CN104966690B - Etching device and its application method - Google Patents
Etching device and its application method Download PDFInfo
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- CN104966690B CN104966690B CN201510441683.9A CN201510441683A CN104966690B CN 104966690 B CN104966690 B CN 104966690B CN 201510441683 A CN201510441683 A CN 201510441683A CN 104966690 B CN104966690 B CN 104966690B
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- 238000005530 etching Methods 0.000 title claims abstract description 174
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 230000001680 brushing effect Effects 0.000 claims description 110
- 230000005540 biological transmission Effects 0.000 claims description 41
- 230000007246 mechanism Effects 0.000 claims description 31
- 238000001514 detection method Methods 0.000 claims description 19
- 238000009434 installation Methods 0.000 claims description 16
- 238000012423 maintenance Methods 0.000 claims description 11
- 230000000694 effects Effects 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 description 18
- 239000007921 spray Substances 0.000 description 9
- 239000012530 fluid Substances 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning In General (AREA)
Abstract
The present invention provides a kind of etching device, including etching cavity, and the etching device further includes that setting removes component in the indoor drop of the etch chamber, and the drop removal component is for removing the drop being attached on the etching cavity roof.Correspondingly, the present invention also provides a kind of application methods of the etching device.The present invention can remove the drop on component removal etching cavity roof by drop, the etching uneven phenomenon that drips generate on substrate be reduced, so as to improve etching effect.
Description
Technical field
The present invention relates to the manufacturing fields of display device, and in particular to a kind of etching device and a kind of etching device make
Use method.
Background technology
Array substrate manufacturing process is broadly divided into cleaning, film forming, exposure imaging, etching, five big techniques of stripping.Wherein carve
Etching technique is divided into dry etching and wet etching, and wet etching is widely used in the etching of metallic film and sull.It is wet
Method etching technics is primarily referred to as a kind of technology being removed to engraving using chemical liquid.Substrate to be etched is carried out wet
When method etches, is chemically reacted by chemical liquid and engraving, the film not being covered by photoresist is removed, to
It realizes electrode patterning.
Wet-method etching equipment is typically that etching liquid is sprayed to substrate table to be etched by nozzle using acid etch liquids
Face is chemically reacted with the film layer of substrate surface, to achieve the purpose that etching.However, in actual production process, spray
It can be attached on the cover board of etching apparatus with the etching liquid drop volatilized, the etching liquid drop being attached on etching apparatus cover board
It builds up, forms increasing etching liquid drop, be finally dropped on substrate to be etched, cause etching uneven, serious shadow
Ring the yield of product.
Invention content
The purpose of the present invention is to provide a kind of etching devices and a kind of application method of the etching device, to prevent from etching
Etching drop is dropped on substrate in the process.
To achieve the goals above, the present invention provides a kind of etching device, including etching cavity, wherein the etching dress
It further includes that setting removes component in the indoor drop of the etch chamber to set, and the drop removal component is attached to described for removal
Drop on etching cavity roof.
Preferably, maintenance access is formed at the top of the etching cavity, the etching device includes cover board, the cover board
It is covered on the maintenance access, to be formed as at least part of the roof of the etching cavity, the drop removes component
It is arranged on the surface of the direction etching cavity of the cover board.
Preferably, the drop removal component includes brushing piece, and the brushing piece can be before etching starts or after etching
It is relatively moved with the cover board along the surface of the direction of the cover board etching cavity, so that the direction of the cover board
Drop on the surface of the etching cavity, which is brushed, to be dropped down onto in the etching cavity.
Preferably, the drop removal component further includes at least one transmission mechanism, and the transmission mechanism is arranged described
On the surface towards etching cavity of cover board, the transmission mechanism includes driving wheel, driven wheel, is sleeved on the driving wheel and described
Belt on driven wheel, the drop removal component further include the motor for driving the driving wheel rotation, and the brushing piece is set
It sets on the belt, the length direction of the brushing piece and the extending direction of the belt intersect.
