CN104858104B - Nozzle and applying device - Google Patents
Nozzle and applying device Download PDFInfo
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- CN104858104B CN104858104B CN201510025706.8A CN201510025706A CN104858104B CN 104858104 B CN104858104 B CN 104858104B CN 201510025706 A CN201510025706 A CN 201510025706A CN 104858104 B CN104858104 B CN 104858104B
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- nozzle
- flow path
- nozzle body
- long side
- gas circuit
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Abstract
The present invention provides a kind of nozzle, can remove effectively the bubble contained by the coating liquid flowed in flow path.In addition, a kind of applying device of present invention offer can inhibit the generation of striped with said nozzle, to form the film of high-quality.Nozzle has：The nozzle body of strip；Flow path is formed in the inside of nozzle body along the long side direction of nozzle body, is circulated for coating liquid；Ejiction opening is formed in the lower section of flow path in nozzle body along long side direction, which connect with flow path, sprays coating liquid；And remove gas circuit, it is formed in the top of flow path in the inside of nozzle body along long side direction, it should be continuous in the long side direction except gas circuit, and it is connect with flow path, for flow path and except the separating distance between gas circuit, compared with the separating distance of the one end of the nozzle body on long side direction, the separating distance bigger of the another side of the nozzle body on long side direction.
Description
Technical field
The present invention relates to nozzle and applying devices.
Background technology
On the glass substrate of display panel for constituting liquid crystal display etc., it is formed with wiring or electrode, colour filter etc.
Fine pattern.Usually, such pattern is formed by the methods of photoetching process.In photolithography, it carries out respectively in glass
Coating forms the working procedure of coating of the film (etchant resist) formed by erosion resistant, carries out pattern exposure to the etchant resist on glass substrate
Exposure process and the developing procedure to develop later to the etchant resist.
Wherein, in working procedure of coating, in most cases using the applying device with gap nozzle.As such coating
Device, such as it has been known that there is such as lower structures：The moving glass substrate in a manner of the lower section by gap nozzle on one side, on one side coating contain
There is the coating liquid of erosion resistant.Hereinafter, the coating liquid containing erosion resistant is referred to as " anti-corrosion liquid ".
Gap nozzle is formed as the structure of the ejiction opening equipped with coating liquid for example on the nozzle body for be formed as strip.
The flow path for connecting with ejiction opening and circulating for coating liquid is formed in the inside of nozzle body.In addition, being equipped on nozzle body
The supply mouth of coating liquid is supplied into flow path.
In addition, as gap nozzle, it is known that have the structure (example of the bubble outlet for the bubble in discharge duct
Such as, referring to patent document 1).In structure described in patent document 1, in coating liquid of the bubble in flow path in flow path by
Buoyancy and rise, from above nozzle bubble outlet discharge.Such in the gap nozzle of bubble outlet,
Since bubble becomes to be not easy to be discharged from ejiction opening, it is not easy to be formed the striped (Japanese caused by bubble on film：スジム
ラ), good film can be formed.
Citation
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2008-142648 bulletins
Since the buoyancy for being mixed into the relatively small bubble in the bubble in coating liquid is small, therefore, it is difficult in coating liquid
Flowing keeps the state being trapped in coating liquid mostly.For example, anti-corrosion liquid is high viscosity mostly, even with above-mentioned patent text
Offer the gap nozzle described in 1, it is also difficult to remove the minute bubbles contained by coating liquid.Therefore, seek that coating liquid can be removed effectively
The structure of the nozzle of contained bubble.
Invention content
The subject that the invention solves
The present invention makes in view of the foregoing, it is intended that providing one kind can remove effectively in flow path
The nozzle of bubble contained by the coating liquid of interior flowing.In addition, its purpose also resides in, provide a kind of with said nozzle and energy
Enough inhibit the generation of striped and forms the applying device of the film of high-quality.
Means for solving the problems
In order to solve above-mentioned problem, a technical solution of the invention provides a kind of nozzle, has：The nozzle master of strip
Body；Flow path is formed in the inside of the nozzle body along the long side direction of the nozzle body, is circulated for coating liquid；Spray
Outlet, is formed in the lower section of the flow path in the nozzle body along the long side direction, the ejiction opening and the stream
Road connects, and sprays the coating liquid；And gas circuit is removed, it is formed in along the long side direction in the inside of the nozzle body
The top of the flow path, should be continuous on the long side direction except gas circuit, and is connect with the flow path, for the flow path and institute
It states except the separating distance between gas circuit, the separating distance phase with the one end of the nozzle body on the long side direction
Than the separating distance bigger of the another side of the nozzle body on the long side direction.
On the basis of the technical solution of the present invention, it can also be set as such as lower structure：The nozzle is in the nozzle body
Inside also there is the first link road, first link road the flow path and it is described except between gas circuit along the long side direction
It is formed, by the flow path with described except gas circuit connects, the flow path is formed as, and the extreme higher position of the inner wall of the flow path is
The link position of first link road and the flow path.
On the basis of the technical solution of the present invention, it can also be set as such as lower structure：The nozzle is in the nozzle body
Inside also have the second link road, second link road is between the flow path and the ejiction opening along the long side direction
It is formed, the flow path and the ejiction opening is connected, the flow path is formed as, and the lowest order of the inner wall of the flow path is set low
In the link position of second link road and the flow path.
On the basis of the technical solution of the present invention, it can also be set as such as lower structure：The separating distance is with from institute
One end is stated to tend to the another side and be gradually incremented by.
The technical solution of the present invention is, can also be set as such as lower structure：The flow path is formed as linear.
On the basis of the technical solution of the present invention, it can also be set as such as lower structure：It is described except gas circuit is formed as straight line
Shape.
