal insulation barriers for the top plate of one embodiment of the invention;
Fig. 3 B and Fig. 3 C are arranged at the side view of the not be the same as Example on top plate for the thermal insulation barriers shown in Fig. 3 A;
Fig. 4 A do not illustrate the schematic diagram of top plate and side plate for the projection arrangement of another embodiment of the present invention;
Fig. 4 B are the explosive view of the projection arrangement shown in Fig. 4 A;
Fig. 5 A do not illustrate the schematic diagram of top plate and side plate for the projection arrangement of another embodiment of the present invention;
Fig. 5 B are the side schematic view of the subelement of the projection arrangement shown in Fig. 5 A;
Fig. 6 does not illustrate the schematic diagram of top plate and side plate for the projection arrangement of another embodiment of the present invention;
Fig. 7 A do not illustrate the schematic diagram of top plate and side plate for the projection arrangement of another embodiment of the present invention;
Fig. 7 B do not illustrate the top view of bottom plate for the projection arrangement shown in Fig. 7 A;
Fig. 8 A and Fig. 8 B are the top view and schematic side view of the projection arrangement of another embodiment of the present invention;
Fig. 9 A to Fig. 9 C are the configuration schematic diagram of the diversion member of different embodiments of the invention;
Figure 10 is the schematic diagram of the diversion member of another embodiment of the present invention;
Figure 11 A and Figure 11 B are the schematic diagram and configuration schematic diagram of the diversion member of another embodiment of the present invention;
Figure 12 is the schematic diagram of the electronic installation of one embodiment of the invention.
Embodiment
To make to have further understanding to the purpose of the present invention, construction, feature and its function, hereby coordinate embodiment detailed It is described as follows.
A kind of projection arrangement of present invention offer, especially a kind of projection arrangement of the heat dissipation design with free convection, with Reduction rotation speed of the fan or even release use fan, and then reduce noise lifting operation quality.Furthermore, projection arrangement of the invention With optimized circuit board arrangement to reduce fuel factor influence, also using the cooperation of metal heat-conducting piece and fin to be lifted Heat dissipation.In addition, the present invention also provides a kind of electronic installation, it is by fan and conducting element so that air-flow is with optimized The ventilating duct that angle enters between radiating fin, to promote heat dissipation.The projection dress of the present invention is described in detail in rear reference schema Put and electronic installation embodiment.
Figure 1A is the stereogram of the projection arrangement of one embodiment of the invention;Figure 1B is that the projection arrangement shown in Figure 1A is not illustrated The explosive view of side plate;Fig. 1 C do not illustrate the top view of top plate for the projection arrangement shown in Figure 1A;Fig. 2A is the projection shown in Figure 1A The configuration schematic diagram of the top plate of device, bottom plate and fin;Fig. 2 B are the signal of the optical-mechanical system of the projection arrangement shown in Figure 1A Figure;Fig. 3 A have the partial schematic diagram of thermal insulation barriers for the top plate of one embodiment of the invention;Fig. 3 B and Fig. 3 C be Fig. 3 A shown in every Warmware is arranged at the side view of the not be the same as Example on top plate;Fig. 4 A do not illustrate top for the projection arrangement of another embodiment of the present invention The schematic diagram of plate and side plate;Fig. 4 B are the explosive view of the projection arrangement shown in Fig. 4 A;Fig. 5 A are the throwing of another embodiment of the present invention Image device does not illustrate the schematic diagram of top plate and side plate;Fig. 5 B are the side signal of the subelement of the projection arrangement shown in Fig. 5 A Figure;Fig. 6 does not illustrate the schematic diagram of top plate and side plate for the projection arrangement of another embodiment of the present invention;Fig. 7 A are another reality of the invention The projection arrangement for applying example does not illustrate the schematic diagram of top plate and side plate;Fig. 7 B are that the projection arrangement shown in Fig. 7 A does not illustrate bowing for bottom plate View;Fig. 8 A and Fig. 8 B are the top view and schematic side view of the projection arrangement of another embodiment of the present invention;Fig. 9 A to Fig. 9 C are The configuration schematic diagram of the diversion member of different embodiments of the invention;Figure 10 is the signal of the diversion member of another embodiment of the present invention Figure;Figure 11 A and Figure 11 B are the schematic diagram and configuration schematic diagram of the diversion member of another embodiment of the present invention;Figure 12 is the present invention The schematic diagram of the electronic installation of one embodiment.
As shown in Figure 1A to Fig. 1 C, in an embodiment, projection arrangement 1 of the invention comprising housing 10, optical-mechanical system 20 and Multiple fin 30, wherein housing 10 are that have the top plate 110 and bottom plate 120 be arrangeding in parallel, and multiple side plates 130 are around connection The side of top plate 110 and bottom plate 120, to surround accommodation space jointly, is filled for accommodating optical-mechanical system 20 and the projection of the grade of fin 30 Put part.In this embodiment, top plate 110 has multiple top air vents 112, and bottom plate 120 has multiple bottom air vents 122, its Middle top air vent 112 and bottom air vent 122 are the gateways flowed as gas.Furthermore, as shown in Figure 1A, side plate 130 is preferable Also there are multiple side air vents 132, to promote heat sinking benefit.In this embodiment, housing 10 is preferably made of metal, such as aluminium, But it is not limited.In other embodiment, housing 10 can be made up of alloy or nonmetallic (such as polymer).
