CN105072873A - Electronic device - Google Patents
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- CN105072873A CN105072873A CN201510506079.XA CN201510506079A CN105072873A CN 105072873 A CN105072873 A CN 105072873A CN 201510506079 A CN201510506079 A CN 201510506079A CN 105072873 A CN105072873 A CN 105072873A
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- fin
- flow
- air duct
- electronic installation
- fan
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Projection Apparatus (AREA)
Abstract
The invention provides an electronic device for enhancing heat radiation efficiency. The electronic device comprises a heat source, at least one heat radiating blade, a fan and a diversion element, wherein the at least one heat radiating blade is arranged on the periphery of the heat source and has a plurality of heat radiation fins, ventilating channels are formed between the heat radiation fins, the fan is arranged relative to the at least one heat radiating blade to provide air flow perpendicular to the ventilating channels, and the diversion element is arranged relative to the fan to guide the air flow into the ventilating channels in a way of non-perpendicular to the ventilating channels.
Description
Technical field
The invention relates to a kind of projection arrangement, especially about a kind of electronic installation with high efficiency Natural Heat Convection mechanism.
Background technology
The power of projector, because the requirement of brightness is done larger and larger, and the efficiency of light-emitting diode fails relatively to promote, even if when smaller power, existing product all needs to do forced heat radiation with fan, and when power increase, the problem of thermal effect is just even more serious.
When the use power of light-emitting diode is increasing, its heating efficiency also will increase along with use power.For general small projector, because three looks (R/G/B) light source is placed in three sides of light hydrid component usually, the integral heat sink usefulness of small projector is caused also the restriction because of space to be affected.
Therefore, how effectively to utilize inner space, inner member configuration reaches efficiently radiates heat, to make projection arrangement still can run well without anxiety, is the important issue of projection arrangement heat dissipation design in fact.
Summary of the invention
The object of the present invention is to provide a kind of electronic installation, to promote heat dissipation.
First aspect, the invention provides a kind of electronic installation, comprises: thermal source, at least one fin, fan and diversion member; This at least one fin is arranged at around this thermal source, and this at least one fin respectively has multiple radiating fin, wherein forms multiple air duct between the plurality of radiating fin; This fan is to arranging, to provide the air-flow vertical with the plurality of air duct by least one fin; This diversion member is to arranging, so that this air-flow is imported the plurality of air duct in the mode of the plurality of air duct of out of plumb by fan.
Preferably, this fan sucks this air-flow outward from this electronic installation, and sucks this air-flow with the direction being parallel to the plurality of air duct and provide this air-flow to this diversion member.
Preferably, this diversion member comprises multiple flow deflector, is respectively provided with at least one flow deflector in the plurality of flow deflector in the plurality of air duct, and the plurality of flow deflector is respectively coupled to the plurality of radiating fin adjacent with corresponding the plurality of air duct.
Preferably, this diversion member separately comprises a connecting piece, and the plurality of flow deflector is connected to the same side of this brace and interval is arranged.
Preferably, at least one of them is provided with at least two these flow deflectors in the plurality of flow deflector to the plurality of air duct, and these at least two flow deflectors are along the stepped setting of wind direction of this fan.
Preferably, this diversion member is arc flow deflector, and this arc flow deflector has multiple coupling aperture to couple the plurality of radiating fin of the plurality of fin respectively.
Preferably, this electronic installation is projection arrangement, and this thermal source is optical-mechanical system.
Preferably, this diversion member couples this at least one fin, makes this air-flow enter the plurality of air duct with miter angle direction.
Preferably, also comprise: housing, this housing has top board and base plate, and this top board has multiple tops ventilation hole, and this base plate has ventilation hole of multiple ends; The plurality of top ventilation hole is via the plurality of air duct straight line connection accordingly ventilation hole of the plurality of end.
Preferably, this fan is arranged at the opposite side of this at least one fin.
Compared with prior art, electronic installation provided by the invention, it is by fan and conducting element, makes air-flow enter the air duct between radiating fin with optimized angle, and then enhances heat dissipation.
Accompanying drawing explanation
Figure 1A is the stereogram of the projection arrangement of one embodiment of the invention;
Figure 1B does not illustrate the explosive view of side plate for the projection arrangement shown in Figure 1A;
Fig. 1 C does not illustrate the vertical view of top board for the projection arrangement shown in Figure 1A;
The configuration schematic diagram of the top board that Fig. 2 A is the projection arrangement shown in Figure 1A, base plate and fin;
Fig. 2 B is the schematic diagram of the optical-mechanical system of the projection arrangement shown in Figure 1A;
Fig. 3 A is the partial schematic diagram that the top board of one embodiment of the invention has thermal insulation barriers;
Fig. 3 B and Fig. 3 C is arranged at the end view of the different embodiments on top board for the thermal insulation barriers shown in Fig. 3 A;
Fig. 4 A is the schematic diagram that the projection arrangement of another embodiment of the present invention does not illustrate top board and side plate;
Fig. 4 B is the explosive view of the projection arrangement shown in Fig. 4 A;
Fig. 5 A is the schematic diagram that the projection arrangement of another embodiment of the present invention does not illustrate top board and side plate;
Fig. 5 B is the side schematic view of the subelement of the projection arrangement shown in Fig. 5 A;
Fig. 6 is the schematic diagram that the projection arrangement of another embodiment of the present invention does not illustrate top board and side plate;
Fig. 7 A is the schematic diagram that the projection arrangement of another embodiment of the present invention does not illustrate top board and side plate;
Fig. 7 B does not illustrate the vertical view of base plate for the projection arrangement shown in Fig. 7 A;
Fig. 8 A and Fig. 8 B is vertical view and the schematic side view of the projection arrangement of another embodiment of the present invention;
Fig. 9 A to Fig. 9 C is the configuration schematic diagram of the diversion member of different embodiments of the invention;
Figure 10 is the schematic diagram of the diversion member of another embodiment of the present invention;
Figure 11 A and Figure 11 B is schematic diagram and the configuration schematic diagram of the diversion member of another embodiment of the present invention;
Figure 12 is the schematic diagram of the electronic installation of one embodiment of the invention.
Embodiment
For making there is further understanding to object of the present invention, structure, feature and function thereof, embodiment is hereby coordinated to be described in detail as follows.
The invention provides a kind of projection arrangement, especially a kind of projection arrangement with the heat dissipation design of free convection, use fan to reduce rotation speed of the fan or even to exempt, and then reduce noise lifting operation quality.Moreover projection arrangement of the present invention has optimized circuit board arrangement to reduce thermal effect impact, also can utilize coordinating with heat radiation usefulness of metal heat-conducting piece and fin.In addition, the present invention also provides a kind of electronic installation, and it is by fan and conducting element, makes air-flow enter the air duct between radiating fin with optimized angle, to promote heat dissipation.In the rear embodiment with reference to graphic detailed description projection arrangement of the present invention and electronic installation.