In addition, the technical solution of the present invention provides a kind of applying device, which has：Board carrying portion,
Handling substrate；And coated portion applies coating liquid from the nozzle to the substrate being handled upside down with above-mentioned nozzle
It applies.
Invention effect
In accordance with the invention it is possible to provide a kind of nozzle, can remove effectively contained by the coating liquid flowed in flow path
Bubble.In addition, being capable of providing a kind of applying device, with the nozzle, and the generation of striped can be inhibited and form height
The film of quality.
Description of the drawings
Fig. 1 is the stereogram of the applying device of present embodiment.
Fig. 2 is the side view of the applying device of present embodiment.
Fig. 3 is the side view of the nozzle of present embodiment.
Fig. 4 is the stereogram of the nozzle of present embodiment.
Fig. 5 is the sectional view of the nozzle of present embodiment.
Fig. 6 is the vertical view of the action process for the applying device for indicating present embodiment.
Fig. 7 is the definition graph of the situation in nozzle when indicating to spray anti-corrosion liquid.
Fig. 8 is the figure of the action for the applying device for indicating present embodiment.
Fig. 9 is the vertical view of the applying device of modified embodiment of the present embodiment.
Figure 10 is the side view of the applying device of modified embodiment of the present embodiment.
Reference sign：
1 ... applying device；2 ... board carrying portions；3 ... coated portions；S ... substrates；32 ... nozzles；32A ... nozzle bodies；
32a ... flow paths；32b ... removes gas circuit；The interior extreme lower position of 321 ... flow paths；The connection position of 32m ... the second link road and flow path
It sets；The link position of 32n ... the first link road and flow path；The first link roads of 32x ...；The second link roads of 32y ...；320 ... spray
Mouthful
Specific implementation mode
Hereinafter, referring to Fig.1~Fig. 8 illustrates the nozzle and applying device of present embodiment.It should be noted that
In whole attached drawings below, suitably change the size of each integral part, ratio to be easy observation attached drawing etc..
<Applying device>
Fig. 1 is the brief perspective views of the applying device 1A of present embodiment.As shown, the applying device of present embodiment
1A is, for example, the applying device that anti-corrosion liquid is applied on the substrates such as glass substrate S used in liquid crystal display panel etc., with board carrying
Portion 2, coated portion 3 and management department 4 are used as main inscape.
In applying device 1A, using board carrying portion 2 come handling substrate S, is applied and resisted on substrate S using coated portion 3
Liquid is lost, the state of coated portion 3 is managed using management department 4.Preferably, applying device 1A is such as to configure in dust free room
Mode under cleaning ambient uses.
Fig. 2 is the side view of applying device 1A.Hereinafter, referring to Fig.1, the detailed construction of 2 couples of applying device 1A illustrates.
When illustrating the structure of applying device 1A, the direction in definition graph is come using XYZ coordinate system.By board carrying portion 2
Long side direction, i.e. substrate S carry direction be recorded as X-direction.Direction orthogonal with X-direction when overlooking is recorded as Y-direction.
The direction vertical with the plane including X-direction axis and Y-direction axis is recorded as Z-direction.It should be noted that X-direction,
Y-direction and Z-direction are set as, and direction identical with the direction of the arrow in figure is+direction, the side opposite with the direction of arrow
To for-direction.
[board carrying portion]
As shown in Figure 1, board carrying portion 2 has frame 21, workbench 22 and two carrying mechanisms 23.In board carrying
In portion 2, using two carrying mechanisms 23 in 22 upper edge +X direction handling substrate S of workbench.+X direction is in applying device 1A
Board carrying direction.
(frame)
As shown in Figure 1, 2, frame 21 is divided into frame central portion 21a and two frame side 21b, 21c, Zong Gongsan
A part.In addition, three parts are arranged along Y-direction.Frame 21 is, for example, to load on the ground and supporting table
22 and carrying mechanism 23 supporting member.
Frame central portion 21a is the part in centers in three parts being partitioned into, being configured at Y-direction, to workbench
22 are supported.
Two frame sides 21b, 21c are configured in a manner of frame central portion 21a is clamped when looking down.In present embodiment
In, frame side 21b configures the -Y direction side of centre portion 21a in the frame, is supported to carrying mechanism 23.In addition, frame side
Portion 21c configures the +Y direction side of centre portion 21a in the frame, is supported to carrying mechanism 23.In frame side 21b and frame
Between centre portion 21a and between frame side 21c and frame central portion 21a, gap is equipped in the +Z direction side of frame 21.
Frame central portion 21a, frame side 21b and frame side 21c are formed as lengthwise, the X of each section in the X direction
The size in direction is almost the same.
(carrying mechanism)
As shown in Figure 1, 2, carrying mechanism 23 has the mechanism for keeping substrate S and carrying it along +X direction, and in frame
The top of frame side 21b and frame side 21c are equipped with a pair of of carrying mechanism 23.A pair of carrying mechanism 23 be formed as relative to
The Y-direction Central Line symmetrical structure of workbench 22 removes and is formed as identical structure except the symmetrical this point of the line.Thus,
It is illustrated by taking the carrying mechanism 23 set on frame side 21b as an example below.
Carrying mechanism 23 has carrying implement 23a, board holder 23b and guide rail 23c.Including carrying implement 23a is formed as
Portion's such as structure equipped with linear motor, by driving the linear motor, carrying implement 23a that can be moved in guide rail 23c upper edge Y-directions
It is dynamic.
As shown in Fig. 2, board holder 23b is to maintain the component of in substrate S, -Y direction side side edge part.Substrate is protected
The side edge part for the substrate S that the portion 23b of holding is kept is the part stretched out when looking down from workbench 22 to -Y direction, and be along
One side in board carrying direction (X-direction).Board holder 23b on the face of the +Y direction side of carrying implement 23a in X direction
Arrangement, such as there are four setting.It is equipped with suction tray on each board holder 23b, is adsorbed using the suction tray and keeps substrate
S.In the accompanying drawings, show that board holder 23b cantilevers keep the situation of substrate S.