Preferably, the transmission mechanism further includes installation part, and the installation part is removably disposed on the belt, institute
Brushing piece is stated to be fixed on the installation part.
Preferably, the drop removal component includes two spaced transmission mechanisms, the both ends of the brushing piece
It is separately positioned on the installation part of two transmission mechanisms.
Preferably, the etching device further includes substrates detector part and controller, and the substrates detector part is for examining
Substrate position is surveyed, when the substrates detector part detects that the substrate is located at outside the etching cavity, substrate detection
Device can send commencing signal to the controller, and the controller controls the motor according to the commencing signal and starts to transport
Row.
Preferably, the transmission mechanism can drive the brushing piece to be moved between the first precalculated position and the second precalculated position
Dynamic, the drop removal component further includes the brushing piece detection device of the position for detecting the brushing piece, when the brushing piece detects
When units test is moved to first precalculated position or the second precalculated position to the brushing piece, it can be sent to the controller
Stop signal, the controller are out of service according to the stop signal control motor.
Preferably, the position detection device includes being arranged to exist in the first sensor in first precalculated position and setting
The second sensor in second precalculated position, when the first sensor detects that the brushing piece reaches first pre-determined bit
When setting, the first sensor can send stop signal to the controller, when the second sensor detects the brush
When piece reaches second precalculated position, the second sensor can send stop signal to the controller.
Preferably, the etching device further includes transmission assembly, for the substrate to be input in the etching cavity
Presumptive area, described in the orthographic projection in region defined by first precalculated position and second precalculated position at least covers
The orthographic projection of presumptive area.
Correspondingly, the present invention also provides a kind of application method of etching device, the etching device is provided by the invention
Above-mentioned etching device, the application method include：
It is attached to the drop on the etching cavity roof using drop removal component removal.
Preferably, maintenance access is formed at the top of the etching cavity, the etching device includes cover board, the cover board
It is covered on the maintenance access, to be formed as at least part of the roof of the etching cavity, the drop removes component
It is arranged on the surface of the direction etching cavity of the cover board, the quarter is attached to using drop removal component removal
Erosion chamber roof on drop the step of include：
The drop on the surface for the direction etching cavity that component removes the cover board is removed using drop.
Preferably, drop removal component includes brushing piece, using drop removal component remove the cover board towards institute
The step of stating the drop on the surface of etching cavity include：
Before etching starts or after etching, controlling table of the brushing piece along the direction etching cavity of the cover board
Face is relatively moved with the cover board, is dropped down onto in the etching cavity so that the drop on the cover board is brushed.
Preferably, the drop removal component further includes at least one transmission mechanism, and the transmission mechanism is arranged described
On the surface towards etching cavity of cover board, the transmission mechanism includes driving wheel, driven wheel, is sleeved on the driving wheel and described
Belt on driven wheel, the drop removal component further include the motor for driving the driving wheel rotation, and the brushing piece is set
It sets on the belt, the length direction of the brushing piece and the extending direction of the belt intersect,
The brushing piece is controlled to relatively move with the cover board along the surface of the direction etching cavity of the cover board
The step of include：
The motor operation is controlled, to drive brushing piece to be moved along the surface of the direction etching cavity of the cover board.
Preferably, the etching device further includes substrates detector part and controller, the step of controlling the motor operation
Including：
The position that substrate is detected using the substrates detector part detects substrate position when the substrate detects detection device
When outside the etching cavity, commencing signal is sent to the controller；
The motor is controlled using the controller according to the commencing signal to bring into operation.
Preferably, the drop removal component further includes the brushing piece detection device of the position for detecting the brushing piece, institute
Stating application method further includes：
Using the position of brushing piece described in brushing piece detection units test, when brushing piece detection device detects the brush
When piece is moved to first precalculated position or the second precalculated position, stop signal is sent to the controller；
It is out of service according to the control signal control motor using the controller.
In the present invention, it is provided with drop removal component in the etch chamber, can will be attached on etching cavity roof
Drop removal, occur in the case where substrate surface to reduce drips, and then improve etching effect, ensure that production
The quality of product.
