CN104834168A - Projection device - Google Patents
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- CN104834168A CN104834168A CN201510238930.5A CN201510238930A CN104834168A CN 104834168 A CN104834168 A CN 104834168A CN 201510238930 A CN201510238930 A CN 201510238930A CN 104834168 A CN104834168 A CN 104834168A
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Abstract
The invention provides a projection device capable of reducing the influence of the thermal effect. The projection device comprises a shell and at least two circuit boards. The shell has a top plate and a bottom plate. The at least two circuit boards are arranged in the shell and are parallel to the top plate and the bottom plate. The at least two circuit boards differ in temperature/power or are provided with electronic elements differing in heat sensitivity. The at least two circuit boards are sequentially superimposed according to the temperature/power or according to the heat sensitivity of the electronic elements. The circuit board, closer to the bottom plate, among the at least two circuit boards has lower temperature/power, or the electronic element of the circuit board, closer to the bottom plate, among the at least two circuit boards is more susceptible to heat.
Description
Technical field
The invention relates to a kind of projection arrangement, especially about a kind of projection arrangement with high-level efficiency Natural Heat Convection mechanism.
Background technology
The power of projector, because the requirement of brightness is done larger and larger, and the efficiency of light emitting diode fails relatively to promote, even if when smaller power, existing product all needs to do forced heat radiation with fan, and when power increase, the problem of thermal effect is just even more serious.
The design of conventional projectors all can use fan, therefore mostly be with forced convertion smooth degree for primary concern to considering of radiating airflow, reach heat extraction effect to make the air flow energy smooth outflow of fan.But, because fan can produce sizable noise in the running, if rotation speed of the fan significantly can be reduced or even exempt the use of fan, will be to home audio-visual or of environment for use improving greatly of needing peace and quiet.
Moreover when the use power of light emitting diode is increasing, its heating efficiency also will increase along with use power.For general small projector, because three looks (R/G/B) light source is placed in three sides of light hydrid component usually, the integral heat sink usefulness of small projector is caused also the restriction because of space to be affected.
Therefore, how effectively to utilize inner space, inner member configuration reduces thermal effect, is the important issue of projection arrangement heat dissipation design in fact.
Summary of the invention
The object of the present invention is to provide a kind of projection arrangement, the impact of thermal effect can be reduced, lifting gear function.
On the one hand, the invention provides a kind of projection arrangement, comprise: housing and at least two circuit boards; This housing has top board and base plate; These at least two circuit boards, to be arranged in this housing and to be parallel to this top board and this base plate, these at least two circuit boards have different temperature/power or have the electronic component of different heat sensitivity, and these at least two circuit boards are sequentially stacked according to the heat sensitivity of the height of temperature/power or electronic component, the circuit board wherein more close to this base plate in these at least two circuit boards has lower temperature/power; Or the electronic component more had close to the circuit board of this base plate in these at least two circuit boards is more easily influenced by heat.
Preferably, these at least two circuit boards comprise first circuit board and second circuit board, this first circuit board has the first electronic component, this second circuit board has the second electronic component, the heat sensitivity of this first electronic component is lower than the heat sensitivity of this second electronic component, and this second circuit board is stacked and placed on above this first circuit board.
Preferably, separately comprise metal heat-conducting piece, wherein this metal heat-conducting piece comprises body and extension, this body part separates this first circuit board and this second circuit board with essence between this first circuit board and this second circuit board, this extension extends the side of this first circuit board from the bending of this body, and this first electronic component and this second electronic component are respectively in the face of two apparent surfaces of this body.
Preferably, separately comprise Heat Conduction Material, wherein this Heat Conduction Material is filled between this first circuit board and this body and/or this Heat Conduction Material is filled between this second circuit board and this body.
On the other hand, the invention provides a kind of projection arrangement, comprise: housing, optical-mechanical system, first circuit board and second circuit board; This optical-mechanical system is arranged in this housing, and this optical-mechanical system comprises light source module and imaging modules, and this imaging modules is arranged at the side of this light source module; This first circuit board is horizontally placed on below this light source module; This second circuit board be uprightly arranged at this imaging modules side and away from this light source module.
Preferably, separately comprise heat radiator, wherein this heat radiator is arranged at the top of this imaging modules, and this heat radiator has multiple radiating fin, the plurality of radiating fin configured in parallel and extending, to form multiple ventiduct towards away from the top-direction of this imaging modules.
Preferably, separately comprise at least one and extend heat radiator, wherein this extension heat radiator extends towards the bottom direction of this imaging modules from the side of this heat radiator, to be parallel to this second circuit board, this extension heat radiator has multiple radiating fin, multiple radiating fins of this extension heat radiator are along this imaging modules configured in parallel to form multiple extension ventiduct, and the plurality of extension ventiduct is communicated with the plurality of ventiduct accordingly.
