CN104984874B - Diode lead sizing sealing device capable of achieving uniform sizing - Google Patents
Diode lead sizing sealing device capable of achieving uniform sizing Download PDFInfo
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- CN104984874B CN104984874B CN201510348069.8A CN201510348069A CN104984874B CN 104984874 B CN104984874 B CN 104984874B CN 201510348069 A CN201510348069 A CN 201510348069A CN 104984874 B CN104984874 B CN 104984874B
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- end block
- lead
- sealing
- gluing
- sizing
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Abstract
The invention discloses a diode lead sizing sealing device capable of achieving uniform sizing. The device comprises a supporting platform. A transmission chain and a sizing sealing rack are arranged on the supporting platform. The sizing sealing rack comprises a plurality of sizing sealing teeth. Gluing ports are formed above the sizing sealing rack and communicated into a sizing groove. Lead placement end blocks are arranged in the diode lead sizing sealing device capable of achieving uniform sizing and fixedly arranged on the transmission chain. A plurality of lead placement holes are formed in each lead placement end block. In the sizing sealing rack, one gluing port is formed between every two adjacent sizing sealing teeth, and each gluing port is internally provided with at least two gluing port holes. By the adoption of the technical scheme, according to the diode lead sizing sealing device capable of achieving uniform sizing, the uniformity of sizing fluid at the diode lead sizing sealing position is effectively ensured by optimizing the contact time and area between the lead and the sizing fluid.
Description
Technical field
The present invention relates to a kind of process equipment of electronic devices and components, especially a kind of diode for being capable of achieving uniform gluing draw
Line sealing adhesive device.
Background technology
The lead of diode need to carry out sealing process to which, so which can be caused to be prepared into complete diode.Existing envelope
In adhesive process, its contact repeatedly often through lead between the multiple sealing teeth on sealing tooth bar so that positioned at sealing tooth
On glue lead is realized gluing process；However, during above-mentioned sealing adhesive process, lead is only capable of by the upper of sealing tooth
End face, and the contact with glue is completed in the position, when the glue of the upper surface of sealing tooth is not enough to realize that multiple leads are carried out
During gluing, the uniformity of the glue on every lead can receive impact；At the same time, during actual setting, lead
Be difficult to just flush with the upper surface of sealing tooth, when lead is too high, lead is difficult to contact enough glue, when lead it is too low
When, friction can cause which to bend between sealing tooth repeatedly for which.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of diode lead sealing adhesive device, and which can cause lead in sealing
During process, the uniformity of the glue on lead is improved, and can avoid the damage of lead.
To solve above-mentioned technical problem, the present invention relates to a kind of diode lead sealing adhesive device for being capable of achieving uniform gluing,
Which includes support platform, is provided with for transmitting the conveyor chain of diode, and for drawing to diode on support platform
Line carries out the sealing tooth bar of sealing process, includes multiple upwardly extending sealing teeth in sealing tooth bar, sealing tooth bar parallel to
Conveyor chain is extended；Gluing port is provided among the sealing tooth bar, which is communicated among being arranged on support platform
Among glue groove；Leaded storing end block is set in the diode lead sealing adhesive device of the achievable uniform gluing, which is fixed on
On conveyor chain, lead is provided with multiple lead holding holes parallel to each other in putting end block, and its axis is perpendicular to chain
Bar is extended；The lead puts the bottom end block that end block is sequentially distributed by the vertical direction, middle part end block, and top
End block constitute, wherein, lead holding hole may be contained within middle part end block among, between the adjacent lead holding hole of any two away from
From being in two neighboring sealing tooth, the integral multiple of distance between the center line of its upper surface, the middle part end block and top end block
And be attached by multiple elastomeric springs between the end block of bottom；In the sealing tooth bar, the adjacent sealing of any two
A gluing port is provided between tooth, at least 2 gluing stomidiums, multiple gluing ends in each gluing port, are provided with
Hole is uniformly distributed on the bearing of trend of sealing tooth bar.
As a modification of the present invention, it is provided with the diode lead sealing adhesive device of the achievable uniform gluing many
Individual leads support end block, which includes upper support end block and lower support end block, wherein, it is provided with upper support end block many
Individual leads support hole, the lead holding hole that multiple leads support holes are put with lead in end block respectively correspond；The top
Support and be attached by elastomeric spring between end block and lower support end block, the bottom face of the lower support end block is provided with
Directive wheel, the correspondence position in support platform are provided with the guide rail extended parallel to conveyor chain, and the directive wheel extends
To guide rail.
