CN104984872B - Gluing device for diode lead glue sealing device - Google Patents
Gluing device for diode lead glue sealing device Download PDFInfo
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- CN104984872B CN104984872B CN201510348183.0A CN201510348183A CN104984872B CN 104984872 B CN104984872 B CN 104984872B CN 201510348183 A CN201510348183 A CN 201510348183A CN 104984872 B CN104984872 B CN 104984872B
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- lead
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- end block
- conveyor chain
- diode
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Abstract
The invention discloses a gluing device for a diode lead glue sealing device. The diode lead glue sealing device comprises a supporting platform. A conveying chain for conveying diodes is arranged above the supporting platform. The gluing device for the diode lead glue sealing device comprises a glue sealing tank arranged on the supporting platform, and a plurality of glue sealing holes stretching in the vertical direction are formed in the glue sealing tank. A lead containing end block is arranged in the gluing device for the diode lead glue sealing device, and a plurality of parallel lead containing holes are formed in the lead containing end block. A plurality of hydraulic cylinders rising and falling in the vertical direction are arranged between the lead containing end block and the conveying chain. The glue sealing holes correspond to the lead containing holes one to one. By the adoption of the technical scheme, the gluing device for the diode lead glue sealing device can finish glue sealing treatment on leads in the vertical direction, the glue sealing positions of the leads only make contact with glue in the glue sealing process, and therefore the leads are prevented from being possibly bent.
Description
Technical field
The present invention relates to a kind of process equipment of electronic devices and components, especially a kind of gluing of diode lead sealing adhesive device
Device.
Background technology
The lead of diode need to carry out sealing process to which, so which can be caused to be prepared into complete diode.Existing envelope
In adhesive process, its contact repeatedly often through lead between the multiple sealing teeth on sealing tooth bar so that positioned at sealing tooth
On glue lead is realized gluing process.However, in above-mentioned sealing adhesive process, lead also can be with sealing while with gluing
Friction is produced between tooth, so that lead may occur bending；Simultaneously as the glue distribution degree on sealing tooth is difficult to
To guarantee, the gluing of lead is spent and is also difficult to be controlled.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of sizer of diode lead sealing adhesive device, and which can avoid
Lead is damaged during gluing, and can improve the gluing of lead and spend.
To solve above-mentioned technical problem, the present invention relates to a kind of sizer of diode lead sealing adhesive device, described two
Pole pipe lead sealing adhesive device includes support platform, is provided with for transmitting the conveyor chain of diode on support platform；It is described
Transmission support is provided with support platform, which is extended in the horizontal direction, among conveyor chain is arranged at transmission support；Institute
The sizer for stating diode lead sealing adhesive device includes the sealing groove being arranged on support platform, and which is located at conveyor chain
Inside the projection of support platform, sealing groove includes sealing cell body, and is arranged on the sealing cover plate of sealing cell body upper surface,
Multiple sealing holes for vertically extending are provided with sealing cover plate；In the sizer of the diode lead sealing adhesive device
Leaded storing end block is set, and which is hung on conveyor chain, lead is provided with multiple parallel to each other drawing in putting end block
Line holding hole, its axis is perpendicular to conveyor chain, and is vertically extended；The lead puts end block and conveyor chain
Between be provided with multiple hydraulic cylinders for vertically being lifted；End block is put with lead in sealing hole in the sealing cover plate
In lead holding hole correspond.
As a modification of the present invention, connection end block, the cylinder body of multiple hydraulic cylinders on the conveyor chain, are provided with
It is fixedly connected on connection end block；The lead is put and multiple is prolonged in the horizontal direction
The lifting plate stretched, which is corresponded with hydraulic cylinder, and the push rod end portion of the hydraulic cylinder is respectively connecting to corresponding lifting plate
On.Using above-mentioned design, the setting which can be by multiple hydraulic cylinders with lifting plate causes which to put end block reality for lead
Now stable support and lifting, to avoid its run-off the straight in transmission with lifting process from causing lead be normally carried out sealing
Process.