Guide rail 23c is arranged on frame side 21b, extends in X direction in the side of workbench 22.Pass through carrying implement 23a
It moves and can be moved along workbench 22 on guide rail 23c.
It should be noted that each carrying mechanism 23 being arranged on frame side 21b and frame side 21c can be independent
Ground handling substrate S.For example, the carrying mechanism 23 set on frame side 21b and the carrying implement set on frame side 21c can be utilized
Structure 23 keeps different substrate S.It in this case, can be using each carrying mechanism 23 come alternately handling substrate S, therefore
Throughput improves.
In addition, in the case where the substrate to about half area with aforesaid substrate S is carried, such as utilize two
Carrying mechanism 23 respectively keeps a substrate, and two above-mentioned carrying mechanisms 23 is made to go forward side by side along +X direction, and thus, it is possible to remove simultaneously
Transport two substrates.
[coated portion]
Coated portion 3 is the part that anti-corrosion liquid is applied on substrate S has gate frame 31, nozzle 32 as shown in Figure 1, 2
And sensor 33.
(gate frame)
As shown in Fig. 2, gate frame 31 has a pair of posts component 31a and bridge formation component 31b.Pillar component 31a with
Workbench 22 is interposed between intermediate mode in the Y direction and is each provided with one.Each pillar component 31a is supported on frame side respectively
21b and frame side 21c is arranged in a manner of the alignment of the height and position of upper end.In addition, bridge formation component 31b prolongs along Y-direction
It stretches, both ends are connect with the side of the upper end side (+Z direction side) of each pillar component 31a.Gate frame 31 is set as in the side Y as a result,
Upwards across workbench 22.In addition, bridge formation component 31b can be lifted relative to pillar component 31a.
The gate frame 31 is connect with mobile mechanism 34.Mobile mechanism 34 has guide rail component 35 and driving mechanism 36.
Guide rail component 35 is for example each provided with one in the slot 21d of frame side 21b and frame side 21c, prolongs in X direction respectively
It stretches.Each guide rail component 35 is respectively set to more extend to -X direction side than configuring the management department 4 on workbench 22.Driving mechanism
36 connect with gate frame 31, and coated portion 3 is made to be moved in the X direction along guide rail component 35.It should be noted that in Fig. 1
In, indicate that coated portion 3 can move in X direction using double-head arrow.
(nozzle)
One all directions of nozzle 32 are configured to the strip of lengthwise, and gate frame 31 is installed in a manner of assemble and unassemble
The lower section (-Z direction side) of bridge formation component 31b.
Fig. 3 is side view when observing nozzle 32 along +X direction.As shown, nozzle 32 has the nozzle body of strip
32A and be set to nozzle body 32A long side direction both ends the first side plate 324 and the second side plate 325.Following
Explanation in, by 325 side of the second side plate on the long side direction of nozzle body 32A be known as " one end ", by 324 side of the first side plate
Referred to as " another side ".
As shown in the picture, nozzle 32 has：Nozzle body 32A；Flow path 32a, in the inside of nozzle body 32A along spray
The long side direction of mouth main body 32A is formed, and is circulated for anti-corrosion liquid (coating liquid)；Ejiction opening 320, the edge in nozzle body 32A
The lower section that long side direction is formed in flow path 32a, which connect with flow path 32a and spray anti-corrosion liquid；And remove gas circuit
32b is formed in the top of flow path 32a in the inside of nozzle body 32A along long side direction, should be except gas circuit 32b is in long side side
It is continuous upwards and connect with flow path 32a.
In addition, in nozzle 32, for flow path 32a and the separating distance for removing gas circuit 32b, with the nozzle master on long side direction
The separating distance of the one end of body 32A is compared, the separation of the another side of the nozzle body 32A on long side direction away from
From larger.In the nozzle 32 of present embodiment, flow path 32a and except gas circuit 32b is all formed as linearly.In addition, flow path 32a
It is passed with the another side for tending to nozzle body 32A from the one end of nozzle body 32A with the separating distance except gas circuit 32b
Increase.
Flow path 32a extends along Y-direction and is formed parallel to Y-axis.Except gas circuit 32b extends along Y-direction and in Y-axis updip
Tiltedly.In z-direction, the end for removing the one end of gas circuit 32b is minimum.Except gas circuit 32b is preferred relative to the angle of inclination of flow path 32a
For be more than 0 degree and 10 degree hereinafter, more preferably higher than 0 degree and 5 degree hereinafter, further preferably 1 degree or more and 3 degree or less.
In nozzle 32, above-mentioned angle of inclination is 2 degree.
Nozzle body 32A also have the first link road 32x, the first link road 32x the inside of nozzle body 32A along
Long side direction is formed in flow path 32a and except between gas circuit 32b, by flow path 32a with connect except gas circuit 32b.
In addition, nozzle body 32A also has the second link road 32y, the second link road 32y is in nozzle body 32A
Portion is formed in along long side direction between flow path 32a and ejiction opening 320, and flow path 32a and ejiction opening 320 are connected.
Fig. 4 is the stereogram of nozzle 32, and Fig. 4 (a) is the brief perspective views for the appearance for indicating nozzle 32, and Fig. 4 (b) is nozzle
32 exploded perspective view.Fig. 5 is the sectional view at the line segment V-V of Fig. 3.
As shown in Figure 4,5, nozzle body 32A has first component 321, second component 322 and partition 323.
First component 321 is the component of the strip for example formed using stainless steel and other metal materials.First component 321 with
The opposed face 321p of second component 322 is equipped with the recess portion 321a for constituting flow path 32a in nozzle 32 and the structure in nozzle 32
At the recess portion 321b except gas circuit 32b.
