CN104854020A - 使用共聚物封端剂制备银纳米线的方法 - Google Patents
使用共聚物封端剂制备银纳米线的方法 Download PDFInfo
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- CN104854020A CN104854020A CN201380065547.3A CN201380065547A CN104854020A CN 104854020 A CN104854020 A CN 104854020A CN 201380065547 A CN201380065547 A CN 201380065547A CN 104854020 A CN104854020 A CN 104854020A
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- Prior art keywords
- vinyl
- salt
- imidazole
- vinyl pyrrolidone
- chemical formula
- Prior art date
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 97
- 229920001577 copolymer Polymers 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000002042 Silver nanowire Substances 0.000 title abstract description 21
- 239000003795 chemical substances by application Substances 0.000 title abstract description 7
- 238000004519 manufacturing process Methods 0.000 title abstract description 7
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 21
- 238000003786 synthesis reaction Methods 0.000 claims abstract description 21
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000004917 polyol method Methods 0.000 claims abstract description 5
- 239000002904 solvent Substances 0.000 claims description 34
- 239000003153 chemical reaction reagent Substances 0.000 claims description 33
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical group C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 claims description 29
- 239000000126 substance Substances 0.000 claims description 20
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 20
- 229920002554 vinyl polymer Polymers 0.000 claims description 20
- 239000002608 ionic liquid Substances 0.000 claims description 19
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 claims description 15
- 150000001450 anions Chemical class 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 12
- MLMGJTAJUDSUKA-UHFFFAOYSA-N 2-ethenyl-1h-imidazole Chemical group C=CC1=NC=CN1 MLMGJTAJUDSUKA-UHFFFAOYSA-N 0.000 claims description 9
- 150000002460 imidazoles Chemical class 0.000 claims description 8