Description of the drawings
Attached drawing is to be used to provide further understanding of the present invention, an and part for constitution instruction, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings：
Fig. 1 is the structural schematic diagram of etching device in the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of drop removal component in the embodiment of the present invention；
Fig. 3 is the structural schematic diagram of transmission mechanism in the embodiment of the present invention.
Wherein, reference numeral is：1, spray unit；11, spray tube；12, nozzle；2, etching cavity；3, substrate；4, it transmits
Component；5, liquid feeding pipeline；6, recovery pipe；7, solution feed pump；8, fluid reservoir；9, cover board；10, drop removes component；101, brushing piece；
102, motor；103, transmission shaft；105, transmission mechanism；105a, driving wheel；105b, driven wheel；105c, belt；105d, installation
Part；106, first sensor；107, second sensor.
Specific implementation mode
The specific implementation mode of the present invention is described in detail below in conjunction with attached drawing.It should be understood that this place is retouched
The specific implementation mode stated is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
As one aspect of the present invention, a kind of etching device, including etching cavity are provided, the etching device further includes
Setting removes component in the indoor drop of the etch chamber, and the drop removal component is attached to the etching cavity for removing
Drop on roof.
The etching device of the present invention is particularly suitable in wet etching, during wet etching, etching liquid spray or volatilization
It can adhere to one layer of drop in the roof of etching cavity afterwards, after drop aggregation becomes larger to a certain extent, can be dripped from roof.
In the present invention, it is provided with drop removal component 10 in the etch chamber, can will be attached to etching cavity roof
On drop removal, occur in the case where substrate surface to reduce drips, reduce the drop of drippage and etching is imitated
The influence of fruit, and then ensure that the quality of product.
For the ease of the cleaning and maintenance to etching cavity, as shown in Figure 1, the top of etching cavity 2 be formed with safeguard into
Mouthful, the etching device includes cover board 9, cover board 9 is covered on the maintenance access, to be formed as the roof of etching cavity 2
At least partially, drop removal component 10 is arranged on the surface towards etching cavity of cover board 9, thus by the direction of cover board 9
Drop removal on the surface of etching cavity.
Drop removal component 10 can remove drop by different modes, for example, adsorbed by adsorption layer, or
Drop is scraped using brushing piece.As a kind of specific implementation mode of the present invention, as shown in Fig. 2, drop removal component 10 includes
Brushing piece 101, brushing piece 101 can before etching starts or after etch along the surface of the direction of cover board 9 etching cavity and
Cover board 9 relatively moves, and is dropped down onto in etching cavity 2 so that the drop on the surface towards etching cavity of cover board 9 is brushed.
Since the movement of brushing piece 101 is carried out before etching starts or after etching, in etching cavity and it is not provided with
Therefore substrate even if drop falls off from cover board, will not drop on substrate.When being performed etching to substrate, due on cover board
Drop fallen off, the drop assembled in etching process on the cover board is also smaller, and the possibility of drippage is smaller.Therefore, may be used
Occurred with reducing the phenomenon that drop drops on substrate, improves etching effect.
The structure of the softness such as bristle, spongy layer can be set in brushing piece 101, so that when brushing piece is carved along the direction of cover board 9
When losing the surface movement of chamber, drop brush can be fallen using bristle, or adsorbed drop using spongy layer, and will not be to lid
Board bottom face generates abrasion.
When being not provided with the structures such as above-mentioned bristle, spongy layer in brushing piece, may exist centainly between brushing piece 101 and cover board
Gap, specifically, gap can in 0~3mm, to reduce the friction between brushing piece 101 and cover board, reduce cover board and brushing piece by
The damage arrived.And when the spacing between brushing piece 101 and cover board is in 0~3mm, after the removal of the brushing piece of brushing piece 101, retain
Droplet size on the cover board is smaller, will not drip.