In this embodiment, as shown in Figure 1B and Fig. 2A, top plate 110 is preferably waffle slab, and top plate 110 is by multiple ribs 114a, 114b interlock, and composition is multiple to push up air vents 112.For example, multiple rib 114a are the first side 110a along top plate 110 Parallel interval is configured, and multiple rib 114b are matched somebody with somebody along the first side 110a sides adjacent (such as the second side 110b) parallel interval Put, so that multiple rib 114a, 114b interweave with forming multiple grids as top air vent 112.Herein it may be noted that multiple ribs Spacing, number, width between 114a etc. may be the same or different spacing, number, width between multiple rib 114b etc., and Multiple rib 114a, 114b can otherwise be staggered to form top air vent.In this embodiment, multiple rib 114a extension side To preferably perpendicular to the first side 110a, and multiple rib 114b bearing of trend is preferably perpendicular to the second side 110b, so that Obtain multiple top air vents 112 and be the rectangular openings of array configuration, but be not limited.In another embodiment (not shown), multiple ribs Bar 114a, 114b bearing of trend can accompany non-90 degree angle with the first side 110a and the second side 110b respectively, so that multiple Rib 114a, 114b are respectively relative to the first side 110a and the second side 110b is extended obliquely out, and multiple top air vents 112 are array The diamond hole of configuration.Bottom plate 120 also can form the net dividing plate of bottom air vent 122 to be interweaved by multiple rib 124a, 124b, wherein Rib 124a, 124b can have the rib similar to top plate 110 relative to the first side 120a and the second side 120b of bottom plate 120 114a, 114b configuration, are repeated no more in this.
Herein it may be noted that top plate 110 and bottom plate 120, which are preferably arranged to top air vent 112, is at least partly directed at bottom ventilation Hole 122, to cause top air vent 112 to connect bottom air vent 122, such as Figure 1B and Fig. 2A by the corresponding straight line of ventilating duct 312 Shown (being described in detail in rear).In other words, top air vent 112 and bottom air vent 122 can have identical or different shape, size or number Mesh, not to be limited shown in embodiment.For example, in other embodiment, top air vent 112 can be to be formed at top plate 110 Multiple openings, bottom air vent 122 can be the multiple openings for being formed at bottom plate 120, and opening shape can be circular, rectangle or any Suitable geometry or non-regular shape.
As shown in Figure 1B, Fig. 1 C and Fig. 2 B, optical-mechanical system 20 is arranged in housing 10 and positioned at top plate 110 and bottom plate 120 Between.Specifically, optical-mechanical system 20 includes light source module 210, imaging modules 220 and light Transmission Part 230, wherein being imaged mould The sides that group 220 is arranged at light source module 210, and light Transmission Part 230 be connected to light source module 210 and imaging modules 220 it Between.In this embodiment, light Transmission Part 230 can for photoconductive tube, light guide pillar or other be used for the element of transmission ray, and light source die Group 210, imaging modules 220 and light Transmission Part 230 are arranged to L-shaped, but are not limited.In other embodiment, foundation is set Meter demand, light source module 210, imaging modules 220 and light Transmission Part 230 can be configured to straight line or any suitable shape.Light source Module 210 transmits light to imaging modules 220 by light Transmission Part 230, and imaging modules 220 are according to image data processing Light is simultaneously projeced into the outer formation image of housing 10 by light.
Specifically, light source module 210 includes multiple luminescence unit 212a, 212b, 212c and mixed light unit 214, wherein Luminescence unit 212a, 212b, 212c are disposed on around mixed light unit 214, and are emitted beam to mixed light unit 214.In this Embodiment, the side connection light Transmission Part 230 of mixed light unit 214, and luminescence unit 212a, 212b, 212c are to set respectively In mixed light unit 214 not homonymy (such as its excess-three side) and project the light with different colours or wavelength to mixed light unit 214 Line.Mixed light unit 214 receive and mixed luminescence unit 212a, 212b, 212c project light and exported to light Transmission Part 230 Mix light (such as white light).In this embodiment, luminescence unit 212a, 212b, 212c are preferably respectively output red, green, blue color The light emitting diode of light, but be not limited.In other embodiment, luminescence unit 212a, 212b, 212c can be to send white Or the light emitting diode of other color (or wavelength) light.Imaging modules 220 include lens unit 222 and image formation optical unit 224, wherein the connection light of image formation optical unit 224 Transmission Part 230 is to receive light, and handles light according to image data and obtain To corresponding target light, then target light is projeced into outside housing 10 by lens unit 222 and image is formed.Implement in one Example, image formation optical unit 224 includes digital micro-mirror device (Digital Micromirror Device, DMD) 224a, its basis Image signal controls micro mirror to form image.
