CN104984872A - Gluing device for diode lead glue sealing device - Google Patents
Gluing device for diode lead glue sealing device Download PDFInfo
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- CN104984872A CN104984872A CN201510348183.0A CN201510348183A CN104984872A CN 104984872 A CN104984872 A CN 104984872A CN 201510348183 A CN201510348183 A CN 201510348183A CN 104984872 A CN104984872 A CN 104984872A
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Abstract
The invention discloses a gluing device for a diode lead glue sealing device. The diode lead glue sealing device comprises a supporting platform. A conveying chain for conveying diodes is arranged above the supporting platform. The gluing device for the diode lead glue sealing device comprises a glue sealing tank arranged on the supporting platform, and a plurality of glue sealing holes stretching in the vertical direction are formed in the glue sealing tank. A lead containing end block is arranged in the gluing device for the diode lead glue sealing device, and a plurality of parallel lead containing holes are formed in the lead containing end block. A plurality of hydraulic cylinders rising and falling in the vertical direction are arranged between the lead containing end block and the conveying chain. The glue sealing holes correspond to the lead containing holes one to one. By the adoption of the technical scheme, the gluing device for the diode lead glue sealing device can finish glue sealing treatment on leads in the vertical direction, the glue sealing positions of the leads only make contact with glue in the glue sealing process, and therefore the leads are prevented from being possibly bent.
Description
Technical field
The present invention relates to a kind of process equipment of electronic devices and components, especially a kind of sizer of diode lead sealing adhesive device.
Background technology
The lead-in wire of diode need carry out sealing process to it, is prepared into complete diode can make it.In existing sealing adhesive process, it, often through the contact repeatedly between the multiple sealing teeth gone between on sealing tooth bar, makes the glue be positioned on sealing tooth realize gluing process to lead-in wire.But, in above-mentioned sealing adhesive process, to go between while gluing also can and sealing tooth between produce and rub, thus lead-in wire may be bent; Meanwhile, all spend due to the glue distribution on sealing tooth and be difficult to be guaranteed, the gluing of lead-in wire is all spent and is also difficult to be controlled.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of sizer of diode lead sealing adhesive device, and it can avoid lead-in wire to be damaged in gluing process, and the gluing that can improve lead-in wire is all spent.
For solving the problems of the technologies described above, the present invention relates to a kind of sizer of diode lead sealing adhesive device, described diode lead sealing adhesive device comprises support platform, is provided with the conveyor chain for transmitting diode on support platform; Be provided with transmission support on described support platform, it extends in the horizontal direction, and conveyor chain is arranged among transmission support; The sizer of described diode lead sealing adhesive device includes the sealing groove be arranged on support platform, it is inner in the projection of support platform that it is positioned at conveyor chain, sealing groove includes sealing cell body, and be arranged on the sealing cover plate of sealing cell body upper surface, be provided with multiple sealing hole vertically extended in sealing cover plate; Be provided with lead-in wire in the sizer of described diode lead sealing adhesive device and put end block, it hangs on conveyor chain, lead-in wire is put in end block and is provided with multiple lead-in wire holding hole parallel to each other, and its axes normal in conveyor chain, and vertically extends; Described lead-in wire is put between end block and conveyor chain and is provided with multiple hydraulic cylinder prolonging vertical direction and carry out being elevated; Sealing hole in described sealing end cap and the lead-in wire holding hole one_to_one corresponding put in end block that goes between.
As a modification of the present invention, be provided with connection end block on described conveyor chain, the cylinder body of multiple hydraulic cylinder is fixedly connected on and connects on end block; Be respectively arranged with multiple lifting plate extended in the horizontal direction on the side end face that end block put by described lead-in wire, it is with hydraulic cylinder one_to_one corresponding, and the push rod end of described hydraulic cylinder is connected on the lifting plate of correspondence respectively.Adopt above-mentioned design, its by multiple hydraulic cylinder with lifting plate be arranged so that it is put end block for go between and realizes stable support and lifting, with avoid its transmit and lifting process in run-off the straight cause lead-in wire normally cannot carry out sealing process.