Preferably, the temperature/power of this first circuit board is lower than the temperature/power of this second circuit board.
Preferably, this first circuit board is main circuit board and/or drive circuit board, and this second circuit board is power supply circuit plate.
Compared with prior art, projection arrangement provided by the invention, has the design of optimized circuit board arrangement, can reduce the impact of thermal effect, lifting gear function.
Accompanying drawing explanation
Figure 1A is the stereographic map of the projection arrangement of one embodiment of the invention;
Figure 1B does not illustrate the explosive view of side plate for the projection arrangement shown in Figure 1A;
Fig. 1 C does not illustrate the vertical view of top board for the projection arrangement shown in Figure 1A;
The configuration schematic diagram of the top board that Fig. 2 A is the projection arrangement shown in Figure 1A, base plate and heat radiator;
Fig. 2 B is the schematic diagram of the optical-mechanical system of the projection arrangement shown in Figure 1A;
Fig. 3 A is the partial schematic diagram that the top board of one embodiment of the invention has thermal insulation barriers;
Fig. 3 B and Fig. 3 C is arranged at the side view of the different embodiments on top board for the thermal insulation barriers shown in Fig. 3 A;
Fig. 4 A is the schematic diagram that the projection arrangement of another embodiment of the present invention does not illustrate top board and side plate;
Fig. 4 B is the explosive view of the projection arrangement shown in Fig. 4 A;
Fig. 5 A is the schematic diagram that the projection arrangement of another embodiment of the present invention does not illustrate top board and side plate;
Fig. 5 B is the side schematic view of the subelement of the projection arrangement shown in Fig. 5 A;
Fig. 6 is the schematic diagram that the projection arrangement of another embodiment of the present invention does not illustrate top board and side plate;
Fig. 7 A is the schematic diagram that the projection arrangement of another embodiment of the present invention does not illustrate top board and side plate;
Fig. 7 B does not illustrate the vertical view of base plate for the projection arrangement shown in Fig. 7 A.
Embodiment
For making there is further understanding to object of the present invention, structure, feature and function thereof, embodiment is hereby coordinated to be described in detail as follows.
The invention provides a kind of projection arrangement, especially a kind of projection arrangement with the heat dissipation design of natural convection, use fan to reduce rotation speed of the fan or even to exempt, and then reduce noise lifting operation quality.Moreover projection arrangement of the present invention has optimized circuit board arrangement to reduce thermal effect impact, also can utilize coordinating with heat radiation usefulness of metal heat-conducting piece and heat radiator.In the rear embodiment with reference to graphic detailed description projection arrangement of the present invention.
Figure 1A is the stereographic map of the projection arrangement of one embodiment of the invention; Figure 1B does not illustrate the explosive view of side plate for the projection arrangement shown in Figure 1A; Fig. 1 C does not illustrate the vertical view of top board for the projection arrangement shown in Figure 1A; The configuration schematic diagram of the top board that Fig. 2 A is the projection arrangement shown in Figure 1A, base plate and heat radiator; Fig. 2 B is the schematic diagram of the optical-mechanical system of the projection arrangement shown in Figure 1A; Fig. 3 A is the partial schematic diagram that the top board of one embodiment of the invention has thermal insulation barriers; Fig. 3 B and Fig. 3 C is arranged at the side view of the different embodiments on top board for the thermal insulation barriers shown in Fig. 3 A; Fig. 4 A is the schematic diagram that the projection arrangement of another embodiment of the present invention does not illustrate top board and side plate; Fig. 4 B is the explosive view of the projection arrangement shown in Fig. 4 A; Fig. 5 A is the schematic diagram that the projection arrangement of another embodiment of the present invention does not illustrate top board and side plate; Fig. 5 B is the side schematic view of the subelement of the projection arrangement shown in Fig. 5 A; Fig. 6 is the schematic diagram that the projection arrangement of another embodiment of the present invention does not illustrate top board and side plate; Fig. 7 A is the schematic diagram that the projection arrangement of another embodiment of the present invention does not illustrate top board and side plate; Fig. 7 B does not illustrate the vertical view of base plate for the projection arrangement shown in Fig. 7 A.
As shown in Figure 1A to Fig. 1 C, in an embodiment, projection arrangement 1 of the present invention comprises housing 10, optical-mechanical system 20 and multiple heat radiator 30, its middle shell 10 has the top board 110 and base plate 120 that be arranged in parallel, and multiple side plate 130 is around the side connecting top board 110 and base plate 120, jointly to surround accommodation space, for the projection arrangement parts such as accommodating optical-mechanical system 20 and heat radiator 30.In this embodiment, top board 110 has multiple tops air vent 112, and base plate 120 has air vent of multiple ends 122, and wherein top air vent 112 and end air vent 122 are the gateways as gas flowing.Moreover as shown in Figure 1A, side plate 130 is better also has multiple sides air vent 132, to promote heat sinking benefit.In this embodiment, housing 10 is better to be made of metal, such as aluminium, but not as limit.In other embodiments, housing 10 can be made up of alloy or nonmetal (such as polymkeric substance).
