CN104667559A - Etching acid mist dissociating device - Google Patents
Etching acid mist dissociating device Download PDFInfo
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- CN104667559A CN104667559A CN201310635791.0A CN201310635791A CN104667559A CN 104667559 A CN104667559 A CN 104667559A CN 201310635791 A CN201310635791 A CN 201310635791A CN 104667559 A CN104667559 A CN 104667559A
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- etching
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Abstract
The invention discloses an etching acid mist dissociating device. The etching acid mist dissociating device is used for wet-process etching and comprises an exhausting pipeline, a condenser, a liquid receiving disc and a reflowing pipe, wherein negative pressure exists in the exhausting pipeline and acid mist formed in an etching machine chamber is dissociated; the condenser is located under the exhausting pipeline and is communicated with the exhausting pipeline; the condenser is used for condensing the dissociated acid mist into acid liquid; the liquid receiving disc is located under the condenser and is used for receiving the condensed acid liquid; the reflowing pipe is located at the bottom of the liquid accepting disc and is communicated with the liquid receiving disc; and the reflowing pipe is used for guiding the acid liquid in the liquid receiving disc to flow into the etching machine chamber. By virtue of the etching acid mist dissociating device, the problem that the acid liquid falls onto a base plate so that the etching of the base plate is not uniform and the product yield is low when the base plate is etched by adopting a wet process can be avoided.
Description
Technical field
The present invention detaches device about a kind of acid mist, refers to that a kind of etching acid mist for detaching acid mist in wet etching detaches device especially.
Background technology
Wet-etching technology mainly refers to the lithographic technique adopting liquid chemical medicine to remove engraving.Wet etching is with suitable etching liquid, carry out chemical reaction with engraving, change the structure of engraving, make the part covered without photoresist depart from substrate surface, and the region having photoresist to cover is preserved, so just obtain required figure at substrate surface.
Utilize acid solution to etch substrate in wet method etching groove in wet-method etching equipment, in production process, acid solution is at high temperature, under spray pattern, volatilization forms acid mist, meet cold rear aggegation to be attached to gradually on the cover plate of wet method etching groove, attachment acid droplet on the cover board will condense into large acid drop gradually, the acid strength of acid solution aggegation is far longer than etching liquid concentration, when large acid drop drops on substrate, easily cause the fast phenomenon of local etching speed, cause base plate carving and corrosion uneven, even there is etching spot phenomenon, affect product yield.
Summary of the invention
In view of this, main purpose of the present invention is to provide a kind of uneven etching acid mist of etching of avoiding in wet-etching technology to detach device.
For achieving the above object, the invention provides a kind of etching acid mist and detach device, it is in wet etching, this etching acid mist detaches device and includes air draft pipe, condenser, liquid dish and return duct, be negative pressure in this air draft pipe and detach the acid mist formed in etching machine chamber, this condenser to be positioned at below air draft pipe and to be communicated with this air draft pipe, acid mist after detaching is aggregated into acid solution by this condenser, this liquid dish to be positioned at below this condenser and to receive the acid solution of aggegation, this return duct to be positioned at bottom this liquid dish and to be communicated with this liquid dish, acid solution water conservancy diversion in this liquid dish enters in this etching machine chamber by this return duct.
Described return duct is multiple.
What described condenser bottom margin was provided with oblique below detaches device baffle plate, and this detaches device baffle plate and is resisted against etching machine chamber inner wall.
Described condenser outer walls is provided with cool cycles pipe.
Described air draft pipe connects one makes its inner air exhauster forming negative pressure.
Etching acid mist of the present invention detaches device, because it has condenser, liquid dish and return duct, and the liquid outlet of return duct is positioned at the inwall place of etching machine chamber, the acid solution after aggegation can be made to import the inwall of etching machine chamber by return duct, avoid acid droplet and be exposed on substrate; What simultaneously detach that device is provided with inclination due to etching acid mist of the present invention detaches device baffle plate, the acid solution that aggegation is detaching device baffle plate place is made to avoid dropping on substrate, therefore the present invention can avoid when wet etching substrate, and Acidic Liquid is dropped on substrate and causes uneven to the etching of substrate, that product yield is low problem.
Accompanying drawing explanation
Fig. 1 is that etching acid mist of the present invention detaches device and implements a structural representation;
Fig. 2 is that etching acid mist of the present invention detaches device and implements two structural representations.
Detailed description of the invention
For ease of having further understanding to structure of the present invention and the effect that reaches, the existing preferred embodiment that develops simultaneously by reference to the accompanying drawings is described in detail as follows.