Using above-mentioned design, which can cause diode lead during sealing process, by multiple leads support ends
Leads support hole in block to the clamping action of lead to support, to avoid diode lead on sealing tooth bar
Carry out that bending occurs during curvilinear motion；Meanwhile, in leads support end block, its top support end block and lower support end block, and
Its attachment structure each other arranges and the upper support end block for being supported to diode lead necessarily can should
In the range of carry out oscilaltion, and coordinate the setting of the directive wheel of lower support end block bottom so which is existed with diode lead
Lead is put end block and is consistent with the movement locus under the impact of gluing port, and then avoids supporting end block to cause diode lead
Damage.
As a modification of the present invention, in the diode lead sealing adhesive device of the achievable uniform gluing, two are provided with
Individual leads support end block, which is respectively positioned at the both sides of sealing tooth bar.Using above-mentioned design, which can be by two positioned at sealing tooth bar
The leads support end block of side is supported to diode lead respectively, so that its support effect is further improved.
As a modification of the present invention, in the sealing tooth bar, between two neighboring sealing tooth, camber extends, described
Gluing port adopts the arcuate structure parallel with the extended surface between two sealing teeth corresponding to which；Each gluing port
In be provided with 5 gluing stomidiums.Using above-mentioned design, which can be by the arcuate structure between two neighboring sealing tooth so that
The curvilinear motion that the end face of sealing tooth bar is carried out under the driving of lead storing end block with diode lead is more fitted, so as to
So that the sealing uniformity of diode lead is further improved；Meanwhile, the arcuate structure of gluing port causes which keep away
Exempt from diode lead and deviate sealing rack surface in the presence of elastomeric spring, and by multiple gluing stomidiums with to sealing tooth bar
Between each position carry out uniform gluing process.
Used as a modification of the present invention, the vertical dimension between the gluing port and sealing tooth bar is at most 1 centimetre,
Which can further guarantee the stickiness between the lead of diode and sealing tooth bar, and gluing port.
It is above-mentioned be capable of achieving uniform gluing diode lead sealing adhesive device in practical work process, first by diode
Lead is placed in lead and puts in the lead holding hole of end block, while so that the other end of lead is contacted with sealing tooth bar, and
It is dropped in the glue on sealing tooth bar to carry out sealing process to lead by gluing port.
Sealing tooth bar together constitutes the tracks extended along sealing tooth bar end face with gluing port；Lead is in fortune
When carrying out moving ahead in dynamic rail road, the middle part end block among lead storing end block is by elastomeric spring in top end block and bottom end block
Between move back and forth so that lead also in the vertical direction moves back and forth therewith, lead its reciprocating motion with
Under forward movement combines, it is allowed to carry out curvilinear motion along above-mentioned tracks.It is as lead is put in end block, adjacent
The distance between two leads are equal with the spacing of sealing tooth, so during lead puts end block, every lead is also capable of achieving above-mentioned song
Line is moved.
During riding, which can keep fitting with the end face of sealing tooth bar lead in real time.Sealing tooth bar
Among, gluing port is provided between each two sealing tooth, so each position in sealing tooth bar uniformly can be dripped
There is glue.In the motor process along sealing tooth bar, which can keep the real-time contact and glue between to lead, it is achieved thereby that drawing
The uniformity of line surface glue.
Using the diode lead sealing adhesive device of the achievable uniform gluing of above-mentioned technical proposal, which can be by improving lead
Time of contact and contact area between glue, so that the glue uniformity of diode lead sealing position is able to effectively
Ensure；Meanwhile, above-mentioned sealing adhesive device causes lead that the movement locus consistent with sealing tooth bar end face are kept during gluing, from
And avoid in traditional sealing adhesive process, lead is contacted with each other with sealing tooth and causes which that phenomenons such as bending occur.
Description of the drawings
Fig. 1 is schematic diagram of the present invention；
Fig. 2 puts end block schematic diagram for lead in the present invention；
Fig. 3 is leads support end block schematic diagram in the present invention；
Fig. 4 is sealing tooth bar schematic diagram in the present invention；
Fig. 5 is gluing port schematic internal view in the present invention；
Reference numerals list：
1-support platform, 2-conveyor chain, 3-sealing tooth bar, 31-sealing tooth, 4-gluing port, 41-gluing end
Hole, 5-glue groove, 6-lead are put end block, 61-top end block, 62-middle part end block, 63-bottom end block, 7-lead and are put
Hole, 8-elastomeric spring, 9-leads support end block, 91-upper support end block, 92-lower support end block, 10-leads support
Hole, 11-directive wheel, 12-guide rail.