In the present invention, brushing piece can also be driven to move automatically by motor by driving the movement of brushing piece 101 manually
It is dynamic.Preferably, drop removal component 10 can also include at least one transmission mechanism 105, and transmission mechanism 105 is arranged in cover board 9
The surface towards etching cavity on, as shown in figure 3, transmission mechanism 105 include driving wheel 105a, driven wheel 105b, be sleeved on master
Belt 105c on driving wheel 105a and driven wheel 105b, it further includes for driving driving wheel 105a to rotate that drop, which removes component 10,
Motor 102, brushing piece 101 are arranged on belt 105c, and the extending direction of the length direction and belt 105c of brushing piece 101 intersects.
Driving wheel 105a rotations are driven when motor 102 is run, to drive belt to operate, to drive brushing piece 101 to move.
For the ease of the installation of brushing piece and the maintenance of transmission mechanism, as shown in Figures 2 and 3, transmission mechanism 105 further includes
Installation part 105d, installation part 105d are removably disposed on belt 105c, for example, by one end of belt with installation part 105d's
One end is detachably connected, and the other end of the other end and installation part 105d of belt is detachably connected, to be formed closely
Cyclic structure.Brushing piece 101 is fixed on installation part 105d.When the maintenance for carrying out transmission mechanism or when needing replacing brushing piece, only need
Installation part 105d is disassembled from belt.
Further, drop removal component 10 includes two spaced transmission mechanisms 105, the both ends point of brushing piece 101
It is not arranged on the installation part 105d of two transmission mechanisms, is moved with stablizing under the drive of motor.Wherein, two belt 105c
It can be arranged in parallel, brushing piece 101 is vertical with two belt 105c.
Further, as shown in Fig. 2, drop removal mechanism 10 can also include transmission shaft 103, transmission shaft 103 will be electric
The power that machine 102 exports is transferred to driving wheel 105.Specifically, can transmission gear be set on the output shaft of motor, is being driven
Axis 103 is provided with driven gear close to one end of motor, and the driven gear is engaged with the transmission gear.By driving wheel 105
It is arranged on transmission shaft 103, drives two driving wheel 105a to rotate simultaneously by transmission shaft 103 when motor 102 is run.
Further, the etching device further includes the substrates detector part and controller for detecting substrate position,
When the substrates detector part detects that substrate 3 is located at 2 outside of etching cavity, which can be to the control
Device sends commencing signal, and the controller controls motor 102 according to the commencing signal and brings into operation, to drive brushing piece 101 to open
Begin to move, the drop brush on cover board is fallen, prevents drop from dropping on substrate.
Further, motor 102 can drive driving wheel to rotate, to drive brushing piece 101 in the first precalculated position and
It is moved between two precalculated positions.Drop removal component 10 further includes the brushing piece detection device of the position for detecting brushing piece 101, when
It, can be to the control when brushing piece detection device detects that brushing piece 101 is moved to first movement position or the second precalculated position
Device processed sends stop signal, and it is out of service that the controller according to the stop signal controls motor, to ensure that brushing piece can be
Suitable range is moved, and brushing piece is prevented to be detached from guide rail.For example, when starting to remove drop, brushing piece 101 is by a certain position
It is moved to the first precalculated position, when brushing piece 101 is moved to the first precalculated position, it is out of service that controller controls motor.It is next
When secondary removal drop, brushing piece 101 is moved from the first precalculated position to the second precalculated position, is made a reservation for when brushing piece 101 is moved to second
When position, it is out of service that controller controls motor.
Specifically, as shown in Fig. 2, the position detection device includes the first sensing being arranged in first precalculated position
Device 106 and the second sensor 107 in second precalculated position is set.When first sensor 106 detects that brushing piece 101 reaches
When the first precalculated position, first sensor 106 can send stop signal to the controller, when second sensor 107 detects
When detecting that brushing piece 101 reaches the second precalculated position to brushing piece 101, second sensor 107 can be sent to the controller stops
Stop signal transmitted by stop signal, first sensor 106 and second sensor 107 can be identical, and the controller is according to institute
It is out of service to state stop signal control motor 102.
