CN104966690A - Etching device and application method therefor - Google Patents
Etching device and application method therefor Download PDFInfo
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- CN104966690A CN104966690A CN201510441683.9A CN201510441683A CN104966690A CN 104966690 A CN104966690 A CN 104966690A CN 201510441683 A CN201510441683 A CN 201510441683A CN 104966690 A CN104966690 A CN 104966690A
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- cover plate
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- 238000005530 etching Methods 0.000 title claims abstract description 192
- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 64
- 230000001680 brushing effect Effects 0.000 claims description 116
- 230000005540 biological transmission Effects 0.000 claims description 45
- 230000007246 mechanism Effects 0.000 claims description 34
- 238000001514 detection method Methods 0.000 claims description 25
- 238000012423 maintenance Methods 0.000 claims description 15
- 239000007788 liquid Substances 0.000 abstract description 22
- 230000000694 effects Effects 0.000 abstract description 5
- 238000001039 wet etching Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 239000007921 spray Substances 0.000 description 6
- 239000012530 fluid Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning In General (AREA)
Abstract
The invention provides an etching device, and the device comprises an etching cavity. The device also comprises a liquid drop removing assembly disposed in the etching cavity. The liquid drop removing assembly is used for removing liquid drops attached to the top wall of the etching cavity. Correspondingly, the invention also provides an application method for the device. The device and method can effectively remove liquid drops attached to the top wall of the etching cavity, reduces the phenomena of uneven etching caused by that liquid drops falls to a substrate, thereby improving the etching effect.
Description
Technical field
The present invention relates to the manufacture field of display device, be specifically related to the using method of a kind of etching device and this etching device a kind of.
Background technology
Array base palte manufacture process, is mainly divided into cleaning, film forming, exposure imaging, etching, the large technique of stripping five.Wherein etching technics is divided into dry etching and wet etching, and wet etching is widely used in the etching of metallic film and sull.Wet-etching technology mainly refers to a kind of technology adopting chemical liquid to remove engraving.When wet etching is carried out to substrate to be etched, by chemical liquid and engraving generation chemical reaction, film not covered by photoresist is removed, thus realizes electrode patterning.
Wet-method etching equipment normally utilizes acid etch liquids, by nozzle, etching liquid is sprayed substrate surface to be etched, with the rete generation chemical reaction of substrate surface, thus reaches the object of etching.But, in the middle of actual production process, spray and the etching liquid drop volatilized can be attached on the cover plate of etching apparatus, the etching liquid drop be attached on etching apparatus cover plate builds up, form increasing etching liquid drop, finally be dropped on substrate to be etched, cause etching uneven, have a strong impact on the yield of product.
Summary of the invention
The object of the present invention is to provide the using method of a kind of etching device and this etching device a kind of, be dropped on substrate to prevent etching drop in etching process.
To achieve these goals, the invention provides a kind of etching device, comprise etching cavity, wherein, described etching device also comprises the drop be arranged in described etching cavity and removes assembly, and described drop removes assembly for removing the drop be attached on described etching cavity roof.
Preferably, the top of described etching cavity is formed with maintenance access, described etching device comprises cover plate, described cover plate covers on described maintenance access, to be formed as the roof of described etching cavity at least partially, described drop remove assembly be arranged on described cover plate towards on the surface of described etching cavity.
Preferably, described drop is removed assembly and is comprised brushing piece, described brushing piece can before etching starts or etching terminate after along the surface towards described etching cavity of described cover plate and described cover plate generation relative movement, to make being dropped down onto in described etching cavity by brush towards the drop on the surface of described etching cavity of described cover plate.
Preferably, described drop is removed assembly and is also comprised at least one transmission mechanism, described transmission mechanism be arranged on described cover plate towards on the surface of etching cavity, described transmission mechanism comprises driving wheel, driven pulley, the belt be enclosed within described driving wheel and described driven pulley, described drop removal assembly also comprises the motor for driving described driving wheel to rotate, described brushing piece is arranged on described belt, and the length direction of described brushing piece and the bearing of trend of described belt intersect.
Preferably, described transmission mechanism also comprises installed part, and described installed part is removably disposed on described belt, and described brushing piece is fixed on described installed part.