- 101710134784 Agnoprotein Proteins 0.000 claims description 6
- -1 chloride (Cl -) halogen anion Chemical class 0.000 claims description 6
- 239000011259 mixed solution Substances 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 239000000460 chlorine Substances 0.000 claims description 4
- JZMJDSHXVKJFKW-UHFFFAOYSA-M methyl sulfate(1-) Chemical compound COS([O-])(=O)=O JZMJDSHXVKJFKW-UHFFFAOYSA-M 0.000 claims description 4
- 239000000178 monomer Substances 0.000 claims description 4
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims description 3
- 239000005864 Sulphur Substances 0.000 claims description 3
- 150000001449 anionic compounds Chemical class 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 238000007334 copolymerization reaction Methods 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 229910001412 inorganic anion Inorganic materials 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 150000002891 organic anions Chemical class 0.000 claims description 3
- FQTUOJOWQBMFTM-UHFFFAOYSA-N 1-butyl-3-ethenyl-2h-imidazole Chemical class CCCCN1CN(C=C)C=C1 FQTUOJOWQBMFTM-UHFFFAOYSA-N 0.000 claims description 2
- KBTXHQBLNPPLNX-UHFFFAOYSA-N 1-ethenyl-3-hexylimidazol-3-ium Chemical class CCCCCC[N+]=1C=CN(C=C)C=1 KBTXHQBLNPPLNX-UHFFFAOYSA-N 0.000 claims description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052794 bromium Inorganic materials 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 125000005842 heteroatom Chemical group 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 229910052740 iodine Inorganic materials 0.000 claims description 2
- 239000011630 iodine Substances 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 abstract description 12
- 239000004332 silver Substances 0.000 abstract description 12
- 239000002245 particle Substances 0.000 abstract description 4
- 238000002156 mixing Methods 0.000 abstract description 2
- 239000002243 precursor Substances 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 35
- 210000002469 basement membrane Anatomy 0.000 description 13
- 239000002070 nanowire Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 10