As shown in Figure 1B and Fig. 1 C, multiple fin 30 are arranged at around optical-mechanical system 20, and plurality of fin 30 is each Multiple ventilating ducts 312 are formed with multiple radiating fins 310, and between multiple radiating fins 310.As described above, multiple radiatings Piece 30 is arranged to, and so that multiple top air vents 112 are via multiple ventilating ducts 312, accordingly straight line connects multiple bottom air vents 122.Referring to Fig. 1 C, multiple fin 30 include the first fin 30a, the second fin 30b and the 3rd fin 30c, wherein First fin 30a, the second fin 30b and the 3rd fin 30c are respectively arranged at three sides of light source module 210, i.e., Correspondence luminescence unit 212a, 212b, 212c are respectively arranged at three sides of mixed light unit 214, so that multiple radiating fins 310 The corresponding side configured in parallel along along three sides of mixed light unit 214 respectively, and radiating fin 310 is dorsad mixed light unit 214 extensions.Thereby, ventilating duct 312 is also configured along three sides of mixed light unit 214, and each ventilating duct 312 connects corresponding Push up air vent 112 and bottom air vent 122.For another viewpoint, multiple radiating fins 310 are to stand on top plate 110 and bottom plate Between 120, and by top plate 110 top air vent 112 towards bottom plate 120 watch when, can be via correspondence ventilating duct 312 and bottom air vent 122 see through bottom plate 120.In other words, the top air vent 112 of top plate 110, corresponding ventilating duct 312 and bottom air vent 122 are to constitute Straight line runs through the runner of housing 10.Thereby, projection arrangement 1 can reach effective radiating by the free convection of air.
As shown in Figure 1 C, in an embodiment, multiple luminescence unit 212a, 212b, 212c are preferably attached at multiple respectively Fin (such as the first fin 30a, the second fin 30b and the 3rd fin 30c).In other words, luminescence unit 212a, 212b, 212c are preferably attached to fin 30 back on the surface of the side of radiating fin 310 by its substrate, to promote radiating Benefit.
Furthermore, as shown in Figure 3A, multiple thermal insulation barriers 140 may be disposed at the outer surface of top plate 110, with for user provide every Thermal effect.Specifically, thermal insulation barriers 140 and top plate 110 are made up of different materials, and compared to top plate 110, thermal insulation barriers 140 have preferably effect of heat insulation.In this embodiment, thermal insulation barriers 140 are preferably flexible material (such as silica gel), think user Preferably sense of touch and effect of heat insulation are provided.In an embodiment, as shown in Figure 3 B, thermal insulation barriers 140 are strip and are attached at rib 114a surface.In another embodiment, as shown in Figure 3 C, the outer surface of top plate 110 has multiple grooves 116, and thermal insulation barriers 140 are It is inserted in groove 116.For example, groove 116 is formed at rib 114a ' surface and along rib 114a ' length side To extension, the bottom insertion groove 116 of strip thermal insulation barriers 140 so that thermal insulation barriers 140 protrude from top plate 110 (i.e. rib 114a ') Surface.When projection arrangement 1 by fin 30 and natural convection effect by thermal conductivity to housing 10 when, by thermal insulation barriers 140 Set, the top plate 110 that the direct Contact Temperature of user can be avoided higher, and preferably sense of touch is provided simultaneously.
In addition, in an embodiment, as shown in Figure 1B, Fig. 1 C and Fig. 2A, projection arrangement of the invention additionally comprises auxiliary heat dissipation Piece 32, and auxiliary heat dissipation piece 32 has multiple radiating fins 320.The preferably correspondence imaging modules 220 of auxiliary heat dissipation piece 32 are set, The digital micro-mirror device 224a for especially corresponding to imaging modules 220 is set.In this embodiment, auxiliary heat dissipation piece 32 is disposed on into As the top of module 224, such as top positioned at imaging unit 224, or further extend partially into lens unit 222 and push up Portion, and digital micro-mirror device 224a is preferably disposed on the top of imaging modules 220 and is attached at auxiliary heat dissipation piece 32.Change speech It, digital micro-mirror device 224a is preferably disposed on the top of imaging unit 224, and is attached to fin 32 by its substrate and carries on the back To on the surface of the side of radiating fin 320.In this embodiment, multiple radiating fins 320 of auxiliary heat dissipation piece 32 are parallel match somebody with somebody Put and towards top plate 110 extend to form multiple secondary ventilation roads 322.Herein it may be noted that top air vent 112, the side plate of top plate 110 130 side air vent 132 preferably also corresponds to auxiliary heat dissipation piece 32 and set so that top air vent 112, side air vent 132, auxiliary are logical Air channel 322 may make up radiating flow passage, to promote heat sinking benefit.