Same as first component 321, second component 322 is also the strip structure for example formed using stainless steel and other metal materials
Part.The face 322p opposed with first component 321 of second component 322 is set as planar.It should be noted that can also be in face
When being provided with assembling nozzle 32 on 322p be set to the opposed recess portions of the recess portion 321a of first component 321 or with recess portion 321b
Opposed recess portion.Such recess portion constitutes flow path 32a when assembling nozzle, except a part of gas circuit 32b.
Same as first component 321, partition 323 is also the structure of the strip formed using such as stainless steel and other metal materials
Part.Partition 323 is in using the both ends of long side direction as the trapezoidal shape at upper bottom and bottom.
Nozzle body 32A is so that the face 321p of first component 321 is opposed with the face 322p of second component 322 and first
The state that partition 323 is clamped between component 321 and second component 322 assembles.
As shown in Fig. 4 (b) and Fig. 5, partition 323 is configured when being assembled in nozzle body 32A is depending on+Z than recess portion 321b
The position of direction side.In addition, matching in such a way that the bevel edge of trapezoidal partition 323 is along the edge of the +Z direction side of recess portion 321b
It sets.Nozzle body 32A is configured to that partition 323 is not utilized to block recess portion 321b and between face 321p and face 322p with partition as a result,
The state of 323 thickness separation.
In the nozzle body 32A so assembled, flow path is become by the space that recess portion 321a and face 322p are surrounded
32a.Gas circuit 32b is removed in addition, being become by the space that recess portion 321b and face 322p are surrounded.
In addition, gap between face 321p and face 322p, be formed in flow path 32a and except the gap between gas circuit 32b at
For the first link road 32x.Gap between face 321p and face 322p, the gap being formed between flow path 32a and ejiction opening 320
As the second link road 32y.
Ejiction opening 320 is to be formed in stream in the state that first component 321, second component 322 combine with partition 323
The opening portion of the side ends-Z of road 32a, and be the part for spraying the anti-corrosion liquid applied on substrate S.Ejiction opening 320 is along nozzle
32 long side direction is formed as slit-shaped.The size of Y-direction of the size of the long side direction of ejiction opening 320 less than substrate S, in base
The neighboring area of plate S does not apply anti-corrosion liquid.
In nozzle body 32A, if preparing the different multiple partitions 323 of thickness in advance, can by suitably replace every
Piece 323 come change flow path 32a, except the diameter of gas circuit 32b.In addition, by replacing partition 323, it can also change the first link road
The opening width of the width of the X-direction of 32x, the second link road 32y, the X-direction of ejiction opening 320.
As shown in figure 5, in nozzle body 32A, the extreme higher position of the inner wall of flow path 32a become the first link road 32x with
The link position 32n of flow path 32a.In addition, the extreme lower position 321 of the inner wall of flow path 32a be formed as less than the second link road 32y with
The link position 32m of flow path 32a.
First side plate 324 and the second side plate 325 are the components for example formed using stainless steel and other metal materials, have with
The identical shape of contour shape of section when observing nozzle body 32A along Y-direction.
On the first side plate 324, it is equipped with through-thickness and runs through the first side plate 324 and the flow path 32a with nozzle body 32A
The through hole 324a of the connection and through hole 324b being similarly connected to except gas circuit 32b.
Second side plate 325 is to close flow path 32a and the plank of the one end except gas circuit 32b.
On such nozzle 32, the connecting pipings 100 in a manner of being connected to the through hole 324a of the first side plate 324, with
The mode connecting pipings 110 being connected to through hole 324b.When in use, by via the piping 100 being connect with the first side plate 324 to
The anti-corrosion liquid supplied in flow path 32a is sprayed from ejiction opening 320.In addition, in nozzle 32, to the anti-corrosion liquid institute of flow path 32a inflows
The bubble contained by buoyancy to the direction floating except gas circuit 32b, via what is connect with except gas circuit 32b and the first side plate 324
110 discharge of piping.The mode that anti-corrosion liquid is sprayed about nozzle 32, is referred to aftermentioned.
(sensor)
As shown in Figure 1, 2, sensor 33 is installed in the lower surface of bridge formation component 31b, which measures nozzle 32
320 side of ejiction opening front end with and the opposed opposed faces of the spray nozzle front end, for example configure the substrate S of the lower section of nozzle 32 it
Between Z-direction on distance.There are three sensor 33 is for example set along the Y direction.
[management department]
As shown in Figure 1, 2, management department 4 is the pipe in a manner of making the spray volume to the substrate S anti-corrosion liquids sprayed become constant
The position for managing nozzle 32, is arranged position in board carrying portion 2, that -X direction side is in relative to coated portion 3.The management department
4 have preparation emitting mechanism 41, dipping tank 42, nozzle cleaning 43, accommodate their receiving portion 44 and keep the receiving
The holding member 45 in portion.Preparation emitting mechanism 41, dipping tank 42 and nozzle cleaning 43 are arranged in order towards -X direction side.
Preparation emitting mechanism 41 is the part that preparation sprays anti-corrosion liquid.The preparation emitting mechanism 41 is configured in coated portion 3
It is set near the position of nozzle 32 in the state of applying on processing region 27S.
Dipping tank 42 is to be stored with the liquid tank of dilution equal solvent in inside.
Nozzle cleaning 43 is the device that cleaning is nearby rinsed to the ejiction opening 320 of nozzle 32, is had along Y-direction
Mobile wiper mechanism (not shown) and the mobile mechanism (not shown) for making the wiper mechanism move.Mobile mechanism setting exists
Than the position that wiper mechanism leans on -X direction side.The size of the X-direction of nozzle cleaning 43 due to being equipped with mobile mechanism correspondingly
Size than the X-direction of prepared emitting mechanism 41 and dipping tank 42 is big.