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 239000000243 solution Substances 0.000 description 8
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 7
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 7
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 125000002883 imidazolyl group Chemical group 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- XUHHZNLAPUWRHH-UHFFFAOYSA-N 3-butyl-1-methyl-1,2-dihydroimidazol-1-ium;methanesulfonate Chemical compound CS(O)(=O)=O.CCCCN1CN(C)C=C1 XUHHZNLAPUWRHH-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical class CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- QWMVKSPSWWCSEK-UHFFFAOYSA-N ethene;pyrrolidin-2-one Chemical class C=C.O=C1CCCN1 QWMVKSPSWWCSEK-UHFFFAOYSA-N 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
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- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- 239000003021 water soluble solvent Substances 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
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- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 210000004379 membrane Anatomy 0.000 description 2
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- 229940098779 methanesulfonic acid Drugs 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N methanesulfonic acid Substances CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical class CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- VFWCMGCRMGJXDK-UHFFFAOYSA-N 1-chlorobutane Chemical compound CCCCCl VFWCMGCRMGJXDK-UHFFFAOYSA-N 0.000 description 1
- IBZJNLWLRUHZIX-UHFFFAOYSA-N 1-ethyl-3-methyl-2h-imidazole Chemical compound CCN1CN(C)C=C1 IBZJNLWLRUHZIX-UHFFFAOYSA-N 0.000 description 1
- BMQZYMYBQZGEEY-UHFFFAOYSA-M 1-ethyl-3-methylimidazolium chloride Chemical compound [Cl-].CCN1C=C[N+](C)=C1 BMQZYMYBQZGEEY-UHFFFAOYSA-M 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- 125000001340 2-chloroethyl group Chemical class [H]C([H])(Cl)C([H])([H])* 0.000 description 1