Figure 1A is the stereogram of the projection arrangement of one embodiment of the invention; Figure 1B does not illustrate the explosive view of side plate for the projection arrangement shown in Figure 1A; Fig. 1 C does not illustrate the vertical view of top board for the projection arrangement shown in Figure 1A; The configuration schematic diagram of the top board that Fig. 2 A is the projection arrangement shown in Figure 1A, base plate and fin; Fig. 2 B is the schematic diagram of the optical-mechanical system of the projection arrangement shown in Figure 1A; Fig. 3 A is the partial schematic diagram that the top board of one embodiment of the invention has thermal insulation barriers; Fig. 3 B and Fig. 3 C is arranged at the end view of the different embodiments on top board for the thermal insulation barriers shown in Fig. 3 A; Fig. 4 A is the schematic diagram that the projection arrangement of another embodiment of the present invention does not illustrate top board and side plate; Fig. 4 B is the explosive view of the projection arrangement shown in Fig. 4 A; Fig. 5 A is the schematic diagram that the projection arrangement of another embodiment of the present invention does not illustrate top board and side plate; Fig. 5 B is the side schematic view of the subelement of the projection arrangement shown in Fig. 5 A; Fig. 6 is the schematic diagram that the projection arrangement of another embodiment of the present invention does not illustrate top board and side plate; Fig. 7 A is the schematic diagram that the projection arrangement of another embodiment of the present invention does not illustrate top board and side plate; Fig. 7 B does not illustrate the vertical view of base plate for the projection arrangement shown in Fig. 7 A; Fig. 8 A and Fig. 8 B is vertical view and the schematic side view of the projection arrangement of another embodiment of the present invention; Fig. 9 A to Fig. 9 C is the configuration schematic diagram of the diversion member of different embodiments of the invention; Figure 10 is the schematic diagram of the diversion member of another embodiment of the present invention; Figure 11 A and Figure 11 B is schematic diagram and the configuration schematic diagram of the diversion member of another embodiment of the present invention; Figure 12 is the schematic diagram of the electronic installation of one embodiment of the invention.
As shown in Figure 1A to Fig. 1 C, in an embodiment, projection arrangement 1 of the present invention comprises housing 10, optical-mechanical system 20 and multiple fin 30, its middle shell 10 has the top board 110 and base plate 120 that be arranged in parallel, and multiple side plate 130 is around the side connecting top board 110 and base plate 120, jointly to surround accommodation space, for the projection arrangement parts such as accommodating optical-mechanical system 20 and fin 30.In this embodiment, top board 110 has multiple tops ventilation hole 112, and base plate 120 has ventilation hole of multiple ends 122, and wherein top ventilation hole 112 and end ventilation hole 122 are the gateways as gas flow.Moreover as shown in Figure 1A, side plate 130 is better also has multiple sides ventilation hole 132, to promote heat sinking benefit.In this embodiment, housing 10 is better to be made of metal, such as aluminium, but not as limit.In other embodiments, housing 10 can be made up of alloy or nonmetal (such as polymer).
In this embodiment, as shown in Figure 1B and Fig. 2 A, top board 110 is preferably waffle slab, and top board 110 forms multiple tops ventilation hole 112 by multiple rib 114a, 114b are staggered.For example, multiple rib 114a is the first side 110a parallel interval configuration along top board 110, and multiple rib 114b configure along sides adjacent (such as the second side 110b) parallel interval of the first side 110a, interweave to make multiple rib 114a, 114b and form multiple grid as top ventilation hole 112.Should be noted at this, spacing, number, width etc. between multiple rib 114a may be the same or different spacing, number, width etc. between multiple rib 114b, and multiple rib 114a, 114b can otherwise be staggered to form top ventilation hole.In this embodiment, the bearing of trend of multiple rib 114a is preferably perpendicular to the first side 110a, and the bearing of trend of multiple rib 114b is preferably perpendicular to the second side 110b, to make the rectangular opening that multiple tops ventilation hole 112 is array configurations, but not as limit.In another embodiment (not shown), the bearing of trend of multiple rib 114a, 114b can accompany non-90 degree angle with the first side 110a and the second side 110b respectively, to make multiple rib 114a, 114b respectively relative to the first side 110a and the oblique extension of the second side 110b, and multiple tops ventilation hole 112 is the diamond hole of array configurations.Base plate 120 also can be interweaved by multiple rib 124a, 124b with forming the net dividing plate of end ventilation hole 122, its center rib 124a, 124b can have the configuration of rib 114a, the 114b being similar to top board 110 relative to the first side 120a of base plate 120 and the second side 120b, repeat no more in this.
Should be noted at this, top board 110 and base plate 120 are preferably and are configured to top ventilation hole 112 aligning end ventilation hole 122 at least partly, to make to push up the air duct 312 straight line connection end ventilation hole 122 of ventilation hole 112 by correspondence, as shown in Figure 1B and Fig. 2 A (in rear detailed description).In other words, top ventilation hole 112 and end ventilation hole 122 can have identical or different shape, size or number, are not limited with shown in embodiment.For example, in other embodiments, top ventilation hole 112 can for being formed at multiple openings of top board 110, and end ventilation hole 122 can for being formed at multiple openings of base plate 120, and opening shape can be circle, rectangle or any suitable geometry or non-regular shape.
As shown in Figure 1B, Fig. 1 C and Fig. 2 B, optical-mechanical system 20 to be arranged in housing 10 and between top board 110 and base plate 120.Specifically, optical-mechanical system 20 comprises light source module 210, imaging modules 220 and light transmission part 230, and wherein imaging modules 220 is arranged at the side of light source module 210, and light transmission part 230 is connected between light source module 210 and imaging modules 220.In this embodiment, light transmission part 230 can be photoconductive tube, light guide pillar or other elements for transmission ray, and light source module 210, imaging modules 220 and light transmission part 230 are configured to L shape, but not as limit.In other embodiments, according to design requirement, light source module 210, imaging modules 220 and light transmission part 230 can be configured to straight line or any suitable shape.Light source module 210 by light transmission part 230 by light transmission to imaging modules 220, and ray cast is formed image according to image data process light by imaging modules 220 outside housing 10.
Specifically, light source module 210 comprises multiple luminescence unit 212a, 212b, 212c and mixed light unit 214, and wherein luminescence unit 212a, 212b, 212c is arranged at mixed light unit 214 around, and emits beam to mixed light unit 214.In this embodiment, the side of mixed light unit 214 connects light transmission part 230, and luminescence unit 212a, 212b, 212c be arranged at respectively mixed light unit 214 not homonymy (such as its excess-three side) and there is to mixed light unit 214 injection the light of different colours or wavelength.Mixed light unit 214 accept and mixed luminescence unit 212a, 212b, 212c injection light and to light transmission part 230 export mixing light (such as white light).In this embodiment, luminescence unit 212a, 212b, 212c are better is respectively the light-emitting diode exporting red, green, blue coloured light line, but not as limit.In other embodiments, luminescence unit 212a, 212b, 212c can be the light-emitting diode sending white or other colors (or wavelength) light.Imaging modules 220 comprises lens unit 222 and image formation optical unit 224, wherein image formation optical unit 224 connects light transmission part 230 to accept light, and obtain corresponding target light according to image data process light, then form image by target light is projeced into outside housing 10 by lens unit 222.In an embodiment, image formation optical unit 224 comprises digital micro-mirror device (DigitalMicromirrorDevice, DMD) 224a, and it controls micro mirror to form image according to image signal.