As shown in Figure 1, etching acid mist of the present invention detaches device and includes air draft pipe 111, condenser 108, liquid dish 106 and return duct 105, this condenser 108 to be positioned at below air draft pipe 111 and to be communicated with air draft pipe 111, liquid dish 106 is positioned at below condenser 108, and return duct 105 to be positioned at bottom liquid dish 106 and to be communicated with liquid dish 106.In the present invention, the bottom of condenser 108 and liquid dish 106 are positioned at etching machine chamber 101 with return duct 105, nozzle 104 in this etching machine chamber 101 substrate 103 downwards sprays acid solution and etches, and this substrate 103 is transmitted by the conveyance roller 102 be positioned at below it.
Condenser 108 outer wall in the present invention is provided with cool cycles pipe (not shown), and this cool cycles pipe makes cooling water circulate the acid mist flowed through with aggegation wherein by cooling water inlet 109 and coolant outlet 110.Be negative pressure in air draft pipe 111 in the present invention, therefore can the acid mist formed in etching machine chamber 101 be detached, acid mist after detaching carries out aggegation in condenser 108, acid solution after aggegation is back to liquid dish 106, by return duct 105, acid solution water conservancy diversion in liquid dish is entered in etching machine chamber 101, and sprayed through nozzle 104 by the circulatory system, acid solution can be recycled.
As shown in Figure 2, it is second embodiment of the invention, etching acid mist of the present invention detaches that device includes air draft pipe 111, condenser 108, detaches device baffle plate 107, liquid dish 106 and return duct 105, this condenser 108 to be positioned at below air draft pipe 111 and to be communicated with air draft pipe 111, detach device baffle plate 107 and be located at the oblique below of condenser 108 bottom margin, this detaches device baffle plate 107 and is resisted against etching machine chamber 101 inwall, liquid dish 106 is positioned at below condenser 108, and return duct 105 to be positioned at bottom liquid dish 106 and to be communicated with liquid dish 106.In the present invention, the bottom of condenser 108 and liquid dish 106 are positioned at etching machine chamber 101 with return duct 105, nozzle 104 in this etching machine chamber 101 substrate 103 downwards sprays acid solution and etches, and this substrate 103 is transmitted by the conveyance roller 102 be positioned at below it.
Condenser 108 outer wall in the present invention is provided with cool cycles pipe (not shown), and this cool cycles pipe makes cooling water circulate the acid mist flowed through with aggegation wherein by cooling water inlet 109 and coolant outlet 110.Because the negative pressure of air draft pipe 111 detaches, in etching machine chamber 101, most of acid mist can be pulled out, acid mist after detaching carries out aggegation in condenser 108, acid solution after aggegation is back to liquid dish 106, by return duct 105, acid solution water conservancy diversion in liquid dish is entered in etching machine chamber 101, and sprayed through nozzle 104 by the circulatory system, acid solution can be recycled.The acid mist be not pulled out can aggegation detach on device baffle plate 107, owing to detaching device baffle plate 107 for being obliquely installed, therefore the acid solution after aggegation can not directly drip dew on a substrate 103, can along detaching device baffle plate 107 following current in etching machine chamber 101, and sprayed through nozzle 104 by the circulatory system, acid solution can be recycled.
For avoiding the acid droplet that this return duct 105 flows out to be exposed on substrate, the liquid outlet of return duct 105 is positioned at the inwall place of etching machine chamber 101.Return duct in the present invention can be multiple, to dispersible discharge when the acid solution of aggegation is more.
The power that in the present invention, acid mist detaches, can be that the discharge of factory detaches, also can be that etching acid mist of the present invention detaches the air exhauster that device carries and detaches, namely air draft pipe 111 connects an air exhauster (not shown), to make form negative pressure in air draft pipe 111 and detach acid mist.
The present invention realizes the backflow of acid mist by the way, acid mist can not directly be dripped to be exposed on substrate, thus solution causes uneven to base plate carving and corrosion, that product yield is low problem because Acidic Liquid is dropped on substrate, can ensure that again acid solution will cause concentration to reduce because detaching acid mist simultaneously.
The above, be only preferred embodiment of the present invention, be not intended to limit protection scope of the present invention.
Claims (5)
1. an etching acid mist detaches device, it is in wet etching, it is characterized in that, this etching acid mist detaches device and includes air draft pipe (111), condenser (108), liquid dish (106) and return duct (105), be negative pressure in this air draft pipe (111) and detach the acid mist formed in etching machine chamber (101), this condenser (108) is positioned at air draft pipe (111) below and is communicated with this air draft pipe (111), acid mist after detaching is aggregated into acid solution by this condenser (108), this liquid dish (106) is positioned at this condenser (108) below and receives the acid solution of aggegation, this return duct (105) is positioned at this liquid dish (106) bottom and is communicated with this liquid dish (106), acid solution water conservancy diversion in this liquid dish (106) enters in this etching machine chamber (101) by this return duct (105).