- XDKUKGIJDNUFGK-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CN=C[N]1 XDKUKGIJDNUFGK-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
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- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
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- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
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- 125000002791 glucosyl group Chemical class C1([C@H](O)[C@@H](O)[C@H](O)[C@H](O1)CO)* 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 210000004276 hyalin Anatomy 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
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- LYGJENNIWJXYER-UHFFFAOYSA-N nitromethane Chemical compound C[N+]([O-])=O LYGJENNIWJXYER-UHFFFAOYSA-N 0.000 description 1
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- 238000009832 plasma treatment Methods 0.000 description 1
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- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
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- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical class CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 1
- CIBMHJPPKCXONB-UHFFFAOYSA-N propane-2,2-diol Chemical compound CC(C)(O)O CIBMHJPPKCXONB-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/0547—Nanofibres or nanotubes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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Abstract
本发明涉及用于制备直径小于100nm且长度为5μm或更长的银纳米线的新型封端剂,更具体地,涉及一种制备银纳米线的方法以及由此制备的银纳米线,其中,当所述银纳米线是通过将银盐前驱体、还原性溶剂(还原剂)和封端剂混合并加热(多元醇法)合成时,通过使用乙烯基吡咯烷酮-乙烯基咪唑共聚物(PIC)作为新型封端剂替代现有的封端剂,使银纳米线具有大的纵横比。使用该方法能轻易合成直径小于100nm且长度为5μm或更长的银纳米线,在合成期间几乎没有颗粒状银离子形成。
Description
技术领域
本发明涉及一种使用新型封端剂(capping agent)制备银纳米线的方法,具体地,涉及一种均匀制备直径小于100nm且长度至少为5μm的银纳米线的方法,其中,当银纳米线是用银盐前驱体、还原性溶剂(a reducing solvent)和封端剂合成时,新采用乙烯基吡咯烷酮-乙烯基咪唑共聚物(vinylpyrrolidone-co-vinylimidazole copolymer)(PIC)作为所述封端剂。
背景技术
所谓的触摸屏用于各种电子设备,包括智能手机、平板电脑等。这种触摸屏包括透明电极膜,该透明电极膜具有数百欧姆/平方(Ω/□)或更低的表面电阻率和相对于基膜的透光率为90%或更高的透光率。
为此,目前可用的透明电极材料为铟锡氧化物(ITO)。使用喷射工艺(sputtering process)使透明电极膜在玻璃或透明聚合物膜的表面上形成,以使其具有几十到几百Ω/□的表面电阻率和相对于基膜的透光率为90%或更高的透光率。
