CN105390406B - Sealing rubber die on diode - Google Patents
Sealing rubber die on diode Download PDFInfo
- Publication number
- CN105390406B CN105390406B CN201510915578.4A CN201510915578A CN105390406B CN 105390406 B CN105390406 B CN 105390406B CN 201510915578 A CN201510915578 A CN 201510915578A CN 105390406 B CN105390406 B CN 105390406B
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- China
- Prior art keywords
- diode
- mould bases
- template
- fixture block
- forming pockets
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Abstract
This patent discloses sealing rubber die on the diode in diode manufacture field, including mould bases, core rod.The mould bases is rectangular box-like, and two relative madial walls of mould bases are provided with some relative necks.The core rod includes template and fixture block, and one end of the template is provided with multiple shaping grooves being set up in parallel, and the fixture block, which is fixed in the bottom of forming pockets, each forming pockets, is set side by side with two fixture blocks.The two ends of the template are outwards extended and form chuck, and the thickness of the chuck is equal with the half of the neck width.This programme is simple in construction, is skillfully constructed, and will not cause abrasion during glue to diode on the diode, is more convenient to carry out gluing to the diode after pickling.
Description
Technical field
Field is manufactured the present invention relates to diode, and in particular to sealing rubber die on a kind of diode.
Background technology
Diode, is that a kind of device with two electrodes only allows electric current by single direction stream among electronic component
Cross.The most common function of diode is exactly only to allow electric current to be passed through by single direction（Referred to as forward bias voltage drop）, blocked when reverse
（Referred to as reverse bias）.Therefore, diode can be thought of as the non-return valve of electronic edition.
In the production technology of existing axial diode, its technological process is：Lead is filled to-cDNA microarray-chip
Fill out-weld -- pickling --- gluing -- baking --- plastic packaging --- solidify afterwards --- plating --- lettering test -- outer inspection -- packaging.Wherein
Upper glue process refers to that the die surfaces for drying moisture through high temperature, which apply one layer of silicon rubber, makes tube core P-N junction and extraneous ring by after pickling
Border keeps apart, to avoid influence of the surrounding impurities to device performance, can play protection tube core, stable die surfaces.It is existing
It is, by a stainless steel strip, by the Surface Machining of stainless steel strip into saw male and fomale(M＆F), to produce to have the diode gluing fixture in technology
Product surface after this gluing fixture has full uniform liquid silica gel to cover.Have a disadvantage in that：In-convenience in use, and in production
During because contact gluing fixture stainless steel strip be copper conductor, be in rolling contact metal break flour occurs for a long time, while can also grind
Diode chip for backlight unit inside damaging, can influence the electrical property of product, and usage cycles are not long.
The content of the invention
The invention is intended to provide sealing rubber die on a kind of diode, gluing is carried out to the diode after pickling to facilitate, it is to avoid
Abrasion is caused to diode chip for backlight unit.
To reach above-mentioned purpose, basic technology scheme of the invention is as follows：Sealing rubber die on diode, including mould bases, core rod.
The mould bases is rectangular box-like, and two relative madial walls of mould bases are provided with some relative necks.The core rod include template and
Fixture block, one end of the template is provided with multiple shaping grooves being set up in parallel, and the fixture block is fixed on the bottom of forming pockets,
Two fixture blocks are set side by side with each forming pockets.Outwards extend and form chuck, the chuck in the two ends of the template
Thickness it is equal with the half of the neck width.
The principle and advantage of this programme be：During operation, it would be desirable to which the diode of gluing is placed on the forming pockets in template
It is interior, have the one side of forming pockets is relative to snap together two templates, pressed from both sides diode by the fixture block in forming pockets
Fasten, the chuck of snap together two templates is connected in the neck on mould bases, by multiple diodes that are fixed with
Mould bases can be carried to progress gluing operation on point gum machine by template after being connected on mould bases.This programme is simple in construction, design
It is ingenious, abrasion will not be caused during glue to diode on the diode, be more convenient to carry out gluing to the diode after pickling.
