CN104894537A - 一种单面导电的聚酰亚胺复合材料及其制备方法 - Google Patents
一种单面导电的聚酰亚胺复合材料及其制备方法 Download PDFInfo
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- CN104894537A CN104894537A CN201510376701.XA CN201510376701A CN104894537A CN 104894537 A CN104894537 A CN 104894537A CN 201510376701 A CN201510376701 A CN 201510376701A CN 104894537 A CN104894537 A CN 104894537A
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- 239000004642 Polyimide Substances 0.000 title claims abstract description 37
- 229920001721 polyimide Polymers 0.000 title claims abstract description 37
- 239000002131 composite material Substances 0.000 title claims abstract description 35
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 239000007921 spray Substances 0.000 claims abstract description 64
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 62
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 31
- 239000000126 substance Substances 0.000 claims abstract description 29
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000007747 plating Methods 0.000 claims abstract description 26
- 230000004913 activation Effects 0.000 claims abstract description 24
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 22
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 18
- 238000010926 purge Methods 0.000 claims abstract description 13
- 238000005554 pickling Methods 0.000 claims abstract description 11
- 238000001035 drying Methods 0.000 claims abstract description 10
- 206010070834 Sensitisation Diseases 0.000 claims abstract description 9
- 230000008313 sensitization Effects 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 89
- 239000007788 liquid Substances 0.000 claims description 52
- 238000000034 method Methods 0.000 claims description 30
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 24
- 239000000243 solution Substances 0.000 claims description 22
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 20
- 239000002585 base Substances 0.000 claims description 18
- 239000008367 deionised water Substances 0.000 claims description 15
- 239000005543 nano-size silicon particle Substances 0.000 claims description 15
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 15
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims description 15
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 14
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 10
- 239000003513 alkali Substances 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 10
- -1 polyoxyethylene Polymers 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 9
- 239000003929 acidic solution Substances 0.000 claims description 8
- 239000012528 membrane Substances 0.000 claims description 8
- 239000011780 sodium chloride Substances 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 5
- 229910021607 Silver chloride Inorganic materials 0.000 claims description 2
- 239000003637 basic solution Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 claims description 2
- 239000010408 film Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000010409 thin film Substances 0.000 abstract description 3
- 239000002253 acid Substances 0.000 abstract 2
- 238000007788 roughening Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000011159 matrix material Substances 0.000 description 9
- 238000001514 detection method Methods 0.000 description 6
- 230000003628 erosive effect Effects 0.000 description 6
- 238000007655 standard test method Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
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Claims (10)
Priority Applications (1)
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CN201510376701.XA CN104894537B (zh) | 2015-07-01 | 2015-07-01 | 一种单面导电的聚酰亚胺复合材料及其制备方法 |
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CN201510376701.XA CN104894537B (zh) | 2015-07-01 | 2015-07-01 | 一种单面导电的聚酰亚胺复合材料及其制备方法 |
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CN104894537A true CN104894537A (zh) | 2015-09-09 |
CN104894537B CN104894537B (zh) | 2018-04-06 |
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CN201510376701.XA Expired - Fee Related CN104894537B (zh) | 2015-07-01 | 2015-07-01 | 一种单面导电的聚酰亚胺复合材料及其制备方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114059050A (zh) * | 2020-08-03 | 2022-02-18 | 比亚迪股份有限公司 | 一种聚苯硫醚基材的表面粗化方法及金属化方法 |
CN117467990A (zh) * | 2023-10-11 | 2024-01-30 | 深圳中科利尔科技有限公司 | 一种提高铜层韧性的pcb化学镀铜方法 |
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US4950553A (en) * | 1987-02-24 | 1990-08-21 | Polyonics Corporation | Thermally stable dual metal coated laminate products made from polyimide film |
JPH05112872A (ja) * | 1991-10-21 | 1993-05-07 | Okuno Seiyaku Kogyo Kk | ポリイミド系樹脂の無電解めつき方法及びプリエツチング用組成物 |
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CN101470283A (zh) * | 2007-12-28 | 2009-07-01 | Lg电子株式会社 | 柔性膜和包括该柔性膜的显示设备 |
CN201311792Y (zh) * | 2008-10-09 | 2009-09-16 | 天津亿鑫通科技股份有限公司 | 一种数字信号传输电缆 |
CN101414496A (zh) * | 2008-11-13 | 2009-04-22 | 天津亿鑫通科技股份有限公司 | 双层分屏蔽信号传输同轴电缆 |
CN101476150A (zh) * | 2008-12-29 | 2009-07-08 | 广州电器科学研究院 | 一种电镀Sn-Cu合金的装置及其方法 |
CN201477912U (zh) * | 2009-08-18 | 2010-05-19 | 王建荣 | 一种镀锡铜包铜合金线 |
CN102031505A (zh) * | 2009-09-25 | 2011-04-27 | 比亚迪股份有限公司 | 一种用于聚酰亚胺粗化活化的处理液和一种聚酰亚胺表面粗化活化的方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114059050A (zh) * | 2020-08-03 | 2022-02-18 | 比亚迪股份有限公司 | 一种聚苯硫醚基材的表面粗化方法及金属化方法 |
CN114059050B (zh) * | 2020-08-03 | 2023-03-28 | 比亚迪股份有限公司 | 一种聚苯硫醚基材的表面粗化方法及金属化方法 |
CN117467990A (zh) * | 2023-10-11 | 2024-01-30 | 深圳中科利尔科技有限公司 | 一种提高铜层韧性的pcb化学镀铜方法 |
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Inventor after: Chen Honghui Inventor before: Yang Fang Inventor before: Sun Aixiang Inventor before: Gan Yong Inventor before: Zhang Xiaoli Inventor before: Chen Yuandao Inventor before: Gao Yuan |
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Effective date of registration: 20180302 Address after: No. 22, No. 415001, Longmei street, Changde economic and Technological Development Zone, Hunan Province, No. 1, No. 3, medium and small enterprise garden, 13. Applicant after: Chang Rui Rui Xin Materials Co., Ltd. Address before: No. 3150, Dongting Avenue, Chang Jiashan community, Wuling District, Changde City, Hunan Applicant before: Changde Vincellar metal material Co., Ltd |
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Effective date of registration: 20190322 Address after: 415001 No. 11 Songlin Road, Changde Economic and Technological Development Zone, Hunan Province Patentee after: Changde Dexin Enterprise Management Partnership (Limited Partnership) Address before: 415001 No. 22 Longmei Street, Changde Economic and Technological Development Zone, Hunan Province (Floor 3, Floor 13, Building 1, Small and Medium-sized Enterprise Park) Patentee before: Chang Rui Rui Xin Materials Co., Ltd. |
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