然而,ITO透明薄膜由于真空处理而具有很高的制造成本,并且不耐外部冲击,例如热冲击。因此,已进行了许多尝试来取代ITO膜。
能够取代ITO透明电极材料的材料包括碳纳米管、石墨烯、导电聚合物和金属纳米线。其中,当制造成直径小于100nm且长度大约几十μm的金属纳米线以薄膜的形式设置在透明基膜的表面时,已知金属纳米线具有适用于透明电极的表面电阻率和透光率。尤其是当要求表面电阻率如几十Ω/□低时,具有几十Ω/□或更低表面电阻率和相对于基膜的透光率为90%或更高的透光率的银纳米线作为新型材料而受到关注,因为常规的ITO膜的透光率低。
银纳米线是金属纳米线中最有用的。已知银纳米线由使用所谓的多元醇法制造(参考:US 2005/0056118,Science 298,2176,2002,Chem.Mater.14,4736,2002)。
通过将银盐前驱体(金属前驱体)、例如乙二醇(EG)的还原性溶剂和封端剂混合,多元醇法能形成具有纳米数量级直径的银纳米线。
为了由金属盐前驱体(包括银盐)合成纳米线形式的纳米结构,封端剂的使用是必要的。该封端剂的典型例子包括聚环氧乙烷、葡萄糖类化合物、聚乙烯吡咯烷酮(PVP)和咪唑鎓盐离子液体(imidazolium ionic liquid)(IL)。最有用的封端剂可以包括聚乙烯吡咯烷酮和咪唑鎓盐类离子液体。当使用聚乙烯吡咯烷酮作为封端剂时,可以制造长且直径相对小的银纳米线,但是颗粒状银粒子可能会与纳米线一起形成,因此必须进行额外的步骤来分离颗粒状银以只获得纳米线,这是不可取的。另一方面,当使用咪唑鎓盐类离子液体作为封端剂时,可以控制该离子液体中的阴离子成分以合成不同形态的纳米结构,例如立方体、正八面体、纳米线等。(参考:Angewandte Chemie,121,3864,2009)。尤其是当使用离子液体作为封端剂制备银纳米线时,可以单独制造几乎没有颗粒状银的银纳米线,因此可以避免分离颗粒状银的额外步骤;然而,所得纳米线的直径稍大。
对于使用银合成金属纳米线,需要有能够克服现有的封端剂(例如聚乙烯吡咯烷酮和咪唑鎓盐类离子液体)缺点的新型封端剂,并且需要使用这种新型封端剂制备直径小于100nm且长度至少为5μm的银纳米线的方法。
发明内容
技术问题
因此,本发明的目的在于提供一种通过使用利用银盐前驱体的多元醇还原反应可重复制备直径小于100nm且长度为5μm或更长(没有任何其他纳米结构)的均匀的银纳米线的方法。
本发明的目的不局限于上述目的,且本领域技术人员能够从以下描述清楚地了解到本文没有提到的其他目的。
技术方案
为了实现上述目的,关于通过将银盐前驱体、还原性溶剂和封端剂混合的银纳米线的合成,本发明的发明人评价了各种封端剂对所合成的银纳米线的直径和长度的影响。
基于研究结果,本发明的发明人发现,关于通过将银盐前驱体(例如AgNO3)和还原性溶剂(例如乙二醇)作为主要成分与封端剂混合合成银纳米线,当含有一种或多种功能团(functional groups)的共聚物被制备且被用作封端剂(取代仅仅由单一成分组成的常规共聚物的使用)时,表现出了单个功能团有益效果的组合。具体地,当使用既具有乙烯基吡咯烷酮功能团又具有乙烯基咪唑或乙烯基咪唑鎓盐功能团的共聚物作为封端剂时,可以合成几乎没有颗粒状银的直径小于100nm且长度至少为5μm(大多在20μm或更长)的银纳米线。
所述银盐前驱体是含有银离子和有机或无机阴离子的化合物,其例子可以包括AgNO3、AgClO4、AgBF4、AgPF6、CH3COOAg、AgCF3SO3、Ag2SO4和CH3COCH=COCH3Ag。该银盐在溶剂中解离然后被还原,并因此转化为银金属。
所述还原性溶剂是能够溶解银盐的极性溶剂,并且是指其分子中至少有两个羟基的溶剂,例如二醇、多元醇或乙二醇。其具体的例子可以包括乙二醇、1,2-丙二醇、1,3-丙二醇、丙三醇(glycerin)、甘油(glycerol)和乙二醇二乙醚。该还原性溶剂作用是溶解银盐并在预设或更高的温度下引起银离子的还原反应以生产银金属元素。
对于封端剂,将乙烯基咪唑类离子液体单体、乙烯基吡咯烷酮类单体和引发剂在溶剂中混合然后加热,得到乙烯基吡咯烷酮-乙烯基咪唑共聚物(PIC),其后用作银纳米线合成中的封端剂。
咪唑功能团通过单独的反应转化为咪唑鎓盐功能团,之后咪唑鎓盐中的阴离子成分被卤素类成分(例如氯化物)或烷基硫酸盐成分(例如硫酸甲酯)取代,从而合成任何类型的离子液体,其然后可以用作封端剂。
根据本发明的封端剂可以包括以下化学式1所示的乙烯基吡咯烷酮-乙烯基咪唑共聚物、以下化学式2所示的乙烯基吡咯烷酮-乙烯基咪唑鎓盐共聚物或它们的混合物。化学式2所示的乙烯基吡咯烷酮-乙烯基咪唑鎓盐共聚物的阴离子为有机或无机阴离子。为了合成银纳米线,该阴离子例如为氯化物(Cl-)或如硫酸甲酯(MeSO4 2-)的烷基硫酸盐。
[化学式1]
