CN203277348U - Sizing strip for diode production - Google Patents
Sizing strip for diode production Download PDFInfo
- Publication number
- CN203277348U CN203277348U CN 201320265515 CN201320265515U CN203277348U CN 203277348 U CN203277348 U CN 203277348U CN 201320265515 CN201320265515 CN 201320265515 CN 201320265515 U CN201320265515 U CN 201320265515U CN 203277348 U CN203277348 U CN 203277348U
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- CN
- China
- Prior art keywords
- adhesive tape
- diode production
- diode
- wearing layer
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a sizing strip for diode production. The strip comprises a sizing strip body (1), a teeth-shaped clamp groove (2) uniformly disposed on the front surface of the sizing strip body (1). The surface of the teeth-shaped clamp groove (2) is provided with a non-metal wearproof layer. The surface of the teeth-shaped clamp groove of the sizing strip is provided with a non-metal wearproof layer, so that contacts among metals are prevented in a diode machining process, and metal powder cannot be generated to pollute the diodes. The sizing strip is provided with a bayonet to enable cooperation with mechanical sizing operation.
Description
Technical field
The utility model relates to a kind of diode production technology frock clamp, and particularly adhesive tape is used in a kind of diode production.
Background technology
Along with the development of science and technology, the electric equipment that people use emerges thereupon, so also development thereupon of semiconductor, and it plays an important role in many circuit.Such as: in the numerous areas such as metallurgical industry, Chemical Manufacture, power engineering, paper industry, machine-building and food processing, people need various machines, equipment, carry out and debugging control; At agricultural production, grain reserves, computer room, all there is diode in household electrical appliance etc.So diode pair newly advances social various equipment and equipment is very valuable.
Diode is by III-IV compounds of group, makes as semiconductors such as GaAs, gallium phosphide, gallium arsenide phosphides, and its core is PN junction.So forward conduction, the characteristic of oppositely ending, puncturing.Anti-seismic performance is good, low in energy consumption, low cost and other advantages.
Existing diode production technique mainly comprises: the steps such as welding, pickling, gluing, mold pressing, curing.The technique purpose of wherein gluing step is; pickling is coated with one deck silicon rubber by the die surfaces of hyperthermia drying moisture makes tube core P-N knot keep apart with external environment; to avoid the impact of impurity on device performance on every side, can play the protection tube core, stablize the effect of die surfaces.At present upper adhesive tape is used to contact with diode chip for backlight unit for jagged stainless steel strip is arranged for a long time, pollutes diode thereby can produce metal dust, and is the manual gluing use of coupling.
The utility model content
The purpose of this utility model is to solve above-mentioned deficiency, provides a kind of diode production to use adhesive tape.
The technical scheme that realizes the utility model purpose is: a kind of diode production is used adhesive tape, comprises the adhesive tape body, and what evenly be arranged on adhesive tape body front surface has a dentation draw-in groove, and described dentation draw-in groove surface has nonmetal wearing layer.
Above-mentioned diode production is used adhesive tape, and described nonmetal wearing layer thickness is 0.2 ~ 1 millimeter.
Above-mentioned diode production is used adhesive tape, it is characterized in that: described nonmetal wearing layer thickness is 0.5 ~ 0.8 millimeter.
Above-mentioned diode production is used adhesive tape, it is characterized in that: described nonmetal wearing layer thickness is 0.5 millimeter.
Above-mentioned diode production is used adhesive tape, and described nonmetal wearing layer is the wear-resisting enamelled coating of epoxy.
Above-mentioned diode production is used adhesive tape, and described upper adhesive tape body is aluminum strip, and the described dentation draw-in groove back side has bayonet socket.
The utlity model has positive effect: (1) the utility model gluing clamp bar slot surface has nonmetal wearing layer, has avoided contacting of metal and metal in the diode course of processing, can not produce metal dust and pollute diode; (2) thus on the utility model adhesive tape have bayonet socket can the cooperative mechanical gluing operation.
Description of drawings
Content of the present utility model is easier to be expressly understood in order to make, and the below is described in further detail the utility model, wherein according to specific embodiment also by reference to the accompanying drawings
Fig. 1 is generalized section of the present utility model; Fig. 2 is the front view of structural representation of the present utility model.
Embodiment
See Fig. 1, Fig. 2 the utlity model has adhesive tape body 1, and what evenly be arranged on adhesive tape body 1 front surface has a dentation draw-in groove 2, and it is 0.5 millimeter that described dentation draw-in groove 2 surfaces have epoxy wear resistant paint layer thickness.Dentation draw-in groove 2 back sides have bayonet socket 3.The diode semi-finished product for the treatment of gluing during use are inserted in draw-in groove 2 the insides, and upper adhesive tape is stuck on gluing machine by bayonet socket 3.
Above-described specific embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; institute is understood that; the above is only specific embodiment of the utility model; be not limited to the utility model; all within spirit of the present utility model and principle, any modification of making, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (6)
1. a diode production is used adhesive tape, comprises adhesive tape body (1), and what evenly be arranged on adhesive tape body (1) front surface has a dentation draw-in groove (2), it is characterized in that: described dentation draw-in groove (2) surface has nonmetal wearing layer.
2. diode production according to claim 1 is used adhesive tape, it is characterized in that: described nonmetal wearing layer thickness is 0.2 ~ 1 millimeter.
3. diode production according to claim 2 is used adhesive tape, it is characterized in that: described nonmetal wearing layer thickness is 0.5 ~ 0.8 millimeter.
4. diode production according to claim 3 is used adhesive tape, it is characterized in that: described nonmetal wearing layer thickness is 0.5 millimeter.
5. according to claim 1 ~ 4 arbitrary described diode production are used adhesive tape, it is characterized in that: described nonmetal wearing layer is the wear-resisting enamelled coating of epoxy.
6. according to claim 1 ~ 4 arbitrary described diode production are used adhesive tape, it is characterized in that: described upper adhesive tape body (1) is aluminum strip, and described dentation draw-in groove (2) back side has bayonet socket (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320265515 CN203277348U (en) | 2013-05-15 | 2013-05-15 | Sizing strip for diode production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320265515 CN203277348U (en) | 2013-05-15 | 2013-05-15 | Sizing strip for diode production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203277348U true CN203277348U (en) | 2013-11-06 |
Family
ID=49507702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320265515 Expired - Fee Related CN203277348U (en) | 2013-05-15 | 2013-05-15 | Sizing strip for diode production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203277348U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104984874A (en) * | 2015-06-23 | 2015-10-21 | 定远县安卓电子科技有限公司 | Diode lead sizing sealing device capable of achieving uniform sizing |
| CN105390406A (en) * | 2015-12-10 | 2016-03-09 | 重庆凯西驿电子科技有限公司 | Diode gluing mold |
-
2013
- 2013-05-15 CN CN 201320265515 patent/CN203277348U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104984874A (en) * | 2015-06-23 | 2015-10-21 | 定远县安卓电子科技有限公司 | Diode lead sizing sealing device capable of achieving uniform sizing |
| CN104984874B (en) * | 2015-06-23 | 2017-04-12 | 定远县安卓电子科技有限公司 | Diode lead sizing sealing device capable of achieving uniform sizing |
| CN105390406A (en) * | 2015-12-10 | 2016-03-09 | 重庆凯西驿电子科技有限公司 | Diode gluing mold |
| CN105390406B (en) * | 2015-12-10 | 2017-11-07 | 重庆凯西驿电子科技有限公司 | Sealing rubber die on diode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131106 Termination date: 20200515 |