As shown in Figure 1B and Fig. 1 C, multiple fin 30 is arranged at around optical-mechanical system 20, and wherein multiple fin 30 respectively has multiple radiating fin 310, and forms multiple air duct 312 between multiple radiating fin 310.As mentioned above, multiple fin 30 is arranged so that multiple tops ventilation hole 112 is via multiple air duct 312 straight line connection accordingly ventilation hole of multiple ends 122.See Fig. 1 C, multiple fin 30 comprises the first fin 30a, the second fin 30b and the 3rd fin 30c, wherein the first fin 30a, the second fin 30b and the 3rd fin 30c are arranged at three sides of light source module 210 respectively, namely corresponding luminescence unit 212a, 212b, 212c are arranged at three sides of mixed light unit 214 respectively, to make multiple radiating fin 310 respectively along side configured in parallel corresponding in three sides of mixed light unit 214, and radiating fin 310 is that mixed light unit 214 extends dorsad.By this, air duct 312 is also along three side configurations of mixed light unit 214, and each air duct 312 is communicated with corresponding top ventilation hole 112 and end ventilation hole 122.From another viewpoint, multiple radiating fin 310 stands between top board 110 and base plate 120, and when being watched towards base plate 120 by the top ventilation hole 112 of top board 110, can see through base plate 120 via corresponding air duct 312 and end ventilation hole 122.In other words, the top ventilation hole 112 of top board 110, the air duct 312 of correspondence and end ventilation hole 122 are runners that formation straight line runs through housing 10.By this, projection arrangement 1 can reach effective heat radiation by the free convection of air.
As shown in Figure 1 C, in an embodiment, multiple luminescence unit 212a, 212b, 212c are preferably and are attached at multiple fin (such as the first fin 30a, the second fin 30b and the 3rd fin 30c) respectively.In other words, luminescence unit 212a, 212b, 212c are better is attached to fin 30 back on the surface of the side of radiating fin 310, to promote heat sinking benefit by its substrate.
Moreover as shown in Figure 3A, multiple thermal insulation barriers 140 can be arranged at the outer surface of top board 110, think that user provides effect of heat insulation.Specifically, thermal insulation barriers 140 and top board 110 are made up of different materials, and compared to top board 110, thermal insulation barriers 140 has preferably effect of heat insulation.In this embodiment, thermal insulation barriers 140 is preferably flexible material (such as silica gel), thinks that user provides preferably sense of touch and effect of heat insulation.In an embodiment, as shown in Figure 3 B, thermal insulation barriers 140 is strip and is attached at the surface of rib 114a.In another embodiment, as shown in Figure 3 C, the outer surface of top board 110 has multiple groove 116, and thermal insulation barriers 140 is inserted in groove 116.For example, groove 116 is formed at the surface of rib 114a ' and the length direction along rib 114a ' extends, and groove 116 is inserted in the bottom of strip thermal insulation barriers 140, makes thermal insulation barriers 140 protrude from the surface of top board 110 (i.e. rib 114a ').When projection arrangement 1 by fin 30 and natural convection effect by thermal conductance to housing 10 time, by the setting of thermal insulation barriers 140, the top board 110 that the direct Contact Temperature of user is higher can be avoided, and preferably sense of touch is provided simultaneously.
In addition, in an embodiment, as shown in Figure 1B, Fig. 1 C and Fig. 2 A, projection arrangement of the present invention separately comprises auxiliary heat dissipation sheet 32, and auxiliary heat dissipation sheet 32 has multiple radiating fin 320.Auxiliary heat dissipation sheet 32 is preferably corresponding imaging modules 220 and arranges, and the digital micro-mirror device 224a of especially corresponding imaging modules 220 is arranged.In this embodiment, auxiliary heat dissipation sheet 32 is the tops being arranged at imaging modules 224, such as be positioned at the top of image-generating unit 224, or further part extends to lens unit 222 top, and digital micro-mirror device 224a is preferably the top that is arranged at imaging modules 220 and is attached at auxiliary heat dissipation sheet 32.In other words, digital micro-mirror device 224a is preferably the top being arranged at image-generating unit 224, and is attached to fin 32 back on the surface of the side of radiating fin 320 by its substrate.In this embodiment, multiple radiating fins 320 of auxiliary heat dissipation sheet 32 are configured in parallel and extend to form multiple secondary ventilation road 322 towards top board 110.Should be noted at this, the top ventilation hole 112 of top board 110, the better also corresponding auxiliary heat dissipation sheet 32 of the side ventilation hole 132 of side plate 130 are arranged, and make top ventilation hole 112, side ventilation hole 132, secondary ventilation road 322 can form radiating flow passage, to promote heat sinking benefit.
Moreover projection arrangement separately comprises at least one and extends fin 34, and wherein extending fin 34 is extend towards base plate 120 from the side of auxiliary heat dissipation sheet 32, to be positioned at the side of imaging modules 220.Extend fin 34 and there is multiple radiating fin 340, extending multiple radiating fins 340 of fin 34 is along the side configured in parallel of imaging modules 220 to form multiple extension air duct 342, wherein multiple extension air duct 342 accordingly straight line be communicated with at least one of them and the ventilation hole of multiple ends 122 of multiple tops ventilation hole 112 at least one of them.That is, be similar to above-mentioned, the top ventilation hole 112 of top board 110 and the better also corresponding extension fin 34 of the end ventilation hole 122 of base plate 120 are arranged, and make to push up the extension air duct 342 straight line connection end ventilation hole 122 of ventilation hole 112 by correspondence, to form the runner of free convection.In this embodiment, extend fin 34 and be preferably from the both sides of auxiliary heat dissipation sheet 32 to downward-extension, and " ㄇ shape " fin integrated with auxiliary heat dissipation sheet 32, but not as limit.In this embodiment, be positioned at the extension fin 34 of " ㄇ shape " fin both sides, its radiating fin 340 extends dorsad, to extend towards side plate 130 and light source module 210 respectively.In other embodiments, according to configuration space, radiating requirements etc., extending fin 34 can to downward-extension more than the one-sided of auxiliary heat dissipation sheet 32 or both sides, with the fin of " the L shape " that integrate with auxiliary heat dissipation sheet 32 or other shapes.Should be noted at this, extension fin 34 and auxiliary heat dissipation sheet 32 are preferably integrally formed fin, but also can be the fin of separation.When extending fin 34 and auxiliary heat dissipation sheet 32 integrates, the extension radiating fin 340 of fin 34 and the radiating fin 320 of auxiliary heat dissipation sheet 32 are preferably and are arranged so that extending heat dissipation channel 342 difference correspondence is communicated with auxiliary heat dissipation passage 322, but not as limit.In addition, extend the length that fin 34 extends along auxiliary heat dissipation sheet 32 side, may be the same or different the length in this side of auxiliary heat dissipation sheet 32, be not limited with shown in embodiment.For example, when auxiliary heat dissipation sheet 32 is only arranged at the top of image-generating unit 224, extends the side that fin 34 only can be positioned at image-generating unit 224, also can extend to the side of camera lens module 222 further.Or, when auxiliary heat dissipation sheet 32 is arranged at the top of image-generating unit 224 and extends to the top of camera lens module 222, extend fin 34 can be positioned at the side of image-generating unit 224 and extend to the side of camera lens module 222, also only can be positioned at the side of image-generating unit 224.
Moreover projection arrangement of the present invention separately can by the configuration of optimization circuits plate, to reduce the impact of thermal effect.Specifically, projection arrangement of the present invention separately comprises multiple circuit board (such as 410,420,430), and wherein each circuit board has different temperature/power.The present invention can carry out optimization configuration, to reduce the impact of thermal effect according to the temperature of each circuit board/power height.As shown in fig. 4 a and fig. 4b, in an embodiment, projection arrangement separately comprises circuit board 410,420, and wherein circuit board 410 is arranged at below light source module 210, and circuit board 420 be arranged at imaging modules 220 side and away from circuit board 410 and light source module 210.For example, circuit board 410 is main circuit board, and circuit board 420 is power supply circuit plate, and wherein temperature/the power of power supply circuit plate 420 is higher than the temperature/power of main circuit board 410.In this embodiment, relative to base plate 120, main circuit board 410 is horizontally placed on the below of light source module 210, and power supply circuit plate 420 is uprightly arranged at the side of imaging modules 220.By this, multiple circuit boards 410,420 of decentralized configuration projection arrangement 1, especially place independent for circuit board (such as power supply circuit plate 420) higher for temperature/power, the heat that circuit board 410,420 can be avoided to produce concentrates on same position (such as near light source module 210) and aggravates the impact of thermal effect.