Preferred scheme one, based on scheme a kind of improvement, scribble the wear-resisting enamelled coating of epoxy on the fixture block.On fixture block
The wear-resisting enamelled coating of epoxy makes fixture block not cause abrasion to diode when diode is clamped.
A kind of improvement of preferred scheme two, preferably one, the template is made up of hard polyester rubber.Hard gathers
The template that ester rubber is made is easily manufactured, with low cost, will not take out more convenient during diode after gluing with glue adhesion.
A kind of improvement of preferred scheme three, preferably two, the mould bases is fixed with handle on relative both sides.
Set handle to be more convenient the carrying of mould bases on mould bases, reduce labor intensity.
Brief description of the drawings
Fig. 1 is the schematic top plan view of the embodiment of the present invention.
Embodiment
Below by embodiment, the present invention is further detailed explanation：
Reference in Figure of description includes：Mould bases 1, template 2, neck 3, shaping groove 4, fixture block 5.
Embodiment is substantially as shown in Figure 1：Sealing rubber die on diode, including mould bases 1, core rod, the mould bases 1 are rectangle frame
Shape, two relative madial walls of mould bases 1 are provided with some relative necks 3.The core rod includes template 2 and fixture block 5, the template
2 one end is provided with multiple shaping grooves 4 being set up in parallel, and the fixture block 5 is fixed on the bottom of forming pockets, each shaped recessed
Two fixture blocks 5 are set side by side with groove.The two ends of the template 2 are outwards extended and form chuck, the thickness of the chuck with
The half of the width of neck 3 is equal.The wear-resisting enamelled coating of epoxy is scribbled on the fixture block 5, the template 2 is hard polyester rubber system
Into.The mould bases 1 is fixed with handle on relative both sides.
In the present embodiment, during operation, it would be desirable to which the diode of gluing is placed in the forming pockets in template 2, by two
Template 2 has the one side of forming pockets is relative to snap together, and diode is fixedly clamped by the fixture block 5 in forming pockets,
The chuck of snap together two templates 2 is connected in the neck 3 on mould bases 1, by multiple templates 2 for being fixed with diode
Mould bases 1 can be carried to progress gluing operation on point gum machine after being connected on mould bases 1.The wear-resisting enamelled coating of epoxy on fixture block 5
Fixture block 5 is set not cause abrasion to diode when diode is clamped.The manufacturer of template 2 that hard polyester rubber is made
Just, it is with low cost, it will not take out more convenient during diode after gluing with glue adhesion.Handle is set to be more convenient on mould bases 1
The carrying of mould bases 1, reduces labor intensity.This programme is simple in construction, is skillfully constructed, on the diode will not be to diode during glue
Abrasion is caused, is more convenient to carry out gluing to the diode after pickling.
Above-described is only that the known general knowledge such as concrete structure and/or characteristic is herein in embodiments of the invention, scheme
Excessive description is not made.It should be pointed out that for those skilled in the art, without departing from the structure of the invention, also
Several modifications and improvements can be made, these should also be considered as protection scope of the present invention, these are real all without the influence present invention
The effect and practical applicability applied.The scope of protection required by this application should be based on the content of the claims, specification
In embodiment etc. record the content that can be used for explaining claim.
Claims (3)
1. sealing rubber die on diode, it is characterised in that including mould bases, core rod, the mould bases be it is rectangular box-like, mould bases it is relative two
Madial wall is provided with some relative necks；The core rod includes template and fixture block, one end of the template provided with it is multiple simultaneously
The shaping groove set is arranged, the fixture block, which is fixed in the bottom of forming pockets, each forming pockets, is set side by side with two institutes
Fixture block is stated, diode is fixedly clamped by the fixture block in forming pockets；The two ends of the template are outwards extended and form chuck, institute
The thickness for stating chuck is equal with the half of the neck width, and the wear-resisting enamelled coating of epoxy is scribbled on the fixture block.
2. sealing rubber die on diode according to claim 1, it is characterised in that：The template is hard polyester rubber system
Into.