In this embodiment, as shown in Figure 1B and Fig. 2 A, top board 110 is preferably waffle slab, and top board 110 forms multiple tops air vent 112 by multiple rib 114a, 114b are staggered.For example, multiple rib 114a is the first side 110a parallel interval configuration along top board 110, and multiple rib 114b configure along sides adjacent (such as the second side 110b) parallel interval of the first side 110a, interweave to make multiple rib 114a, 114b and form multiple grid as top air vent 112.Should be noted at this, spacing, number, width etc. between multiple rib 114a may be the same or different spacing, number, width etc. between multiple rib 114b, and multiple rib 114a, 114b can otherwise be staggered to form top air vent.In this embodiment, the bearing of trend of multiple rib 114a is preferably perpendicular to the first side 110a, and the bearing of trend of multiple rib 114b is preferably perpendicular to the second side 110b, to make the rectangular opening that multiple tops air vent 112 is array configurations, but not as limit.In another embodiment (not shown), the bearing of trend of multiple rib 114a, 114b can accompany non-90 degree angle with the first side 110a and the second side 110b respectively, to make multiple rib 114a, 114b respectively relative to the first side 110a and the oblique extension of the second side 110b, and multiple tops air vent 112 is the diamond hole of array configurations.Base plate 120 also can be interweaved by multiple rib 124a, 124b with forming the net dividing plate of end air vent 122, its center rib 124a, 124b can have the configuration of rib 114a, the 114b being similar to top board 110 relative to the first side 120a of base plate 120 and the second side 120b, repeat no more in this.
Should be noted at this, top board 110 and base plate 120 are preferably and are configured to top air vent 112 aligning end air vent 122 at least partly, to make to push up the ventiduct 312 straight line connection end air vent 122 of air vent 112 by correspondence, as shown in Figure 1B and Fig. 2 A (in rear detailed description).In other words, top air vent 112 and end air vent 122 can have identical or different shape, size or number, are not limited with shown in embodiment.For example, in other embodiments, top air vent 112 can for being formed at multiple openings of top board 110, and end air vent 122 can for being formed at multiple openings of base plate 120, and opening shape can be circle, rectangle or any suitable geometric configuration or non-regular shape.
As shown in Figure 1B, Fig. 1 C and Fig. 2 B, optical-mechanical system 20 to be arranged in housing 10 and between top board 110 and base plate 120.Specifically, optical-mechanical system 20 comprises light source module 210, imaging modules 220 and light transmission part 230, and wherein imaging modules 220 is arranged at the side of light source module 210, and light transmission part 230 is connected between light source module 210 and imaging modules 220.In this embodiment, light transmission part 230 can be photoconductive tube, light guide pillar or other elements for transmission ray, and light source module 210, imaging modules 220 and light transmission part 230 are configured to L shape, but not as limit.In other embodiments, according to design requirement, light source module 210, imaging modules 220 and light transmission part 230 can be configured to straight line or any suitable shape.Light source module 210 by light transmission part 230 by light transmission to imaging modules 220, and ray cast is formed image according to image data process light by imaging modules 220 outside housing 10.
Specifically, light source module 210 comprises multiple luminescence unit 212a, 212b, 212c and mixed light unit 214, and wherein luminescence unit 212a, 212b, 212c is arranged at mixed light unit 214 around, and emits beam to mixed light unit 214.In this embodiment, the side of mixed light unit 214 connects light transmission part 230, and luminescence unit 212a, 212b, 212c be arranged at respectively mixed light unit 214 not homonymy (such as its excess-three side) and there is to mixed light unit 214 injection the light of different colours or wavelength.Mixed light unit 214 accept and mixed luminescence unit 212a, 212b, 212c injection light and to light transmission part 230 export mixing light (such as white light).In this embodiment, luminescence unit 212a, 212b, 212c are better is respectively the light emitting diode exporting red, green, blue coloured light line, but not as limit.In other embodiments, luminescence unit 212a, 212b, 212c can be the light emitting diode sending white or other colors (or wavelength) light.Imaging modules 220 comprises lens unit 222 and image formation optical unit 224, wherein image formation optical unit 224 connects light transmission part 230 to accept light, and obtain corresponding target light according to image data process light, then form image by target light is projeced into outside housing 10 by lens unit 222.In an embodiment, image formation optical unit 224 comprises digital micro-mirror device (Digital Micromirror Device, DMD) 224a, and it controls micro mirror to form image according to image signal.
