CN105008461B - 光学元件封装用树脂组合物 - Google Patents

光学元件封装用树脂组合物 Download PDF

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Publication number
CN105008461B
CN105008461B CN201480010669.7A CN201480010669A CN105008461B CN 105008461 B CN105008461 B CN 105008461B CN 201480010669 A CN201480010669 A CN 201480010669A CN 105008461 B CN105008461 B CN 105008461B
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optical element
chemical formula
resin composition
carbon atom
atom number
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CN105008461A (zh
Inventor
朱汉福
宋善植
权赫勇
朴恩珠
金宰贤
郭泳齐
殷熙天
任喜恩
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Dongjin Semichem Co Ltd
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Dongjin Semichem Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/60—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/62—Nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
CN201480010669.7A 2013-02-28 2014-02-24 光学元件封装用树脂组合物 Active CN105008461B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020130021845A KR102016348B1 (ko) 2013-02-28 2013-02-28 광학소자 봉지용 수지 조성물
KR10-2013-0021845 2013-02-28
PCT/KR2014/001458 WO2014133287A1 (ko) 2013-02-28 2014-02-24 광학소자 봉지용 수지 조성물

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CN105008461A CN105008461A (zh) 2015-10-28
CN105008461B true CN105008461B (zh) 2019-07-05

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US (1) US9593241B2 (https=)
JP (1) JP6325006B2 (https=)
KR (1) KR102016348B1 (https=)
CN (1) CN105008461B (https=)
TW (1) TWI623587B (https=)
WO (1) WO2014133287A1 (https=)

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Publication number Priority date Publication date Assignee Title
SG10201800517XA (en) * 2013-07-19 2018-02-27 Az Electronic Mat Luxembourg Sarl Encapsulation material for light emitting diodes
CN104993067A (zh) * 2015-07-13 2015-10-21 深圳市华星光电技术有限公司 有机发光二极管封装件、其制造方法及显示装置
WO2018106089A1 (ko) 2016-12-09 2018-06-14 주식회사 엘지화학 밀봉재 조성물
CN111263981B (zh) * 2017-10-31 2024-06-25 陶氏环球技术有限责任公司 用于光伏封装膜的聚烯烃组成物
KR102013860B1 (ko) * 2017-11-24 2019-08-23 한국생산기술연구원 불소그룹이 도입된 불소 폴리실라잔 소재 및 이의 제조방법
CN109705802A (zh) * 2018-12-30 2019-05-03 苏州桐力光电股份有限公司 一种液晶显示屏全贴合用高折光率硅胶
KR102784211B1 (ko) * 2018-12-31 2025-03-21 주식회사 동진쎄미켐 합성 수지 코팅 조성물 및 이를 이용한 합성 수지 기재 제조 방법
NO348381B1 (en) * 2020-07-02 2024-12-23 Nanize As Polysilazane coating method and device
CN112420893B (zh) * 2020-10-28 2021-11-16 吉安市木林森半导体材料有限公司 一种使用硅氮烷进行封装的紫外led灯珠及其制备方法
NO347925B1 (en) * 2021-07-07 2024-05-13 Nanize As Polysilazane compositions

Citations (1)

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US7375170B2 (en) * 2004-12-28 2008-05-20 Chisso Corporation Organosilicon compound

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US5412053A (en) * 1993-08-12 1995-05-02 The University Of Dayton Polymers containing alternating silsesquioxane and bridging group segments and process for their preparation
US7915369B2 (en) * 2004-12-07 2011-03-29 Panasonic Electric Works Co., Ltd. Ultraviolet transmissive polyhedral silsesquioxane polymers
JP2007045971A (ja) * 2005-08-11 2007-02-22 Asahi Kasei Corp 封止材用組成物及び光学デバイス
WO2008141201A1 (en) * 2007-05-10 2008-11-20 Fish Christopher N Composite materials
KR101504308B1 (ko) * 2007-12-27 2015-03-19 신닛테츠 수미킨 가가쿠 가부시키가이샤 케이지구조 함유 경화성 실리콘 공중합체 및 그 제조방법 그리고 케이지구조 함유 경화성 실리콘 공중합체를 사용한 경화성 수지 조성물 및 그 경화물
KR20090107882A (ko) * 2008-04-10 2009-10-14 삼성전자주식회사 고정층을 포함하는 경사 조성 봉지 박막 및 그의 제조방법
KR20110012581A (ko) * 2009-07-31 2011-02-09 (주)디엔에프 수소 실세스퀴옥산을 포함하는 폴리실라잔 코팅 조성물
KR20110030014A (ko) * 2009-09-17 2011-03-23 주식회사 동진쎄미켐 발광다이오드의 밀봉 방법 및 이에 의해 밀봉된 발광다이오드
JP5704168B2 (ja) * 2010-05-18 2015-04-22 Jnc株式会社 新規有機ケイ素化合物、該有機ケイ素化合物を含む熱硬化性樹脂組成物、硬化樹脂および光半導体用封止材料
TWI483995B (zh) * 2010-08-18 2015-05-11 第一毛織股份有限公司 聚有機矽氧烷與由該聚有機矽氧烷獲得之封裝材料以及包含該封裝材料之電子元件
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Also Published As

Publication number Publication date
TW201443156A (zh) 2014-11-16
JP6325006B2 (ja) 2018-05-16
KR102016348B1 (ko) 2019-08-30
US20150376407A1 (en) 2015-12-31
CN105008461A (zh) 2015-10-28
WO2014133287A1 (ko) 2014-09-04
JP2016514179A (ja) 2016-05-19
TWI623587B (zh) 2018-05-11
US9593241B2 (en) 2017-03-14
KR20140107815A (ko) 2014-09-05

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