As a modification of the present invention, the push rod end of each hydraulic cylinder is provided with magnetic end block, and the correspondence position in described lifting plate is provided with electromagnetic lock, described magnetic end block and electromagnetic lock adhesive each other.Adopt above-mentioned design, it is by the magnetic end block of hydraulic cylinder push rod end, and corresponding electromagnetic lock realizes its quick separating with closed among lifting plate, put end block to make lead-in wire and can realize rapidly the disengaging with hydraulic cylinder after completing processing, thus can realize connecting recycling of end block, staff can be made again to be improved to its operating efficiency.
As a modification of the present invention, the upper surface that end block put by described lead-in wire is provided with two clamping end blocks, and it lays respectively at the perpendicular both sides at the axis place of multiple lead-in wire holding hole; Each clamping end block is all connected with screw mandrel, and screw mandrel is connected with and controls its motor moved along axle; Described screw mandrel is all parallel to conveyor chain and extends, and the direction of motion of the screw mandrel of two clampings corresponding to end block is opposite each other.Adopt above-mentioned design, it clamps the lead-in wire that lead-in wire is put in end block by two clamping end blocks on the one hand, come off in lead-in wire holding hole to avoid it, on the other hand, two clamping end blocks can move along contrary direction under the driving of screw mandrel with motor, thus lead-in wire is rotated under the drive of two clamping end blocks, the gluing after it is contacted with glue is all spent and also can be improved.
As a modification of the present invention, at least one level sensing groove is provided with in described sealing cover plate, it vertically extends to sealant cover intralamellar part by the opposing end surface of sealing cover plate and sealing cell body, and the diameter of described level sensing groove is identical with the diameter in sealing hole; The upper surface of described level sensing groove is provided with liquid level sensor.Adopt above-mentioned design, it detects for the glue height in multiple sealing hole by the liquid level sensor in level sensing hole, and during to guarantee that the adjustable height gone between is determined, every root lead-in wire all can realize good gluing effect; Level sensing groove carries out arranging independent of sealing hole, and the sealing process of liquid level sensor to lead-in wire can be avoided to impact.
As a modification of the present invention, drying unit is provided with in the sizer of described diode lead sealing adhesive device, it includes the bracing frame being arranged at sealing groove both sides respectively, and the upper end of bracing frame is provided with oven dry plate, and the opposing end surface of two oven dry plates is provided with many heating wire; Height and position residing for described oven dry plate is between conveyor chain and sealing groove.Adopt above-mentioned design, it can make lead-in wire complete gluing and by when taking out in sealing groove, by the heating wire of drying on plate, drying and processing is carried out to it, glue can be avoided on the one hand to drip the pollution causing equipment, the substrate processing time of lead-in wire can be reduced on the other hand, its overall processing efficiency is improved.
The sizer of above-mentioned diode lead sealing adhesive device, lead-in wire is placed in lead-in wire and puts among end block by it, and is connected on conveyor chain by lead-in wire storing end block by hydraulic cylinder; Meanwhile, by injecting glue in sealing groove, make the glue in sealing groove can extend to sealing hole in sealing cover plate via sealing cell body and level sensing groove is inner; When the liquid level of glue reaches the demand height of diode lead sealing in level sensing groove, transmission can be carried out by controls transfer chain.
When conveyor chain drives connection end block connection lead-in wire storing end block to arrive directly over sealing groove, the storing end block that goes between declines under the driving of hydraulic cylinder, inner to make lead-in wire enter sealing groove.Now, the two pieces of clamping end blocks putting end block upper surface that go between carry out counter motion respectively under the driving of screw mandrel, and lead-in wire acts in sealing groove by it and rotates, thus makes it realize more efficient and uniform sealing process.After lead-in wire completes sealing process, it takes out in sealing hole, and the heating wire in the oven dry plate of simultaneously sealing groove both sides starts, when lead-in wire rise to dry plate place height time, carry out drying and processing under its heat produced at heating wire.Glue on lead-in wire is dried under the state that can not drip, it is communicated with lead-in wire storing end block and moves ahead under the drive of conveyor chain, until it arrives at the end of conveyor chain, staff puts the disengaging of end block and hydraulic cylinder by untiing electromagnetic lock to realize going between, and so far completes whole sealing operations of lead-in wire.