Used as a modification of the present invention, the push rod end of each hydraulic cylinder is provided with magnetic end block, the lifting
Correspondence position in plate is provided with electromagnetic lock, the magnetic end block and electromagnetic lock adhesive each other.Using above-mentioned design, which can lead to
Among crossing the magnetic end block of hydraulic cylinder push rod end, and lifting plate, corresponding electromagnetic lock is realized its sharp separation and is closed
Close, so that lead storing end block can realize rapidly the disengaging with hydraulic cylinder after completing to process, so as to be capable of achieving connection end
Recycling for block, enables to staff again and its operating efficiency is improved.
Used as a modification of the present invention, the lead is put the upper surface of end block and is provided with two clamping end blocks, its point
Not Wei Yu multiple lead holding holes axis be located perpendicular both sides；Each clamping end block is respectively connected with screw mandrel, screw mandrel
It is connected with and controls its motor moved along axle；The screw mandrel is extended each parallel to conveyor chain, and two clamping end block institutes are right
The direction of motion of the screw mandrel answered is opposite each other.Using above-mentioned design, on the one hand which can be put to lead by two clamping end blocks
Lead in end block is clamped, to avoid which from coming off from lead holding hole, on the other hand, two clamping end blocks screw mandrel with
Can move in opposite direction under the driving of motor, so that lead is rotated under two drives for clamping end block, make
Obtain its gluing after contacting with glue and spend and can also be improved.
As a modification of the present invention, at least one Level Detection groove in the sealing cover plate, is provided with, which is by sealing
Cover plate vertically extends to sealant cover intralaminar part, diameter and the envelope of the Level Detection groove with the opposing end surface of sealing cell body
The diameter in glue hole is identical；The upper surface of the Level Detection groove is provided with liquid level sensor.Using above-mentioned design, which can pass through liquid
Liquid level sensor in the detection hole of position is highly detected for the glue in multiple sealing holes, to guarantee the adjustable height of lead
When determining, every lead is capable of achieving good gluing effect；Level Detection groove is configured independently of sealing hole, can be avoided
Sealing of the liquid level sensor to lead is processed and is impacted.
As a modification of the present invention, drying dress in the sizer of the diode lead sealing adhesive device, is provided with
Put, which includes the bracing frame for being respectively arranged at sealing groove both sides, the upper end of bracing frame is provided with drying plate, two drying
Many heating wire are provided with the opposing end surface of plate；Height and position residing for the drying plate is located at conveyor chain and sealing
Between groove.Using above-mentioned design, which can cause lead to complete gluing and during by taking out in sealing groove, by drying on plate
Heating wire carries out drying and processing to which, and glue drippage on the one hand can be avoided to cause the pollution of equipment, lead on the other hand can be reduced
Substrate processing time so that its overall processing efficiency is improved.
The sizer of above-mentioned diode lead sealing adhesive device, among lead to be placed in lead storing end block for which, and will
Lead is put end block and is connected on conveyor chain by hydraulic cylinder；At the same time, by injecting glue in sealing groove so that
Glue in sealing groove can be extended to via sealing cell body inside sealing hole and Level Detection groove in sealing cover plate；When liquid level is examined
When in survey groove, the liquid level of glue reaches the demand height of diode lead sealing, you can controlling transmission chain is driven.
When conveyor chain drives connection end block connection lead to put the surface of end block arrival sealing groove, lead puts end
Block is declined under the driving of hydraulic cylinder, so that lead is entered inside sealing groove.Now, lead puts end block upper surface
Two pieces of clamping end blocks carry out adverse movement respectively under the driving of screw mandrel, and lead is acted in sealing groove by which and rotated, from
And cause which to realize highly efficient processing with uniform sealing.After lead completes sealing to be processed, which is taken out from sealing hole, together
When sealing groove both sides drying plate in heating wire start, when lead rise to drying plate place height when, which is in electric heating
Drying and processing is carried out under heat produced by silk.When the glue on lead is dried in the state of will not drip, its connection is drawn
Line is put end block and is moved ahead under the drive of conveyor chain, until which arrives at the end of conveyor chain, staff is by untiing electricity
Magnetic padlock puts the disengaging of end block and hydraulic cylinder to realize lead, so far completes whole sealing operations of lead.