As shown in Figure 1, the etching device further includes transmission assembly 4, for substrate 3 to be input in etching cavity 2
Region (that is, moving area of brushing piece) defined by presumptive area, first precalculated position and second precalculated position
Orthographic projection at least cover the orthographic projection of the presumptive area.So that brushing piece 101 at least can be by the drop of 3 top of substrate
Removal, prevents drips on substrate.The orthographic projection refers to projection in the vertical direction.
It should be noted that the structures such as brushing piece, driving wheel, driven wheel in the present invention can use corrosion-resistant material
It makes, prevents in prolonged wet etching, corrosive liquid removes drop the corrosion of all parts of component.
As shown in Figure 1, the etching device can also include：
Spray unit 1, the spray unit 1 include spray tube 11 and the multiple nozzles 12 being arranged below spray tube 11,
For spraying etching liquid to the indoor substrate of etch chamber；
Fluid reservoir 8, for storing etching liquid；
Liquid feeding pipeline 5 and solution feed pump 7, the solution feed pump extract the etching liquid in fluid reservoir 8 out, and the etching liquid of extraction passes through confession
Liquid pipeline 2 is delivered to spray unit 1；
Recovery pipe 6, which is arranged between etching cavity and fluid reservoir 8, by the etching in etching cavity 2
Liquid is recycled in fluid reservoir 8, carries out recycling use.
As the second aspect of the invention, a kind of application method of above-mentioned etching device, the application method packet are provided
It includes：
It is attached to the drop on the etching cavity roof using drop removal component removal.
Specifically, maintenance access is formed at the top of the etching cavity, the etching device includes cover board, the cover board
It is covered on the maintenance access, to be formed as at least part of the roof of the etching cavity, the drop removes component
It is arranged on the surface of the direction etching cavity of the cover board, the quarter is attached to using drop removal component removal
Erosion chamber roof on drop the step of include：
The drop on the surface for the direction etching cavity that component removes the cover board is removed using drop.
As mentioned above it is possible, the drop removal component includes brushing piece, the cover board is removed using drop removal component
Include towards the step of drop on the surface of the etching cavity：
Before etching starts or after etching, controlling table of the brushing piece along the direction etching cavity of the cover board
Face is relatively moved with the cover board, is dropped down onto in the etching cavity so that the drop on the cover board is brushed.
Due to etching start before or etching start after, substrate is not provided in etching cavity, therefore, drop by brush fall behind
It will not drop on substrate, prevent from having an impact etching effect.
The mode for controlling brushing piece movement can be manually mode, or in the way of motor drive brushing piece movement.In order to
Working efficiency is improved, as mentioned above it is possible, drop removal component further includes at least one transmission mechanism, the transmission mechanism
It is arranged on the surface towards etching cavity of the cover board, the transmission mechanism includes driving wheel, driven wheel, is sleeved on the master
Belt on driving wheel and the driven wheel, the drop removal component further include the motor for driving the driving wheel rotation,
The brushing piece is arranged on the belt, and the length direction of the brushing piece and the extending direction of the belt intersect,
The brushing piece is controlled to relatively move with the cover board along the surface of the direction etching cavity of the cover board
The step of include：
The motor operation is controlled, to drive brushing piece to be moved along the surface of the direction etching cavity of the cover board.
When motor operation, the driving wheel is driven to rotate, to drive driven wheel to rotate and belt transmission, and then band
Dynamic brushing piece is moved along the surface of the direction etching cavity of the cover board.
The operation and stopping of motor again may be by manually controlling, and can also be automatically controlled by controller.Into one
Step ground, as mentioned above it is possible, the etching device further includes substrates detector part and controller, controls the step of the motor operation
Suddenly further include：
The position that substrate is detected using the substrates detector part detects substrate position when the substrate detects detection device
When outside the etching cavity, commencing signal is sent to the controller；
The motor is controlled using the controller according to the commencing signal to bring into operation.
When the substrates detector part detects that substrate is located inside etching cavity, is sent to the controller and stop letter
Number, controller is out of service according to stop signal control motor.Therefore, under the control action of controller, can make
The brush of drop, which is fallen, to carry out automatically, improve process efficiency.When there is no substrate in etching cavity, start the liquid that brush is fallen on cover board
Drop, prevents drips on substrate, when there is substrate in etching cavity, since the drop brush on cover board being fallen,
The drop being gathered in again on the surface towards etching cavity of cover board when etching is also smaller, is not enough to be dropped on substrate.