Furthermore, projection arrangement additionally comprises at least one extension fin 34, wherein extension fin 34 is from auxiliary heat dissipation The side of piece 32 extends towards bottom plate 120, with positioned at the side of imaging modules 220.Extending fin 34 has multiple radiating fins 340, multiple radiating fins 340 of extension fin 34 are the side configured in parallel along imaging modules 220 to form multiple extensions Ventilating duct 342, it is plurality of extension ventilating duct 342 accordingly straight line connection it is multiple top air vents 112 at least one and At least one of multiple bottom air vents 122.That is, similar to above-mentioned, the top air vent 112 of top plate 110 and bottom plate 120 Bottom air vent 122 preferably also corresponds to extension fin 34 and set so that top air vent 112 can pass through corresponding extension ventilating duct 342 straight lines connect bottom air vent 122, to constitute the runner of free convection.In this embodiment, extension fin 34 is preferably from auxiliary Help the both sides of fin 32 to extend downwardly, and " ㄇ shapes " fin integrated with auxiliary heat dissipation piece 32, but not as Limit.In this embodiment, the extension fin 34 positioned at " ㄇ shapes " fin both sides, its radiating fin 340 is dorsad to extend, to divide Not extend towards side plate 130 and light source module 210.In other embodiment, according to configuration space, radiating requirements etc., extension radiating Piece 34 can be extended downwardly from more than the one side of auxiliary heat dissipation piece 32 or both sides, with " the L integrated with auxiliary heat dissipation piece 32 The fin of shape " or other shapes.Herein it may be noted that extension fin 34 and auxiliary heat dissipation piece 32 be preferably one of the forming dissipate Backing, but also can be the fin of separation.When extending fin 34 and auxiliary heat dissipation piece 32 is integrated, extend fin 34 radiating fin 340 and the radiating fin 320 of auxiliary heat dissipation piece 32 are preferably placed so that extension heat dissipation channel 342 is distinguished Correspondence connection auxiliary heat dissipation passage 322, but be not limited.In addition, extension fin 34 extends along the side of auxiliary heat dissipation piece 32 Length, may be the same or different in the length of the side of auxiliary heat dissipation piece 32, not to be limited shown in embodiment.For example, when auxiliary When helping the fin 32 to be only arranged at the top of imaging unit 224, extension fin 34 can be only located at the side of imaging unit 224, Also it may be further extended to the side of camera lens module 222.Or, when auxiliary heat dissipation piece 32 is arranged at the top of imaging unit 224 And when extending to the top of camera lens module 222, extension fin 34 can be located at the side of imaging unit 224 and extend to camera lens mould The side of group 222, can also be only located at the side of imaging unit 224.
Furthermore, projection arrangement of the invention separately can by optimization circuits plate configuration, to reduce the influence of fuel factor.Tool For body, projection arrangement of the invention additionally comprises multiple circuit boards (such as 410,420,430), wherein each circuit board has difference Temperature/power.The present invention can carry out optimization configuration according to temperature/power height of each circuit board, to reduce fuel factor Influence.As shown in fig. 4 a and fig. 4b, in an embodiment, projection arrangement additionally comprises circuit board 410,420, and wherein circuit board 410 is set The lower section of light source module 210 is placed in, and circuit board 420 is arranged at the side of imaging modules 220 and away from circuit board 410 and light source die Group 210.For example, circuit board 410 is main circuit board, and circuit board 420 is power supply circuit plate, wherein power supply supply electricity Temperature/power of road plate 420 is higher than temperature/power of main circuit board 410.In this embodiment, relative to bottom plate 120, main circuit Plate 410 is horizontally placed on the lower section of light source module 210, and power supply circuit plate 420 is uprightly arranged at the one of imaging modules 220 Side.Thereby, multiple circuit boards 410,420 of projection arrangement 1 are distributed, especially by the higher circuit board (example of temperature/power Such as power supply circuit plate 420) independently to place, the heat produced by can avoiding circuit board 410,420 concentrates on same position (for example Near light source module 210) and aggravate the influence of fuel factor.
As shown in fig. 4 a and fig. 4b, in this embodiment, extension fin 34 is preferably disposed on circuit board 420 and imaging mould Between group 220, with isolating circuit plate 420 and imaging modules 220.That is, extension fin 34 is the side court from fin 32 The bottom direction extension of imaging modules 220, with parallel to circuit board 420 and positioned between circuit board 420 and imaging modules 220. In this embodiment, the radiating fin 340 of extension fin 34 is directed towards circuit board 420 and extended, and temperature/work(of circuit board 420 The higher element of rate is preferably towards side plate 130, and the relatively low element of temperature/power of circuit board 420 is then towards radiating fin 340.Herein it may be noted that the top air vent 112 of top plate 110 and the bottom air vent 122 of bottom plate 120 preferably also correspond to extension fin 34 are set so that top air vent 112 can connect bottom air vent 122 by the corresponding straight line of ventilating duct 342, to constitute free convection Runner (with reference to Figure 1B related description).