Using the sizer of the diode lead sealing adhesive device of above-mentioned technical proposal, its can in the vertical direction complete right
The sealing of lead is processed, and the sealing position of lead is only come in contact with glue during sealing, so as to avoid biography
In the sealing operation of system, lead may occur the phenomenon for bending；Meanwhile, the setting in the sealing hole employed in sizer makes
Obtain glue to be effectively controlled with the contact area of air, the glue for causing in atmosphere is exposed for a long time so as to avoid glue
The decline of quality；Additionally, in the immersion in glue, lead can ensure which is produced sufficient between glue and uniformly contacts, and then
So that the gluing quality of lead is improved.
Description of the drawings
Fig. 1 is schematic diagram of the present invention；
Fig. 2 puts end block top view for lead in the present invention；
Fig. 3 is hydraulic cylinder in the present invention and lifting plate connection diagram；
Reference numerals list：
1-support platform, 2-conveyor chain, 3-transmission support, 4-sealing groove, 41-sealing cell body, 42-sealant cover
Plate, 43-sealing hole, 44-Level Detection groove, 45-liquid level sensor, 5-lead put end block, 6-lead holding hole, 7-
Hydraulic cylinder, 8-connection end block, 9-lifting plate, 10-magnetic end block, 11-electromagnetic lock, 12-clamping end block, 13-screw mandrel,
14-bracing frame, 15-drying plate, 16-heating wire.
Specific embodiment
With reference to specific embodiment, the present invention is further elucidated, it should be understood that following specific embodiments are only used for
The bright present invention rather than restriction the scope of the present invention.It should be noted that word "front", "rear" used in describing below,
"left", "right", "up" and "down" refer to the direction in accompanying drawing, and word " interior " and " outward " are referred respectively to towards or away from specific
The direction at component geometry center.
Embodiment 1
A kind of sizer of diode lead sealing adhesive device as shown in Figure 1, the diode lead sealing adhesive device bag
Support platform 1 is included, is provided with support platform 1 for transmitting the conveyor chain 2 of diode；Set on the support platform 1
Transmission support 3 is equipped with, which is extended in the horizontal direction, among conveyor chain 2 is arranged at transmission support 3；The diode draws
The sizer of line sealing adhesive device includes the sealing groove 4 being arranged on support platform, and it is flat in supporting which is located at conveyor chain 2
Inside the projection of platform, sealing groove 4 includes sealing cell body 41, and is arranged on the sealing cover plate 42 of 41 upper surface of sealing cell body,
Multiple sealing holes 43 for vertically extending are provided with sealing cover plate 42；The upper mucilage binding of the diode lead sealing adhesive device
Leaded storing end block 5 is centered, which is hung on conveyor chain 2, and lead is provided with putting end block 5 and multiple puts down each other
Capable lead holding hole 6, its axis is perpendicular to conveyor chain 2, and is vertically extended；The lead puts end block 5
Multiple hydraulic cylinders 7 for vertically being lifted are provided between conveyor chain 2；Sealing hole in the sealing cover plate 42
43 put the lead holding hole 6 in end block 5 with lead corresponds.
As shown in Fig. 2 connection end block 8 is provided with the conveyor chain 2, the cylinder body of multiple hydraulic cylinders 7 is fixedly connected
On connection end block 8；The lead to be put and be respectively arranged with multiple horizontally extending liters on the side end face of end block 5
Drop plate 9, which is corresponded with hydraulic cylinder 7, the push rod end portion of the hydraulic cylinder 7 be respectively connecting to corresponding lifting plate 9 it
On.Using above-mentioned design, the setting which can be by multiple hydraulic cylinders with lifting plate cause which to put end block realization for lead
Stable support and lifting, to avoid its run-off the straight in transmission with lifting process from causing lead be normally carried out sealing glue position
Reason.
As shown in Figure 2 and Figure 3, the push rod end of each hydraulic cylinder 7 is provided with magnetic end block 10, the lifting plate
Correspondence position in 9 is provided with electromagnetic lock 11, the magnetic end block 10 and the adhesive each other of electromagnetic lock 11.Using above-mentioned design, its
Can by the magnetic end block of hydraulic cylinder push rod end, and among lifting plate corresponding electromagnetic lock realize its sharp separation with
Closure, so that lead storing end block can realize rapidly the disengaging with hydraulic cylinder after completing to process, so as to be capable of achieving connection
Recycling for end block, enables to staff again and its operating efficiency is improved.