Specific embodiment
With reference to specific embodiment, the present invention is further elucidated, it should be understood that following specific embodiments are only used for
The bright present invention rather than restriction the scope of the present invention.It should be noted that word "front", "rear" used in describing below,
"left", "right", "up" and "down" refer to the direction in accompanying drawing, and word " interior " and " outward " are referred respectively to towards or away from specific
The direction at component geometry center.
Embodiment 1
A kind of diode lead sealing adhesive device for being capable of achieving uniform gluing as shown in Figure 1, which includes support platform 1,
It is provided with support platform 1 for transmitting the conveyor chain 2 of diode, and for carrying out sealing process to diode lead
Sealing tooth bar 3, includes multiple upwardly extending sealing teeth 31 in sealing tooth bar 3, sealing tooth bar 3 enters parallel to conveyor chain 2
Row extends；Gluing port 4 is provided among the sealing tooth bar 3, its be communicated to the glue groove 5 that is arranged among support platform 1 it
In.
As shown in Figures 1 and 2, leaded storing is set in the diode lead sealing adhesive device of the achievable uniform gluing
End block 6, which is fixed on conveyor chain 2, and lead is provided with multiple lead holding holes 7 parallel to each other in putting end block 6, draws
The axis of line holding hole 7 is extended perpendicular to conveyor chain 2；The lead is put end block 6 and is divided by the vertical direction successively
The bottom end block 61 of cloth, middle part end block 62, and top end block 63 are constituted, wherein, lead holding hole 7 may be contained within middle part end block
Among 62, the distance between adjacent lead holding hole 7 of any two with sealing tooth bar 3 in, on two neighboring sealing tooth 31
Between the center line of end face, distance is equal, by multiple between the middle part end block 62 and top end block 61 and bottom end block 63
Elastomeric spring 8 is attached；In the sealing tooth bar 3, between the adjacent sealing tooth 31 of any two, a gluing is provided with
Port 4, is provided with least 2 gluing stomidiums 41 in each gluing port 4, multiple gluing stomidiums 41 are in sealing tooth bar 3
It is uniformly distributed on bearing of trend.
As shown in figure 3, being provided with multiple leads supports in the diode lead sealing adhesive device of the achievable uniform gluing
End block 9, which includes upper support end block 91 and lower support end block 92, wherein, it is provided with upper support end block 91 multiple
Leads support hole 10, multiple leads support holes 10 are put the lead holding hole 7 in end block 6 with lead respectively and are corresponded；It is described
It is attached by elastomeric spring 8 between upper support end block 91 and lower support end block 92, the lower support end block 92
Bottom face is provided with directive wheel 11, and the correspondence position in support platform 1 is provided with the guide rail extended parallel to conveyor chain 2
12, the directive wheel 11 is extended to inside guide rail 12.
Using above-mentioned design, which can cause diode lead during sealing process, by multiple leads support ends
Leads support hole in block to the clamping action of lead to support, to avoid diode lead on sealing tooth bar
Carry out that bending occurs during curvilinear motion；Meanwhile, in leads support end block, its top support end block and lower support end block, and
Its attachment structure each other arranges and the upper support end block for being supported to diode lead necessarily can should
In the range of carry out oscilaltion, and coordinate the setting of the directive wheel of lower support end block bottom so which is existed with diode lead
Lead is put end block and is consistent with the movement locus under the impact of gluing port, and then avoids supporting end block to cause diode lead
Damage.
As shown in figs. 4 and 5, in the sealing tooth bar 3, between two neighboring sealing tooth 31 camber extend, it is described on
Glue port 4 adopts the arcuate structure parallel with the extended surface between two sealing teeth 31 corresponding to which；Each gluing end
5 gluing stomidiums 5 are provided with mouth 4.Using above-mentioned design, its can by the arcuate structure between two neighboring sealing tooth,
So that the curvilinear motion that the end face of sealing tooth bar is carried out under the driving of lead storing end block with diode lead is more fitted,
So that the sealing uniformity of diode lead is further improved；Meanwhile, the arcuate structure of gluing port causes which
Diode lead can be avoided to deviate sealing rack surface in the presence of elastomeric spring, and by multiple gluing stomidiums with to sealing
Each position between tooth bar carries out uniform gluing process.