As shown in fig. 4 a and fig. 4b, in this embodiment, extension fin 34 is preferably and is arranged between circuit board 420 and imaging modules 220, with isolating circuit plate 420 and imaging modules 220.That is extending fin 34 is extend towards the bottom direction of imaging modules 220 from the side of fin 32, to be parallel to circuit board 420 and between circuit board 420 and imaging modules 220.In this embodiment, extending the radiating fin 340 of fin 34 is extend towards circuit board 420, and the higher element of the temperature/power of circuit board 420 is preferably towards side plate 130, and the lower element of the temperature/power of circuit board 420 is then towards radiating fin 340.Should be noted at this, the top ventilation hole 112 of top board 110 and the better also corresponding extension fin 34 of the end ventilation hole 122 of base plate 120 are arranged, make to push up the air duct 342 straight line connection end ventilation hole 122 of ventilation hole 112 by correspondence, to form the runner (related description with reference to Figure 1B) of free convection.
In another embodiment, projection arrangement is the configuration that the heat sensitivity of the electronic component had according to temperature/power height or the circuit board of circuit board makes differing heights, wherein multiple circuit board is sequentially stacked according to the heat sensitivity of the height of temperature/power or its electronic component, more has lower temperature/power close to the circuit board of base plate or the electronic component that more has close to the circuit board of base plate is more easily influenced by heat.As shown in Figure 5A, multiple circuit boards 410,430 are arranged at the below of light source module 210, and parallel mat 120, and wherein temperature/the power of circuit board 410 is lower than the temperature/power of circuit board 430.For example, circuit board 410 is the main circuit boards for controlling projector's running, and circuit board 430 is the drive circuit board of driving light source, wherein main circuit board 410 is arranged at below light source module 210, and drive circuit board 430 is arranged between main circuit board 410 and light source module 210.As shown in Fig. 5 A and Fig. 5 B, projection arrangement separately comprises metal heat-conducting piece 50, and wherein metal heat-conducting piece 50 comprises body 510 and extension 520.Body 510 is surfaces that essence is covered in circuit board 410,430, and extension 520 is the sides extending circuit board 410,430 from body 510 bending.In an embodiment, metal heat-conducting piece 50 can be bent by aluminium sheet and form, and wherein extension 520 is preferably smooth fin (such as the second fin 30b), and the heat energy produced to make circuit board is conducted to fin 30b.
Moreover, as shown in Figure 5 B, circuit board 410 has the electronic component 412 of lower heat sensitivity, and circuit board 430 has the electronic component 432 of higher thermal susceptibility, and metal heat-conducting piece 50 is inserted between circuit board 410 and 430, wherein electronic component 412,432 is respectively in the face of the apparent surface of the body 510 of metal heat-conducting piece 50.Should be noted at this, the electronic component 412 of low heat sensitivity refers to the electronic component be more easily influenced by heat, and the electronic component 432 of high heat sensitivity refers to the electronic component be more not easily influenced by heat.That is, when multiple circuit board is stacked arrange time, the circuit board with the electronic component be more easily influenced by heat is preferably and is arranged at more below, and the circuit board with the electronic component be more not easily influenced by heat be preferably be arranged at more top, more can operate in normal temperature to make low heat sensitivity electronic component.Projection arrangement separately comprises Heat Conduction Material 60 (such as heat-conducting glue), wherein Heat Conduction Material 60 is filled between circuit board 410 and body 510 and/or Heat Conduction Material 60 is filled between circuit board 430 and body 510, to promote heat via metal heat-conducting piece 50 heat conduction to fin 30b.Should be noted at this, Fig. 5 A, though illustrate metal heat-conducting piece 50 to have an extension 520, and in order to attach fin 30b, this is not limited.In other embodiments, metal heat-conducting piece can have the extension of one or more bending, and extension can be attached at identical or different fin (such as 30a, 30b, 30c).In addition, the overbending direction of extension 520 can change according to design requirement, is not limited upwards to bend.In other embodiments, extension 520 can form from body 510 bending downwards.Moreover in this embodiment, though the surface of body 510 of display metal heat-conducting piece 50 is plane, but in other embodiments, body 510 according to the electronic component-sized of circuit board, the position being arranged at its both sides, and can have corresponding concavo-convex surface.Moreover, though it is stacked only to illustrate two circuit boards (such as 410,430) in the present embodiment, not as limit.In other embodiments (not illustrating), when projection arrangement comprises plural circuit board (such as 410,410,430), multiple circuit board 410,420,430 also can be sequentially stacked according to the height of temperature/power, circuit board more close to base plate has lower temperature/power, the main circuit board 410 that such as temperature/power is minimum is positioned at closest to base plate, temperature/power time high drive circuit board 430 is stacked and placed on main circuit board 410, and on the relatively the highest stacked drive circuit board 430 of power supply circuit plate 420 of temperature/power.Projection arrangement of the present invention is by circuit board higher for temperature/power being arranged at more top, and the lower circuit board of temperature/power is arranged at more below, low temperature/lower powered circuit board can be made not heated by the circuit board of high temperature/high-capacity, and Low Temperature Thermal susceptibility element more can be operated in normal temperature, and reach optimized convection current configuration.
Moreover as shown in Figure 6, in another embodiment, projection arrangement of the present invention is stacked by the height by circuit board decentralized configuration and according to temperature/power, thermal effect impact can be improved further.In this embodiment, the circuit board 420 that temperature/power is the highest is preferably the side being arranged at image-generating unit 224, and the relatively low better height according to temperature/power of circuit board 410 and 430 of temperature/power is arranged at the below of light source module 210.Embodiment with reference to figure 4B and Fig. 5 A illustrates, power supply circuit plate 420 has the highest temperature/power, drive circuit board 430 has secondary high temperature/power, and main circuit board 410 has relatively minimum temperature and power.In this embodiment, power supply circuit plate 420 be arranged at image-generating unit 224 side and away from light source module 210, and separate with imaging modules 220 by extension fin 34, and main circuit board 420 is arranged at below mixed light unit 214 and comparatively close to base plate 120, drive circuit board 430 is arranged between main circuit board 420 and mixed light unit 214.
In another embodiment, as shown in figs. 7 a and 7b, multiple circuit board (such as 410a, 410b, 420,430) is the side being arranged at optical-mechanical system 20, wherein multiple circuit board 410a, 410b, 420,430 are upright settings relative to base plate 120, with make multiple tops ventilation hole 112 at least one of them be by multiple circuit board 410a, 410b, 420,430 other space lines be communicated with ventilation hole of multiple ends 122 at least one of them.Specifically, in response to spatial limitation and radiating requirements, multiple circuit board 410a, 410b, 420,430 are preferably the side being arranged at imaging modules 220, and away from light source module 210.Moreover, in this embodiment, the control unit of I/O (I/O) unit and main circuit board independently can be designed, to form master control circuit board (such as 410a) and input/output circuitry plate (such as 410b).In this embodiment, drive circuit board 430 is preferably and is arranged at image-generating unit 224 and arranges relative to the opposite side of lens unit 222, and master control circuit board 410a, input/output circuitry plate 410b, power supply circuit plate 420 are preferably and arrange in the opposite side interval of image-generating unit 224 relative to light source module 210.
