CN103037664A - Radiating device and electronic device using same - Google Patents
Radiating device and electronic device using same Download PDFInfo
- Publication number
- CN103037664A CN103037664A CN 201110292905 CN201110292905A CN103037664A CN 103037664 A CN103037664 A CN 103037664A CN 201110292905 CN201110292905 CN 201110292905 CN 201110292905 A CN201110292905 A CN 201110292905A CN 103037664 A CN103037664 A CN 103037664A
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- CN
- China
- Prior art keywords
- radiator
- electronic installation
- wind scooper
- electronic
- heat abstractor
- Prior art date
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Abstract
The invention relates to a radiating device and an electronic device with the same. The radiating device is used for radiating heat for the electronic device and comprises an air guiding cover and at least one radiator. The at least one radiator is arranged on a corresponding electronic component of the electronic device. The air guiding cover is fixed on the electronic device and used for collecting the radiator and the corresponding electronic component. The air guiding cover comprises a top plate. The top plate of the air guiding cover is provided with at least one accommodating hole corresponding to the electronic component. The radiator extends out of the air guiding cover through the accommodating hole. Due to the accommodating hole, the size of the radiator is not subject to limit of an inherent space, the radiator can be enlarged and have a better radiating effect, and overall radiating performance of the radiating device and the electronic device with the radiating device is improved.
Description
Technical field
The invention relates to a kind of heat radiator of electronic element and utilize the electronic installation of this heat abstractor.
Background technology
Existing electronic installation in computer or server, tends to arrange a plurality of electronic devices that run up, such as CPU, hard disk etc., and this type of electronic device often produces high heat in when work and causes its temperature higher, therefore, usually needs the design radiator structure to reduce the temperature of electronic device.Take the CPU that is arranged on main circuit board on computer or the server as example, cpu heat is set usually on it.And for the radiating mode of other electronic devices of main circuit board, the common way of industry is in the main frame inside at main circuit board place one wind scooper to be set, be fastened on the electronic device that needs heat radiation, as: the CPU of main circuit board and the upper cpu heat that arranges thereof, circulate according to preset direction under the guiding of wind scooper with the air that makes the outside, and then take away the electronic device temperature that is fastened by wind scooper.But because the inner limited space that is used for arranging radiator of main frame, the area of radiator is difficult for expansion, causes radiating effect limited.
Summary of the invention
For the limited problem of the heat-sinking capability that solves the radiator of electronic installation in the prior art, be necessary to provide a kind of can improving radiating effect heat abstractor and use the electronic installation of this heat abstractor.
A kind of heat abstractor is used for to electronic installation heat radiation, and it comprises wind scooper and at least one radiator.This at least one radiator is arranged on the corresponding electronic element of this electronic installation.This wind scooper is fixed on this electronic installation, to accommodate this at least one radiator and corresponding electronic component.This wind scooper comprises a top board.The top board of this wind scooper has at least one containing hole that arranges should electronic component.This at least one radiator stretches out this wind scooper via this at least one containing hole.
A kind of electronic installation, it comprises circuit board, is located at electronic component and heat abstractor on this circuit board.This heat abstractor is used for the electronic element radiating to electronic installation inside, and it comprises wind scooper and at least one radiator.This radiator is arranged on the corresponding electronic element of this electronic installation.This wind scooper is fixed on this electronic installation, to accommodate this at least one radiator and corresponding electronic component.This wind scooper comprises a top board.The top board of this wind scooper has at least one containing hole that arranges should electronic component.This wind scooper is stretched out via this at least one containing hole in the top of this at least one radiator.
Compared with prior art, the size that makes radiator that arranges of the containing hole of the wind scooper of heat abstractor is not subject to the restriction in intrinsic space and can does large, to play further comparatively good thermolysis, improve heat abstractor and have the integral heat sink performance of the electronic installation of this heat abstractor.
Description of drawings
Fig. 1 is the perspective exploded view of the electronic installation in one embodiment of the invention.
Fig. 2 is the part assembling schematic diagram of electronic installation shown in Figure 1.
Fig. 3 is the assembling schematic diagram of electronic installation shown in Figure 1.
Fig. 4 is the partial cutaway schematic at IV-IV place among Fig. 3.
The main element symbol description
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10 |
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20 |
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12 |
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13 |
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15 |
| The |
16 |
| The |
17 |
| The |
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27 |
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28 |
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19 |
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120 |
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123 |
| The first |
129 |
| The second |
128 |
| Through |
33 |
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190 |
| The first containing |
195 |
| The |
196 |
| Connecting |
197 |
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178、188 |
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170、180 |
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121 |
| The height of the first receiving space | D1 |
| The height of the second receiving | D2 |
| Fan | |
| 21、22 |
Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
Embodiment
See also Fig. 1, for using the exploded view of the electronic installation that heat abstractor one execution mode of the present invention dispels the heat.Heat abstractor of the present invention can be used for having on the electronic installation of golf calorific value electronic device, as: the main frame of PC, data terminal set etc.