In another embodiment, projection arrangement is the electronics member having according to the temperature/power height or circuit board of circuit board The heat sensitivity of part makees the configuration of different height, and plurality of circuit board is the height or its electronic component according to temperature/power Heat sensitivity be sequentially stacked, closer to bottom plate circuit board have lower temperature/power or the circuit board closer to bottom plate The electronic component having more easily is influenced by heat.As shown in Figure 5A, multiple circuit boards 410,430 are arranged under light source module 210 Side, and temperature/power of the temperature/power less than circuit board 430 of parallel mat 120, wherein circuit board 410.For example, it is electric Road plate 410 is the main circuit board for the running of control projector, and circuit board 430 is the drive circuit board of driving light source, wherein main Circuit board 410 is arranged at the lower section of light source module 210, and drive circuit board 430 is arranged at main circuit board 410 and light source module 210 Between.As shown in Fig. 5 A and Fig. 5 B, projection arrangement additionally comprises metal heat-conducting piece 50, and wherein metal heat-conducting piece 50 includes body 510 and extension 520.Body 510 is the surface that essence is covered in circuit board 410,430, and extension 520 is from body 510 bendings extend the side of circuit board 410,430.In an embodiment, metal heat-conducting piece 50 can be formed by aluminium sheet bending, wherein Extension 520 is preferably smooth fin (such as the second fin 30b), to cause the heat energy of circuit board generation is conducted to scattered Backing 30b.
Furthermore, as shown in Figure 5 B, circuit board 410 has the electronic component 412 of relatively low heat sensitivity, and circuit board 430 has There is the electronic component 432 of higher thermal susceptibility, and metal heat-conducting piece 50 is inserted between circuit board 410 and 430, wherein electronics is first Part 412,432 is the apparent surface for the body 510 for facing metal heat-conducting piece 50 respectively.Herein it may be noted that low-heat susceptibility Electronic component 412 refers to the electronic component for being easier to be influenced by heat, and the electronic component 432 of high heat sensitivity refers to be less susceptible to be heated The electronic component of influence.That is, when multiple circuit boards are stacked, the circuit with the electronic component being more easily influenced by heat Plate is preferably disposed on more lower section, and the circuit board with the electronic component for being more difficult to be influenced by heat preferably is disposed on more Side, so that low-heat susceptibility electronic component can more be operated in normal temperature.Projection arrangement additionally comprises (such as heat conduction of Heat Conduction Material 60 Glue), wherein Heat Conduction Material 60 is to be filled between circuit board 410 and body 510 and/or Heat Conduction Material 60 is filled in circuit board Between 430 and body 510, to promote heat via the heat conduction of metal heat-conducting piece 50 to fin 30b.Herein it may be noted that Fig. 5 A, Though metal heat-conducting piece 50 is illustrated with an extension 520, and to attach fin 30b, this is not limited.In other implementations Example, metal heat-conducting piece can have the extension of one or more bendings, and extension can be attached at identical or different fin (such as 30a, 30b, 30c).In addition, the overbending direction of extension 520 can change according to design requirement, not be folded upward at for Limit.In other embodiment, extension 520 can bending be formed downwards from body 510.Furthermore, in this embodiment, though show metal The surface of the body 510 of heat-conducting piece 50 is plane, but in other embodiment, and body 510 can be according to being arranged at its both sides The electronic component-sized of circuit board, position, and with corresponding concavo-convex surface.Furthermore, though only illustrate two in the present embodiment Circuit board (such as 410,430) is stacked, but is not limited.(do not illustrated) in other embodiment, when projection arrangement includes two (such as 410,410,430), the height that multiple circuit boards 410,420,430 also can be according to temperature/power during the circuit board of the above Sequentially it is stacked, the circuit board closer to bottom plate has lower temperature/power, the minimum main circuit board 410 of such as temperature/power Bottom plate is located nearest to, the high drive circuit board 430 of temperature/power time is stacked and placed on main circuit board 410, and temperature/power phase Highest power supply circuit plate 420 is then stacked on drive circuit board 430.The projection arrangement of the present invention is by by temperature/work( The higher circuit board of rate is arranged at more top, and the lower circuit board of temperature/power is arranged at more lower section, may be such that low temperature/low The circuit board of power is not heated by the circuit board of high temperature/high-capacity, and make it that low temperature heat sensitivity element more can be in normal temperature Running, and reach optimized to stream configuration.
Furthermore, as shown in fig. 6, in another embodiment, projection arrangement of the invention by by circuit board be distributed and according to The height of temperature/power is stacked, and can further improve fuel factor influence.In this embodiment, temperature/power highest circuit board 420 are preferably disposed on the side of imaging unit 224, and the relatively low circuit board 410 and 430 of temperature/power is preferably according to temperature The height of degree/power is arranged at the lower section of light source module 210.Illustrate with reference to Fig. 4 B and Fig. 5 A embodiment, power supply circuit There is plate 420 highest temperature/power, drive circuit board 430 to have secondary high temperature/power, and main circuit board 410 has phase To minimum temperature and power.In this embodiment, power supply circuit plate 420 is disposed on the side of imaging unit 224 and remote Separate from light source module 210, and by extension fin 34 with imaging modules 220, and main circuit board 420 is arranged at mixed light unit 214 lower section and be closer to bottom plate 120, drive circuit board 430 is arranged between main circuit board 420 and mixed light unit 214.