Should be noted at this, be configured to image-generating unit 224 dorsad vertically extend, not as limit though Fig. 7 A and Fig. 7 B illustrates circuit board 430.In other embodiments, circuit board 430 can be configured to the side horizontal-extending of parallel imaging unit 224.Moreover, when multiple circuit board 410a, 410b, 420,430 intervals uprightly arrange time, the circuit board (such as power supply circuit plate 420) that temperature/power is higher is preferably and is arranged at outermost (or farthest away from imaging modules 220 place), and the side ventilation hole 132 of side plate 130 faced by the better electronic component made on it.In this embodiment, input/output circuitry plate 410b is arranged between master control circuit board 410a and power supply circuit plate 420, and input/output circuitry plate 410b and power supply circuit plate 420 are opposing settings, make the electronic component on it towards opposing direction.Master control circuit board 410a is arranged so that the radiating fin 340 of the electronic component on it towards extension fin 34.In this embodiment, the normal direction that circuit board 410a, 410b, 420,430 arrange the plate face of electronic component is perpendicular to top board 110 and base plate 120 normal to a surface direction.By this, make between circuit board 410a, 410b, 420,430, to form the air duct be similar between radiating fin 310.In this embodiment, the top ventilation hole 112 of top board 110 and the end ventilation hole 122 of base plate 120 also corresponding circuits plate 410a, 410b, 420,430 are arranged, make to push up ventilation hole 112 and be communicated with end ventilation hole 122, to form the runner of free convection by the space line by circuit board 410a, 410b, 420,430.
Moreover when projection arrangement is arranged at higher temperature environment or want to strengthen the intensity of light source, projection arrangement of the present invention can be equipped with fan further with improving heat radiation efficiency.In another embodiment, as shown in Fig. 8 A and Fig. 8 B, projection arrangement can comprise fan 70 and diversion member 80 further, and its fan 70 is arranged at base plate 120 and provides air-flow, and the corresponding fan of diversion member 80 70 arranges the multiple air ducts 312 air-flow to be imported fin 30.That is diversion member 80 and radiating fin 310 are arranged at the same side of fin 30, and fan 70 is arranged at the opposite side of fin 30.Specifically, fan 70 can be blowing machine type fan, and the angle in the inspiratory direction of fan 70 and air feed direction about 90 degree.In this embodiment, fan 70 sucks air-flow (i.e. air) from the direction of vertical base plate 120, and provides air-flow to diversion member 80 from the direction of parallel mat 120.That is fan 70 provides air-flow vertical with multiple air duct 312 in fact, and air-flow is imported multiple air duct 312 in the mode of the multiple air duct of out of plumb 312 in fact by diversion member 80.Moreover, the multiple fin 30 of the better correspondence of fan 70 enclose scope center arrange.In this embodiment, fan 70 is better arrange three fin 30a ~ 30c enclose the center of scope, that is fan 70 correspondence is arranged at the base plate 120 below light source module 210.The better corresponding fan 70 of diversion member 80 arranges and couples multiple fin 30a ~ 30c, enters multiple air duct 312 with the air-flow provided by fan 70 with essence miter angle direction.In this embodiment, as shown in Figure 8 A, diversion member 80 couples with fin 30a ~ 30c respectively, is trapped among ㄇ shape baffle liner around fan 70 to form essence, but not as limit.
In an embodiment, as shown in Figure 9 A, diversion member 80 comprises multiple flow deflector 810, and be respectively provided with at least one flow deflector 810 in multiple air duct 312, wherein each flow deflector 810 is coupled to the radiating fin 310 adjacent with corresponding air duct 312, and the air-flow provided to make fan 70 enters multiple air ducts 312 of fin 30a ~ 30c with essence miter angle direction.Flow deflector 810 can be fixed on radiating fin 310, to make in the air duct 312 of flow deflector 810 between two adjacent heat radiation fin 310 by modes such as adhesion, engagings.The position that flow deflector 810 is arranged at air duct 312 is better close to fan 70 and close to air duct 312 bottom, makes to export from fan 70 air-flow provided and more early can contact flow deflector 810 and then promote water conservancy diversion effect.In an embodiment, as shown in Figure 9 A, flow deflector 810 predetermined inclination or angle of bend can be adhered to the relative wall of two adjacent heat radiation fin 310, and fan 70 is provided distinguished and admirable encounter flow deflector 810 after, guiding by flow deflector 810 is better enters air duct 312 with essence miter angle direction, uses the heat and improving heat radiation efficiency of taking away radiating fin 310.In another embodiment, as shown in Figure 9 B, flow deflector 810 can have holding section 812, and radiating fin 310 can have connecting hole 310a, makes flow deflector 810 be positioned radiating fin 310 by holding section 812 with the engaging of connecting hole 310a.Should be noted at this, though Fig. 9 B illustrates flow deflector 810 both sides respectively have a holding section 812 to engage, not as limit with the corresponding connecting hole 310a of each side radiating fin 310.In other embodiments, the each side of flow deflector 810 can arrange multiple holding section 812, and radiating fin 310 has corresponding multiple connecting hole 310a, wherein multiple connecting hole 310a can be distributed in the appropriate location of radiating fin 310 according to the inclination of flow deflector 810 or bending demand, possesses required inclination or curved shape to make flow deflector 810.
Moreover, though the embodiment of Fig. 9 A and Fig. 9 B illustrates each air duct 312 arrange a flow deflector 810, not as limit.In another embodiment, as shown in Figure 9 C, single ventilation road 312 can be provided with at least two flow deflectors (such as three flow deflectors 810a, 810b, 810c), wherein flow deflector 810a, 810b, 810c is arranged along wind direction, and from fan 70 more close to the setting position higher (namely more close to top board 110) of flow deflector 810a.For example, three flow deflectors 810a, 810b, 810c are staged configuration along the air-out direction W of fan 70, flow deflector 810a arranges from base plate 120 farthest (namely position is the highest) closest to fan 70, flow deflector 810c is arranged from base plate 120 recently (namely position is minimum) farthest from fan 70, and flow deflector 810b is then arranged between flow deflector 810a and flow deflector 810c.
Moreover multiple flow deflectors 810 can be the flow deflector of separation, each flow deflector 810 is inserted in the air duct 312 between adjacent heat radiation fin 310 respectively, but not as limit, can be integrated into the combination of single flow deflector in the multiple flow deflector of other embodiments 810.In another embodiment, as shown in Figure 10, diversion member 80 separately comprises brace 820, and multiple flow deflector 810 is connected to the same side of brace 820 and interval is arranged.Specifically, the better essence of width D w of flow deflector 810 equals the width of air duct 312, and the interval G between adjacent baffle 810 is the thickness of radiating fin 310, but not as limit.In other embodiments, the width D w of flow deflector 810 can be slightly less than the width of air duct 312, and the interval G between adjacent baffle 810 can slightly larger than the thickness of radiating fin 310.In this embodiment, make multiple flow deflector 810 connect into the diversion member 80 of monolithic by brace 820, the assembly program of diversion member 80 and fin 30 can be simplified, promote packaging efficiency.