Preferably, described drop is removed assembly and is comprised two spaced described transmission mechanisms, and the two ends of described brushing piece are separately positioned on the installed part of two transmission mechanisms.
Preferably, described etching device also comprises substrates detector part and controller, described substrates detector part is for detecting substrate position, when described substrates detector part detects that described substrate is positioned at described etching cavity outside, this substrates detector part can send commencing signal to described controller, and described controller controls described motor according to described commencing signal and brings into operation.
Preferably, described transmission mechanism can drive described brushing piece to move between the first precalculated position and the second precalculated position, described drop removes the brushing piece detection means that assembly also comprises the position for detecting described brushing piece, when described brushing piece detection means detects that described brushing piece moves to described first precalculated position or the second precalculated position, can send stop signal to described controller, it is out of service that described controller controls described motor according to this stop signal.
Preferably, described position detection device comprises the first sensor being arranged on described first precalculated position and the second transducer being arranged on described second precalculated position, when described first sensor detects that described brushing piece arrives described first precalculated position, described first sensor can send stop signal to described controller, when described second transducer detects that described brushing piece arrives described second precalculated position, described second transducer can send stop signal to described controller.
Preferably, described etching device also comprises transmission assembly, for described substrate being inputed to the presumptive area in described etching cavity, the orthographic projection in the region that described first precalculated position and described second precalculated position limit at least covers the orthographic projection of described presumptive area.
Correspondingly, the present invention also provides a kind of using method of etching device, and described etching device is above-mentioned etching device provided by the invention, and described using method comprises:
Utilize described drop to remove assembly and remove the drop be attached on described etching cavity roof.
Preferably, the top of described etching cavity is formed with maintenance access, described etching device comprises cover plate, described cover plate covers on described maintenance access, to be formed as the roof of described etching cavity at least partially, described drop remove assembly be arranged on described cover plate towards on the surface of described etching cavity, step that assembly removes the drop be attached on described etching cavity roof comprises to utilize described drop to remove:
Utilize drop remove assembly remove described cover plate towards the drop on the surface of described etching cavity.
Preferably, described drop is removed assembly and is comprised brushing piece, and the step towards the drop on the surface of described etching cavity utilizing drop removal assembly to remove described cover plate comprises:
Before etching starts or after etching terminates, control described brushing piece along the surface towards described etching cavity of described cover plate and described cover plate generation relative movement, dropped down onto in described etching cavity by brush to make the drop on described cover plate.
Preferably, described drop is removed assembly and is also comprised at least one transmission mechanism, described transmission mechanism be arranged on described cover plate towards on the surface of etching cavity, described transmission mechanism comprises driving wheel, driven pulley, the belt be enclosed within described driving wheel and described driven pulley, described drop removal assembly also comprises the motor for driving described driving wheel to rotate, described brushing piece is arranged on described belt, and the length direction of described brushing piece and the bearing of trend of described belt intersect
Control described brushing piece to comprise along the surface towards described etching cavity of described cover plate and the step of described cover plate generation relative movement:
Control described motor to run, move along the surface towards described etching cavity of described cover plate to drive brushing piece.
Preferably, described etching device also comprises substrates detector part and controller, and the step controlling the operation of described motor comprises:
Utilize described substrates detector part to detect the position of substrate, when described substrate detection detection means detects that substrate is positioned at described etching cavity outside, send commencing signal to described controller;
Utilize described controller to control described motor according to described commencing signal to bring into operation.
Preferably, described drop removes the brushing piece detection means that assembly also comprises the position for detecting described brushing piece, and described using method also comprises:
Utilize described brushing piece detection means to detect the position of described brushing piece, when described brushing piece detection means detects that described brushing piece moves to described first precalculated position or the second precalculated position, send stop signal to described controller;
Described controller is utilized to control described motor according to described control signal out of service.
In the present invention, be provided with drop in described etch chamber and remove assembly, can remove the drop that be attached on etching cavity roof, thus decrease drips and occur in the situation of substrate surface, and then improve etching effect, ensure that the quality of product.