In another embodiment, as shown in figs. 7 a and 7b, multiple circuit boards (such as 410a, 410b, 420,430) are to set In the side of optical-mechanical system 20, plurality of circuit board 410a, 410b, 420,430 are upright settings relative to bottom plate 120, with So that at least one of multiple top air vents 112 is straight by the space by multiple circuit board 410a, 410b, 420,430 Line connects at least one of multiple bottom air vents 122.Specifically, in response to space limitation and radiating requirements, multiple circuits Plate 410a, 410b, 420,430 are preferably disposed on the side of imaging modules 220, and away from light source module 210.Furthermore, in this Embodiment, can independently design the control unit of input/output (I/O) unit and main circuit board, to form main control electricity Road plate (such as 410a) and input/output circuitry plate (such as 410b).In this embodiment, drive circuit board 430 is preferably set Set in imaging unit 224 relative to the opposite side of lens unit 222, and master control circuit board 410a, input/output circuitry plate 410b, power supply circuit plate 420 are preferably to be arranged at intervals in imaging unit 224 relative to the opposite side of light source module 210.
Herein it may be noted that though Fig. 7 A and Fig. 7 B illustrate circuit board 430 is configured to dorsad imaging unit 224 and extends vertically, It is not limited.In other embodiment, the side that circuit board 430 can be configured to parallel imaging unit 224 is horizontal-extending.Furthermore, When multiple circuit board 410a, the interval of 410b, 420,430 are uprightly set, (for example power supply is supplied the higher circuit board of temperature/power Answer circuit board 420) outermost (or farthest away from imaging modules 220 at) is preferably disposed on, and preferably make electronic component thereon In face of the side air vent 132 of side plate 130.In this embodiment, input/output circuitry plate 410b is disposed on master control circuit board Between 410a and power supply circuit plate 420, and input/output circuitry plate 410b and power supply circuit plate 420 are to set opposite to each other Put so that electronic component thereon is towards opposite direction.Master control circuit board 410a is placed so that electronic component thereon Towards the radiating fin 340 of extension fin 34.In this embodiment, circuit board 410a, 410b, 420,430 set electronic component The normal direction of plate face be perpendicular to top plate 110 and the normal to a surface direction of bottom plate 120.Thereby so that circuit board 410a, The ventilating duct being similar between radiating fin 310 is formed between 410b, 420,430.In this embodiment, the top of top plate 110 is divulged information Also corresponding circuits plate 410a, 410b, 420,430 are set the bottom air vent 122 of hole 112 and bottom plate 120 so that top air vent 112 Bottom air vent 122 can be connected by the space line by circuit board 410a, 410b, 420,430, to constitute the stream of free convection Road.
Furthermore, when projection arrangement is arranged at higher temperature environment or wants the enhancing intensity of light source, projection dress of the invention Fan can be further equipped with improving heat radiation efficiency by putting.In another embodiment, as shown in Fig. 8 A and Fig. 8 B, projection arrangement can enter one Step includes fan 70 and diversion member 80, and wherein fan 70 is arranged at bottom plate 120 and provides air-flow, the corresponding fan of diversion member 80 70 set to import air-flow into multiple ventilating ducts 312 of fin 30.That is, diversion member 80 and radiating fin 310 are arranged at The same side of fin 30, and fan 70 is arranged at the opposite side of fin 30.Specifically, fan 70 can be blowing machine type wind Fan, and the inspiratory direction and about 90 degree of the angle in supply direction of fan 70.In this embodiment, fan 70 is from vertical base plate 120 Direction suction airflow (i.e. air), and air-flow is provided to diversion member 80 from the direction of parallel mat 120.That is, fan 70 is carried For the substantial air-flow vertical with multiple ventilating ducts 312, and diversion member 80 by air-flow with the multiple ventilating ducts of substantial out of plumb 312 mode imports multiple ventilating ducts 312.Furthermore, fan 70 preferably corresponds to multiple fin 30 and encloses the centrally disposed of scope. In this embodiment, the preferably three fin 30a~30c of setting of fan 70 enclose the center of scope, that is, the correspondence of fan 70 It is arranged at the bottom plate 120 of the lower section of light source module 210.The preferably correspondence fan 70 of diversion member 80 sets and couples multiple fin 30a~30c, the air-flow that fan 70 is provided enters multiple ventilating ducts 312 with 45 degree of angular direction of essence.In this embodiment, such as Shown in Fig. 8 A, diversion member 80 is coupled with fin 30a~30c respectively, and the ㄇ shapes being trapped among with forming essence around fan 70 are led Stream circle, but be not limited.