As shown in Figure 1B and Fig. 1 C, multiple heat radiator 30 is arranged at around optical-mechanical system 20, and wherein multiple heat radiator 30 respectively has multiple radiating fin 310, and forms multiple ventiduct 312 between multiple radiating fin 310.As mentioned above, multiple heat radiator 30 is arranged so that multiple tops air vent 112 is via multiple ventiduct 312 straight line connection accordingly air vent of multiple ends 122.See Fig. 1 C, multiple heat radiator 30 comprises the first heat radiator 30a, the second heat radiator 30b and the 3rd heat radiator 30c, wherein the first heat radiator 30a, the second heat radiator 30b and the 3rd heat radiator 30c are arranged at three sides of light source module 210 respectively, namely corresponding luminescence unit 212a, 212b, 212c are arranged at three sides of mixed light unit 214 respectively, to make multiple radiating fin 310 respectively along side configured in parallel corresponding in three sides of mixed light unit 214, and radiating fin 310 is that mixed light unit 214 extends dorsad.By this, ventiduct 312 is also along three side configurations of mixed light unit 214, and each ventiduct 312 is communicated with corresponding top air vent 112 and end air vent 122.From another viewpoint, multiple radiating fin 310 stands between top board 110 and base plate 120, and when being watched towards base plate 120 by the top air vent 112 of top board 110, can see through base plate 120 via corresponding ventiduct 312 and end air vent 122.In other words, the top air vent 112 of top board 110, the ventiduct 312 of correspondence and end air vent 122 are runners that formation straight line runs through housing 10.By this, projection arrangement 1 can reach effective heat radiation by the natural convection of air.
As shown in Figure 1 C, in an embodiment, multiple luminescence unit 212a, 212b, 212c are preferably and are attached at multiple heat radiator (such as the first heat radiator 30a, the second heat radiator 30b and the 3rd heat radiator 30c) respectively.In other words, luminescence unit 212a, 212b, 212c are better is attached to heat radiator 30 back on the surface of the side of radiating fin 310, to promote heat sinking benefit by its substrate.
Moreover as shown in Figure 3A, multiple thermal insulation barriers 140 can be arranged at the outside surface of top board 110, think that user provides effect of heat insulation.Specifically, thermal insulation barriers 140 and top board 110 are made up of different materials, and compared to top board 110, thermal insulation barriers 140 has preferably effect of heat insulation.In this embodiment, thermal insulation barriers 140 is preferably flexible material (such as silica gel), thinks that user provides preferably sense of touch and effect of heat insulation.In an embodiment, as shown in Figure 3 B, thermal insulation barriers 140 is strip and is attached at the surface of rib 114a.In another embodiment, as shown in Figure 3 C, the outside surface of top board 110 has multiple groove 116, and thermal insulation barriers 140 is inserted in groove 116.For example, groove 116 is formed at the surface of rib 114a ' and the length direction along rib 114a ' extends, and groove 116 is inserted in the bottom of strip thermal insulation barriers 140, makes thermal insulation barriers 140 protrude from the surface of top board 110 (i.e. rib 114a ').When projection arrangement 1 by heat radiator 30 and natural convection effect by thermal conductance to housing 10 time, by the setting of thermal insulation barriers 140, the top board 110 that the direct Contact Temperature of user is higher can be avoided, and preferably sense of touch is provided simultaneously.
In addition, in an embodiment, as shown in Figure 1B, Fig. 1 C and Fig. 2 A, projection arrangement of the present invention separately comprises auxiliary heat dissipation sheet 32, and auxiliary heat dissipation sheet 32 has multiple radiating fin 320.Auxiliary heat dissipation sheet 32 is preferably corresponding imaging modules 220 and arranges, and the digital micro-mirror device 224a of especially corresponding imaging modules 220 is arranged.In this embodiment, auxiliary heat dissipation sheet 32 is the tops being arranged at imaging modules 224, such as be positioned at the top of image-generating unit 224, or further part extends to lens unit 222 top, and digital micro-mirror device 224a is preferably the top that is arranged at imaging modules 220 and is attached at auxiliary heat dissipation sheet 32.In other words, digital micro-mirror device 224a is preferably the top being arranged at image-generating unit 224, and is attached to heat radiator 32 back on the surface of the side of radiating fin 320 by its substrate.In this embodiment, multiple radiating fins 320 of auxiliary heat dissipation sheet 32 are configured in parallel and extend to form multiple secondary ventilation road 322 towards top board 110.Should be noted at this, the top air vent 112 of top board 110, the better also corresponding auxiliary heat dissipation sheet 32 of the side air vent 132 of side plate 130 are arranged, and make top air vent 112, side air vent 132, secondary ventilation road 322 can form radiating flow passage, to promote heat sinking benefit.