Adopt the sizer of the diode lead sealing adhesive device of technique scheme, it can the sealing process of the complete paired lead of in the vertical direction, and the sealing position gone between only is come in contact with glue in sealing process, thus avoiding in traditional sealing operation, the phenomenon bent may be there is in lead-in wire; Meanwhile, the setting in the sealing hole adopted in sizer, makes the contact area of glue and air be effectively controlled, thus avoids the decline that glue exposes the glue quality caused in atmosphere for a long time; In addition, the immersion gone between in glue can be guaranteed produce sufficient between its with glue and contact uniformly, and then the gluing quality gone between is improved.
Accompanying drawing explanation
Fig. 1 is schematic diagram of the present invention;
Fig. 2 is that in the present invention, end block top view put by lead-in wire;
Fig. 3 is hydraulic cylinder and lifting plate connection diagram in the present invention;
Reference numerals list:
1-support platform, 2-conveyor chain, 3-transmission support, 4-sealing groove, 41-sealing cell body, 42-sealing cover plate, 43-sealing hole, 44-level sensing groove, 45-liquid level sensor, 5-lead-in wire storing end block, 6-lead-in wire holding hole, 7-hydraulic cylinder, 8-connection end block, 9-lifting plate, 10-magnetic end block, 11-electromagnetic lock, 12-clamping end block, 13-screw mandrel, 14-bracing frame, 15-oven dry plate, 16-heating wire.
Detailed description of the invention
Below in conjunction with detailed description of the invention, illustrate the present invention further, following detailed description of the invention should be understood and be only not used in for illustration of the present invention and limit the scope of the invention.It should be noted that, the word "front", "rear" of use is described below, "left", "right", "up" and "down" refer to direction in accompanying drawing, word " interior " and " outward " refer to the direction towards or away from particular elements geometric center respectively.
Embodiment 1
The sizer of a kind of diode lead sealing adhesive device as shown in Figure 1, described diode lead sealing adhesive device comprises support platform 1, is provided with the conveyor chain 2 for transmitting diode on support platform 1; Be provided with transmission support 3 on described support platform 1, it extends in the horizontal direction, and conveyor chain 2 is arranged among transmission support 3; The sizer of described diode lead sealing adhesive device includes the sealing groove 4 be arranged on support platform, it is inner in the projection of support platform that it is positioned at conveyor chain 2, sealing groove 4 includes sealing cell body 41, and be arranged on the sealing cover plate 42 of sealing cell body 41 upper surface, be provided with multiple sealing hole 43 vertically extended in sealing cover plate 42; Be provided with lead-in wire in the sizer of described diode lead sealing adhesive device and put end block 5, it hangs on conveyor chain 2, lead-in wire is put in end block 5 and is provided with multiple lead-in wire holding hole 6 parallel to each other, and its axes normal in conveyor chain 2, and vertically extends; Described lead-in wire is put between end block 5 and conveyor chain 2 and is provided with multiple hydraulic cylinder 7 prolonging vertical direction and carry out being elevated; Sealing hole 43 in described sealing end cap 42 and lead-in wire holding hole 6 one_to_one corresponding put in end block 5 that goes between.
As shown in Figure 2, be provided with and connect end block 8 on described conveyor chain 2, the cylinder body of multiple hydraulic cylinder 7 is fixedly connected on and connects on end block 8; Be respectively arranged with multiple lifting plate 9 extended in the horizontal direction on the side end face that end block 5 put by described lead-in wire, it is with hydraulic cylinder 7 one_to_one corresponding, and the push rod end of described hydraulic cylinder 7 is connected on the lifting plate 9 of correspondence respectively.Adopt above-mentioned design, its by multiple hydraulic cylinder with lifting plate be arranged so that it is put end block for go between and realizes stable support and lifting, with avoid its transmit and lifting process in run-off the straight cause lead-in wire normally cannot carry out sealing process.
As shown in Figure 2 and Figure 3, the push rod end of each hydraulic cylinder 7 is provided with magnetic end block 10, and the correspondence position in described lifting plate 9 is provided with electromagnetic lock 11, described magnetic end block 10 and electromagnetic lock 11 adhesive each other.Adopt above-mentioned design, it is by the magnetic end block of hydraulic cylinder push rod end, and corresponding electromagnetic lock realizes its quick separating with closed among lifting plate, put end block to make lead-in wire and can realize rapidly the disengaging with hydraulic cylinder after completing processing, thus can realize connecting recycling of end block, staff can be made again to be improved to its operating efficiency.