In an embodiment, as shown in Figure 9 A, diversion member 80 includes multiple flow deflectors 810, and each in multiple ventilating ducts 312 At least one flow deflector 810 is provided with, wherein each flow deflector 810 is coupled to the radiating fin adjacent with corresponding ventilating duct 312 310, to cause the air-flow that fan 70 is provided to enter fin 30a~30c multiple ventilating ducts 312 with 45 degree of angular direction of essence. Flow deflector 810 can be fixed on radiating fin 310 by modes such as adhesion, engagings, to cause flow deflector 810 is located at two adjacent scattered In ventilating duct 312 between hot fin 310.Flow deflector 810 is arranged at the position of ventilating duct 312 preferably close to fan 70 and approached The bottom of ventilating duct 312 so that the air-flow provided is exported from fan 70 can more early contact flow deflector 810 and then lift water conservancy diversion effect. In an embodiment, as shown in Figure 9 A, flow deflector 810 can be adhered to two adjacent heat radiation fins 310 with predetermined inclination or angle of bend Relative wall, and cause fan 70 provide it is distinguished and admirable encountering after flow deflector 810, by flow deflector 810 guiding preferably with reality 45 degree of angular direction of matter enter ventilating duct 312, use the heat for taking away radiating fin 310 and improving heat radiation efficiency.Implement in another Example, as shown in Figure 9 B, flow deflector 810 can have holding section 812, and radiating fin 310 can have connecting hole 310a so that water conservancy diversion Piece 810 is positioned at radiating fin 310 by the engaging with connecting hole 310a of holding section 812.Herein it may be noted that though Fig. 9 B are illustrated The both sides of flow deflector 810 respectively have a holding section 812 to engage with the corresponding connecting hole 310a of each side radiating fin 310, but not As limit.In other embodiment, multiple holding sections 812 can be set in each side of flow deflector 810, and radiating fin 310 has correspondence Multiple connecting hole 310a, the inclination or bending demand that plurality of connecting hole 310a can be according to flow deflector 810 be distributed in radiating The appropriate location of fin 310, with the inclination needed for causing flow deflector 810 to possess or curved shape.
Furthermore, though Fig. 9 A and Fig. 9 B embodiment illustrate each ventilating duct 312 and set a flow deflector 810, not as Limit.In another embodiment, as shown in Figure 9 C, single ventilation road 312 is settable at least two flow deflectors (such as three flow deflectors 810a, 810b, 810c), wherein flow deflector 810a, 810b, 810c is set along wind direction, and the flow deflector nearer from fan 70 810a set location is higher (i.e. closer to top plate 110).For example, three flow deflectors 810a, 810b, 810c are along fan 70 Air-out direction W configured in staged, flow deflector 810a sets farthest (i.e. position highest) from bottom plate 120 closest to fan 70, Flow deflector 810c is farthest from fan 70 and sets from bottom plate 120 recently (i.e. position is minimum), and flow deflector 810b is then arranged at water conservancy diversion Between piece 810a and flow deflector 810c.
Furthermore, multiple flow deflectors 810 can be the flow deflector of separation, and each flow deflector 810 is inserted in adjacent heat radiation fin respectively Ventilating duct 312 between 310, but be not limited, it can be integrated into single flow deflector group in the multiple flow deflectors 810 of other embodiment Close.In another embodiment, as shown in Figure 10, diversion member 80 additionally comprises connection sheet 820, and multiple flow deflectors 810 are connected to The same side of contact pin 820 and interval setting.Specifically, the width D w of flow deflector 810 is preferably substantially equal to the width of ventilating duct 312 Interval G between degree, adjacent baffle 810 is the thickness of radiating fin 310, but is not limited.In other embodiment, water conservancy diversion The interval G that the width D w of piece 810 can be slightly less than between the width of ventilating duct 312, adjacent baffle 810 may be slightly larger than radiating fin 310 thickness.In this embodiment, multiple flow deflectors 810 are caused to connect into the diversion member 80 of monolithic by connection sheet 820, can Simplify the assembly program of diversion member 80 and fin 30, lift packaging efficiency.
In another embodiment, as shown in FIG. Figure 11 A and 11 B, diversion member 80A is arc flow deflector, and arc flow deflector With multiple coupling aperture 830 to be respectively coupled to multiple radiating fins 310 of fin 30.Specifically, diversion member 80A is whole The sheet material of piece, and multiple coupling aperture 830 correspond to the position of radiating fin 310 and thickness is opened up, make it that each radiating fin 310 can In the corresponding coupling aperture 830 of partial insertion.Herein it may be noted that the width Ow of coupling aperture 830 is desirably equal to or slightly larger than heat radiating fin The thickness of piece 310, and the length OL of coupling aperture 830 can change according to diversion member 80A inclination or bending demand.In addition, The diversion member 80A of arc water conservancy diversion chip can also form above-mentioned holding section 812 in the two side in coupling aperture 830, with dissipating The connecting hole 310a engagings of hot fin 310, and then diversion member 80A is positioned in fin 30.