Accompanying drawing explanation
Accompanying drawing is used to provide a further understanding of the present invention, and forms a part for specification, is used from explanation the present invention, but is not construed as limiting the invention with embodiment one below.In the accompanying drawings:
Fig. 1 is the structural representation of etching device in embodiments of the invention;
Fig. 2 is the structural representation that in embodiments of the invention, drop removes assembly;
Fig. 3 is the structural representation of transmission mechanism in embodiments of the invention.
Wherein, Reference numeral is: 1, spray unit; 11, shower; 12, nozzle; 2, etching cavity; 3, substrate; 4, transmission assembly; 5, liquid feeding pipeline; 6, reclaim line; 7, solution feed pump; 8, fluid reservoir; 9, cover plate; 10, drop removes assembly; 101, brushing piece; 102, motor; 103, power transmission shaft; 105, transmission mechanism; 105a, driving wheel; 105b, driven pulley; 105c, belt; 105d, installed part; 106, first sensor; 107, the second transducer.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.Should be understood that, embodiment described herein, only for instruction and explanation of the present invention, is not limited to the present invention.
As one aspect of the present invention, a kind of etching device is provided, comprise etching cavity, described etching device also comprises the drop be arranged in described etching cavity and removes assembly, and described drop removes assembly for removing the drop be attached on described etching cavity roof.
Etching device of the present invention is particularly useful in wet etching, in wet etching process, can adhere to one deck drop after etching liquid spray or volatilization at the roof of etching cavity, assemble becomeing greater to a certain degree, can drip from roof when drop.
In the present invention, be provided with drop in described etch chamber and remove assembly 10, can remove the drop that be attached on etching cavity roof, thus decrease drips and occur in the situation of substrate surface, decrease the impact of drop on etching effect of drippage, and then ensure that the quality of product.
For the ease of to the cleaning of etching cavity and maintenance, as shown in Figure 1, the top of etching cavity 2 is formed with maintenance access, described etching device comprises cover plate 9, cover plate 9 covers on described maintenance access, to be formed as the roof of etching cavity 2 at least partially, drop remove assembly 10 be arranged on cover plate 9 towards on the surface of etching cavity, thus by cover plate 9 towards on the surface of etching cavity drop remove.
Drop removes assembly 10 can remove drop by different modes, such as, is adsorbed by adsorption layer, or utilizes brushing piece to be scraped by drop.As a kind of embodiment of the present invention, as shown in Figure 2, drop is removed assembly 10 and is comprised brushing piece 101, brushing piece 101 can before etching starts or etching terminate after there is relative movement, to make being dropped down onto in etching cavity 2 by brush towards the drop on the surface of etching cavity of cover plate 9 along the surface towards described etching cavity of cover plate 9 and cover plate 9.
Due to brushing piece 101 movement etching start before or etching terminate after carry out, in etching cavity, substrate is not set, therefore, even if drop comes off from cover plate, also can not drops on substrate.When etching substrate, because the drop on cover plate comes off, the drop assembled in etching process is on the cover board also smaller, and the possibility of drippage is less.Therefore, drop can be reduced and drop in phenomenon on substrate and occur, improve etching effect.
Brushing piece 101 can be arranged the structure that bristle, spongy layer etc. are soft, to make when brushing piece moves along the surface towards etching cavity of cover plate 9, bristle can be utilized to be fallen by drop brush, or utilize spongy layer to be adsorbed by drop, and wearing and tearing can not be produced to cover plate bottom surface.
When brushing piece not being arranged the structures such as above-mentioned bristle, spongy layer, can there is certain gap between brushing piece 101 and cover plate, particularly, gap can in 0 ~ 3mm, to reduce the friction between brushing piece 101 and cover plate, reduces the damage that cover plate and brushing piece are subject to.And the spacing between brushing piece 101 and cover plate is when 0 ~ 3mm, after the removal of the brushing piece of brushing piece 101, the droplet size retained on the cover board is less, can not drip.