It should be noted that the configuration about preparation emitting mechanism 41, dipping tank 42, nozzle cleaning 43, and it is unlimited
Can also be other configurations in the configuration of present embodiment.
The size of the Y-direction of receiving portion 44 is less than the distance between the pillar component 31a of above-mentioned gate frame 31, above-mentioned gate
Frame 31 can in X direction move in such a way that the +Z direction side in receiving portion 44 is across receiving portion 44.In addition, being received about being located at
Preparation emitting mechanism 41, dipping tank 42 in appearance portion 44 and nozzle cleaning 43, gate frame 31 can with across they
The mode of each section is close with them.
Holding member 45 is connect with mobile mechanism of management department 46.Mobile mechanism of management department 46 has guide rail component 47 and drives
Motivation structure 48.Guide rail component 47 is separately positioned in the slot 21e of frame side 21b and frame side 21c, respectively in X direction
Extend.The configuration of each guide rail component 47 is between a pair of guide rails component 35 that the gate frame 31 of coated portion 3 is connect.Each guide rail structure
The end set of the -X direction of part 47 is to the end of such as -X direction of frame side 21b and frame side 21c.Driving mechanism
48 connect with holding member 45, and make management department 4 along being moved in the X direction on guide rail component 47.It should be noted that scheming
In 1, indicate that management department 4 can move in X direction using double-head arrow.
The applying device 1A of present embodiment is formed as the above structure.
<Coating acts>
Fig. 6 is the vertical view for the action process for indicating applying device 1A.In the accompanying drawings, management department 4 (referring to Fig.1) is omitted
Diagram.In addition, gate frame 31 is represented by dashed line in profit, the structure of nozzle 32 and sensor 33 is made to be easy to distinguish.
It is parallel with carry direction (X-direction) with short side direction in the coating action of applying device 1A as shown below
Substrate S is moved in workbench 22 by mode, is applied anti-corrosion liquid while using 23 handling substrate S of carrying mechanism, is moved out painting later
It is covered with the substrate S of anti-corrosion liquid.It is alternately carried out such action using a pair of of carrying mechanism 23.
First, the carrying mechanism 23 of the side in a pair of of carrying mechanism 23 is (for example, be arranged on frame side 21b
Carrying mechanism 23) in, make carrying implement 23a configurations in the end of the -X direction side of guide rail 23c.Next, being protected using carrying implement 23a
It holds such as the substrate S by being moved in from outside handling arm (not shown).Specifically, make the suction sheet of board holder 23b
It is adsorbed on the back side of substrate S, keeps substrate S.It should be noted that on workbench 22, it is possible to have protected using substrate
Hold the mechanism before portion 23b keeps the substrate S that is moved to, substrate S lifted and kept along +Z direction by air or multiple pins.
Later, carrying implement 23a is made to be moved towards +X direction along guide rail 23c.Substrate S along with the movement of carrying implement 23a and
It is moved towards +X direction.
After the carry direction front end of substrate S reaches the position of ejiction opening 320 (with reference to Fig. 5) of nozzle 32, from nozzle 32
Ejiction opening 320 spray anti-corrosion liquid towards substrate S.By making the position of nozzle 32 fix and carrying base using carrying implement 23a
Thus plate S changes the relative position between ejiction opening 320 and the upper surface of substrate S, carries out the ejection of anti-corrosion liquid on one side on one side.
Fig. 7 is the definition graph of the situation in the nozzle 32 when indicating to spray anti-corrosion liquid.
First, as shown in Fig. 7 (a), (not shown) the stream of the piping 100 that is connect with nozzle 32 to nozzle 32 is pumped via using
Road 32a supplies anti-corrosion liquid L.The anti-corrosion liquid L supplied into flow path 32a is promptly filled to the one end of flow path 32a.
In addition, since anti-corrosion liquid L pressurizes by pump (not shown), towards having and partition 323 is (with reference to scheming
5) the first link road 32x of the identical opening width of thickness and the second link road 32y squeeze out anti-corrosion liquid L.In Fig. 7 (a),
The anti-corrosion liquid squeezed out towards the first link road 32x is indicated using reference numeral LB, is squeezed out towards the second link road 32y against corrosion
Liquid is indicated using reference numeral LA.
At this point, as shown in the cross section view of figure 5, nozzle 32 is formed as, the extreme lower position 321 of the inner wall of flow path 32a is less than the
The link position 32m of two link road 32y and flow path 32a.In the nozzle 32 of above-mentioned construction, for example, with the inner wall of flow path 32a
Compared with extreme lower position is the second link road 32y with the link position 32m of flow path 32a the case where, added when in non-flow path 32a
When pressure, anti-corrosion liquid L will not start to flow among the second link road 32y.Therefore, the anti-corrosion liquid L being supplied in flow path 32a will not
It flows into, but is first filled with to the one end of flow path 32a to the second link road 32y at once, and flow into after internal pressure increases the
Two link road 32y.Therefore, in the one end and another side of the long side direction of ejiction opening 320, the spray volume of anti-corrosion liquid L is difficult to
It is poor to generate, and can not generate and unevenly apply anti-corrosion liquid.
In addition, in nozzle 32, as shown in the cross section view of figure 5, the extreme higher position of the inner wall of flow path 32a becomes the first connection
The link position 32n of road 32x and flow path 32a.According to such construction, there is no for the gas contained by anti-corrosion liquid L in flow path 32a
The part being detained is steeped, bubble is floated by the link position 32n of buoyancy towards the first link road 32x and flow path 32a.Therefore, hold
Easily by the bubble contained by anti-corrosion liquid L towards except gas circuit 32b discharges.