Moreover projection arrangement separately comprises at least one and extends heat radiator 34, and wherein extending heat radiator 34 is extend towards base plate 120 from the side of auxiliary heat dissipation sheet 32, to be positioned at the side of imaging modules 220.Extend heat radiator 34 and there is multiple radiating fin 340, extending multiple radiating fins 340 of heat radiator 34 is along the side configured in parallel of imaging modules 220 to form multiple extension ventiduct 342, wherein multiple extension ventiduct 342 accordingly straight line be communicated with at least one of them and the air vent of multiple ends 122 of multiple tops air vent 112 at least one of them.That is, be similar to above-mentioned, the top air vent 112 of top board 110 and the better also corresponding extension heat radiator 34 of the end air vent 122 of base plate 120 are arranged, and make to push up the extension ventiduct 342 straight line connection end air vent 122 of air vent 112 by correspondence, to form the runner of natural convection.In this embodiment, extend heat radiator 34 and be preferably from the both sides of auxiliary heat dissipation sheet 32 to downward-extension, and " ㄇ shape " heat radiator integrated with auxiliary heat dissipation sheet 32, but not as limit.In this embodiment, be positioned at the extension heat radiator 34 of " ㄇ shape " heat radiator both sides, its radiating fin 340 extends dorsad, to extend towards side plate 130 and light source module 210 respectively.In other embodiments, according to configuration space, radiating requirements etc., extending heat radiator 34 can to downward-extension more than the one-sided of auxiliary heat dissipation sheet 32 or both sides, with the heat radiator of " the L shape " that integrate with auxiliary heat dissipation sheet 32 or other shapes.Should be noted at this, extension heat radiator 34 and auxiliary heat dissipation sheet 32 are preferably integrally formed heat radiator, but also can be the heat radiator of separation.When extending heat radiator 34 and auxiliary heat dissipation sheet 32 integrates, the extension radiating fin 340 of heat radiator 34 and the radiating fin 320 of auxiliary heat dissipation sheet 32 are preferably and are arranged so that extending heat dissipation channel 342 difference correspondence is communicated with auxiliary heat dissipation passage 322, but not as limit.In addition, extend the length that heat radiator 34 extends along auxiliary heat dissipation sheet 32 side, may be the same or different the length in this side of auxiliary heat dissipation sheet 32, be not limited with shown in embodiment.For example, when auxiliary heat dissipation sheet 32 is only arranged at the top of image-generating unit 224, extends the side that heat radiator 34 only can be positioned at image-generating unit 224, also can extend to the side of camera lens module 222 further.Or, when auxiliary heat dissipation sheet 32 is arranged at the top of image-generating unit 224 and extends to the top of camera lens module 222, extend heat radiator 34 can be positioned at the side of image-generating unit 224 and extend to the side of camera lens module 222, also only can be positioned at the side of image-generating unit 224.
Moreover projection arrangement of the present invention separately can by the configuration of optimization circuits plate, to reduce the impact of thermal effect.Specifically, projection arrangement of the present invention separately comprises multiple circuit board (such as 410,420,430), and wherein each circuit board has different temperature/power.The present invention can carry out optimization configuration, to reduce the impact of thermal effect according to the temperature of each circuit board/power height.As shown in fig. 4 a and fig. 4b, in an embodiment, projection arrangement separately comprises circuit board 410,420, and wherein circuit board 410 is arranged at below light source module 210, and circuit board 420 be arranged at imaging modules 220 side and away from circuit board 410 and light source module 210.For example, circuit board 410 is main circuit board, and circuit board 420 is power supply circuit plate, and wherein temperature/the power of power supply circuit plate 420 is higher than the temperature/power of main circuit board 410.In this embodiment, relative to base plate 120, main circuit board 410 is horizontally placed on the below of light source module 210, and power supply circuit plate 420 is uprightly arranged at the side of imaging modules 220.By this, be distributed multiple circuit boards 410,420 of projection arrangement 1, especially place independent for circuit board (such as power supply circuit plate 420) higher for temperature/power, the heat that circuit board 410,420 can be avoided to produce concentrates on same position (such as near light source module 210) and aggravates the impact of thermal effect.
As shown in fig. 4 a and fig. 4b, in this embodiment, extension heat radiator 34 is preferably and is arranged between circuit board 420 and imaging modules 220, with isolating circuit plate 420 and imaging modules 220.That is extending heat radiator 34 is extend towards the bottom direction of imaging modules 220 from the side of heat radiator 32, to be parallel to circuit board 420 and between circuit board 420 and imaging modules 220.In this embodiment, extending the radiating fin 340 of heat radiator 34 is extend towards circuit board 420, and the higher element of the temperature/power of circuit board 420 is preferably towards side plate 130, and the lower element of the temperature/power of circuit board 420 is then towards radiating fin 340.Should be noted at this, the top air vent 112 of top board 110 and the better also corresponding extension heat radiator 34 of the end air vent 122 of base plate 120 are arranged, make to push up the ventiduct 342 straight line connection end air vent 122 of air vent 112 by correspondence, to form the runner (related description with reference to Figure 1B) of natural convection.