In the present invention, manually can drive the movement of brushing piece 101, also can pass through the movement automatically of driven by motor brushing piece.Preferably, drop removes assembly 10 can also comprise at least one transmission mechanism 105, transmission mechanism 105 be arranged on cover plate 9 towards on the surface of etching cavity, as shown in Figure 3, transmission mechanism 105 comprises driving wheel 105a, driven pulley 105b, the belt 105c be enclosed within driving wheel 105a and driven pulley 105b, drop removal assembly 10 also comprises the motor 102 for driving driving wheel 105a to rotate, brushing piece 101 is arranged on belt 105c, and the length direction of brushing piece 101 and the bearing of trend of belt 105c intersect.Drive driving wheel 105a to rotate when motor 102 runs, thus drive belt running, thus drive brushing piece 101 to move.
For the ease of the installation of brushing piece and the maintenance of transmission mechanism, as shown in Figures 2 and 3, transmission mechanism 105 also comprises installed part 105d, installed part 105d is removably disposed on belt 105c, such as, removably be connected one end with installed part 105d, one end of belt, the other end of belt is removably connected with the other end of installed part 105d, thus forms closed ground circulus.Brushing piece 101 is fixed on installed part 105d.When carrying out the maintenance of transmission mechanism or needing to change brushing piece, only need installed part 105d to disassemble from belt.
Further, drop is removed assembly 10 and is comprised two spaced transmission mechanisms 105, and the two ends of brushing piece 101 are separately positioned on the installed part 105d of two transmission mechanisms, with stable mobile under the drive of motor.Wherein, two belt 105c can be arranged in parallel, and brushing piece 101 is vertical with two belt 105c.
Further, as shown in Figure 2, drop removal mechanism 10 can also comprise power transmission shaft 103, and the transmission of power that motor 102 exports by power transmission shaft 103 is to driving wheel 105.Particularly, can arrange travelling gear on the output shaft of motor, at power transmission shaft 103, one end of motor be provided with driven gear, described driven gear engages with described travelling gear.Driving wheel 105 is arranged on power transmission shaft 103, when motor 102 runs, drives two driving wheel 105a to rotate by power transmission shaft 103 simultaneously.
Further, described etching device also comprises substrates detector part for detecting substrate position and controller, when described substrates detector part detects that substrate 3 is positioned at etching cavity 2 outside, this substrates detector part can send commencing signal to described controller, described controller controls motor 102 according to this commencing signal and brings into operation, thus it is mobile to drive brushing piece 101 to start, and to be fallen by the drop brush on cover plate, prevents drop from dropping on substrate.
Further, motor 102 can drive driving wheel to rotate, and moves between the first precalculated position and the second precalculated position to drive brushing piece 101.Drop removes the brushing piece detection means that assembly 10 also comprises the position for detecting brushing piece 101, when described brushing piece detection means detects that brushing piece 101 moves to the first shift position or the second precalculated position, stop signal can be sent to described controller, it is out of service that described controller controls motor according to this stop signal, thus ensure that brushing piece can move in suitable scope, prevent brushing piece getaway.Such as, when starting to remove drop, brushing piece 101 moves to the first precalculated position by a certain position, and when brushing piece 101 moves to the first precalculated position, it is out of service that controller controls motor.When removing drop, brushing piece 101 is moved to the second precalculated position by the first precalculated position next time, and when brushing piece 101 moves to the second precalculated position, it is out of service that controller controls motor.
Particularly, as shown in Figure 2, described position detection device comprises the first sensor 106 being arranged on described first precalculated position and the second transducer 107 being arranged on described second precalculated position.When first sensor 106 detects that brushing piece 101 arrives the first precalculated position, first sensor 106 can send stop signal to described controller, when the second transducer 107 detects that brushing piece 101 detects that brushing piece 101 arrives the second precalculated position, second transducer 107 can send stop signal to described controller, the stop signal that first sensor 106 and the second transducer 107 send can be identical, and it is out of service that described controller controls motor 102 according to described stop signal.
As shown in Figure 1, described etching device also comprises transmission assembly 4, for substrate 3 being inputed to the presumptive area in etching cavity 2, the orthographic projection in the region (that is, the moving area of brushing piece) that described first precalculated position and described second precalculated position limit at least covers the orthographic projection of described presumptive area.Thus the drop above substrate 3 at least can be removed by brushing piece 101, prevent drips on substrate.Described orthographic projection refers to the projection of in the vertical direction.