In another embodiment, as shown in FIG. Figure 11 A and 11 B, diversion member 80A is arc flow deflector, and arc flow deflector has multiple coupling aperture 830 to couple multiple radiating fins 310 of fin 30 respectively.Specifically, diversion member 80A is the sheet material of full wafer, and the position of the corresponding radiating fin 310 of multiple coupling aperture 830 and thickness are offered, to make each radiating fin 310 can in coupling aperture 830 corresponding to partial insertion.Should be noted at this, the width Ow of coupling aperture 830 is better to be equaled or slightly larger than the thickness of radiating fin 310, and the length OL of coupling aperture 830 can change according to the inclination of diversion member 80A or bending demand.In addition, the diversion member 80A of arc water conservancy diversion chip also can form above-mentioned holding section 812 in the two side in coupling aperture 830, and to engage with the connecting hole 310a of radiating fin 310, and then location diversion member 80A is in fin 30.
Such as, moreover the heat dissipation design of projection arrangement of the present invention can be applicable to other electronic installations needing because having thermal source to dispel the heat, and desktop/notebook computer etc., are not limited to projection arrangement.In an embodiment, as shown in figure 12, electronic installation 90 can comprise thermal source 910, at least one fin 920, fan 930 and diversion member 940.At least one fin 920 is arranged at around thermal source 910, and wherein fin 920 has multiple radiating fin 922, and forms multiple air duct 924 between multiple radiating fin 922.The corresponding fin 920 of fan 930 is arranged, to provide air-flow vertical with multiple air duct 924 in fact.The corresponding fan 930 of diversion member 940 is arranged, so that air-flow is imported multiple air duct 924 in the mode of the multiple air duct of out of plumb 924 in fact.For example, when being applied to computer, thermal source 910 can be central processing unit, and at least one fin 920, fan 930 and diversion member 940 can have with optical-mechanical system in above-mentioned projection arrangement 20 (especially light source module 210) is fin during thermal source 30, the similar configuration of fan 70 and diversion member 80 (or 80A).That is fan 930 sucks air-flow (i.e. air) outside electronic installation 90, and be parallel to the direction suction air-flow of multiple air duct 924 with essence and provide air-flow to diversion member 940.Specifically, fan 930 sucks the direction Wi of air-flow and provides the direction Wo of air-flow about to accompany an angle of 90 degrees, and diversion member 940 can have arbitrary form of implementation of above-mentioned Fig. 9 A ~ Figure 11 B, accompany with the air-flow provided by fan 930 guiding and inhaling air flow path direction Wi the guiding direction Wh being less than an angle of 90 degrees (being preferably miter angle) and enter air duct 924 between radiating fin 922.Should be noted at this, each component details and the configuration of electronic installation 90 with reference to the related description of above-mentioned projection arrangement embodiment, can repeat no more in this.
Compared to prior art, the top ventilation hole of projection arrangement of the present invention by housing and the upright configuration of end ventilation hole cooperation fin, high efficiency Natural Heat Convection mechanism can be reached, significantly to reduce the rotating speed of fan or even to exempt the use of fan, and then the noise produced when reducing fan running.Moreover projection arrangement of the present invention, has the setting of the design of optimized circuit board arrangement and metal heat-conducting piece, can reduce the impact of thermal effect, lifting device function.In addition, projection arrangement of the present invention can coordinate the design of fan and diversion member, and with further improving heat radiation efficiency, and heat dissipation design of the present invention not only can be applicable to projection arrangement, more can be applicable to any there is thermal source and need dispel the heat electronic installation.
The present invention is described by above-mentioned related embodiment, but above-described embodiment is only enforcement example of the present invention.Must it is noted that the embodiment disclosed limit the scope of the invention.On the contrary, change done without departing from the spirit and scope of the present invention and retouching, all belong to scope of patent protection of the present invention.
Claims (10)
1. an electronic installation, is characterized in that, comprises:
Thermal source;
At least one fin, is arranged at around this thermal source, and this at least one fin respectively has multiple radiating fin, wherein forms multiple air duct between the plurality of radiating fin;
Fan, to arranging, to provide the air-flow vertical with the plurality of air duct by least one fin; And
Diversion member, to arranging, so that this air-flow is imported the plurality of air duct in the mode of the plurality of air duct of out of plumb by fan.
2. electronic installation as claimed in claim 1, it is characterized in that, this fan sucks this air-flow outward from this electronic installation, and sucks this air-flow with the direction being parallel to the plurality of air duct and provide this air-flow to this diversion member.
3. electronic installation as claimed in claim 1, it is characterized in that, this diversion member comprises multiple flow deflector, respectively be provided with at least one flow deflector in the plurality of flow deflector in the plurality of air duct, and the plurality of flow deflector is respectively coupled to the plurality of radiating fin adjacent with corresponding the plurality of air duct.
4. electronic installation as claimed in claim 3, it is characterized in that, this diversion member separately comprises a connecting piece, and the plurality of flow deflector is connected to the same side of this brace and interval is arranged.
5. electronic installation as claimed in claim 3, it is characterized in that, at least one of them is provided with at least two these flow deflectors in the plurality of flow deflector to the plurality of air duct, and these at least two flow deflectors are along the stepped setting of wind direction of this fan.
6. electronic installation as claimed in claim 1, it is characterized in that, this diversion member is arc flow deflector, and this arc flow deflector has multiple coupling aperture to couple the plurality of radiating fin of the plurality of fin respectively.
7. electronic installation as claimed in claim 1, it is characterized in that, this electronic installation is projection arrangement, and this thermal source is optical-mechanical system.
8. electronic installation as claimed in claim 1, it is characterized in that, this diversion member couples this at least one fin, makes this air-flow enter the plurality of air duct with miter angle direction.
9. electronic installation as claimed in claim 1, it is characterized in that, also comprise: housing, this housing has top board and base plate, and this top board has multiple tops ventilation hole, and this base plate has ventilation hole of multiple ends; The plurality of top ventilation hole is via the plurality of air duct straight line connection accordingly ventilation hole of the plurality of end.
