CN104908400A - 一种高频特性覆铜板的制作方法 - Google Patents
一种高频特性覆铜板的制作方法 Download PDFInfo
- Publication number
- CN104908400A CN104908400A CN201510111111.4A CN201510111111A CN104908400A CN 104908400 A CN104908400 A CN 104908400A CN 201510111111 A CN201510111111 A CN 201510111111A CN 104908400 A CN104908400 A CN 104908400A
- Authority
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- Prior art keywords
- copper
- clad plate
- weight portion
- high frequency
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- 239000003822 epoxy resin Substances 0.000 claims abstract description 20
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 20
- 239000000203 mixture Substances 0.000 claims abstract description 18
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 66
- 239000004305 biphenyl Substances 0.000 claims description 34
- 235000010290 biphenyl Nutrition 0.000 claims description 33
- 229920000090 poly(aryl ether) Polymers 0.000 claims description 33
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 30
- 239000003292 glue Substances 0.000 claims description 24
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 23
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 21
- 238000003756 stirring Methods 0.000 claims description 21
- 238000002360 preparation method Methods 0.000 claims description 20
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 15
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 15
- 239000000377 silicon dioxide Substances 0.000 claims description 15
- 238000001879 gelation Methods 0.000 claims description 14
- 239000007787 solid Substances 0.000 claims description 14
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229930185605 Bisphenol Natural products 0.000 claims description 9
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 229910000077 silane Inorganic materials 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 8
- 239000004744 fabric Substances 0.000 claims description 8
- 239000004843 novolac epoxy resin Substances 0.000 claims description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 7
- 238000007731 hot pressing Methods 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 239000012779 reinforcing material Substances 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 6
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 6
- 150000002460 imidazoles Chemical class 0.000 claims description 6
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims description 6
- -1 2-ethyl imidazol Chemical compound 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000002386 leaching Methods 0.000 claims description 2
- 230000009477 glass transition Effects 0.000 abstract description 6
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract 6
- IJAPPYDYQCXOEF-UHFFFAOYSA-N phthalazin-1(2H)-one Chemical compound C1=CC=C2C(=O)NN=CC2=C1 IJAPPYDYQCXOEF-UHFFFAOYSA-N 0.000 abstract 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract 1
- 230000007547 defect Effects 0.000 abstract 1
- 239000003063 flame retardant Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 9
- 238000011049 filling Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 230000010365 information processing Effects 0.000 description 3
- 150000003457 sulfones Chemical class 0.000 description 3
- 238000010295 mobile communication Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- XEVRDFDBXJMZFG-UHFFFAOYSA-N carbonyl dihydrazine Chemical compound NNC(=O)NN XEVRDFDBXJMZFG-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 125000003963 dichloro group Chemical group Cl* 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 229920006258 high performance thermoplastic Polymers 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
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CN201510111111.4A CN104908400B (zh) | 2015-03-13 | 2015-03-13 | 一种高频特性覆铜板的制作方法 |
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CN201510111111.4A CN104908400B (zh) | 2015-03-13 | 2015-03-13 | 一种高频特性覆铜板的制作方法 |
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CN104908400A true CN104908400A (zh) | 2015-09-16 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109677059A (zh) * | 2017-10-18 | 2019-04-26 | 泰州市旺灵绝缘材料厂 | 一种宽介电常数新型聚四氟乙烯玻璃布覆铜箔板及其制备方法 |
CN110103477A (zh) * | 2019-05-09 | 2019-08-09 | 河源广工大协同创新研究院 | 一种高频覆铜板的制备方法 |
CN113444471A (zh) * | 2021-07-20 | 2021-09-28 | 郴州功田电子陶瓷技术有限公司 | 一种应用于多层高频覆铜板粘结片的组合物及其应用 |
CN114806176A (zh) * | 2022-06-08 | 2022-07-29 | 大连理工大学 | 一种热塑性树脂增韧颗粒的制备方法及其应用 |
CN115028967A (zh) * | 2022-07-13 | 2022-09-09 | 山东金宝电子股份有限公司 | 一种树脂组合物及高频高速覆铜板的制作方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01150382A (ja) * | 1987-11-07 | 1989-06-13 | Basf Ag | 改善された熱伝導度を有する回路基板 |
CN102320168A (zh) * | 2011-08-11 | 2012-01-18 | 大连理工大学 | 杂萘联苯聚芳醚高性能热塑性树脂基覆铜板及其制备方法 |
CN103717635A (zh) * | 2011-07-19 | 2014-04-09 | 松下电器产业株式会社 | 树脂组合物、树脂清漆、预浸料、覆金属层压板及印刷线路板 |
-
2015
- 2015-03-13 CN CN201510111111.4A patent/CN104908400B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01150382A (ja) * | 1987-11-07 | 1989-06-13 | Basf Ag | 改善された熱伝導度を有する回路基板 |
CN103717635A (zh) * | 2011-07-19 | 2014-04-09 | 松下电器产业株式会社 | 树脂组合物、树脂清漆、预浸料、覆金属层压板及印刷线路板 |
CN102320168A (zh) * | 2011-08-11 | 2012-01-18 | 大连理工大学 | 杂萘联苯聚芳醚高性能热塑性树脂基覆铜板及其制备方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109677059A (zh) * | 2017-10-18 | 2019-04-26 | 泰州市旺灵绝缘材料厂 | 一种宽介电常数新型聚四氟乙烯玻璃布覆铜箔板及其制备方法 |
CN110103477A (zh) * | 2019-05-09 | 2019-08-09 | 河源广工大协同创新研究院 | 一种高频覆铜板的制备方法 |
CN113444471A (zh) * | 2021-07-20 | 2021-09-28 | 郴州功田电子陶瓷技术有限公司 | 一种应用于多层高频覆铜板粘结片的组合物及其应用 |
CN114806176A (zh) * | 2022-06-08 | 2022-07-29 | 大连理工大学 | 一种热塑性树脂增韧颗粒的制备方法及其应用 |
CN114806176B (zh) * | 2022-06-08 | 2023-03-10 | 大连理工大学 | 一种热塑性树脂增韧颗粒的制备方法及其应用 |
CN115028967A (zh) * | 2022-07-13 | 2022-09-09 | 山东金宝电子股份有限公司 | 一种树脂组合物及高频高速覆铜板的制作方法 |
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CN104908400B (zh) | 2017-04-12 |
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Effective date of registration: 20190903 Address after: 351100 Chigang Street 889, Chigang Overseas Chinese Development Zone, Jiangkou Town, Hanjiang District, Putian City, Fujian Province Patentee after: PUTIAN HANJIANG YD PCB Co.,Ltd. Address before: 351100 High-tech Industrial Development Zone of Hanjiang District, Putian City, Fujian Province (Chigang Development Zone) Patentee before: FUJIAN NEW CENTURY ELECTRONIC MATERIAL Co.,Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: A manufacturing method of high frequency characteristic copper clad plate Effective date of registration: 20230112 Granted publication date: 20170412 Pledgee: Industrial Bank Putian branch, Limited by Share Ltd. Pledgor: PUTIAN HANJIANG YD PCB Co.,Ltd. Registration number: Y2023350000018 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20170412 Pledgee: Industrial Bank Putian branch, Limited by Share Ltd. Pledgor: PUTIAN HANJIANG YD PCB Co.,Ltd. Registration number: Y2023350000018 |