In addition, as described above, in nozzle 32, the extreme lower position 321 of the inner wall of flow path 32a is formed as less than the second connection
The link position 32m of road 32y and flow path 32a, the pressure for being filled into the anti-corrosion liquid L in flow path 32a are easy to increase.Pressure after raising
Power properly squeezes out anti-corrosion liquid L towards the first link road 32x, as shown in Fig. 7 (a), promotes bubble together with anti-corrosion liquid LB
Discharge.
Next, as shown in Fig. 7 (b), in nozzle 32, flow path 32a is formed as with the separating distance except gas circuit 32b, with
The separating distance of the one end (325 side of the second side plate) of nozzle body 32A on long side direction is compared, another side (the
324 side of side plate) the separating distance it is larger.Therefore, it is flowed into first within the scope of the whole face of the long side direction of nozzle 32
The anti-corrosion liquid LB of in the anti-corrosion liquid LB of link road 32x, close one end is first reached than the anti-corrosion liquid LB of close another side to be removed
Gas circuit 32b starts to flow in except gas circuit 32b from the one end except gas circuit 32b towards another side.That is, except in gas circuit 32b
Anti-corrosion liquid LB in except gas circuit 32b using flow path 32a with the shortest position of separating distance except gas circuit 32b as starting point, towards this point
Separation is flowed from increased direction.
Next, as shown in Fig. 7 (c), due in nozzle 32, flow path 32a and the separating distance except gas circuit 32b with from
One end tends to another side and is incremented by, and therefore, the anti-corrosion liquid LB of the first link road 32x of inflow is from one end towards another side
It gently reaches and removes gas circuit 32b.At this point, in except gas circuit 32b, anti-corrosion liquid LB is formed with from one end towards another side
Flowing therefore periodically reach except the anti-corrosion liquid LB of gas circuit 32b is also formed at except the anti-corrosion liquid LB's in gas circuit 32b
Flowing washes away.
Anti-corrosion liquid LB flows in except gas circuit 32b by this method, and is discharged to outside via piping 110.
On the other hand, the anti-corrosion liquid L supplied into flow path 32a in the pump flow path 32a of anti-corrosion liquid L pressurizes, and utilizes
The pressurization squeezes out anti-corrosion liquid L to the second link road 32y.The anti-corrosion liquid LA of the second link road 32y is expressed into from ejiction opening 320
It sprays.As described above, being contained in the bubble of anti-corrosion liquid L and being expressed into the anti-corrosion liquid LB of the first link road 32x together via degasification
Road 32b is discharged to outside, therefore, the anti-corrosion liquid LA for properly eliminating bubble is sprayed from ejiction opening 320.
In nozzle 32, flow path 32a and except gas circuit 32b is respectively formed as linearly, therefore, anti-corrosion liquid as described above
L, the flowing of LA, LB do not occur to be detained smooth progress.
As shown in fig. 6, anti-corrosion liquid the moving and be coated on substrate S along with substrate S sprayed from nozzle 32.That is, base
Under ejiction openings 320 of the plate S by spraying resist, etchant resist R is thus formed in the defined region of substrate S.
Be formed with the substrate S of etchant resist R by carrying implement 23a towards the +X direction side of guide rail 23c end (workbench 22
The end of +X direction side) it carries.Next, substrate S is moved out towards the outside for example, by handling arm (not shown) etc..It needs to illustrate
It is, on workbench 22, it is possible to have will be taken off from board holder 23b using air or multiple pins before moving out substrate S
From the substrate S mechanisms lifting and keep along +Z direction.
After substrate S is delivered to handling arm, carrying implement 23a returns again to the end of the -X direction side of guide rail 23c,
And it waits until and carries next substrate S.
In the case where carrying out the carrying of next substrate S, for example, removing using another party in a pair of of carrying mechanism 23
Mechanism 23 (for example, carrying mechanism 23 on frame side 21c) is transported to keep simultaneously handling substrate S.It is removed in next substrate S
During before shipping, the preparation that the ejection state for keeping nozzle 32 is carried out at coated portion 3 sprays.As shown in figure 8, sharp
Gate frame 31 is set to be moved to towards -X direction the position of management department 4 with guide rail component 35.
After so that gate frame 31 is moved to the position of management department 4, the position of gate frame 31 is adjusted, nozzle 32 is made
Front end is close to nozzle cleaning 43, using the nozzle cleaning 43 come washer jet front end 32c.
After the cleaning for carrying out spray nozzle front end 32c, make the nozzle 32 close to preparation emitting mechanism 41.In preparation emitting mechanism
In 41, the ejiction opening 320 of the front end of nozzle 32 is set to move while measuring the distance between ejiction opening 320 and preparation discharging surface
320 preparation of ejiction opening spray is followed in defined position on to Z-direction while so that nozzle 32 is moved towards -X direction or +X direction
Go out anti-corrosion liquid.
After carrying out prepared spray action, gate frame 31 returns to original position.It is arranged in frame side utilizing
After carrying mechanism 23 on 21c carries next substrate S, nozzle 32 is made to be moved to the defined position in Z-direction.In this way, logical
It crosses and the coating action for applying etchant resist R on substrate S and preparation spray action is repeated, thus formed on substrate S high-quality
Etchant resist R.
It should be noted that can also be as needed, such as to management department 4 (referring to Fig.1) close to the every of stipulated number
In primary, make the nozzle 32 close in dipping tank 42 (referring to Fig.1).In dipping tank 42, by the ejiction opening 320 for making nozzle 32
It is exposed in the steam ambient for the solvent (dilution) stored in dipping tank 42, to prevent the drying of nozzle 32.
In the applying device 1A of present embodiment, coating action is carried out as described above.
According to the nozzle 32 of above structure, can be formed contained by the anti-corrosion liquid that can be removed effectively and be flowed in flow path 32a
The nozzle of some bubbles.