2. etching acid mist as claimed in claim 1 detaches device, and it is characterized in that, described return duct (105) is for multiple.
3. etching acid mist as claimed in claim 1 detaches device, it is characterized in that, what described condenser (108) bottom margin was provided with oblique below detaches device baffle plate (107), and this detaches device baffle plate (107) and is resisted against described etching machine chamber (101) inwall.
4. etching acid mist as claimed in claim 1 detaches device, and it is characterized in that, described condenser (108) outer wall is provided with cool cycles pipe.
5. etching acid mist as claimed in claim 1 detaches device, it is characterized in that, described air draft pipe (111) connects one makes its inner air exhauster forming negative pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310635791.0A CN104667559A (en) | 2013-12-03 | 2013-12-03 | Etching acid mist dissociating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310635791.0A CN104667559A (en) | 2013-12-03 | 2013-12-03 | Etching acid mist dissociating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104667559A true CN104667559A (en) | 2015-06-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310635791.0A Pending CN104667559A (en) | 2013-12-03 | 2013-12-03 | Etching acid mist dissociating device |
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| Country | Link |
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| CN (1) | CN104667559A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104966690A (en) * | 2015-07-24 | 2015-10-07 | 京东方科技集团股份有限公司 | Etching device and application method therefor |
| CN104992914A (en) * | 2015-07-13 | 2015-10-21 | 合肥鑫晟光电科技有限公司 | Etching device and etching method |
| CN107224790A (en) * | 2016-03-23 | 2017-10-03 | 盟立自动化股份有限公司 | Wet processing device with built-in gas-liquid separation unit |
| CN109166809A (en) * | 2018-07-12 | 2019-01-08 | 深圳市华星光电技术有限公司 | Wet etching equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2070036U (en) * | 1990-04-28 | 1991-01-23 | 哈尔滨工业大学 | High-efficiency simple silicon etching cup |
| WO2002067313A1 (en) * | 2001-02-23 | 2002-08-29 | Tokyo Electron Limited | Plasma etching method and device |
| CN1511653A (en) * | 2002-12-30 | 2004-07-14 | Lg.飞利浦Lcd有限公司 | Etching agent fume exhauster |
| CN200964439Y (en) * | 2006-10-20 | 2007-10-24 | 扬博科技股份有限公司 | Etching device for circuit board |
| CN202359202U (en) * | 2011-11-10 | 2012-08-01 | 北京七星华创电子股份有限公司 | Exhaust device |
-
2013
- 2013-12-03 CN CN201310635791.0A patent/CN104667559A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2070036U (en) * | 1990-04-28 | 1991-01-23 | 哈尔滨工业大学 | High-efficiency simple silicon etching cup |
| WO2002067313A1 (en) * | 2001-02-23 | 2002-08-29 | Tokyo Electron Limited | Plasma etching method and device |
| CN1511653A (en) * | 2002-12-30 | 2004-07-14 | Lg.飞利浦Lcd有限公司 | Etching agent fume exhauster |
| CN200964439Y (en) * | 2006-10-20 | 2007-10-24 | 扬博科技股份有限公司 | Etching device for circuit board |
| CN202359202U (en) * | 2011-11-10 | 2012-08-01 | 北京七星华创电子股份有限公司 | Exhaust device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104992914A (en) * | 2015-07-13 | 2015-10-21 | 合肥鑫晟光电科技有限公司 | Etching device and etching method |
| CN104992914B (en) * | 2015-07-13 | 2017-12-01 | 合肥鑫晟光电科技有限公司 | A kind of etching device and lithographic method |
| CN104966690A (en) * | 2015-07-24 | 2015-10-07 | 京东方科技集团股份有限公司 | Etching device and application method therefor |
| CN104966690B (en) * | 2015-07-24 | 2018-09-04 | 京东方科技集团股份有限公司 | Etching device and its application method |
| CN107224790A (en) * | 2016-03-23 | 2017-10-03 | 盟立自动化股份有限公司 | Wet processing device with built-in gas-liquid separation unit |
| CN107224790B (en) * | 2016-03-23 | 2019-05-21 | 盟立自动化股份有限公司 | Wet processing device with built-in gas-liquid separation unit |
| CN109166809A (en) * | 2018-07-12 | 2019-01-08 | 深圳市华星光电技术有限公司 | Wet etching equipment |
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Application publication date: 20150603 |
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