CN104871040A - 保护性组合物 - Google Patents
保护性组合物 Download PDFInfo
- Publication number
- CN104871040A CN104871040A CN201380067712.9A CN201380067712A CN104871040A CN 104871040 A CN104871040 A CN 104871040A CN 201380067712 A CN201380067712 A CN 201380067712A CN 104871040 A CN104871040 A CN 104871040A
- Authority
- CN
- China
- Prior art keywords
- light
- protective composite
- organic metal
- protective
- transformation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C53/00—Saturated compounds having only one carboxyl group bound to an acyclic carbon atom or hydrogen
- C07C53/08—Acetic acid
- C07C53/10—Salts thereof
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261739780P | 2012-12-20 | 2012-12-20 | |
US61/739,780 | 2012-12-20 | ||
PCT/IB2013/060991 WO2014097120A1 (en) | 2012-12-20 | 2013-12-16 | Protective composition |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104871040A true CN104871040A (zh) | 2015-08-26 |
CN104871040B CN104871040B (zh) | 2020-02-21 |
Family
ID=50114411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380067712.9A Expired - Fee Related CN104871040B (zh) | 2012-12-20 | 2013-12-16 | 保护性组合物 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20150340564A1 (zh) |
EP (1) | EP2936218B1 (zh) |
JP (1) | JP6422882B2 (zh) |
CN (1) | CN104871040B (zh) |
WO (1) | WO2014097120A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9620686B2 (en) * | 2015-01-28 | 2017-04-11 | Apple Inc. | Display light sources with quantum dots |
JP2019186305A (ja) * | 2018-04-04 | 2019-10-24 | シャープ株式会社 | 発光装置および製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011065044A1 (ja) * | 2009-11-30 | 2011-06-03 | 日本化薬株式会社 | 硬化性樹脂組成物およびその硬化物 |
CN102190890A (zh) * | 2010-01-26 | 2011-09-21 | 横滨橡胶株式会社 | 有机硅树脂组合物及其使用方法、有机硅树脂、含有其的结构体、和光半导体元件密封体 |
CN102569593A (zh) * | 2010-12-22 | 2012-07-11 | 展晶科技(深圳)有限公司 | 发光二极管 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3065194A (en) * | 1959-07-16 | 1962-11-20 | Wacker Chemie Gmbh | Method of preparing silicone rubber compositions |
US6469215B1 (en) * | 2000-05-17 | 2002-10-22 | Degussa Ag | Process for the production of an intermediate mixture of β-isophorone epoxide and its isomer 4-hydroxyisophorone (HIP) |
JP2009120437A (ja) | 2007-11-14 | 2009-06-04 | Niigata Univ | シロキサンをグラフト化したシリカ及び高透明シリコーン組成物並びに該組成物で封止した発光半導体装置 |
JP4788837B2 (ja) * | 2010-01-26 | 2011-10-05 | 横浜ゴム株式会社 | シリコーン樹脂組成物およびその使用方法、シリコーン樹脂、シリコーン樹脂含有構造体、ならびに光半導体素子封止体 |
CN104060274A (zh) * | 2010-04-22 | 2014-09-24 | 日本化药株式会社 | 防银变色剂、防银变色树脂组合物、防银变色方法、及使用该防银变色剂的发光二极管 |
DE102010035110A1 (de) * | 2010-08-23 | 2012-02-23 | Osram Opto Semiconductors Gmbh | Polymerkomposit, Verwendung des Polymerkomposits und optoelektronisches Bauelement enthaltend das Polymerkomposit |
JP5728858B2 (ja) * | 2010-09-10 | 2015-06-03 | 横浜ゴム株式会社 | 金属層の腐食防止方法、耐硫化性を有する、積層体、半導体発光装置およびシリコーン樹脂組成物 |
CN103348497B (zh) * | 2011-04-05 | 2016-08-17 | 三井金属矿业株式会社 | 发光器件 |
-
2013
- 2013-12-16 JP JP2015548826A patent/JP6422882B2/ja not_active Expired - Fee Related
- 2013-12-16 WO PCT/IB2013/060991 patent/WO2014097120A1/en active Application Filing
- 2013-12-16 EP EP13830100.7A patent/EP2936218B1/en not_active Not-in-force
- 2013-12-16 CN CN201380067712.9A patent/CN104871040B/zh not_active Expired - Fee Related
- 2013-12-16 US US14/652,589 patent/US20150340564A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011065044A1 (ja) * | 2009-11-30 | 2011-06-03 | 日本化薬株式会社 | 硬化性樹脂組成物およびその硬化物 |
CN102190890A (zh) * | 2010-01-26 | 2011-09-21 | 横滨橡胶株式会社 | 有机硅树脂组合物及其使用方法、有机硅树脂、含有其的结构体、和光半导体元件密封体 |
CN102569593A (zh) * | 2010-12-22 | 2012-07-11 | 展晶科技(深圳)有限公司 | 发光二极管 |
Also Published As
Publication number | Publication date |
---|---|
US20150340564A1 (en) | 2015-11-26 |
EP2936218B1 (en) | 2017-02-22 |
EP2936218A1 (en) | 2015-10-28 |
WO2014097120A1 (en) | 2014-06-26 |
CN104871040B (zh) | 2020-02-21 |
JP6422882B2 (ja) | 2018-11-14 |
JP2016505213A (ja) | 2016-02-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170310 Address after: The city of Eindhoven in Holland Applicant after: PHILIPS LIGHTING HOLDING B.V. Address before: The city of Eindhoven in Holland Applicant before: KONINKLIJKE PHILIPS N.V. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: The city of Eindhoven in Holland Patentee after: Signify Holdings Ltd. Address before: The city of Eindhoven in Holland Patentee before: PHILIPS LIGHTING HOLDING B.V. |
|
CP01 | Change in the name or title of a patent holder | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200221 Termination date: 20211216 |
|
CF01 | Termination of patent right due to non-payment of annual fee |