[化学式2]
在化学式1和2中,R1、R2和R3彼此相同或不同,各自表示氢或具有1-16个碳原子的烃基,且可以选择性地含有选自氧、硫、氮、磷、氟、氯、溴、碘和硅中至少一种的杂原子。在化学式2中,X-为咪唑鎓盐类离子液体的阴离子,例如包括Cl-或Br-的卤素阴离子或烷基硫酸盐成分。在化学式1和2中,x和y为整数。
化学式1表示乙烯基吡咯烷酮-咪唑共聚物,化学式2表示乙烯基吡咯烷酮-乙烯基咪唑鎓盐共聚物。乙烯基咪唑鎓盐的具体例子可以包括1-乙烯基-3-烷基咪唑鎓盐,其包括1-乙烯基-3-乙基咪唑鎓盐、1-乙烯基-3-丁基咪唑鎓盐或1-乙烯基-3-己基咪唑鎓盐。
为了合成纳米线,优选使用包括氯化物(Cl-)的卤素类阴离子成分或包括硫酸甲酯的烷基硫酸盐成分作为含有1-乙烯基-3-烷基咪唑鎓盐的化学式2所示的共聚物的阴离子。
由此制备乙烯基吡咯烷酮-乙烯基咪唑共聚物和制备乙烯基吡咯烷酮-乙烯基咪唑鎓盐共聚物的方法如下所示。
具体地,乙烯基吡咯烷酮和乙烯基咪唑以预定的比例在反应溶剂中混合,再加入适量的反应引发剂,然后在50-80℃下加热1-24小时以便共聚。
因此获得的乙烯基吡咯烷酮-乙烯基咪唑共聚物用非溶剂沉淀,然后用溶剂洗涤,得到共聚物。
在该反应中,乙烯基吡咯烷酮和乙烯基咪唑以12:1-32:1范围的摩尔比混合。如果乙烯基吡咯烷酮和乙烯基咪唑的摩尔比小于12:1,即如果乙烯基咪唑的量过高,合成的银纳米结构可能为颗粒状或其他形态,而非线形,使本发明的目的不可能实现。相反地,如果它们的摩尔比超过了32:1,即如果乙烯基吡咯烷酮的量过高,可以形成纳米线,但是它的直径可能会太粗。
用于制备本发明的共聚物的溶剂可以包括选自醇溶剂(例如甲醇、乙醇、丙醇、异丙醇、丁醇和异丁醇)、芳香烃溶剂(例如苯、乙苯、氯苯、甲苯和二甲苯)、脂肪烃溶剂(例如己烷、庚烷和环己烷)和卤代烃溶剂(例如三氯甲烷、四氯乙烯、四氯化碳、二氯甲烷和二氯乙烷)中的任意一种或两种或以上的混合物。
可以使用任何引发剂作为反应引发剂,只要它能够与乙烯基反应以使聚合发生。该反应引发剂典型地可以包括选自过氧化物、偶氮化合物和硫化合物中的任何一种或两种或以上的混合物。
以下是由以上所获得的乙烯基吡咯烷酮-乙烯基咪唑共聚物制备乙烯基吡咯烷酮-乙烯基咪唑鎓盐共聚物的描述。具体地,将制备的乙烯基吡咯烷酮-乙烯基咪唑共聚物溶解在溶剂中,加入三氯甲烷溶剂、氯丁烷和硫酸二乙酯,然后搅拌,使得共聚物中的咪唑功能团与阴离子连接从而转变为咪唑鎓盐功能团。
照此,为了用另一种阴离子代替乙烯基吡咯烷酮-乙烯基咪唑鎓盐共聚物中的阴离子成分,将乙烯基吡咯烷酮-乙烯基咪唑鎓盐共聚物溶解于溶剂中,加入具有所需阴离子成分的化合物,并搅拌,从而可以容易地通过所谓的离子交换反应拥有所需的阴离子。
所述乙烯基吡咯烷酮-乙烯基咪唑鎓盐共聚物中乙烯基咪唑鎓盐的量被视为影响银纳米线合成的重要因素。然而,该量可以根据乙烯基吡咯烷酮-乙烯基咪唑共聚物的制备决定,因此在此不额外提及。
乙烯基吡咯烷酮-乙烯基咪唑鎓盐共聚物可以通过制备乙烯基吡咯烷酮-乙烯基咪唑共聚物,随后将咪唑官能团转变为咪唑鎓盐官能团获得。或者,即使当乙烯基吡咯烷酮-乙烯基咪唑鎓盐共聚物是用先将乙烯基咪唑转变为乙烯基咪唑鎓盐这样的方法制备的,仍然可以得到相同的结果。同样地,乙烯基吡咯烷酮与乙烯基咪唑鎓盐的比例可以被设定在如上所述的12:1到32:1的范围内。
使用乙烯基吡咯烷酮-乙烯基咪唑共聚物或乙烯基吡咯烷酮-乙烯基咪唑鎓盐共聚物制备银纳米线的方法在以下详细说明。事实上可以使用常规的多元醇合成方法,所不同的是使用根据本发明的新型封端剂取代现有的封端剂。
本发明的银盐前驱体、还原性溶剂和封端剂可以以合适的比例混合,搅拌,在50-180℃下反应30分钟至7天,从而制备银纳米线。当反应温度低时,银纳米线生长所需的时间可能增加并且反应时间可能变长。相反地,当反应温度高时,银纳米线可以在相对较短的时间内形成。
为了均匀制备根据本发明的银纳米线,所混合的各成分的比例被认为是重要的,并且基于1mol的银盐,优选保持封端剂在1-2mol(4.171g)的范围内和咪唑鎓盐类离子液体在0.001-0.2mol的范围内。照此,如果封端剂的用量小于1mol且离子液体的用量小于0.001mol,纳米线可能形成得不均匀,并且不仅纳米线而且纳米颗粒可能被制备。相反地,如果封端剂的用量超过2mol且离子液体的用量超过0.2mol,纳米线的直径可能增长到100nm或者更长,或者可能获得三维形式的银粒子(例如颗粒状),使得难以制备均匀的银纳米线。尤其是落在0.005-0.02mol的范围内的离子液体在形成更均匀的银纳米线方面是有利的。