10. electronic installation as claimed in claim 1, it is characterized in that, this fan is arranged at the opposite side of this at least one fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510506079.XA CN105072873B (en) | 2015-05-12 | 2015-08-18 | Electronic installation |
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| CN2015102378917 | 2015-05-12 | ||
| CN201510237891.7A CN104834167A (en) | 2015-05-12 | 2015-05-12 | Projection device |
| CN201510506079.XA CN105072873B (en) | 2015-05-12 | 2015-08-18 | Electronic installation |
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| CN105072873A true CN105072873A (en) | 2015-11-18 |
| CN105072873B CN105072873B (en) | 2017-09-29 |
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| CN201510237891.7A Pending CN104834167A (en) | 2015-05-12 | 2015-05-12 | Projection device |
| CN201510506079.XA Active CN105072873B (en) | 2015-05-12 | 2015-08-18 | Electronic installation |
| CN201510507599.2A Active CN105159018B (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
| CN201810089613.5A Pending CN108490723A (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
| CN201810088972.9A Pending CN108445699A (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
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| CN201510507599.2A Active CN105159018B (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
| CN201810089613.5A Pending CN108490723A (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
| CN201810088972.9A Pending CN108445699A (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN110687739A (en) * | 2019-10-31 | 2020-01-14 | 青岛海信激光显示股份有限公司 | Laser projection device |
| JP7528735B2 (en) | 2020-11-17 | 2024-08-06 | 株式会社リコー | Image Projection Device |
| CN113050352B (en) * | 2021-03-09 | 2022-04-22 | 深圳市火乐科技发展有限公司 | Radiator for DMD chip and projection equipment |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000126874A (en) * | 1998-07-09 | 2000-05-09 | Georg Fischer Rohrleitungssyst Ag | Housing unit |
| US7172017B2 (en) * | 2002-07-16 | 2007-02-06 | Delta Electronics, Inc. | Heat sink |
| CN201115248Y (en) * | 2007-09-14 | 2008-09-10 | 杭州华三通信技术有限公司 | A heat radiator |
| US7539017B2 (en) * | 2003-03-27 | 2009-05-26 | Kuo Ta Chang | Heat dissipating device for central processor |
| CN101620368A (en) * | 2008-07-04 | 2010-01-06 | 富准精密工业(深圳)有限公司 | Projector with cooling system |
| US7766076B2 (en) * | 2007-03-23 | 2010-08-03 | Rocky Research | Spot cooler for heat generating electronic components |
| CN201556020U (en) * | 2009-11-13 | 2010-08-18 | 鑫亿光电(深圳)有限公司 | Optical engine cooling device of micro projector |
| CN201600540U (en) * | 2009-12-04 | 2010-10-06 | 彩亿科技(深圳)有限公司 | Cooling device of mini projector optical engine |
| CN101963743A (en) * | 2009-07-24 | 2011-02-02 | 鸿富锦精密工业（深圳）有限公司 | Projector |
| TW201116982A (en) * | 2009-11-13 | 2011-05-16 | Sunonwealth Electr Mach Ind Co | Cooling module |
| CN202600344U (en) * | 2012-04-10 | 2012-12-12 | 星盛光电股份有限公司 | Heat-dissipating module structure for projection device |
Family Cites Families (72)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5077601A (en) * | 1988-09-09 | 1991-12-31 | Hitachi, Ltd. | Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system |
| JPH08222665A (en) * | 1995-02-16 | 1996-08-30 | Fujitsu Ltd | Heat sink |
| JP3598752B2 (en) * | 1996-10-04 | 2004-12-08 | セイコーエプソン株式会社 | Projection display device |
| JPH10239774A (en) * | 1997-02-28 | 1998-09-11 | Nec Corp | Liquid crystal projector device |
| US6147411A (en) * | 1998-03-31 | 2000-11-14 | Micron Technology, Inc. | Vertical surface mount package utilizing a back-to-back semiconductor device module |
| JP3516628B2 (en) * | 2000-03-14 | 2004-04-05 | シャープ株式会社 | Transmissive liquid crystal display |
| CN1305131C (en) * | 2000-11-20 | 2007-03-14 | 英特尔公司 | High performance heat sink configurations for use in high density packaging applications |
| JP2002271074A (en) * | 2001-03-08 | 2002-09-20 | Toshiba Corp | Cooling device and electronic equipment provided with built-in cooling device |
| CN1381765A (en) * | 2001-04-16 | 2002-11-27 | 财团法人工业技术研究院 | Cooler for liquid crystal projector |
| US6479895B1 (en) * | 2001-05-18 | 2002-11-12 | Intel Corporation | High performance air cooled heat sinks used in high density packaging applications |
| KR20030025343A (en) * | 2001-09-20 | 2003-03-29 | 삼성전자주식회사 | Projection display device |
| NO317228B1 (en) * | 2002-07-01 | 2004-09-20 | Bard Eker Ind Design As | projector |
| CN2588416Y (en) * | 2002-10-31 | 2003-11-26 | 大亿科技股份有限公司 | Projector with light-shading effect |
| CN2594832Y (en) * | 2002-12-31 | 2003-12-24 | 上海华显数字影像技术有限公司 | Optical engine radiator for LCDS liquid crystal panel projectnig TV set |
| JP4454233B2 (en) * | 2003-01-30 | 2010-04-21 | 京セラ株式会社 | Optical package and optical module using the same |
| JP2004279778A (en) * | 2003-03-17 | 2004-10-07 | Seiko Epson Corp | Projector |
| JP2004354795A (en) * | 2003-05-30 | 2004-12-16 | Tochigi Nikon Corp | Projection type display device |
| US7112885B2 (en) * | 2003-07-07 | 2006-09-26 | Board Of Regents, The University Of Texas System | System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
| CN1591280A (en) * | 2003-09-01 | 2005-03-09 | 中美万泰科技股份有限公司 | Non-fan type computer device radiator |
| JP2005134858A (en) * | 2003-10-07 | 2005-05-26 | Seiko Epson Corp | Optical device and rear projector |
| US7334898B2 (en) * | 2003-10-10 | 2008-02-26 | Seiko Epson Corporation | Projector |
| US7212344B2 (en) * | 2004-02-27 | 2007-05-01 | Philips Lumileds Lighting Company, Llc | Illumination system with aligned LEDs |
| US7524084B2 (en) * | 2004-03-30 | 2009-04-28 | Sanyo Electric Co., Ltd. | Illuminating device, and projection type video display |
| JP2005345569A (en) * | 2004-05-31 | 2005-12-15 | Toshiba Corp | Projection-type image display device |
| KR20060017292A (en) * | 2004-08-20 | 2006-02-23 | 엘지전자 주식회사 | Cooler for digital micro-mirror device of optical projector |
| KR100717544B1 (en) * | 2004-12-16 | 2007-05-17 | 주식회사 현대사 | Liquid crystal project heat-emitting system |
| KR100683171B1 (en) * | 2005-03-08 | 2007-02-15 | 삼성전자주식회사 | Cooling apparatus and projector having the same |
| JP4507927B2 (en) * | 2005-03-17 | 2010-07-21 | カシオ計算機株式会社 | Projection device, ceiling hanger for projection device, and operation control method of projection device |
| CN1873522A (en) * | 2005-06-01 | 2006-12-06 | 普立尔科技股份有限公司 | Projector, and method of heat elimination |
| JP4217917B2 (en) * | 2006-03-14 | 2009-02-04 | 船井電機株式会社 | LCD television or heat sink fixing structure |
| CN2930219Y (en) * | 2006-06-20 | 2007-08-01 | 中兴通讯股份有限公司 | Heat radiator mounting device |