The upper surface that end block put by described lead-in wire is provided with two clamping end blocks 12, and it lays respectively at the perpendicular both sides at the axis place of multiple lead-in wire holding hole 6; Each clamping end block 12 is all connected with screw mandrel 13, and screw mandrel 13 is connected with and controls its motor moved along axle; Described screw mandrel 13 is all parallel to conveyor chain 2 and extends, and the direction of motion of the screw mandrel 13 of two clampings corresponding to end block 12 is opposite each other.Adopt above-mentioned design, it clamps the lead-in wire that lead-in wire is put in end block by two clamping end blocks on the one hand, come off in lead-in wire holding hole to avoid it, on the other hand, two clamping end blocks can move along contrary direction under the driving of screw mandrel with motor, thus lead-in wire is rotated under the drive of two clamping end blocks, the gluing after it is contacted with glue is all spent and also can be improved.
As a modification of the present invention, a level sensing groove 44 is provided with in described sealing cover plate 42, it is inner that it vertically extends to sealing cover plate 42 by sealing cover plate 42 and the opposing end surface of sealing cell body 41, and the diameter of described level sensing groove 44 is identical with the diameter in sealing hole 43; The upper surface of described level sensing groove 44 is provided with liquid level sensor 45.Adopt above-mentioned design, it detects for the glue height in multiple sealing hole by the liquid level sensor in level sensing hole, and during to guarantee that the adjustable height gone between is determined, every root lead-in wire all can realize good gluing effect; Level sensing groove carries out arranging independent of sealing hole, and the sealing process of liquid level sensor to lead-in wire can be avoided to impact.
As a modification of the present invention, drying unit is provided with in the sizer of described diode lead sealing adhesive device, it includes the bracing frame 14 being arranged at sealing groove 4 both sides respectively, the upper end of bracing frame 14 is provided with to dry on opposing end surface that plate 15, two dries plate 15 and is provided with many heating wire 16; Height and position residing for described oven dry plate 15 is between conveyor chain 2 and sealing groove 4.Adopt above-mentioned design, it can make lead-in wire complete gluing and by when taking out in sealing groove, by the heating wire of drying on plate, drying and processing is carried out to it, glue can be avoided on the one hand to drip the pollution causing equipment, the substrate processing time of lead-in wire can be reduced on the other hand, its overall processing efficiency is improved.
The sizer of above-mentioned diode lead sealing adhesive device, lead-in wire is placed in lead-in wire and puts among end block by it, and is connected on conveyor chain by lead-in wire storing end block by hydraulic cylinder; Meanwhile, by injecting glue in sealing groove, make the glue in sealing groove can extend to sealing hole in sealing cover plate via sealing cell body and level sensing groove is inner; When the liquid level of glue reaches the demand height of diode lead sealing in level sensing groove, transmission can be carried out by controls transfer chain.
When conveyor chain drives connection end block connection lead-in wire storing end block to arrive directly over sealing groove, the storing end block that goes between declines under the driving of hydraulic cylinder, inner to make lead-in wire enter sealing groove.Now, the two pieces of clamping end blocks putting end block upper surface that go between carry out counter motion respectively under the driving of screw mandrel, and lead-in wire acts in sealing groove by it and rotates, thus makes it realize more efficient and uniform sealing process.After lead-in wire completes sealing process, it takes out in sealing hole, and the heating wire in the oven dry plate of simultaneously sealing groove both sides starts, when lead-in wire rise to dry plate place height time, carry out drying and processing under its heat produced at heating wire.Glue on lead-in wire is dried under the state that can not drip, it is communicated with lead-in wire storing end block and moves ahead under the drive of conveyor chain, until it arrives at the end of conveyor chain, staff puts the disengaging of end block and hydraulic cylinder by untiing electromagnetic lock to realize going between, and so far completes whole sealing operations of lead-in wire.
Adopt the sizer of the diode lead sealing adhesive device of technique scheme, it can the sealing process of the complete paired lead of in the vertical direction, and the sealing position gone between only is come in contact with glue in sealing process, thus avoiding in traditional sealing operation, the phenomenon bent may be there is in lead-in wire; Meanwhile, the setting in the sealing hole adopted in sizer, makes the contact area of glue and air be effectively controlled, thus avoids the decline that glue exposes the glue quality caused in atmosphere for a long time; In addition, the immersion gone between in glue can be guaranteed produce sufficient between its with glue and contact uniformly, and then the gluing quality gone between is improved.