In another embodiment, projection arrangement is the configuration that the heat sensitivity of the electronic component had according to temperature/power height or the circuit board of circuit board makes differing heights, wherein multiple circuit board is sequentially stacked according to the heat sensitivity of the height of temperature/power or its electronic component, more has lower temperature/power close to the circuit board of base plate or the electronic component that more has close to the circuit board of base plate is more easily influenced by heat.As shown in Figure 5A, multiple circuit boards 410,430 are arranged at the below of light source module 210, and parallel mat 120, and wherein temperature/the power of circuit board 410 is lower than the temperature/power of circuit board 430.For example, circuit board 410 is the main circuit boards for controlling projector's running, and circuit board 430 is the drive circuit board of driving light source, wherein main circuit board 410 is arranged at below light source module 210, and drive circuit board 430 is arranged between main circuit board 410 and light source module 210.As shown in Fig. 5 A and Fig. 5 B, projection arrangement separately comprises metal heat-conducting piece 50, and wherein metal heat-conducting piece 50 comprises body 510 and extension 520.Body 510 is surfaces that essence is covered in circuit board 410,430, and extension 520 is the sides extending circuit board 410,430 from body 510 bending.In an embodiment, metal heat-conducting piece 50 can be bent by aluminium sheet and form, and wherein extension 520 is preferably smooth heat radiator (such as the second heat radiator 30b), and the heat energy produced to make circuit board is conducted to heat radiator 30b.
Moreover, as shown in Figure 5 B, circuit board 410 has the electronic component 412 of lower heat sensitivity, and circuit board 430 has the electronic component 432 of higher thermal susceptibility, and metal heat-conducting piece 50 is inserted between circuit board 410 and 430, wherein electronic component 412,432 is respectively in the face of the apparent surface of the body 510 of metal heat-conducting piece 50.Should be noted at this, the electronic component 412 of low heat sensitivity refers to the electronic component be more easily influenced by heat, and the electronic component 432 of high heat sensitivity refers to the electronic component be more not easily influenced by heat.That is, when multiple circuit board is stacked arrange time, the circuit board with the electronic component be more easily influenced by heat is preferably and is arranged at more below, and the circuit board with the electronic component be more not easily influenced by heat be preferably be arranged at more top, more can operate in normal temperature to make low heat sensitivity electronic component.Projection arrangement separately comprises Heat Conduction Material 60 (such as heat-conducting glue), wherein Heat Conduction Material 60 is filled between circuit board 410 and body 510 and/or Heat Conduction Material 60 is filled between circuit board 430 and body 510, to promote heat via metal heat-conducting piece 50 heat conduction to heat radiator 30b.Should be noted at this, Fig. 5 A, though illustrate metal heat-conducting piece 50 to have an extension 520, and in order to attach heat radiator 30b, this is not limited.In other embodiments, metal heat-conducting piece can have the extension of one or more bending, and extension can be attached at identical or different heat radiator (such as 30a, 30b, 30c).In addition, the overbending direction of extension 520 can change according to design requirement, is not limited upwards to bend.In other embodiments, extension 520 can form from body 510 bending downwards.Moreover in this embodiment, though the surface of body 510 of display metal heat-conducting piece 50 is plane, but in other embodiments, body 510 according to the electronic component-sized of circuit board, the position being arranged at its both sides, and can have corresponding concavo-convex surface.Moreover, though it is stacked only to illustrate two circuit boards (such as 410,430) in the present embodiment, not as limit.In other embodiments (not illustrating), when projection arrangement comprises plural circuit board (such as 410,410,430), multiple circuit board 410,420,430 also can be sequentially stacked according to the height of temperature/power, circuit board more close to base plate has lower temperature/power, the main circuit board 410 that such as temperature/power is minimum is positioned at closest to base plate, temperature/power time high drive circuit board 430 is stacked and placed on main circuit board 410, and on the relatively the highest stacked drive circuit board 430 of power supply circuit plate 420 of temperature/power.Projection arrangement of the present invention is by circuit board higher for temperature/power being arranged at more top, and the lower circuit board of temperature/power is arranged at more below, low temperature/lower powered circuit board can be made not heated by the circuit board of high temperature/high-capacity, and Low Temperature Thermal susceptibility element more can be operated in normal temperature, and reach optimized convection current configuration.