This electronic installation 10 comprises a housing 12, is positioned at a circuit board 13, electrical connection and the nation at least one processor on this circuit board 13 of this housing 12, and this at least one processor in the course of the work, can produce a large amount of heats.Heat abstractor 20 is arranged in the housing 12 of this electronic installation 10, is used to this at least one processor to dispel the heat.In the present embodiment, this electronic installation 10 comprises a first processor 15 and one second processor 16, and this two processor 15,16 can be central processing unit (CPU), and central processing unit can produce larger heat in the course of the work.Variable ground, this electronic installation 10 further comprises one first memory cell 27 and one second memory cell 28.This two memory cell 27,28 comprises that respectively one is electrically connected slot and is inserted in the interior memory stick of slot.This first processor 15 can be arranged side by side with this first memory 27.This second processor 16 can be arranged side by side with this second memory 28.
This housing 12 is formed with electronic component and this heat abstractor 20 of one first receiving space 129 to accommodate this electronic installation 10, and this housing 12 comprises a loam cake 121, a base plate 120 and is used for connecting the sidewall 123 of this base plate 120 and this loam cake 121.121 intervals of this base plate 120 and this loam cake, one space D 1, the i.e. height of this first receiving space 129.Preferably, relative two sidewalls 123 of this housing 12 comprise a plurality of louvres 33.In one embodiment, this sidewall 123 can extend to form to a side from the limit of this base plate 120.
This heat abstractor 20 comprises at least one radiator and a wind scooper 19.In the present embodiment, it is two that the quantity of this radiator cooperates the quantity of processor, is respectively the first radiator 17 and the second radiator 18.This first radiator 17 is separately positioned on this first and second processor 15,16 tops with this second radiator 18, is used for the heat that first, second processor 15,16 of conduction produces.This first, second radiator 17,18 comprises respectively pedestal 178,188 and a plurality of fin 170,180 that is arranged side by side on this pedestal 178,188.Form a plurality of air-guiding aisles that are arranged in parallel between the adjacent fin 170,180, blow over this radiator from the outside wind that produces along this air-guiding aisle, to accelerate heat radiation.Wherein, the thickness of this first processor 15 and this first radiator 17 and the height that is higher than this first memory 27; The thickness of this second processor 16 and this second radiator 18 and the height that is higher than this second memory 28.
See also Fig. 2 to Fig. 4.This wind scooper 19 is arranged between this circuit board 13 and this loam cake 121, be fastened on this circuit board 13, so that this wind scooper 19 forms one second receiving space 128 with this circuit board 13, and the height D2 of this second receiving space 128 less than the height of this at least one radiator and respective processor with.This wind scooper 19 comprises a top board 190, is provided with at least one containing hole with at least one radiator respective numbers on this top board 190.This at least one containing hole arranges position that should processor.After this wind scooper 19 is installed, stretches out this second receiving space 128 thereby this at least one radiator can pass this at least one containing hole part, and be housed in this first receiving space 129 to this second receiving space 128 peripheral space in addition.In the present embodiment, be correspondingly provided with the first containing hole 195 and the second containing hole 196.The size of this first containing hole 195 is to size and location setting that should the first radiator 17, and the size of this second containing hole 196 is to size and location setting that should the second radiator 18.Preferably, this first containing hole 195 and the size of the second containing hole 196 can make the corresponding part of the first radiator 17, the second radiator 18 expose when assembling, and corresponding the first radiator 17 of accommodating with it, the second radiator 18 are basic identical in the cross section size of accommodating the place.This top board 190 to base plate 120 distances of this housing 12 between the thickness of this first processor 15 and this first radiator 17 and and the height of this first memory 27 between; This top board 190 to base plate 120 distances of this housing 12 between the thickness of this second processor 16 and this second radiator 18 and and the height of this second memory 28 between.The fin 170,180 of this first radiator 17 and the second radiator 18 passes this wind scooper 19 via this first containing hole 195 with this second containing hole 196 respectively.
In one embodiment, this top board 190 can be fixed on the sidewall 123 of this housing 12 by retaining element (not indicating) is set in edge, and then this second receiving space 128 is defined jointly by the sidewall 123 of this top board 190, this circuit board 13 and this housing.
In another embodiment, this wind scooper 19 can also comprise two connecting walls 197 that relatively arrange that extend towards this base plate 120 from top board 190, this connecting wall 197 supports this top board 190 and comprises retaining element, to be fixed on this base plate 120 or this circuit board 13.In this embodiment, this top board 190, this connecting wall 197 and this circuit board 13 define this second receiving space 128 jointly.
This heat abstractor 20 can also comprise at least one fan 21,22, this fan 21,22 for generation of the air-flow of directed flow to strengthen radiating effect.Particularly, this fan 21,22 is arranged at a side of this circuit board 13, and preferably, fan 21,22 is over against first and second radiator 17,18 air-guiding aisle setting.