It is above-mentioned be capable of achieving uniform gluing diode lead sealing adhesive device in practical work process, first by diode
Lead is placed in lead and puts in the lead holding hole of end block, while so that the other end of lead is contacted with sealing tooth bar, and
It is dropped in the glue on sealing tooth bar to carry out sealing process to lead by gluing port.
Sealing tooth bar together constitutes the tracks extended along sealing tooth bar end face with gluing port；Lead is in fortune
When carrying out moving ahead in dynamic rail road, the middle part end block among lead storing end block is by elastomeric spring in top end block and bottom end block
Between move back and forth so that lead also in the vertical direction moves back and forth therewith, lead its reciprocating motion with
Under forward movement combines, it is allowed to carry out curvilinear motion along above-mentioned tracks.It is as lead is put in end block, adjacent
The distance between two leads are equal with the spacing of sealing tooth, so during lead puts end block, every lead is also capable of achieving above-mentioned song
Line is moved.
During riding, which can keep fitting with the end face of sealing tooth bar lead in real time.Sealing tooth bar
Among, gluing port is provided between each two sealing tooth, so each position in sealing tooth bar uniformly can be dripped
There is glue.In the motor process along sealing tooth bar, which can keep the real-time contact and glue between to lead, it is achieved thereby that drawing
The uniformity of line surface glue.
Using the diode lead sealing adhesive device of the achievable uniform gluing of above-mentioned technical proposal, which can be by improving lead
Time of contact and contact area between glue, so that the glue uniformity of diode lead sealing position is able to effectively
Ensure；Meanwhile, above-mentioned sealing adhesive device causes lead that the movement locus consistent with sealing tooth bar end face are kept during gluing, from
And avoid in traditional sealing adhesive process, lead is contacted with each other with sealing tooth and causes which that phenomenons such as bending occur.
Embodiment 2
As a modification of the present invention, in the diode lead sealing adhesive device of the achievable uniform gluing, two are provided with
Individual leads support end block 6, which is respectively positioned at the both sides of sealing tooth bar 3.Using above-mentioned design, which can be by positioned at sealing tooth bar
The leads support end block of both sides is supported to diode lead respectively, so that its support effect is further improved.
Remaining feature of the present embodiment is same as Example 1 with advantage.
Embodiment 3
Used as a modification of the present invention, the vertical dimension between the gluing port 4 and sealing tooth bar 3 is 0.2 centimetre,
Which can further guarantee the stickiness between the lead of diode and sealing tooth bar, and gluing port.
Remaining feature of the present embodiment is same as Example 2 with advantage.
Claims (5)
1. it is a kind of be capable of achieving uniform gluing diode lead sealing adhesive device, which includes support platform, on support platform arrange
Have for transmitting the conveyor chain of diode, and for the sealing tooth bar of sealing process, sealing tooth are carried out to diode lead
Include multiple upwardly extending sealing teeth in bar, sealing tooth bar is extended parallel to conveyor chain；The sealing tooth bar it
In be provided with gluing port, among which is communicated to the glue groove being arranged among support platform；Characterized in that, described be capable of achieving
Leaded storing end block is set in the diode lead sealing adhesive device of even gluing, and which is fixed on conveyor chain, lead is put
Multiple lead holding holes parallel to each other are provided with end block, its axis is extended perpendicular to conveyor chain；The lead is put
Put the bottom end block that end block is sequentially distributed by the vertical direction, middle part end block, and top end block to constitute, wherein, lead is put
Among discharge hole may be contained within middle part end block, the distance between adjacent lead holding hole of any two is two neighboring sealing tooth
In, the integral multiple of distance between the center line of its upper surface leads between the middle part end block and top end block and bottom end block
Cross multiple elastomeric springs to be attached；In the sealing tooth bar, it is provided with one between the adjacent sealing tooth of any two
Glue port, is provided with least 2 gluing stomidiums in each gluing port, multiple gluing stomidiums are in the extension side of sealing tooth bar
It is uniformly distributed upwards.