In addition, according to the applying device 1A of above structure, it can be formed with nozzle 32 as described above and can be inhibited
The generation of striped and formed high-quality etchant resist R applying device.
(variation)
In addition, in the present embodiment, as the applying device with nozzle 32, using following applying device 1A,
The position of nozzle 32 is set to fix and using carrying implement 23a come handling substrate S, to which one side changes the upper of ejiction opening 320 and substrate S
Relative position between surface carries out the coating of anti-corrosion liquid on one side, but the structure for capableing of the applying device of applicating nozzle 32 is unlimited
In this.
For example, it is also possible to be applied to the nozzle 32 of present embodiment by making the position of substrate S fix and carrying nozzle
32 change the applying device of the relative position between ejiction opening 320 and the upper surface of substrate S.
Fig. 9,10 are the definition graphs for the applying device 1B for indicating modified embodiment of the present embodiment.Fig. 9 is applying device 1B
Vertical view, Figure 10 are the side views of applying device 1B.Applying device 1B is using board carrying portion 5 and coated portion 6 as main structure
At element.
In Fig. 9,10, the direction in attached drawing is illustrated using the XYZ coordinate system different from Fig. 1~8.Board carrying will be utilized
The carry direction for the substrate S that portion 5 is set is recorded as X-direction.Direction orthogonal with X-direction when overlooking is recorded as Y-direction.It will be with
The vertical direction of plane including X-direction axis and Y-direction axis is recorded as Z-direction.It should be noted that X-direction, the side Y
To and Z-direction be set as, direction identical with the arrow direction in figure is+direction, and the direction opposite with arrow direction is-side
To.
As shown in Figures 9 and 10, board carrying portion 5 has multiple rollers 51 and handling stage 52.
Multiple rollers 51 are configured to two row in X direction.Be configured at each row roller 51 distinguish the+Y side end edges of supporting substrates S with
And-Y side end edges.In the state of being supported with substrate S, each roller 51 is made to be rotated around Y-axis up time meter or counterclockwise, to quilt
The substrate S that each roller 51 supports along the X direction carry by (+X direction or -X direction).
Handling stage 52 is arranged in the midway of the roller row formed by multiple rollers 51.At handling stage 52, mounting at
For the coating of the substrate S and progress anti-corrosion liquid of the object of coating processing.The face of the sides+Z of handling stage 52 becomes mounting substrate S
Substrate-placing face.The substrate-placing face is formed as parallel with X/Y plane.The formation such as using stainless steel of handling stage 52.
The movable member 61 and scaffold 69 that coated portion 6 has fixing piece 60, keeps nozzle 32.Movable member 61 being capable of edge
The movement of fixing piece 60.
Fixing piece 60 is be overlapped in the plane with handling stage 52, by along Y-direction across handling stage 52 in a manner of along Y
Direction extends, and the both ends of the fixing piece 60 are supported by a pair of of scaffold 69.The configuration of a pair of of scaffold 69 is clamped when looking down
The position of handling stage 52 supports the both ends of fixing piece 60.When such fixing piece 60 is moved as movable member 61
Guide rail and function.
Movable member 61 can along fixing piece 60 extending direction (Y-direction) in the Y direction a pair of of scaffold 69 it
Between move.Therefore, be held in the nozzle 32 of movable member 61 by the Y direction across handling stage 52 in a manner of move.
Movable member 61 has nozzle supporting member 611 and lifting unit 612.Nozzle supporting member 611 is formed as from the sides+Z
Fixing piece 60 is covered to side, there is the guarantor for keeping nozzle 32 in the downside (being -Z direction side relative to fixing piece 60) of fixing piece 60
Hold portion 611a.Nozzle 32 is for example installed on fixture 329, and maintaining part 611a is held in via fixture 329.
In addition, nozzle supporting member 611 is moved by lifting unit 612 along Z-direction.Thereby, it is possible to change spray in z-direction
The position of the ejiction opening of mouth 32.
Nozzle supporting member 611 is set not scheme to what Y-direction and Z-direction moved it should be noted that movable member 61 has
The driving source shown.
Maintenance department 7 is the part for the maintenance for carrying out nozzle 32.Maintenance department 7 has nozzle waiting portion 71 and nozzle management department
72。
Nozzle waiting portion 71 has：Dipping portion (not shown) is impregnated for spray nozzle front end, so as not to make the ejection of nozzle 32
(spray nozzle front end) is dry near mouthful；And discharge unit (not shown), the case where replacing nozzle 32 or replace to nozzle 32
In the case of the liquid body of supply, the liquid body kept in nozzle 32 is discharged.
Nozzle management department 72 is by washer jet front end and its nearby or from the ejiction opening of nozzle 32 to carry out prepared spray
The part for going out and the state of nozzle being adjusted.Nozzle management department 72 has the wiping wiped to the ejiction opening of nozzle 32
The portion 72a and guiding rail 72b for guiding cleaning part 72a in X direction.Cleaning part 72a is in the state contacted with spray nozzle front end
Under, it is moved in X direction using driving source (not shown) etc., to wipe spray nozzle front end.
In addition, being equipped with waste liquid receiving portion 72c in nozzle management department 72,72c receivings in the waste liquid receiving portion are discharged from nozzle 32
Liquid body or nozzle 32 cleaning used in cleaning solution etc..
In the applying device 1B of above structure, the substrate S that handling stage 52 is transported to using board carrying portion 5 is fixed
In handling stage 52, the movable member 61 of coated portion 6 is made to be moved along Y-direction.At handling stage 52, changed by one side
The ejiction opening of nozzle 32 and the relative position of the upper surface of substrate S spray anti-corrosion liquid from nozzle 32 on one side, are thus applied on substrate S
Anti-corrosion liquid is applied, etchant resist is formed in the defined region of substrate S.