Embodiment 2
As a modification of the present invention, be respectively arranged with a lifting plate 9 among four side end faces that end block 5 put by described lead-in wire, on terminal body 8, be provided with four hydraulic cylinders 7, itself and lifting plate 9 one_to_one corresponding.Adopt above-mentioned design, it can put in transport and the lifting process of end block at lead-in wire, its stability in a plurality of directions of maintenance in real time, all spends to make it and is able to further improvement carrying out the gluing in sealing process.
All the other feature & benefits of the present embodiment are all identical with embodiment 1.
Embodiment 3
As a modification of the present invention, each is dried on plate 15 and is provided with 3 heating wire 16 carrying out in the horizontal direction extending, and it can carry out uniform drying and processing to each position of the sealing end of lead-in wire.
All the other feature & benefits of the present embodiment are all identical with embodiment 2.
Claims (6)
1. a sizer for diode lead sealing adhesive device, described diode lead sealing adhesive device comprises support platform, is provided with the conveyor chain for transmitting diode on support platform; It is characterized in that, be provided with transmission support on described support platform, it extends in the horizontal direction, and conveyor chain is arranged among transmission support; The sizer of described diode lead sealing adhesive device includes the sealing groove be arranged on support platform, it is inner in the projection of support platform that it is positioned at conveyor chain, sealing groove includes sealing cell body, and be arranged on the sealing cover plate of sealing cell body upper surface, be provided with multiple sealing hole vertically extended in sealing cover plate;
Be provided with lead-in wire in the sizer of described diode lead sealing adhesive device and put end block, it hangs on conveyor chain, lead-in wire is put in end block and is provided with multiple lead-in wire holding hole parallel to each other, and its axes normal in conveyor chain, and vertically extends; Described lead-in wire is put between end block and conveyor chain and is provided with multiple hydraulic cylinder prolonging vertical direction and carry out being elevated; Sealing hole in described sealing end cap and the lead-in wire holding hole one_to_one corresponding put in end block that goes between.
2. according to the sizer of diode lead sealing adhesive device according to claim 1, it is characterized in that, be provided with connection end block on described conveyor chain, the cylinder body of multiple hydraulic cylinder is fixedly connected on and connects on end block; Be respectively arranged with multiple lifting plate extended in the horizontal direction on the side end face that end block put by described lead-in wire, it is with hydraulic cylinder one_to_one corresponding, and the push rod end of described hydraulic cylinder is connected on the lifting plate of correspondence respectively.
3. according to the sizer of diode lead sealing adhesive device according to claim 2, it is characterized in that, the push rod end of each hydraulic cylinder is provided with magnetic end block, and the correspondence position in described lifting plate is provided with electromagnetic lock, described magnetic end block and electromagnetic lock adhesive each other.
4. according to the sizer of diode lead sealing adhesive device according to claim 3, it is characterized in that, the upper surface that end block put by described lead-in wire is provided with two clamping end blocks, and it lays respectively at the perpendicular both sides at the axis place of multiple lead-in wire holding hole; Each clamping end block is all connected with screw mandrel, and screw mandrel is connected with and controls its motor moved along axle; Described screw mandrel is all parallel to conveyor chain and extends, and the direction of motion of the screw mandrel of two clampings corresponding to end block is opposite each other.
5. according to the sizer of diode lead sealing adhesive device according to claim 4, it is characterized in that, at least one level sensing groove is provided with in described sealing cover plate, it vertically extends to sealant cover intralamellar part by the opposing end surface of sealing cover plate and sealing cell body, and the diameter of described level sensing groove is identical with the diameter in sealing hole; The upper surface of described level sensing groove is provided with liquid level sensor.