因而制备的银纳米线使用过滤装置过滤,然后用例如水或乙醇的溶剂洗涤。因此获得的银纳米线的滤液在溶剂中分散,从而制备银纳米线的分散液。用于分散银纳米线的溶剂优选包括水和水溶性溶剂。该水溶性溶剂的具体例子可以包括水、酒精溶剂(例如甲醇、乙醇、正丙醇、异丙醇、正丁醇、异丁醇、己醇、苄醇和双丙酮醇)、多元醇类溶剂(例如乙二醇、丙二醇和甘油)、醚类溶剂(例如1,4-二氧六环、四氢呋喃(THF)、乙二醇单甲醚、乙二醇单乙醚、乙二醇二甲醚、丙二醇单甲醚、丙二醇单乙醚和丙二醇二甲醚)、酰胺类溶剂(例如N,N-二甲基甲酰胺、N-甲基甲酰胺和N,N-二甲基乙酰胺(DMA))、腈类溶剂(例如乙腈)和醛类溶剂(例如乙醛),也可能包括N-甲基-2-吡咯烷酮、2-吡咯烷酮、N-乙烯基-2-吡咯烷酮、二甲基亚砜,丁内酯(n-butyrolactone)、硝基甲烷和乳酸乙酯,且这些溶剂可以单独或者以两种或以上组合使用。
银纳米线可以在溶剂中分散以使得其中的量为0.1-5重量%,从而制备银纳米线分散液。除银纳米线的成分,必要时可以添加所需要的添加剂,例如包括抗氧化剂、分散剂或增稠剂的稳定剂。用于制备银纳米线分散液的添加剂可以通过本领域技术人员常规实施的任何方法确定,且不受限于具体的方法。
如果银纳米线的量小于0.1重量%,该银纳米线的表面电阻率可能由于银纳米线的量不足而增加,或者湿的涂层厚度增加,不希望地使得涂布性能或外观变差。相反地,如果其量超过5重量%,很难以超高量薄施用所述银纳米线,或者超高量的银纳米线在涂布过程或成膜过程中不得不反复稀释。
通过使用本发明的方法制备的银纳米线经分散获得的银纳米线分散液施用于基膜上并干燥,从而使直径为100nm或更小且长度为5μm或更长的银纳米线以三维网络膜的形式设置在基膜的表面上。
所述基膜是典型有用的透明膜且不受限制,其例子可以包括聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、聚碳酸酯、聚甲基丙烯酸甲酯、聚丙烯酸酯、聚丙烯腈和聚苯乙烯。并且,为了提高基膜与银纳米线之间的粘附力,增强的粘附层可以施用于基膜的表面上。或者,基膜的表面可以进行电晕处理、等离子体处理或底漆处理,从而增强银纳米线与基膜之间的粘附力。
将银纳米线施用于基膜上的涂布工艺可以包括所有已知的方法,其典型的例子可以包括浸渍涂布、旋转涂布、棒涂法、凹版涂布、反向凹版涂布、平板印刷、喷墨印刷、喷雾涂布和夹缝挤出涂布,且对该涂布工艺没有特别地限定。
必要时可以使用涂布碳纳米管的常规方法的双涂层工艺。具体地,将银纳米线层形成于基膜的表面上,然后可以使用单独的溶液在银纳米线层上进一步形成保护层。任何材料都可以用于保护层,只要其与银纳米线的粘附力高,其构成了底层并且具有所需的性能。并且,该方法由本领域技术人员常规实施,且不受限于具体的方法。保护层的厚度也可以由使用本领域技术人员常规实施的任何方法确定。
有益效果
根据本发明,直径小于100nm且长度至少为5μm的银纳米线可以在溶液相中均匀合成。所述银纳米线在溶剂中分散然后施用于基膜的表面上,从而形成透明的导电膜,其能表现出至少几十欧姆/平方的表面电阻率和相对于基膜的透光率为90%或更高的透光率。
附图说明
图1至图8为说明根据对比例和本发明的实施例的银纳米线和/或银纳米离子的扫描电子显微图像。
具体实施方式
通过以下实施例可以使本发明得到更好地理解,这些实施例被阐述以说明但不应理解为限制本发明的范围。
[对比例1]使用聚乙烯吡咯烷酮合成银纳米线
在2L圆底烧瓶中,0.1mol(17g)AgNO3(Kojima制造,99.9%)和0.15mol(16.7g)PVP(Aldrich制造,平均分子量:55,000g/mol)在1L乙二醇(EG)中溶解,然后在室温下搅拌10分钟。当透明混合溶液的内部温度保持在150℃时进行反应大约30分钟,得到灰褐色溶液。将该溶液冷却至室温,用1μm尺寸孔的过滤器过滤,干燥,并使用扫描电子显微镜观察。如图1a和1b的图像所示,形成了直径大约为90-120nm且长度为5-20μm的银纳米线,但是该银纳米线的直径稍大,并且不均匀。而且,不仅有银纳米线,还观察到大约0.5-5μm尺寸的银纳米粒子。
[对比例2]使用1-丁基-3-甲基咪唑甲磺酸合成银纳米线
在2L圆底烧瓶中,0.063mol(10.58g)AgNO3(Kojima制造,99.9%)和0.094mol(23.53g)1-丁基-3-甲基咪唑甲磺酸(Aldrich制造)在1L乙二醇(EG)中溶解,然后在室温下搅拌10分钟。当透明混合溶液的内部温度保持在150℃时进行反应大约30分钟,得到灰褐色溶液。将该溶液冷却至室温,用1μm尺寸孔的过滤器过滤,干燥,并使用扫描电子显微镜观察。如图2a和2b的图像所示,形成了直径大约为200-300nm且长度大约为15μm的银纳米线。
[实施例1]使用乙烯基吡咯烷酮(16)-乙烯基咪唑(1)共聚物合成银纳米线
实施例1涉及乙烯基吡咯烷酮-乙烯基咪唑共聚物(包括比例为16:1的乙烯基吡咯烷酮和乙烯基咪唑)的制备,也涉及使用这样的共聚物合成银纳米线。
乙烯基吡咯烷酮-乙烯基咪唑共聚物的制备按如下进行。