It should be noted that, the structures such as the brushing piece in the present invention, driving wheel, driven pulley can adopt corrosion-resistant material to make, and prevent in long wet etching, and corrosive liquid removes the corrosion of all parts of assembly to drop.
As shown in Figure 1, described etching device can also comprise:
Spray unit 1, multiple nozzles 12 that described spray unit 1 comprises shower 11 and is arranged on below shower 11, for spraying etching liquid to the substrate in etching cavity;
Fluid reservoir 8, for storing etching liquid;
Liquid feeding pipeline 5 and solution feed pump 7, the etching liquid in fluid reservoir 8 is extracted out by this solution feed pump, and the etching liquid of extraction is delivered to spray unit 1 by liquid feeding pipeline 2;
Reclaim line 6, this reclaim line is arranged between etching cavity and fluid reservoir 8, to be recycled in fluid reservoir 8 by the etching liquid in etching cavity 2, to carry out recovery and uses.
As second aspect of the present invention, provide a kind of using method of above-mentioned etching device, described using method comprises:
Utilize described drop to remove assembly and remove the drop be attached on described etching cavity roof.
Particularly, the top of described etching cavity is formed with maintenance access, described etching device comprises cover plate, described cover plate covers on described maintenance access, to be formed as the roof of described etching cavity at least partially, described drop remove assembly be arranged on described cover plate towards on the surface of described etching cavity, step that assembly removes the drop be attached on described etching cavity roof comprises to utilize described drop to remove:
Utilize drop remove assembly remove described cover plate towards the drop on the surface of described etching cavity.
As noted before, described drop is removed assembly and is comprised brushing piece, and the step towards the drop on the surface of described etching cavity utilizing drop removal assembly to remove described cover plate comprises:
Before etching starts or after etching terminates, control described brushing piece along the surface towards described etching cavity of described cover plate and described cover plate generation relative movement, dropped down onto in described etching cavity by brush to make the drop on described cover plate.
Due to etching start front or etching start after, in etching cavity, substrate is not set, therefore, drop brushed fall behind also can not drop on substrate, prevent from having an impact to etching effect.
The mode controlling brushing piece movement can be manual mode, or utilizes the mode of driven by motor brushing piece movement.In order to increase work efficiency, as noted before, described drop is removed assembly and is also comprised at least one transmission mechanism, described transmission mechanism be arranged on described cover plate towards on the surface of etching cavity, described transmission mechanism comprises driving wheel, driven pulley, the belt be enclosed within described driving wheel and described driven pulley, described drop removal assembly also comprises the motor for driving described driving wheel to rotate, described brushing piece is arranged on described belt, the length direction of described brushing piece and the bearing of trend of described belt intersect
Control described brushing piece to comprise along the surface towards described etching cavity of described cover plate and the step of described cover plate generation relative movement:
Control described motor to run, move along the surface towards described etching cavity of described cover plate to drive brushing piece.
When motor runs, drive described driving wheel to rotate, thus drive driven pulley to rotate and belt transmission, and then drive brushing piece to move along the surface towards described etching cavity of described cover plate.
Operation and the stopping of motor can manually control equally, also automatically can be controlled by controller.Further, as noted before, described etching device also comprises substrates detector part and controller, and the step controlling the operation of described motor also comprises:
Utilize described substrates detector part to detect the position of substrate, when described substrate detection detection means detects that substrate is positioned at described etching cavity outside, send commencing signal to described controller;
Utilize described controller to control described motor according to described commencing signal to bring into operation.
When described substrates detector part detects that substrate is positioned at etching cavity inside, send stop signal to described controller, it is out of service that controller controls motor according to described stop signal.Therefore, under the control action of controller, the brush of drop can be made to fall can carry out automatically, improves process efficiency.When there is no substrate in etching cavity, start the drop brushed on cover plate, prevent drips on substrate, when there being substrate in etching cavity, owing to the drop brush on cover plate being fallen, therefore, be again gathered in the also smaller towards the drop on the surface of etching cavity of cover plate during etching, be not enough to be dropped on substrate.