Moreover as shown in Figure 6, in another embodiment, projection arrangement of the present invention, by be distributed by circuit board and height according to temperature/power is stacked, can improve thermal effect impact further.In this embodiment, the circuit board 420 that temperature/power is the highest is preferably the side being arranged at image-generating unit 224, and the relatively low better height according to temperature/power of circuit board 410 and 430 of temperature/power is arranged at the below of light source module 210.Embodiment with reference to figure 4B and Fig. 5 A illustrates, power supply circuit plate 420 has the highest temperature/power, drive circuit board 430 has secondary high temperature/power, and main circuit board 410 has relatively minimum temperature and power.In this embodiment, power supply circuit plate 420 be arranged at image-generating unit 224 side and away from light source module 210, and separate with imaging modules 220 by extension heat radiator 34, and main circuit board 420 is arranged at below mixed light unit 214 and comparatively close to base plate 120, drive circuit board 430 is arranged between main circuit board 420 and mixed light unit 214.
In another embodiment, as shown in figs. 7 a and 7b, multiple circuit board (such as 410a, 410b, 420,430) is the side being arranged at optical-mechanical system 20, wherein multiple circuit board 410a, 410b, 420,430 are upright settings relative to base plate 120, with make multiple tops air vent 112 at least one of them be by multiple circuit board 410a, 410b, 420,430 other space lines be communicated with air vent of multiple ends 122 at least one of them.Specifically, in response to space constraint and radiating requirements, multiple circuit board 410a, 410b, 420,430 are preferably the side being arranged at imaging modules 220, and away from light source module 210.Moreover, in this embodiment, the control module of I/O (I/O) unit and main circuit board independently can be designed, to form master control circuit board (such as 410a) and input/output circuitry plate (such as 410b).In this embodiment, drive circuit board 430 is preferably and is arranged at image-generating unit 224 and arranges relative to the opposite side of lens unit 222, and master control circuit board 410a, input/output circuitry plate 410b, power supply circuit plate 420 are preferably and arrange in the opposite side interval of image-generating unit 224 relative to light source module 210.
Should be noted at this, be configured to image-generating unit 224 dorsad vertically extend, not as limit though Fig. 7 A and Fig. 7 B illustrates circuit board 430.In other embodiments, circuit board 430 can be configured to the side horizontal-extending of parallel imaging unit 224.Moreover, when multiple circuit board 410a, 410b, 420,430 intervals uprightly arrange time, the circuit board (such as power supply circuit plate 420) that temperature/power is higher is preferably and is arranged at outermost (or farthest away from imaging modules 220 place), and the side air vent 132 of side plate 130 faced by the better electronic component made on it.In this embodiment, input/output circuitry plate 410b is arranged between master control circuit board 410a and power supply circuit plate 420, and input/output circuitry plate 410b and power supply circuit plate 420 are opposing settings, make the electronic component on it towards opposing direction.Master control circuit board 410a is arranged so that the radiating fin 340 of the electronic component on it towards extension heat radiator 34.In this embodiment, the normal direction that circuit board 410a, 410b, 420,430 arrange the plate face of electronic component is perpendicular to top board 110 and base plate 120 normal to a surface direction.By this, make between circuit board 410a, 410b, 420,430, to form the ventiduct be similar between radiating fin 310.In this embodiment, the top air vent 112 of top board 110 and the end air vent 122 of base plate 120 also corresponding circuits plate 410a, 410b, 420,430 are arranged, make to push up air vent 112 and be communicated with end air vent 122, to form the runner of natural convection by the space line by circuit board 410a, 410b, 420,430.
Compared to prior art, the top air vent of projection arrangement of the present invention by housing and the upright configuration of end air vent cooperation heat radiator, high efficiency Natural Heat Convection mechanism can be reached, significantly to reduce the rotating speed of fan or even to exempt the use of fan, and then the noise produced when reducing fan running.Moreover projection arrangement of the present invention, has the setting of the design of optimized circuit board arrangement and metal heat-conducting piece, can reduce the impact of thermal effect, lifting gear function.
The present invention is described by above-mentioned related embodiment, but above-described embodiment is only enforcement example of the present invention.Must it is noted that the embodiment disclosed limit the scope of the invention.On the contrary, change done without departing from the spirit and scope of the present invention and retouching, all belong to scope of patent protection of the present invention.
Claims (9)
1. a projection arrangement, is characterized in that, comprises:
Housing, has top board and base plate; And
At least two circuit boards, to be arranged in this housing and to be parallel to this top board and this base plate, these at least two circuit boards have different temperature/power or have the electronic component of different heat sensitivity, and these at least two circuit boards are sequentially stacked according to the heat sensitivity of the height of temperature/power or electronic component, the circuit board wherein more close to this base plate in these at least two circuit boards has lower temperature/power; Or the electronic component more had close to the circuit board of this base plate in these at least two circuit boards is more easily influenced by heat.
2. projection arrangement as claimed in claim 1, it is characterized in that, these at least two circuit boards comprise first circuit board and second circuit board, this first circuit board has the first electronic component, this second circuit board has the second electronic component, the heat sensitivity of this first electronic component is lower than the heat sensitivity of this second electronic component, and this second circuit board is stacked and placed on above this first circuit board.