During running, this two fan 21,22 operations can be according to direction of arrow circulations shown in Figure 2 under the guiding of this wind scooper 19 via the air stream that this fan 21,22 is produced by boasting.Because wind scooper 19 and fin 170,180 orientation all have guide function to the circulation of air, therefore, air can flow out outside this wind scooper 19 from this first containing hole 195 and this second containing hole 196 and the space of exposing between the fin 170,180 in these wind scooper 19 outsides hardly.Under this first containing hole 195 and stepping down of this second containing hole 196 act on, fin 170,180 can not be subjected to wind scooper 19 and 120 formation of base plate the second receiving space 128 limitation in height and extend this containing hole 195,196, thereby take full advantage of the gap larger sized fin when obtaining to adopt the wind scooper that containing hole is not set between the first receiving space 129 and the second receiving space 128.Because the increase of fin 170,180 sizes can be played comparatively good thermolysis further, improves the integral heat sink performance of this electronic installation 10.
Claims (10)
1. heat abstractor, be used for dispelling the heat to an electronic installation, it comprises wind scooper and at least one radiator, this at least one radiator is arranged on the corresponding electronic element of this electronic installation, this wind scooper is fixed on this electronic installation, to accommodate this at least one radiator and corresponding electronic component, it is characterized in that: this wind scooper comprises a top board, the top board of this wind scooper has at least one containing hole that arranges should electronic component, and this at least one radiator stretches out this wind scooper via this at least one containing hole.
2. heat abstractor as claimed in claim 1 is characterized in that: the edge of this top board has retaining element and is used for this wind scooper is fixed in electronic installation.
3. heat abstractor as claimed in claim 1 is characterized in that: the size of this containing hole can make the corresponding part of radiator expose when assembling, and corresponding radiator of accommodating with it is basic identical in the cross section size of accommodating the place.
4. electronic installation, it comprises circuit board, be located at electronic component and heat abstractor on this circuit board, this heat abstractor is used for the electronic element radiating to electronic installation inside, it comprises wind scooper and at least one radiator, this radiator is arranged on the corresponding electronic element of this electronic installation, this wind scooper is fixed on this electronic installation, to accommodate this at least one radiator and corresponding electronic component, it is characterized in that: this wind scooper comprises a top board, the top board of this wind scooper has at least one containing hole that arranges should electronic component, and this wind scooper is stretched out via this at least one containing hole in the top of this at least one radiator.
5. electronic installation as claimed in claim 4, it is characterized in that: this electronic installation comprises housing, this case top lid, base plate reach the sidewall that is used for connecting this base plate and this loam cake, interval one spacing between this base plate and this loam cake is accommodated circuit board to form a receiving space, is located at electronic building brick and heat abstractor on this circuit board.
6. electronic installation as claimed in claim 4, it is characterized in that: this electronic installation further comprises housing, this housing comprises base plate and the sidewall that extends to a side from the limit of this base plate, and this base plate and this sidewall form receiving space and accommodate this circuit board, be located at electronic component and heat abstractor on this circuit board.
7. electronic installation as claimed in claim 6, it is characterized in that: this wind scooper comprises that further two connecting walls that extend to the same side from the relative dual side-edge of top board are used for fixing or support this top board, on this connecting wall retaining element is set, is used for fixing with the inside sidewalls of this housing.
8. electronic installation as claimed in claim 7, it is characterized in that: this housing further comprises loam cake, this sidewall connects this loam cake and this base plate, and then forms a receiving space and accommodate this circuit board, be located at electronic component and heat abstractor on this circuit board.
9. electronic installation as claimed in claim 4, it is characterized in that: this heat abstractor also comprises fan, and this radiator comprises a plurality of fin that are arranged side by side, and adjacent fin forms air-guiding aisle, and this fan is over against the air-guiding aisle setting of radiator.
10. electronic installation as claimed in claim 4, it is characterized in that: this electronic component is processor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110292905 CN103037664A (en) | 2011-10-06 | 2011-10-06 | Radiating device and electronic device using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110292905 CN103037664A (en) | 2011-10-06 | 2011-10-06 | Radiating device and electronic device using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103037664A true CN103037664A (en) | 2013-04-10 |
Family
ID=48023984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110292905 Pending CN103037664A (en) | 2011-10-06 | 2011-10-06 | Radiating device and electronic device using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103037664A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103885562A (en) * | 2014-04-09 | 2014-06-25 | 北京德能恒信科技有限公司 | Heat transfer type server machine shell |
| CN108490723A (en) * | 2015-05-12 | 2018-09-04 | 苏州佳世达光电有限公司 | Projection arrangement |
| CN113873841A (en) * | 2021-09-28 | 2021-12-31 | 苏州浪潮智能科技有限公司 | Server rack heat dissipation module and server rack |
-
2011
- 2011-10-06 CN CN 201110292905 patent/CN103037664A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103885562A (en) * | 2014-04-09 | 2014-06-25 | 北京德能恒信科技有限公司 | Heat transfer type server machine shell |
| CN108490723A (en) * | 2015-05-12 | 2018-09-04 | 苏州佳世达光电有限公司 | Projection arrangement |
| CN113873841A (en) * | 2021-09-28 | 2021-12-31 | 苏州浪潮智能科技有限公司 | Server rack heat dissipation module and server rack |
| CN113873841B (en) * | 2021-09-28 | 2023-02-24 | 苏州浪潮智能科技有限公司 | Server rack heat dissipation module and server rack |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130410 |