Further, the drop removal component further includes the brushing piece detection device of the position for detecting the brushing piece,
The application method further includes：
Using the position of brushing piece described in brushing piece detection units test, when brushing piece detection device detects the brush
When piece is moved to first precalculated position or the second precalculated position, stop signal is sent to the controller；
It is out of service according to the control signal control motor using the controller.
For example, before being removed to drop, brushing piece is located at the first precalculated position, when starting to be removed drop, institute
It states the controller control motor to bring into operation, drives brushing piece movement, when brushing piece reaches the second precalculated position, the brushing piece inspection
It surveys device and sends stop signal to the controller, the controller controls motor according to the stop signal to be stopped；It at this moment can be with
Substrate is sent in etching cavity and is performed etching, after etching, substrate is exported into etching cavity, when substrates detector part is examined
When measuring substrate and being located at outside etching cavity, commencing signal is sent to the controller, the controller controls the motor and opens
Begin operation, brushing piece is moved since the second precalculated position, when brushing piece reaches the first precalculated position, the brushing piece detect device to
The controller sends stop signal, and it is out of service that the controller controls the motor.And so on.Often carry out a drop
Removal process, it is only necessary to brushing piece is mobile primary between the first precalculated position and the second precalculated position, can fall drop brush
, do not need brushing piece and move back and forth, improve working efficiency.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, in the essence for not departing from the present invention
In the case of refreshing and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of etching device, including etching cavity, which is characterized in that the etching device further includes being arranged in the etch chamber
Indoor drop removes component, and the drop removal component is for removing the drop being attached on the etching cavity roof, institute
State and be formed with maintenance access at the top of etching cavity, the etching device includes cover board, the cover board be covered in it is described safeguard into
On mouth, to be formed as at least part of the roof of the etching cavity, the drop removal component is arranged in the cover board
Towards on the surface of the etching cavity；
Drop removal component includes brushing piece, the brushing piece can before etching starts or after etching along the cover board
It is relatively moved towards the surface of the etching cavity and the cover board, so that the direction of the cover board etching cavity
Surface on drop brushed and dropped down onto in the etching cavity；
The drop removal component further includes at least one transmission mechanism, and the direction quarter in the cover board is arranged in the transmission mechanism
On the surface for losing chamber, the transmission mechanism includes driving wheel, driven wheel, the skin being sleeved on the driving wheel and the driven wheel
Band, the drop removal component further include the motor for driving the driving wheel rotation, and the brushing piece is arranged in the belt
On, the length direction of the brushing piece and the extending direction of the belt intersect.
2. etching device according to claim 1, which is characterized in that the transmission mechanism further includes installation part, the peace
Piece installing is removably disposed on the belt, and the brushing piece is fixed on the installation part.
3. etching device according to claim 2, which is characterized in that the drop removal component includes that two intervals are arranged
The transmission mechanism, the both ends of the brushing piece are separately positioned on the installation part of two transmission mechanisms.
4. etching device according to claim 2, which is characterized in that the etching device further include substrates detector part and
Controller, the substrates detector part is for detecting substrate position, when the substrates detector part detects that the substrate is located at
When outside the etching cavity, which can send commencing signal to the controller, the controller according to
The commencing signal controls the motor and brings into operation.
5. etching device according to claim 4, which is characterized in that the transmission mechanism can drive the brushing piece
It is moved between one precalculated position and the second precalculated position, the drop removal component further includes the position for detecting the brushing piece
Brushing piece detect device, when brushing piece detection device detects that the brushing piece is moved to first precalculated position or second pre-
When positioning is set, stop signal can be sent to the controller, the controller controls the motor according to the stop signal and stops
Only run.