According to the applying device 1B of above structure, it can also be formed and inhibit striped due to nozzle 32 as described above
Generation is to form the applying device of the etchant resist of high-quality.
More than, the preferred embodiment of the present invention example is illustrated with reference to attached drawing, but the present invention is not limited to upper
State example.The respective shape of each component parts, combination for showing in above-mentioned example etc. are only an examples, can not depart from the present invention
Purport in the range of made various changes according to design requirement etc..
Claims (7)
1. a kind of nozzle, wherein
The nozzle has：
The nozzle body of strip；
Flow path is formed in the inside of the nozzle body along the long side direction of the nozzle body, is circulated for coating liquid；
Ejiction opening is formed in the lower section of the flow path in the nozzle body along the long side direction, the ejiction opening with
The flow path connection, sprays the coating liquid；And
Except gas circuit, the top of the flow path is formed in along the long side direction in the inside of the nozzle body, the degasification
Road is continuous on the long side direction, and is connect with the flow path,
For the flow path and the separating distance except between gas circuit, one with the nozzle body on the long side direction
The separating distance of end side is compared, and the separating distance of the another side of the nozzle body on the long side direction is more
Greatly.
2. nozzle according to claim 1, wherein
The nozzle in the inside of the nozzle body also there is the first link road, first link road to be removed with described in the flow path
It is formed along the long side direction between gas circuit, by the flow path with described except gas circuit connects,
The flow path is formed as, and the extreme higher position of the inner wall of the flow path is the connection position of first link road and the flow path
It sets.
3. nozzle according to claim 1 or 2, wherein
The nozzle also has the second link road in the inside of the nozzle body, and second link road is in the flow path and the spray
It is formed along the long side direction between outlet, the flow path and the ejiction opening is connected,
The flow path is formed as, and the extreme lower position of the inner wall of the flow path is less than the connection of second link road and the flow path
Position.
4. nozzle according to claim 1 or 2, wherein
The separating distance is gradually incremented by with the another side is tended to from the one end.
5. nozzle according to claim 1 or 2, wherein
The flow path is formed as linear.
6. nozzle according to claim 1 or 2, wherein
It is described except gas circuit is formed as linear.
7. a kind of applying device, has：
Board carrying portion, handling substrate；And
Coated portion, with nozzle according to any one of claims 1 to 6, by coating liquid from the nozzle to being handled upside down
The coating of substrates.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-034359 | 2014-02-25 | ||
| JP2014034359A JP6196916B2 (en) | 2014-02-25 | 2014-02-25 | Nozzle and application equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104858104A CN104858104A (en) | 2015-08-26 |
| CN104858104B true CN104858104B (en) | 2018-10-02 |
Family
ID=53904524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510025706.8A Active CN104858104B (en) | 2014-02-25 | 2015-01-19 | Nozzle and applying device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6196916B2 (en) |
| CN (1) | CN104858104B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6564648B2 (en) * | 2015-08-20 | 2019-08-21 | 東京応化工業株式会社 | Nozzle and application equipment |
| JP2017136512A (en) * | 2016-02-01 | 2017-08-10 | パナソニックＩｐマネジメント株式会社 | Liquid discharge device |
| CN106681105A (en) * | 2017-02-09 | 2017-05-17 | 深圳市华星光电技术有限公司 | Photoresist coating device detection mechanism and photoresist coating machine |
| KR102368359B1 (en) | 2019-05-14 | 2022-02-25 | 주식회사 엘지에너지솔루션 | Slot die coating device having air vent |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1618527A (en) * | 2003-11-18 | 2005-05-25 | 大日本网目版制造株式会社 | Base plate treater, slit jet nozzle and mechanism for determining liquid filling degree and gas mixing degree in filled body |
| JP2005349280A (en) * | 2004-06-09 | 2005-12-22 | Tokyo Ohka Kogyo Co Ltd | Slit nozzle |
| CN101199961A (en) * | 2006-12-12 | 2008-06-18 | 东京应化工业株式会社 | Slit nozzle |
| JP2011147863A (en) * | 2010-01-20 | 2011-08-04 | Dic Corp | Coating die and coating method |
| CN102806177A (en) * | 2011-06-02 | 2012-12-05 | 东京应化工业株式会社 | Substrate treating apparatus and method of treating substrate |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7083826B2 (en) * | 2003-05-16 | 2006-08-01 | 3M Innovative Properties Company | Coating die and method for use |
| JP4315786B2 (en) * | 2003-11-18 | 2009-08-19 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and method of filling processing liquid into slit nozzle |
| JP5494788B2 (en) * | 2012-12-06 | 2014-05-21 | 大日本印刷株式会社 | Die head and die coater provided with the same |
-
2014
- 2014-02-25 JP JP2014034359A patent/JP6196916B2/en not_active Expired - Fee Related
-
2015
- 2015-01-19 CN CN201510025706.8A patent/CN104858104B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1618527A (en) * | 2003-11-18 | 2005-05-25 | 大日本网目版制造株式会社 | Base plate treater, slit jet nozzle and mechanism for determining liquid filling degree and gas mixing degree in filled body |
| JP2005349280A (en) * | 2004-06-09 | 2005-12-22 | Tokyo Ohka Kogyo Co Ltd | Slit nozzle |
| CN101199961A (en) * | 2006-12-12 | 2008-06-18 | 东京应化工业株式会社 | Slit nozzle |
| JP2011147863A (en) * | 2010-01-20 | 2011-08-04 | Dic Corp | Coating die and coating method |
| CN102806177A (en) * | 2011-06-02 | 2012-12-05 | 东京应化工业株式会社 | Substrate treating apparatus and method of treating substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6196916B2 (en) | 2017-09-13 |
| CN104858104A (en) | 2015-08-26 |
| JP2015157270A (en) | 2015-09-03 |
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