| JP2008003183A (en) * | 2006-06-21 | 2008-01-10 | Sony Corp | Cooling fan motor and projection display device |
| JP4703539B2 (en) * | 2006-10-31 | 2011-06-15 | 三洋電機株式会社 | projector |
| CN201039635Y (en) * | 2006-11-02 | 2008-03-19 | 华为技术有限公司 | Heat radiation structure |
| JP2008235321A (en) * | 2007-03-16 | 2008-10-02 | Matsushita Electric Ind Co Ltd | Heat conductive substrate and manufacturing method, and circuit module using the same |
| CN101275787B (en) * | 2007-03-29 | 2010-06-02 | 三洋电机株式会社 | Apparatus including freezing unit and projector including freezing unit |
| CN101308318A (en) * | 2007-05-17 | 2008-11-19 | 中强光电股份有限公司 | Light gate device |
| CN101101439B (en) * | 2007-07-25 | 2010-10-13 | 四川长虹电器股份有限公司 | Projector heat radiation-treatment wind-guiding device |
| JP2009038144A (en) * | 2007-07-31 | 2009-02-19 | Sony Corp | Shield case and electronic component unit |
| CN101498886B (en) * | 2008-01-29 | 2010-09-29 | 佳世达科技股份有限公司 | Image forming apparatus capable of regulating light shielding rate of radiating hole according to external environment brightness |
| JP5062014B2 (en) * | 2008-04-17 | 2012-10-31 | セイコーエプソン株式会社 | Electronic circuit module, power supply device, projector |
| US20110032489A1 (en) * | 2008-06-13 | 2011-02-10 | Takayuki Kimoto | Image display device |
| JP5237012B2 (en) * | 2008-07-30 | 2013-07-17 | 日本電気株式会社 | Heating part cooling device and liquid crystal projector device |
| JP2010087031A (en) * | 2008-09-29 | 2010-04-15 | Tdk-Lambda Corp | Electronic apparatus |
| CN101726974B (en) * | 2008-10-20 | 2011-11-09 | 鸿富锦精密工业（深圳）有限公司 | Projector |
| CN101726973B (en) * | 2008-10-20 | 2011-06-22 | 鸿富锦精密工业（深圳）有限公司 | Projector |
| EP2247172B1 (en) * | 2009-04-27 | 2013-01-30 | Siemens Aktiengesellschaft | Cooling system, cooling board and assembly with cooling system |
| KR101079105B1 (en) * | 2009-04-30 | 2011-11-02 | 엘지전자 주식회사 | Image Projecting Apparatus |
| CN201440780U (en) * | 2009-05-22 | 2010-04-21 | 英业达股份有限公司 | Fixing device |
| EP2450620A1 (en) * | 2009-07-02 | 2012-05-09 | CCS Inc. | Light-source device |
| CN101644878B (en) * | 2009-09-03 | 2012-01-04 | 苏州佳世达光电有限公司 | Projecting device |
| CN101848627A (en) * | 2010-02-10 | 2010-09-29 | 苏州佳世达光电有限公司 | Electronic device and projecting camera |
| CN101986199B (en) * | 2010-07-19 | 2012-09-26 | 深圳雅图数字视频技术有限公司 | Heat pipe cooling system for liquid crystal on silicon (LCOS) projector |
| CN102455762A (en) * | 2010-10-26 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Mainboard and electronic device equipped with same |
| CN102467200A (en) * | 2010-11-12 | 2012-05-23 | 英业达股份有限公司 | Server cabinet |
| CN101995747A (en) * | 2010-12-14 | 2011-03-30 | 天津爱安特科技股份有限公司 | Heat radiation system for 3 liquid crystal display (LCD) projectors by adopting three LED lamp panels as light source |
| JP5614542B2 (en) * | 2011-03-28 | 2014-10-29 | 株式会社安川電機 | Motor control device |
| TWM438667U (en) * | 2011-09-14 | 2012-10-01 | Hwa Best Optoelectronics Co Ltd | Mini optical image device |
| CN103037664A (en) * | 2011-10-06 | 2013-04-10 | 鸿富锦精密工业（深圳）有限公司 | Radiating device and electronic device using same |
| CN103153021A (en) * | 2011-12-07 | 2013-06-12 | 鸿富锦精密工业（深圳）有限公司 | Electronic device and wind guide cover thereof |
| WO2013147068A1 (en) * | 2012-03-30 | 2013-10-03 | 株式会社Ｊｖｃケンウッド | Projection device |
| CN202613540U (en) * | 2012-05-04 | 2012-12-19 | 米技电子电器(上海)有限公司 | Improved heat dissipating structure of commercial induction cooker |
| TWM447998U (en) * | 2012-06-28 | 2013-03-01 | Hwa Best Optoelectronics Co Ltd | Mini optical image device |
| CN203026618U (en) * | 2012-11-02 | 2013-06-26 | 许昌学院电气信息工程学院 | Novel power storage battery activating instrument device |
| JP6413362B2 (en) * | 2013-06-21 | 2018-10-31 | 日亜化学工業株式会社 | Light source device and optical engine using light source device |
| CN103399451B (en) * | 2013-08-16 | 2015-09-16 | 深圳市帅映科技有限公司 | A kind of laser projection |
| CN103763874A (en) * | 2013-11-26 | 2014-04-30 | 四川蓝讯宝迩电子科技有限公司 | Heat-dissipation installation box of circuit board |
| KR101403554B1 (en) * | 2014-04-04 | 2014-06-09 | (주)디에이치씨 | Heat sink unit equipped type printed circuit board with excellent heat dissapation efficiency and stack package having the same |
| CN104460195A (en) * | 2014-11-24 | 2015-03-25 | 天津市君威科技发展有限公司 | Small projector |
| CN104582438A (en) * | 2014-12-25 | 2015-04-29 | 苏州佳世达光电有限公司 | Cooling structure |
| CN104834168A (en) * | 2015-05-12 | 2015-08-12 | 苏州佳世达光电有限公司 | Projection device |
| CN104834167A (en) * | 2015-05-12 | 2015-08-12 | 苏州佳世达光电有限公司 | Projection device |
-
2015
- 2015-05-12 CN CN201510237891.7A patent/CN104834167A/en active Pending
- 2015-08-18 CN CN201510506079.XA patent/CN105072873B/en active Active
- 2015-08-18 CN CN201510507599.2A patent/CN105159018B/en active Active
- 2015-08-18 CN CN201810089613.5A patent/CN108490723A/en active Pending
- 2015-08-18 CN CN201810088972.9A patent/CN108445699A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000126874A (en) * | 1998-07-09 | 2000-05-09 | Georg Fischer Rohrleitungssyst Ag | Housing unit |
| US7172017B2 (en) * | 2002-07-16 | 2007-02-06 | Delta Electronics, Inc. | Heat sink |
| US7539017B2 (en) * | 2003-03-27 | 2009-05-26 | Kuo Ta Chang | Heat dissipating device for central processor |
| US7766076B2 (en) * | 2007-03-23 | 2010-08-03 | Rocky Research | Spot cooler for heat generating electronic components |
| CN201115248Y (en) * | 2007-09-14 | 2008-09-10 | 杭州华三通信技术有限公司 | A heat radiator |
| CN101620368A (en) * | 2008-07-04 | 2010-01-06 | 富准精密工业(深圳)有限公司 | Projector with cooling system |
| CN101963743A (en) * | 2009-07-24 | 2011-02-02 | 鸿富锦精密工业（深圳）有限公司 | Projector |
| CN201556020U (en) * | 2009-11-13 | 2010-08-18 | 鑫亿光电(深圳)有限公司 | Optical engine cooling device of micro projector |
| TW201116982A (en) * | 2009-11-13 | 2011-05-16 | Sunonwealth Electr Mach Ind Co | Cooling module |
| CN201600540U (en) * | 2009-12-04 | 2010-10-06 | 彩亿科技(深圳)有限公司 | Cooling device of mini projector optical engine |
| CN202600344U (en) * | 2012-04-10 | 2012-12-12 | 星盛光电股份有限公司 | Heat-dissipating module structure for projection device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109955474A (en) * | 2017-12-22 | 2019-07-02 | 深圳冠特家居健康系统有限公司 | It is a kind of can rapid cooling 3D printer |
| WO2021043047A1 (en) * | 2019-09-04 | 2021-03-11 | 中兴通讯股份有限公司 | Compound teeth radiator and communication base station |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105159018B (en) | 2018-03-06 |
| CN108490723A (en) | 2018-09-04 |
| CN108445699A (en) | 2018-08-24 |
| CN104834167A (en) | 2015-08-12 |
| CN105072873B (en) | 2017-09-29 |
| CN105159018A (en) | 2015-12-16 |
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