3. projection arrangement as claimed in claim 2, it is characterized in that, separately comprise metal heat-conducting piece, wherein this metal heat-conducting piece comprises body and extension, this body part separates this first circuit board and this second circuit board with essence between this first circuit board and this second circuit board, this extension extends the side of this first circuit board from the bending of this body, and this first electronic component and this second electronic component are respectively in the face of two apparent surfaces of this body.
4. projection arrangement as claimed in claim 3, is characterized in that, separately comprise Heat Conduction Material, and wherein this Heat Conduction Material is filled between this first circuit board and this body and/or this Heat Conduction Material is filled between this second circuit board and this body.
5. a projection arrangement, is characterized in that, comprises:
Housing;
Optical-mechanical system, be arranged in this housing, this optical-mechanical system comprises light source module and imaging modules, and this imaging modules is arranged at the side of this light source module;
First circuit board, is horizontally placed on below this light source module; And
Second circuit board, be uprightly arranged at this imaging modules side and away from this light source module.
6. projection arrangement as claimed in claim 5, it is characterized in that, separately comprise heat radiator, wherein this heat radiator is arranged at the top of this imaging modules, and this heat radiator has multiple radiating fin, the plurality of radiating fin configured in parallel and extending, to form multiple ventiduct towards away from the top-direction of this imaging modules.
7. projection arrangement as claimed in claim 6, it is characterized in that, separately comprise at least one and extend heat radiator, wherein this extension heat radiator extends towards the bottom direction of this imaging modules from the side of this heat radiator, to be parallel to this second circuit board, this extension heat radiator has multiple radiating fin, and multiple radiating fins of this extension heat radiator are along this imaging modules configured in parallel to form multiple extension ventiduct, and the plurality of extension ventiduct is communicated with the plurality of ventiduct accordingly.
8. projection arrangement as claimed in claim 5, is characterized in that, the temperature/power of this first circuit board is lower than the temperature/power of this second circuit board.
9. projection arrangement as claimed in claim 8, it is characterized in that, this first circuit board is main circuit board and/or drive circuit board, and this second circuit board is power supply circuit plate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510238930.5A CN104834168A (en) | 2015-05-12 | 2015-05-12 | Projection device |
| CN201510506080.2A CN105159017B (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510238930.5A CN104834168A (en) | 2015-05-12 | 2015-05-12 | Projection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104834168A true CN104834168A (en) | 2015-08-12 |
Family
ID=53812143
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510238930.5A Pending CN104834168A (en) | 2015-05-12 | 2015-05-12 | Projection device |
| CN201510506080.2A Active CN105159017B (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510506080.2A Active CN105159017B (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN104834168A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016184130A1 (en) * | 2015-10-29 | 2016-11-24 | 中兴通讯股份有限公司 | Radiator of projector and projector |
| CN108445699A (en) * | 2015-05-12 | 2018-08-24 | 苏州佳世达光电有限公司 | Projection arrangement |
| CN110764343A (en) * | 2019-09-30 | 2020-02-07 | 深圳市火乐科技发展有限公司 | Projector |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW403854B (en) * | 1998-11-10 | 2000-09-01 | Seiko Epson Corp | Projection type display device |
| JP2005345569A (en) * | 2004-05-31 | 2005-12-15 | Toshiba Corp | Projection-type image display device |
| JP2006308956A (en) * | 2005-04-28 | 2006-11-09 | Casio Comput Co Ltd | Projector |
| JP4863835B2 (en) * | 2006-10-19 | 2012-01-25 | 三洋電機株式会社 | Projection display device |
| CN201673359U (en) * | 2010-04-19 | 2010-12-15 | 深圳市欧曼特微显示科技有限公司 | Projector |
| CN202600344U (en) * | 2012-04-10 | 2012-12-12 | 星盛光电股份有限公司 | Heat-dissipating module structure for projection device |
-
2015
- 2015-05-12 CN CN201510238930.5A patent/CN104834168A/en active Pending
- 2015-08-18 CN CN201510506080.2A patent/CN105159017B/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108445699A (en) * | 2015-05-12 | 2018-08-24 | 苏州佳世达光电有限公司 | Projection arrangement |
| CN108490723A (en) * | 2015-05-12 | 2018-09-04 | 苏州佳世达光电有限公司 | Projection arrangement |
| WO2016184130A1 (en) * | 2015-10-29 | 2016-11-24 | 中兴通讯股份有限公司 | Radiator of projector and projector |
| CN110764343A (en) * | 2019-09-30 | 2020-02-07 | 深圳市火乐科技发展有限公司 | Projector |
| CN110764343B (en) * | 2019-09-30 | 2021-12-07 | 深圳市火乐科技发展有限公司 | Projector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105159017A (en) | 2015-12-16 |
| CN105159017B (en) | 2017-09-29 |
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Application publication date: 20150812 |