CN2930219Y - Heat radiator mounting device - Google Patents
Heat radiator mounting device Download PDFInfo
- Publication number
- CN2930219Y CN2930219Y CN 200620017529 CN200620017529U CN2930219Y CN 2930219 Y CN2930219 Y CN 2930219Y CN 200620017529 CN200620017529 CN 200620017529 CN 200620017529 U CN200620017529 U CN 200620017529U CN 2930219 Y CN2930219 Y CN 2930219Y
- Authority
- CN
- China
- Prior art keywords
- steel wire
- spring steel
- heat dissipater
- radiator
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat dissipater installment device which comprises a clip foot, a heat dissipater and at least a pressing spring steel wire. The clip foot is welded on the PCB board. The heat dissipater is provided with grooves used for installing the pressing spring steel wire along the heat dissipater tooth-like direction or that vertical to the tooth-like direction. The shape and size of the heat dissipater can be designed according to the actual need. The shape of the pressing spring steel wire is engaged with that of the groove on the heat dissipater. The buckles at two ends of the pressed spring steel wire are connected with the clip foot and press and effectively fix the heat dissipater with the elastic force generated between the heat dissipater through the torsion of the end of the steel wire. Compared with the prior art, the heat dissipater installment device not only achieves simple structure, low cost, fast and convenient installment or detachment of the heat dissipater, great head conductivity property, but also takes small space on the PCB board with only a plurality of round holes.
Description
Technical field:
The utility model relates to heat conduction and erecting device on a kind of pcb board, relates in particular in communication and the IT field heat sink mounting device of main euthermic chip under the more closeer situation of components and parts on the pcb board.
Background technology:
Heat radiation to mainboard chip (for example computer main board cpu chip) in the IT industry nearly all is to adopt radiator to dispel the heat, and how therefore radiator be installed on pcb board just becomes a difficult problem.Weld on pcb board to the installation great majority employing screw connection of big radiator on the pcb board or by other auxiliary members at present, this method has not only taken too big space on pcb board, and the installing/dismounting difficulty.The method that adopts special device that radiator is installed is also arranged at present, although these methods can be installed radiator easily and effectively, not only its complex structure, cost are higher, and take too big space at pcb board.Along with density of components on the present pcb board is increasing, pcb board can't provide enough spaces for the traditional installation method of radiator.
The utility model content:
Problem to be solved in the utility model provides a kind of advantages of simple, is easy to process, is convenient to assemble, cost is low and take up space little heat sink mounting device on pcb board.
The technical scheme that the utility model adopted is: heat sink mounting device comprises at least one pair of card base, radiator and at least one holddown spring steel wire, card base is welded on the pcb board, radiator is in radiator profile of tooth direction and/or have groove perpendicular to the profile of tooth direction and be used to install the holddown spring steel wire, the shape size of radiator can design according to actual needs, the shape of the groove on holddown spring steel wire and the radiator matches, pressurized rear spring steel wire two ends buckle the connection card base, by steel wire do not hold because of reverse and radiator between the elastic compression that produces and fixed heat sink effectively.
Described card base is preferably a zinc-plated U-shaped steel wire, is welded on the pcb board.
Described holddown spring steel wire two terminal interplanars with pcb board have certain angle.
Before being installed, radiator must earlier one or more pairs of card bases be welded on the pcb board, the surface that radiator is contacted with chip is coated heat-conducting glue (cream) equably and is convenient to be transmitted to the heat on the chip on the radiator equably then, and radiator is pasted on chip surface by designing requirement, at last the holddown spring steel wire is passed radiator, firmly the two ends of dead spring steel wire and buckling of making that the holddown spring steel wire do not hold are hooked card base and have promptly been fixed radiator.
After buckling of the holddown spring steel wire need only not being held during radiator of dismounting thrown off in the card base, take off radiator and get final product.
The beneficial effects of the utility model are: compared with prior art, heat sink mounting device described in the utility model is not only simple in structure, cost is lower, convenient and swift, the good heat conductivity of radiator attaching/detaching, and need not to take space too big on the pcb board, only need several circular holes to get final product.
Description of drawings:
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail:
Fig. 1 is the decomposition texture schematic diagram of the utility model embodiment;
Fig. 2 is the schematic diagram that card base 3 is installed on pcb board;
Fig. 3 is the schematic diagram that radiator 4 is installed;
Fig. 4 is the schematic diagram that installs behind the spring steel wire 5.
Be the explanation of Reference numeral in the accompanying drawing below:
Pcb board-------------------1;
Chip on the pcb board----2;
Card base-----------------------3;
Radiator--------------------4;
Holddown spring steel wire-----------5.