The lead is put the upper surface of end block and is provided with two clamping end blocks 12, and which is located at multiple lead holding holes respectively
The perpendicular both sides that 6 axis is located；Each clamping end block 12 is respectively connected with screw mandrel 13, and screw mandrel 13 is connected with its edge of control
The motor of axle motion；The screw mandrel 13 is extended each parallel to conveyor chain 2, the screw mandrel 13 corresponding to two clamping end blocks 12
The direction of motion it is opposite each other.Using above-mentioned design, on the one hand which can be put in end block to lead by two clamping end blocks
Lead is clamped, to avoid which from coming off from lead holding hole, on the other hand, drive of two clamping end blocks in screw mandrel and motor
Can move in opposite direction under dynamic, so that lead is rotated under two drives for clamping end block so that itself and glue
Gluing after liquid contact is spent and can be also improved.
As a modification of the present invention, a Level Detection groove 44 in the sealing cover plate 42, is provided with, which is by sealing
Cover plate 42 is vertically extended to inside sealing cover plate 42 with the opposing end surface of sealing cell body 41, the Level Detection groove 44
Diameter is identical with the diameter in sealing hole 43；The upper surface of the Level Detection groove 44 is provided with liquid level sensor 45.Using above-mentioned
Design, which can be by the liquid level sensor in Level Detection hole for the glue in multiple sealing holes is highly detected, with true
When the adjustable height of guarantor's lead determines, every lead is capable of achieving good gluing effect；Level Detection groove is independently of sealing hole
It is configured, sealing of the liquid level sensor to lead can be avoided to process and impacted.
As a modification of the present invention, drying dress in the sizer of the diode lead sealing adhesive device, is provided with
Put, which includes the bracing frame 14 for being respectively arranged at 4 both sides of sealing groove, the upper end of bracing frame 14 is provided with drying plate 15,
Many heating wire 16 are provided with the opposing end surface of two drying plates 15；Height and position residing for the drying plate 15 is located at
Between conveyor chain 2 and sealing groove 4.Using above-mentioned design, which can cause lead to complete gluing and during by taking out in sealing groove, lead to
The heating wire crossed on drying plate carries out drying and processing to which, glue drippage on the one hand can be avoided to cause the pollution of equipment, separately
On the one hand the substrate processing time of lead can be reduced so that its overall processing efficiency is improved.
The sizer of above-mentioned diode lead sealing adhesive device, among lead to be placed in lead storing end block for which, and will
Lead is put end block and is connected on conveyor chain by hydraulic cylinder；At the same time, by injecting glue in sealing groove so that
Glue in sealing groove can be extended to via sealing cell body inside sealing hole and Level Detection groove in sealing cover plate；When liquid level is examined
When in survey groove, the liquid level of glue reaches the demand height of diode lead sealing, you can controlling transmission chain is driven.
When conveyor chain drives connection end block connection lead to put the surface of end block arrival sealing groove, lead puts end
Block is declined under the driving of hydraulic cylinder, so that lead is entered inside sealing groove.Now, lead puts end block upper surface
Two pieces of clamping end blocks carry out adverse movement respectively under the driving of screw mandrel, and lead is acted in sealing groove by which and rotated, from
And cause which to realize highly efficient processing with uniform sealing.After lead completes sealing to be processed, which is taken out from sealing hole, together
When sealing groove both sides drying plate in heating wire start, when lead rise to drying plate place height when, which is in electric heating
Drying and processing is carried out under heat produced by silk.When the glue on lead is dried in the state of will not drip, its connection is drawn
Line is put end block and is moved ahead under the drive of conveyor chain, until which arrives at the end of conveyor chain, staff is by untiing electricity
Magnetic padlock puts the disengaging of end block and hydraulic cylinder to realize lead, so far completes whole sealing operations of lead.