2. according to the diode lead sealing adhesive device of the achievable uniform gluing described in claim 1, it is characterised in that it is described can
Multiple leads support end blocks are provided with the diode lead sealing adhesive device for realizing uniform gluing, which includes upper support end block
With lower support end block, wherein, be provided with multiple leads support holes in upper support end block, multiple leads support holes respectively with draw
The lead holding hole that line is put in end block is corresponded；By elastic bullet between the upper support end block and lower support end block
Spring is attached, and the bottom face of the lower support end block is provided with directive wheel, and the correspondence position in support platform is provided with flat
The guide rail that row extends in conveyor chain, the directive wheel are extended to inside guide rail.
3. according to the diode lead sealing adhesive device of the achievable uniform gluing described in claim 2, it is characterised in that it is described can
Two leads support end blocks are provided with the diode lead sealing adhesive device for realizing uniform gluing, which is respectively positioned at sealing tooth bar
Both sides.
4. according to the diode lead sealing adhesive device of the achievable uniform gluing described in claims 1 to 3 any one, its feature
Be, in the sealing tooth bar, between two neighboring sealing tooth camber extend, the gluing port using with corresponding to which
The parallel arcuate structure of extended surface between two sealing teeth；5 gluing stomidiums are provided with each gluing port.
5. according to the diode lead sealing adhesive device of the achievable uniform gluing described in described in claim 4, it is characterised in that
Vertical dimension between the gluing port and sealing tooth bar is at most 1 centimetre.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510348069.8A CN104984874B (en) | 2015-06-23 | 2015-06-23 | Diode lead sizing sealing device capable of achieving uniform sizing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510348069.8A CN104984874B (en) | 2015-06-23 | 2015-06-23 | Diode lead sizing sealing device capable of achieving uniform sizing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104984874A CN104984874A (en) | 2015-10-21 |
| CN104984874B true CN104984874B (en) | 2017-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510348069.8A Active CN104984874B (en) | 2015-06-23 | 2015-06-23 | Diode lead sizing sealing device capable of achieving uniform sizing |
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| Country | Link |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105390406B (en) * | 2015-12-10 | 2017-11-07 | 重庆凯西驿电子科技有限公司 | Sealing rubber die on diode |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5536963A (en) * | 1978-09-05 | 1980-03-14 | Nec Corp | Resin coating device |
| CN200977499Y (en) * | 2006-11-30 | 2007-11-21 | 扬博科技股份有限公司 | Surface processing device for printing circuit board |
| CN202087476U (en) * | 2011-05-31 | 2011-12-28 | 常州佳讯光电产业发展有限公司 | Diode crystal grain glue coating strip |
| CN203277348U (en) * | 2013-05-15 | 2013-11-06 | 常州广达电子有限公司 | Sizing strip for diode production |
| CN203329928U (en) * | 2013-06-24 | 2013-12-11 | 安徽中鑫半导体有限公司 | Novel diode gluing machine |
-
2015
- 2015-06-23 CN CN201510348069.8A patent/CN104984874B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5536963A (en) * | 1978-09-05 | 1980-03-14 | Nec Corp | Resin coating device |
| CN200977499Y (en) * | 2006-11-30 | 2007-11-21 | 扬博科技股份有限公司 | Surface processing device for printing circuit board |
| CN202087476U (en) * | 2011-05-31 | 2011-12-28 | 常州佳讯光电产业发展有限公司 | Diode crystal grain glue coating strip |
| CN203277348U (en) * | 2013-05-15 | 2013-11-06 | 常州广达电子有限公司 | Sizing strip for diode production |
| CN203329928U (en) * | 2013-06-24 | 2013-12-11 | 安徽中鑫半导体有限公司 | Novel diode gluing machine |
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| Publication number | Publication date |
|---|---|
| CN104984874A (en) | 2015-10-21 |
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Inventor after: Dan Long Inventor before: Jiang Yuanchang Inventor before: Jiang Youxin |
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Effective date of registration: 20180118 Address after: 233200 Anhui province Chuzhou city Dingyuan County Economic Development Zone Spring dock mountain Avenue Patentee after: Dingyuan County run Sound Electronics Co., Ltd. Address before: Dingyuan County Economic Development Zone 233200 Anhui city of Chuzhou Province Quan Wu Shan Road and Bridge Road intersection Patentee before: DINGYUAN ANZHUO ELECTRONIC TECHNOLOGY CO., LTD. |
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