6. etching device according to claim 5, which is characterized in that the position detection device includes setting described the
The first sensor in one precalculated position and the second sensor in second precalculated position is set, when the first sensor is examined
When measuring brushing piece arrival first precalculated position, the first sensor can be sent to the controller stops letter
Number, when the second sensor detects that the brushing piece reaches second precalculated position, the second sensor can be to
The controller sends stop signal.
7. etching device according to claim 6, which is characterized in that the etching device further includes transmission assembly, is used for
The substrate is input to the presumptive area in the etching cavity, first precalculated position and the second precalculated position institute
The orthographic projection in the region of restriction at least covers the orthographic projection of the presumptive area.
8. a kind of application method of etching device, which is characterized in that the etching device is any one of claim 1 to 7
The etching device, the application method include：
Before etching starts or after etching, control the brushing piece along the surface of the direction etching cavity of the cover board with
The cover board relatively moves, and is dropped down onto in the etching cavity so that the drop on the cover board is brushed；
Control the step that the brushing piece is relatively moved along the surface of the direction etching cavity of the cover board and the cover board
Suddenly include：The motor operation is controlled, to drive brushing piece to be moved along the surface of the direction etching cavity of the cover board.
9. application method according to claim 8, which is characterized in that the etching device further includes substrates detector part
And controller, the step of controlling the motor operation, include：
The position that substrate is detected using the substrates detector part detects that substrate is located at institute when the substrate detects detection device
When stating outside etching cavity, commencing signal is sent to the controller；
The motor is controlled using the controller according to the commencing signal to bring into operation.
10. application method according to claim 9, which is characterized in that the drop removal component further includes for detecting
The brushing piece of the position of the brushing piece detects device, and the application method further includes：
Using the position of brushing piece described in brushing piece detection units test, when brushing piece detection device detects that the brushing piece is moved
When moving to first precalculated position or the second precalculated position, stop signal is sent to the controller；
It is out of service according to the control signal control motor using the controller.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106653658B (en) * | 2016-12-26 | 2019-12-31 | 武汉华星光电技术有限公司 | Cover plate applied to wet process equipment |
| CN109273381A (en) * | 2017-07-18 | 2019-01-25 | 东莞市鸿村环保设备制造有限公司 | A kind of glass substrate etching device with cleaning air-drying function |
| CN109166809A (en) * | 2018-07-12 | 2019-01-08 | 深圳市华星光电技术有限公司 | Wet etching equipment |
| CN110429053B (en) * | 2019-08-19 | 2021-03-23 | 江阴江化微电子材料股份有限公司 | Wet etching equipment with movable cover plate and wet etching method |
| CN114472362B (en) * | 2021-12-30 | 2023-04-25 | 华海清科股份有限公司 | Wafer cleaning device |
| CN114355511B (en) * | 2022-01-14 | 2024-02-06 | 武汉锐科光纤激光技术股份有限公司 | Optical fiber etching device |
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| CN1539027A (en) * | 2001-08-08 | 2004-10-20 | ��ķ�о�����˾ | Rapid cycle chamber having top vent with nitrogen purge |
| CN102091703A (en) * | 2009-12-15 | 2011-06-15 | 中芯国际集成电路制造(上海)有限公司 | Method for cleaning polymer on side wall of etching chamber and contact hole forming method |
| CN104667559A (en) * | 2013-12-03 | 2015-06-03 | 昆山国显光电有限公司 | Etching acid mist dissociating device |
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| JP2007253068A (en) * | 2006-03-23 | 2007-10-04 | Nec Lcd Technologies Ltd | Liquid etching type surface treatment device and its method |
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| CN1539027A (en) * | 2001-08-08 | 2004-10-20 | ��ķ�о�����˾ | Rapid cycle chamber having top vent with nitrogen purge |
| CN102091703A (en) * | 2009-12-15 | 2011-06-15 | 中芯国际集成电路制造(上海)有限公司 | Method for cleaning polymer on side wall of etching chamber and contact hole forming method |
| CN104667559A (en) * | 2013-12-03 | 2015-06-03 | 昆山国显光电有限公司 | Etching acid mist dissociating device |
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