Furthermore, the heat dissipation design of projection arrangement of the invention can be applied to other because needing the electronics of radiating with thermal source Device, such as desktop/notebook computer, is not limited to projection arrangement.In an embodiment, as shown in figure 12, electronic installation 90 Thermal source 910, at least one fin 920, fan 930 and diversion member 940 can be included.At least one fin 920 is arranged at Around thermal source 910, wherein fin 920 has multiple radiating fins 922, and forms multiple logical between multiple radiating fins 922 Air channel 924.The correspondence fin 920 of fan 930 is set, to provide the substantial air-flow vertical with multiple ventilating ducts 924.Water conservancy diversion member The correspondence fan 930 of part 940 is set, and air-flow is imported into multiple ventilating ducts in the way of the multiple ventilating ducts 924 of substantial out of plumb 924.For example, when applied to computer, thermal source 910 can be central processing unit, and at least one fin 920, fan 930 And diversion member 940 can have with optical-mechanical system 20 in above-mentioned projection arrangement (especially light source module 210) be thermal source when radiate The similar configuration of piece 30, fan 70 and diversion member 80 (or 80A).That is, fan 930 is from the outer suction airflow of electronic installation 90 (i.e. air), and to be substantially parallel to the direction suction airflow of multiple ventilating ducts 924 and provide air-flow to diversion member 940.Tool For body, the direction Wi of the suction airflow of fan 930 about accompanies an angle of 90 degrees with providing the direction Wo of air-flow, and diversion member 940 can Any form of implementation with above-mentioned Fig. 9 A~Figure 11 B, the air-flow that fan 930 is provided is oriented to be pressed from both sides with suction airflow direction Wi There is the ventilating duct 924 that the guiding direction Wh less than an angle of 90 degrees (preferably 45 degree of angles) enters between radiating fin 922.Note is needed herein Meaning, each component details of electronic installation 90 and configuration refer to the related description of above-mentioned projection arrangement embodiment, are no longer gone to live in the household of one's in-laws on getting married in this State.
Compared to prior art, projection arrangement of the invention coordinates fin by the top air vent and bottom air vent of housing Upright configuration, efficient Natural Heat Convection mechanism is can reach, so that the rotating speed of fan is greatly reduced or even exempts fan Use, and then the noise that produces when reducing fan running.Furthermore, projection arrangement of the invention, with optimized circuit board Configuration design and the setting of metal heat-conducting piece, it is possible to decrease the influence of fuel factor, lifting device function.In addition, the projection of the present invention Device can coordinate the design of fan and diversion member, not only may be used with the heat dissipation design of further improving heat radiation efficiency, and the present invention Applied to projection arrangement, any electronic installation for needing to radiate with thermal source more can be applied to.
The present invention is been described by by above-mentioned related embodiment, but above-described embodiment is only the example for implementing the present invention. It must be noted that, the embodiment disclosed is not limiting as the scope of the present invention.On the contrary, do not depart from the present invention spirit and In the range of the change and retouching made, belong to the scope of patent protection of the present invention.

Claims (10)

1. a kind of electronic installation, it is characterised in that include:
Thermal source;
At least one fin, is arranged at around the thermal source, and at least one fin respectively has multiple radiating fins, wherein should Multiple ventilating ducts are formed between multiple radiating fins;
Fan, to should at least one fin set, to provide the air-flow vertical with the plurality of ventilating duct;And
Diversion member, to should fan set, the air-flow is imported in the way of the plurality of ventilating duct of out of plumb the plurality of logical Air channel;
Wherein, the fan sucks the air-flow from outside the electronic installation, and sucks the gas with the direction parallel to the plurality of ventilating duct Flow and provide the air-flow to the diversion member.
2. electronic installation as claimed in claim 1, it is characterised in that the inspiratory direction of the fan and the angle in supply direction are 90 degree.
3. electronic installation as claimed in claim 1, it is characterised in that the diversion member includes multiple flow deflectors, the plurality of logical Be each provided with least one flow deflector in the plurality of flow deflector in air channel, and the plurality of flow deflector be respectively coupled to should The adjacent the plurality of radiating fin of multiple ventilating ducts.
4. electronic installation as claimed in claim 3, it is characterised in that the diversion member additionally comprises a connecting piece, the plurality of to lead Flow is connected to the same side of the connection sheet and interval setting.
5. electronic installation as claimed in claim 3, it is characterised in that the plurality of ventilating duct at least one to be provided with this more At least two flow deflectors in individual flow deflector, the wind direction of at least two flow deflectors along the fan is stepped to be set.
6. electronic installation as claimed in claim 1, it is characterised in that the diversion member is arc flow deflector, and the arc is led Flow has multiple coupling aperture to be respectively coupled to the plurality of radiating fin of the plurality of fin.
7. electronic installation as claimed in claim 1, it is characterised in that the electronic installation is projection arrangement, and the thermal source is light Machine system.
8. electronic installation as claimed in claim 1, it is characterised in that the diversion member couples at least one fin, makes The air-flow enters the plurality of ventilating duct with 45 degree of angular direction.
9. electronic installation as claimed in claim 1, it is characterised in that also include:Housing, the housing has top plate and bottom plate, The top plate has multiple top air vents, and the bottom plate has multiple bottom air vents;The plurality of top air vent is via the plurality of ventilation Accordingly straight line connects the plurality of bottom air vent in road.
10. electronic installation as claimed in claim 1, it is characterised in that the fan is arranged at the phase of at least one fin Offside.
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CN105159018B (en) 2018-03-06
CN108445699A (en) 2018-08-24

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