Further, described drop removes the brushing piece detection means that assembly also comprises the position for detecting described brushing piece, and described using method also comprises:
Utilize described brushing piece detection means to detect the position of described brushing piece, when described brushing piece detection means detects that described brushing piece moves to described first precalculated position or the second precalculated position, send stop signal to described controller;
Described controller is utilized to control described motor according to described control signal out of service.
Such as, before drop is removed, brushing piece is positioned at the first precalculated position, when starting to remove drop, described controller controls described motor and brings into operation, and drives brushing piece to move, when brushing piece arrives the second precalculated position, described brushing piece detector sends stop signal to described controller, and described controller controls motor according to described stop signal to be stopped; At this moment substrate can be sent in etching cavity and etch, after etching, substrate is exported etching cavity, when substrates detector part detects that substrate is positioned at etching cavity outside, send commencing signal to described controller, described controller controls described motor and brings into operation, brushing piece is mobile from the second precalculated position, when brushing piece reaches the first precalculated position, described brushing piece detection means sends stop signal to described controller, and it is out of service that described controller controls described motor.By that analogy.Often carry out the removal process of a drop, only need brushing piece to move once between the first precalculated position and the second precalculated position, drop brush can be fallen, not need brushing piece to move around, increase work efficiency.
Be understandable that, the illustrative embodiments that above execution mode is only used to principle of the present invention is described and adopts, but the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (16)
1. an etching device, comprises etching cavity, it is characterized in that, described etching device also comprises the drop be arranged in described etching cavity and removes assembly, and described drop removes assembly for removing the drop be attached on described etching cavity roof.
2. etching device according to claim 1, it is characterized in that, the top of described etching cavity is formed with maintenance access, described etching device comprises cover plate, described cover plate covers on described maintenance access, to be formed as the roof of described etching cavity at least partially, described drop remove assembly be arranged on described cover plate towards on the surface of described etching cavity.
3. etching device according to claim 2, it is characterized in that, described drop is removed assembly and is comprised brushing piece, described brushing piece can before etching starts or etching terminate after along the surface towards described etching cavity of described cover plate and described cover plate generation relative movement, to make being dropped down onto in described etching cavity by brush towards the drop on the surface of described etching cavity of described cover plate.
4. etching device according to claim 3, it is characterized in that, described drop is removed assembly and is also comprised at least one transmission mechanism, described transmission mechanism be arranged on described cover plate towards on the surface of etching cavity, described transmission mechanism comprises driving wheel, driven pulley, the belt be enclosed within described driving wheel and described driven pulley, described drop removal assembly also comprises the motor for driving described driving wheel to rotate, described brushing piece is arranged on described belt, and the length direction of described brushing piece and the bearing of trend of described belt intersect.
5. etching device according to claim 4, is characterized in that, described transmission mechanism also comprises installed part, and described installed part is removably disposed on described belt, and described brushing piece is fixed on described installed part.
6. etching device according to claim 5, is characterized in that, described drop is removed assembly and comprised two spaced described transmission mechanisms, and the two ends of described brushing piece are separately positioned on the installed part of two transmission mechanisms.
7. etching device according to claim 4, it is characterized in that, described etching device also comprises substrates detector part and controller, described substrates detector part is for detecting substrate position, when described substrates detector part detects that described substrate is positioned at described etching cavity outside, this substrates detector part can send commencing signal to described controller, and described controller controls described motor according to described commencing signal and brings into operation.
8. etching device according to claim 7, it is characterized in that, described transmission mechanism can drive described brushing piece to move between the first precalculated position and the second precalculated position, described drop removes the brushing piece detection means that assembly also comprises the position for detecting described brushing piece, when described brushing piece detection means detects that described brushing piece moves to described first precalculated position or the second precalculated position, can send stop signal to described controller, it is out of service that described controller controls described motor according to this stop signal.
9. etching device according to claim 8, it is characterized in that, described position detection device comprises the first sensor being arranged on described first precalculated position and the second transducer being arranged on described second precalculated position, when described first sensor detects that described brushing piece arrives described first precalculated position, described first sensor can send stop signal to described controller, when described second transducer detects that described brushing piece arrives described second precalculated position, described second transducer can send stop signal to described controller.