6. according to the sizer of diode lead sealing adhesive device according to claim 5, it is characterized in that, drying unit is provided with in the sizer of described diode lead sealing adhesive device, it includes the bracing frame being arranged at sealing groove both sides respectively, the upper end of bracing frame is provided with oven dry plate, and the opposing end surface of two oven dry plates is provided with many heating wire; Height and position residing for described oven dry plate is between conveyor chain and sealing groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510348183.0A CN104984872B (en) | 2015-06-23 | 2015-06-23 | Gluing device for diode lead glue sealing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510348183.0A CN104984872B (en) | 2015-06-23 | 2015-06-23 | Gluing device for diode lead glue sealing device |
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| CN104984872A true CN104984872A (en) | 2015-10-21 |
| CN104984872B CN104984872B (en) | 2017-04-12 |
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Cited By (6)
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| CN105390406A (en) * | 2015-12-10 | 2016-03-09 | 重庆凯西驿电子科技有限公司 | Diode gluing mold |
| CN108273709A (en) * | 2018-02-14 | 2018-07-13 | 安徽机电职业技术学院 | A kind of auto parts machinery clamping kiss-coating device of lead screw transmission |
| CN108461430A (en) * | 2018-05-29 | 2018-08-28 | 兰凤 | A kind of semiconductor diode lead sealing system |
| CN108766896A (en) * | 2018-05-21 | 2018-11-06 | 汤美侠 | A kind of diode lead sealing treatment process |
| CN109238169A (en) * | 2018-08-23 | 2019-01-18 | 重庆市嘉凌新科技有限公司 | lead bending detection device |
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| JPH06222B2 (en) * | 1990-06-06 | 1994-01-05 | 山田製作所株式会社 | Coating method and coating equipment for thin sticks such as chopsticks |
| CN201632375U (en) * | 2010-01-22 | 2010-11-17 | 浙江吉利汽车研究院有限公司 | Bolt oiling and gumming device |
| CN102327852A (en) * | 2011-08-19 | 2012-01-25 | 姚加荣 | Method for coating chopsticks |
| CN102950089B (en) * | 2012-10-16 | 2016-03-02 | 浙江双枪竹木有限公司 | A kind of equipment for attaching sand paint in chopsticks end |
| CN103120999B (en) * | 2013-02-22 | 2015-04-22 | 浙江工业大学 | Single-row chopstick ranking device and chopstick ranking method thereof |
| CN203329928U (en) * | 2013-06-24 | 2013-12-11 | 安徽中鑫半导体有限公司 | Novel diode gluing machine |
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| CN105390406A (en) * | 2015-12-10 | 2016-03-09 | 重庆凯西驿电子科技有限公司 | Diode gluing mold |
| CN105390406B (en) * | 2015-12-10 | 2017-11-07 | 重庆凯西驿电子科技有限公司 | Sealing rubber die on diode |
| CN108273709A (en) * | 2018-02-14 | 2018-07-13 | 安徽机电职业技术学院 | A kind of auto parts machinery clamping kiss-coating device of lead screw transmission |
| CN108766896A (en) * | 2018-05-21 | 2018-11-06 | 汤美侠 | A kind of diode lead sealing treatment process |
| CN108461430A (en) * | 2018-05-29 | 2018-08-28 | 兰凤 | A kind of semiconductor diode lead sealing system |
| CN108461430B (en) * | 2018-05-29 | 2020-09-04 | 苏州因知成新能源有限公司 | Semiconductor diode lead sealing system |
| CN109238169A (en) * | 2018-08-23 | 2019-01-18 | 重庆市嘉凌新科技有限公司 | lead bending detection device |
| CN109238169B (en) * | 2018-08-23 | 2020-08-21 | 重庆市嘉凌新科技有限公司 | Lead bending detection device |
| CN111112014A (en) * | 2020-01-06 | 2020-05-08 | 杨海棠 | Energy-saving and environment-friendly paper label production device |
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| CN104984872B (en) | 2017-04-12 |
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Inventor after: Dan Long Inventor before: Jiang Yuanchang Inventor before: Jiang Youxin |
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Effective date of registration: 20180118 Address after: 233200 Anhui province Chuzhou city Dingyuan County Economic Development Zone Spring dock mountain Avenue Patentee after: Dingyuan County run Sound Electronics Co., Ltd. Address before: Dingyuan County Economic Development Zone 233200 Anhui city of Chuzhou Province Quan Wu Shan Road and Bridge Road intersection Patentee before: DINGYUAN ANZHUO ELECTRONIC TECHNOLOGY CO., LTD. |
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