3. sealing rubber die on diode according to claim 2, it is characterised in that：The mould bases is fixed with relative both sides
Handle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510915578.4A CN105390406B (en) | 2015-12-10 | 2015-12-10 | Sealing rubber die on diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510915578.4A CN105390406B (en) | 2015-12-10 | 2015-12-10 | Sealing rubber die on diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105390406A CN105390406A (en) | 2016-03-09 |
| CN105390406B true CN105390406B (en) | 2017-11-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510915578.4A Active CN105390406B (en) | 2015-12-10 | 2015-12-10 | Sealing rubber die on diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105390406B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108465608B (en) * | 2018-05-24 | 2024-02-13 | 天石（深圳）技研有限公司 | Multi-station frame rear cover combined dispensing equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202715529U (en) * | 2012-08-03 | 2013-02-06 | 连云港丰达电子有限公司 | Novel diode gluing jig |
| CN203277348U (en) * | 2013-05-15 | 2013-11-06 | 常州广达电子有限公司 | Sizing strip for diode production |
| CN104984872A (en) * | 2015-06-23 | 2015-10-21 | 定远县安卓电子科技有限公司 | Gluing device for diode lead glue sealing device |
| CN104984874A (en) * | 2015-06-23 | 2015-10-21 | 定远县安卓电子科技有限公司 | Diode lead sizing sealing device capable of achieving uniform sizing |
| CN104992913A (en) * | 2015-06-23 | 2015-10-21 | 定远县安卓电子科技有限公司 | Diode leading wire glue sealing device capable of achieving leading wire positioning processing |
| CN205335228U (en) * | 2015-12-10 | 2016-06-22 | 重庆凯西驿电子科技有限公司 | Diode rubberizing mould |
-
2015
- 2015-12-10 CN CN201510915578.4A patent/CN105390406B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202715529U (en) * | 2012-08-03 | 2013-02-06 | 连云港丰达电子有限公司 | Novel diode gluing jig |
| CN203277348U (en) * | 2013-05-15 | 2013-11-06 | 常州广达电子有限公司 | Sizing strip for diode production |
| CN104984872A (en) * | 2015-06-23 | 2015-10-21 | 定远县安卓电子科技有限公司 | Gluing device for diode lead glue sealing device |
| CN104984874A (en) * | 2015-06-23 | 2015-10-21 | 定远县安卓电子科技有限公司 | Diode lead sizing sealing device capable of achieving uniform sizing |
| CN104992913A (en) * | 2015-06-23 | 2015-10-21 | 定远县安卓电子科技有限公司 | Diode leading wire glue sealing device capable of achieving leading wire positioning processing |
| CN205335228U (en) * | 2015-12-10 | 2016-06-22 | 重庆凯西驿电子科技有限公司 | Diode rubberizing mould |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105390406A (en) | 2016-03-09 |
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Effective date of registration: 20181225 Address after: 453600 HII1201-217 (2109), torch Park, No. 1789, Xinfei Avenue, Xinxiang new high tech Zone, Henan. Patentee after: Henan plain public intellectual property operation and Management Co., Ltd. Address before: 401147 Building 23-3, No. 228 Honghuang Road, Longxi Street, Yubei District, Chongqing Patentee before: CHONGQING KAIXIYI ELECTRONIC TECHNOLOGY CO., LTD. |
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Effective date of registration: 20200831 Address after: 215500 Qiuzhen building, Southeast campus, Changshu Institute of technology, No. 99, Hushan Road, Changshu Southeast Economic Development Zone, Suzhou City, Jiangsu Province Patentee after: Changshu southeast high tech Venture Service Co., Ltd Address before: The torch Park HII1201-217 No. 1789 Xinxiang 453600 Henan province high tech Zone Frestech Avenue (2109) Patentee before: Henan plain public intellectual property operation and Management Co.,Ltd. |
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Effective date of registration: 20201217 Address after: No.17, Yinfeng Road, Changshu high tech Industrial Development Zone, Suzhou City, Jiangsu Province Patentee after: SOPHIA MACHINERY TECHNOLOGY (SUZHOU) Co.,Ltd. Address before: Qiuzhen building, Southeast campus, Changshu Institute of technology, No.99 Hushan Road, Changshu Southeast Economic Development Zone, Suzhou City, Jiangsu Province Patentee before: Changshu southeast high tech Venture Service Co., Ltd |
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