Using the sizer of the diode lead sealing adhesive device of above-mentioned technical proposal, its can in the vertical direction complete right
The sealing of lead is processed, and the sealing position of lead is only come in contact with glue during sealing, so as to avoid biography
In the sealing operation of system, lead may occur the phenomenon for bending；Meanwhile, the setting in the sealing hole employed in sizer makes
Obtain glue to be effectively controlled with the contact area of air, the glue for causing in atmosphere is exposed for a long time so as to avoid glue
The decline of quality；Additionally, in the immersion in glue, lead can ensure which is produced sufficient between glue and uniformly contacts, and then
So that the gluing quality of lead is improved.
Embodiment 2
As a modification of the present invention, among four side end faces of the lead storing end block 5, one is respectively arranged with
Lifting plate 9, is provided with four hydraulic cylinders 7 on terminal body 8, which is corresponded with lifting plate 9.Using above-mentioned design,
Which can be put in transport and the lifting process of end block in lead, keep its stability in a plurality of directions in real time, so that its
Gluing in sealing process is carried out is spent and is further improved.
Remaining feature of the present embodiment is same as Example 1 with advantage.
Embodiment 3
As a modification of the present invention, 3 are provided with each drying plate 15 and are prolonged in the horizontal direction
The heating wire 16 stretched, which can carry out uniform drying and processing to each position at the sealing end of lead.
Remaining feature of the present embodiment is same as Example 2 with advantage.
Claims (3)
1. a kind of sizer of diode lead sealing adhesive device, the diode lead sealing adhesive device include support platform,
It is provided with support platform for transmitting the conveyor chain of diode；Characterized in that, biography is provided with the support platform
Defeated support, which is extended in the horizontal direction, among conveyor chain is arranged at transmission support；The diode lead sealing adhesive device
Sizer include the sealing groove being arranged on support platform, which is located at conveyor chain in the projection of support platform
Portion, sealing groove include sealing cell body, and are arranged on the sealing cover plate of sealing cell body upper surface, are provided with many in sealing cover plate
The individual sealing hole for vertically extending；
Leaded storing end block is set in the sizer of the diode lead sealing adhesive device, its hang on conveyor chain it
On, lead is provided with multiple lead holding holes parallel to each other in putting end block, and its axis is perpendicular to conveyor chain, and edge is vertically
Direction is extended；The lead to be put and be provided with multiple hydraulic pressure for vertically being lifted between end block and conveyor chain
Cylinder；The lead holding hole that sealing hole in the sealing cover plate is put with lead in end block is corresponded；
Connection end block is provided with the conveyor chain, the cylinder body of multiple hydraulic cylinders is fixedly connected on connection end block；Institute
Stating lead and putting multiple horizontally extending lifting plates are respectively arranged with the side end face of end block, itself and hydraulic cylinder one
One correspondence, the push rod end portion of the hydraulic cylinder are respectively connecting on corresponding lifting plate；The push rod end of each hydraulic cylinder
Portion is provided with magnetic end block, and the correspondence position in the lifting plate is provided with electromagnetic lock, the magnetic end block and electromagnetic lock
Adhesive each other；
The lead is put the upper surface of end block and is provided with two clamping end blocks, and which is respectively positioned at the axis of multiple lead holding holes
The perpendicular both sides at place；Each clamping end block is respectively connected with screw mandrel, and screw mandrel is connected with and controls its motor moved along axle；
The screw mandrel is extended each parallel to conveyor chain, and the direction of motion of the screw mandrel corresponding to two clamping end blocks is opposite each other.
2. according to the sizer of the diode lead sealing adhesive device described in claim 1, it is characterised in that the sealing cover plate
In be provided with least one Level Detection groove, which vertically extends to envelope by opposing end surface of sealing cover plate and sealing cell body
Inside glue cover plate, the diameter of the Level Detection groove is identical with the diameter in sealing hole；The upper surface of the Level Detection groove is arranged
There is liquid level sensor.