10. etching device according to claim 8, it is characterized in that, described etching device also comprises transmission assembly, for described substrate being inputed to the presumptive area in described etching cavity, the orthographic projection in the region that described first precalculated position and described second precalculated position limit at least covers the orthographic projection of described presumptive area.
The using method of 11. 1 kinds of etching devices, is characterized in that, described etching device comprises for the etching device in claim 1 to 10 described in any one, described using method:
Utilize described drop to remove assembly and remove the drop be attached on described etching cavity roof.
12. usings method according to claim 11, it is characterized in that, the top of described etching cavity is formed with maintenance access, described etching device comprises cover plate, described cover plate covers on described maintenance access, to be formed as the roof of described etching cavity at least partially, described drop remove assembly be arranged on described cover plate towards on the surface of described etching cavity, step that assembly removes the drop be attached on described etching cavity roof comprises to utilize described drop to remove:
Utilize drop remove assembly remove described cover plate towards the drop on the surface of described etching cavity.
13. usings method according to claim 12, is characterized in that, described drop is removed assembly and comprised brushing piece, and the step towards the drop on the surface of described etching cavity utilizing drop removal assembly to remove described cover plate comprises:
Before etching starts or after etching terminates, control described brushing piece along the surface towards described etching cavity of described cover plate and described cover plate generation relative movement, dropped down onto in described etching cavity by brush to make the drop on described cover plate.
14. usings method according to claim 13, it is characterized in that, described drop is removed assembly and is also comprised at least one transmission mechanism, described transmission mechanism be arranged on described cover plate towards on the surface of etching cavity, described transmission mechanism comprises driving wheel, driven pulley, the belt be enclosed within described driving wheel and described driven pulley, described drop removal assembly also comprises the motor for driving described driving wheel to rotate, described brushing piece is arranged on described belt, the length direction of described brushing piece and the bearing of trend of described belt intersect
Control described brushing piece to comprise along the surface towards described etching cavity of described cover plate and the step of described cover plate generation relative movement:
Control described motor to run, move along the surface towards described etching cavity of described cover plate to drive brushing piece.
15. usings method according to claim 14, is characterized in that, described etching device also comprises substrates detector part and controller, and the step controlling the operation of described motor comprises:
Utilize described substrates detector part to detect the position of substrate, when described substrate detection detection means detects that substrate is positioned at described etching cavity outside, send commencing signal to described controller;
Utilize described controller to control described motor according to described commencing signal to bring into operation.
16. usings method according to claim 15, is characterized in that, described drop removes the brushing piece detection means that assembly also comprises the position for detecting described brushing piece, and described using method also comprises:
Utilize described brushing piece detection means to detect the position of described brushing piece, when described brushing piece detection means detects that described brushing piece moves to described first precalculated position or the second precalculated position, send stop signal to described controller;
Described controller is utilized to control described motor according to described control signal out of service.
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| CN106653658A (en) * | 2016-12-26 | 2017-05-10 | 武汉华星光电技术有限公司 | Cover plate applied to wet process equipment |
| CN109166809A (en) * | 2018-07-12 | 2019-01-08 | 深圳市华星光电技术有限公司 | Wet etching equipment |
| CN109273381A (en) * | 2017-07-18 | 2019-01-25 | 东莞市鸿村环保设备制造有限公司 | A kind of glass substrate etching device with cleaning air-drying function |
| CN110429053A (en) * | 2019-08-19 | 2019-11-08 | 江阴江化微电子材料股份有限公司 | A kind of wet etching equipment and wet etch process with removable cover |
| CN114355511A (en) * | 2022-01-14 | 2022-04-15 | 武汉锐科光纤激光技术股份有限公司 | Optical fiber etching device |
| CN114472362A (en) * | 2021-12-30 | 2022-05-13 | 华海清科股份有限公司 | Wafer cleaning device |
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| CN114355511A (en) * | 2022-01-14 | 2022-04-15 | 武汉锐科光纤激光技术股份有限公司 | Optical fiber etching device |
| CN114355511B (en) * | 2022-01-14 | 2024-02-06 | 武汉锐科光纤激光技术股份有限公司 | Optical fiber etching device |
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| CN104966690B (en) | 2018-09-04 |
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