Specific implementation method:
As shown in Figure 1, heat sink mounting device comprises two pairs of card bases 3, radiator 4 and two holddown spring steel wires 5, card base is zinc-plated U-shaped steel wire, radiator 4 is the profile of tooth direction in the middle, all design the fluting of certain width perpendicular to the profile of tooth direction, the width of groove is determined according to diameter and other demands of holddown spring steel wire 5, to guarantee that holddown spring steel wire 5 can pass smoothly, the shape of holddown spring steel wire 5 can design according to actual needs, its shape cooperates with the fluting at radiator 4 middle parts, and end does not have certain angle with the plane of pcb board, the size of angle can thrust as required design, so that it does not hold the torsion of generation can compress radiator, 5 liang of ends of holddown spring steel wire buckle.
The installation process of radiator:
1), earlier before radiator 4 is installed, reasonably design and make a call to the circular hole of four or eight φ 1.5mm around the chip that on pcb board, needs to dispel the heat, each card base 3 needs two circular holes, pitch-row is determined according to the size of card base 3, if a holddown spring steel wire 5 is installed, then only need 3, four circular holes of two card bases; If two holddown spring steel wires 5 are installed, then need four card bases 3, eight circular holes, adopt in the present embodiment two holddown spring steel wires 5 are installed, insert U-shaped card base 3 in the circular hole on the pcb boards and regulate the height of card base 3, guarantee that holddown spring steel wire 5 can pass card base 3 easily, fixing and weld card base 3, as shown in Figure 2.
2), before radiator 4 is installed, its surface that contacts with chip 2 on the pcb board evenly must be coated heat-conducting glue (cream) and compressed the heat of chip generation can evenly be transmitted on the radiator 4, as shown in Figure 3 effectively.
3), the not end that at last as shown in Figure 4 the holddown spring steel wire is passed the square groove on the radiator and depress steel wire makes its hook live card base to get final product.
The unloading process of radiator: the unloading process of radiator is just in time opposite with its installation process, only needs holddown spring steel wire 5 is thrown off in card base 3, and the deformation of holddown spring steel wire just can be taken off radiator 4 after recovering to discharge its thrust.
The utility model is the installing/dismounting radiator effectively quickly, and this method need not to take the too big space of pcb board, simple in structure, material is common, cost is lower.
Claims (4)
1, a kind of heat sink mounting device, it is characterized in that: described heat sink mounting device comprises at least one pair of card base, radiator and at least one holddown spring steel wire, card base is welded on the pcb board, radiator is in radiator profile of tooth direction and/or have groove perpendicular to the profile of tooth direction and be used to install the holddown spring steel wire, the shape of the groove on holddown spring steel wire and the radiator matches, pressurized rear spring steel wire two ends buckle the connection card base, by steel wire do not hold because of reverse and radiator between the elastic compression that produces and fixed heat sink effectively.
2, heat sink mounting device as claimed in claim 1 is characterized in that: described card base is a zinc-plated U-shaped steel wire, is welded on the pcb board.
3, heat sink mounting device as claimed in claim 1 or 2 is characterized in that: described holddown spring steel wire two terminal interplanars with pcb board have certain angle.
4, heat sink mounting device as claimed in claim 3 is characterized in that: described card base is two pairs, and the holddown spring steel wire is two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620017529 CN2930219Y (en) | 2006-06-20 | 2006-06-20 | Heat radiator mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620017529 CN2930219Y (en) | 2006-06-20 | 2006-06-20 | Heat radiator mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2930219Y true CN2930219Y (en) | 2007-08-01 |
Family
ID=38308584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620017529 Expired - Lifetime CN2930219Y (en) | 2006-06-20 | 2006-06-20 | Heat radiator mounting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2930219Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103621194A (en) * | 2011-06-29 | 2014-03-05 | 三菱电机株式会社 | Electronic device |
| CN104684329A (en) * | 2015-03-19 | 2015-06-03 | 上海克拉索富电子有限公司 | Fixed compressing mechanism for automobile air conditioning speed regulation module |
| CN108490723A (en) * | 2015-05-12 | 2018-09-04 | 苏州佳世达光电有限公司 | Projection arrangement |
-
2006
- 2006-06-20 CN CN 200620017529 patent/CN2930219Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103621194A (en) * | 2011-06-29 | 2014-03-05 | 三菱电机株式会社 | Electronic device |
| CN104684329A (en) * | 2015-03-19 | 2015-06-03 | 上海克拉索富电子有限公司 | Fixed compressing mechanism for automobile air conditioning speed regulation module |
| CN104684329B (en) * | 2015-03-19 | 2018-05-11 | 上海克拉索富电子有限公司 | A kind of mechanism that is fixed and clamped for automobile air conditioner speed regulation module |
| CN108490723A (en) * | 2015-05-12 | 2018-09-04 | 苏州佳世达光电有限公司 | Projection arrangement |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20070801 |
|
| EXPY | Termination of patent right or utility model |