3. according to the sizer of the diode lead sealing adhesive device described in claim 2, it is characterised in that the diode draws
Drying unit is provided with the sizer of line sealing adhesive device, which includes the bracing frame for being respectively arranged at sealing groove both sides,
The upper end of support is provided with drying plate, is provided with many heating wire on the opposing end surface of two drying plates；The drying
Height and position residing for plate is located between conveyor chain and sealing groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510348183.0A CN104984872B (en) | 2015-06-23 | 2015-06-23 | Gluing device for diode lead glue sealing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510348183.0A CN104984872B (en) | 2015-06-23 | 2015-06-23 | Gluing device for diode lead glue sealing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104984872A CN104984872A (en) | 2015-10-21 |
| CN104984872B true CN104984872B (en) | 2017-04-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510348183.0A Active CN104984872B (en) | 2015-06-23 | 2015-06-23 | Gluing device for diode lead glue sealing device |
Country Status (1)
| Country | Link |
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| CN (1) | CN104984872B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105390406B (en) * | 2015-12-10 | 2017-11-07 | 重庆凯西驿电子科技有限公司 | Sealing rubber die on diode |
| CN108273709B (en) * | 2018-02-14 | 2020-09-29 | 三门县点帆环保科技有限公司 | Screw-driven auto-parts centre gripping kiss-coating device |
| CN108766896B (en) * | 2018-05-21 | 2020-07-24 | 温州杰锐电子科技有限公司 | Diode lead sealing treatment process |
| CN108461430B (en) * | 2018-05-29 | 2020-09-04 | 苏州因知成新能源有限公司 | Semiconductor diode lead sealing system |
| CN109238169B (en) * | 2018-08-23 | 2020-08-21 | 重庆市嘉凌新科技有限公司 | Lead bending detection device |
| CN111112014B (en) * | 2020-01-06 | 2020-12-01 | 杨海棠 | Energy-saving and environment-friendly paper label production device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0440257A (en) * | 1990-06-06 | 1992-02-10 | Yamada Seisakusho Kk | Method and apparatus for coating fine rod-like body such as chopsticks |
| CN201632375U (en) * | 2010-01-22 | 2010-11-17 | 浙江吉利汽车研究院有限公司 | Bolt oiling and gumming device |
| CN102327852A (en) * | 2011-08-19 | 2012-01-25 | 姚加荣 | Method for coating chopsticks |
| CN102950089A (en) * | 2012-10-16 | 2013-03-06 | 浙江双枪竹木有限公司 | Equipment for adhering sand paint on end parts of chopsticks |
| CN103120999A (en) * | 2013-02-22 | 2013-05-29 | 浙江工业大学 | Single-row chopstick ranking device and chopstick ranking method thereof |
| CN203329928U (en) * | 2013-06-24 | 2013-12-11 | 安徽中鑫半导体有限公司 | Novel diode gluing machine |
-
2015
- 2015-06-23 CN CN201510348183.0A patent/CN104984872B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0440257A (en) * | 1990-06-06 | 1992-02-10 | Yamada Seisakusho Kk | Method and apparatus for coating fine rod-like body such as chopsticks |
| CN201632375U (en) * | 2010-01-22 | 2010-11-17 | 浙江吉利汽车研究院有限公司 | Bolt oiling and gumming device |
| CN102327852A (en) * | 2011-08-19 | 2012-01-25 | 姚加荣 | Method for coating chopsticks |
| CN102950089A (en) * | 2012-10-16 | 2013-03-06 | 浙江双枪竹木有限公司 | Equipment for adhering sand paint on end parts of chopsticks |
| CN103120999A (en) * | 2013-02-22 | 2013-05-29 | 浙江工业大学 | Single-row chopstick ranking device and chopstick ranking method thereof |
| CN203329928U (en) * | 2013-06-24 | 2013-12-11 | 安徽中鑫半导体有限公司 | Novel diode gluing machine |
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| CN104984872A (en) | 2015-10-21 |
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Inventor after: Dan Long Inventor before: Jiang Yuanchang Inventor before: Jiang Youxin |
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Effective date of registration: 20180118 Address after: 233200 Anhui province Chuzhou city Dingyuan County Economic Development Zone Spring dock mountain Avenue Patentee after: Dingyuan County run Sound Electronics Co., Ltd. Address before: Dingyuan County Economic Development Zone 233200 Anhui city of Chuzhou Province Quan Wu Shan Road and Bridge Road intersection Patentee before: DINGYUAN ANZHUO ELECTRONIC TECHNOLOGY CO., LTD. |
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