向甲醇(40mL)中加入乙烯基吡咯烷酮(4.44g)和乙烯基咪唑(0.235g)[乙烯基吡咯烷酮:乙烯基咪唑=16:1,摩尔比],向该乙烯基吡咯烷酮和乙烯基咪唑的混合溶液中加入大约2%(0.1g)的偶氮二异丁腈(AIBN)作为引发剂,然后在室温下混合5分钟。所得到的混合物在氮气氛围中在75℃下反应7小时。其后,将混合物冷却至室温并且逐滴加入乙酸乙酯,以使得反应产物沉淀。将该沉淀的白色固体过滤然后在30℃的真空干燥箱中干燥两天。
接着,使用该乙烯基吡咯烷酮-乙烯基咪唑共聚物合成银纳米纤维按如下进行。
将4.254g的AgNO3、4.171g该乙烯基吡咯烷酮-乙烯基咪唑共聚物和0.131g氯化1-乙基-3-甲基咪唑(EMIM-Cl)在500mL乙二醇(PG)中溶解,然后在室温下搅拌10分钟。当该透明混合溶液的内部温度保持在90℃时,进行反应大约24小时,得到灰色溶液。将该溶液冷却至室温,用1μm尺寸孔的过滤器过滤,干燥,并使用扫描电子显微镜观察。
如图3的图像所示,均匀形成了直径为80-100nm且长度为20-30μm的银纳米线。与不使用离子液体的对比例1的结果不同,该实施例中只观察到了银纳米线而没有观察到银纳米颗粒。
[实施例2]使用乙烯基吡咯烷酮(20)-乙烯基咪唑(1)共聚物合成银纳米线
在实施例2中,按照与实施例1相同的方式制备乙烯基吡咯烷酮-乙烯基咪唑共聚物,所不同的是乙烯基吡咯烷酮和乙烯基咪唑的用量比为20:1。
如图4的图像所示,均匀形成了直径为55-65nm且直径为10-20μm的银纳米线。
[实施例3]使用乙烯基吡咯烷酮(32)-乙烯基咪唑(1)共聚物合成银纳米线
在实施例3中,按照与实施例1相同的方式制备乙烯基吡咯烷酮-乙烯基咪唑共聚物,所不同的是乙烯基吡咯烷酮和乙烯基咪唑的用量比为32:1。
如图5的图像所示,均匀形成了直径为50-60nm且长度为25-30μm的银纳米线。
[对比例3]制备乙烯基吡咯烷酮(8)-乙烯基咪唑(1)共聚物和使用该共聚物合成银纳米线
在对比例3中,按照与实施例1相同的方式制备乙烯基吡咯烷酮-乙烯基咪唑共聚物,所不同的是乙烯基吡咯烷酮和乙烯基咪唑的用量比为8:1。
如图6的图像所示,形成了直径为100-120nm且长度为5-7μm的银纳米线。观察到许多粒子与纳米线一起形成。
[实施例4]使用氯化乙烯基吡咯烷酮(32)-乙烯基咪唑(1)共聚物合成银纳米线
实施例4按照与实施例3相同的方式进行,所不同的是使用氯化乙烯基吡咯烷酮(32)-乙烯基咪唑(1)共聚物,其由实施例3制备的乙烯基吡咯烷酮(32)-乙烯基咪唑(1)共聚物与氯乙烷反应得到。
如图7所示,均匀形成了直径为50nm且长度为30μm的银纳米线。
[实施例5]使用乙烯基吡咯烷酮(32)-乙烯基咪唑(1)的甲磺酸共聚物合成银纳米线
实施例5按照与实施例3相同的方式进行,所不同的是使用氯化乙烯基吡咯烷酮(32)-乙烯基咪唑(1)的甲磺酸共聚物,其由实施例4所制得的乙烯基吡咯烷酮(32)-乙烯基咪唑(1)共聚物与1-丁基-3-甲基咪唑甲磺酸反应得到。
如图8所示,均匀形成了直径为50nm且长度为30μm的银纳米线。如同实施例1的结果,只观察到了银纳米线而没有观察到银纳米颗粒。
工业实用性
根据本发明,银纳米线可以用于各种电子设备(包括智能手机、平板电脑等)的所谓触摸屏的透明电极膜。
Claims (8)
1.一种制备银纳米线的方法,该方法包括使含有银盐前驱体、还原性溶剂和封端剂的混合溶液进行多元醇还原反应,其中,所述封端剂含有具有乙烯基吡咯烷酮功能团和乙烯基咪唑或乙烯基咪唑鎓盐功能团的共聚物。
2.根据权利要求1所述的方法,其中,所述乙烯基吡咯烷酮和乙烯基咪唑在摩尔比为12:1到32:1的范围内使用。
3.根据权利要求1或2所述的方法,其中,所述封端剂含有通过乙烯基咪唑类离子液体单体和乙烯基吡咯烷酮类单体共聚得到的乙烯基吡咯烷酮-乙烯基咪唑共聚物(PIC)。
4.根据权利要求1-3中任意一项所述的方法,其中,所述乙烯基吡咯烷酮-乙烯基咪唑共聚物(PIC)为以下化学式1所示的乙烯基吡咯烷酮-乙烯基咪唑共聚物、以下化学式2所示的乙烯基吡咯烷酮-乙烯基咪唑鎓盐共聚物或它们的混合物:
[化学式1]
[化学式2]
在化学式1和2中,R1、R2和R3彼此相同或不同,各自表示氢或具有1-16个碳原子的烃基,且选择性地含有选自氧、硫、氮、磷、氟、氯、溴、碘和硅中至少一种的杂原子;在化学式2中,X-为咪唑鎓盐类离子液体的阴离子,包括Cl-或Br-的卤素阴离子或烷基硫酸盐成分;且在化学式1和2中,x和y为整数。
5.根据权利要求4所述的方法,其中,化学式2表示乙烯基吡咯烷酮-乙烯基咪唑鎓盐共聚物,且该乙烯基咪唑鎓盐为包括1-乙烯基-3-乙基咪唑鎓盐、1-乙烯基-3-丁基咪唑鎓盐或1-乙烯基-3-己基咪唑鎓盐的1-乙烯基-3-烷基咪唑鎓盐。
6.根据权利要求5所述的方法,其中,使用包括氯化物(Cl-)的卤素类阴离子成分或包括硫酸甲酯的烷基硫酸盐成分作为含有1-乙烯基-3烷基咪唑鎓盐的化学式2所示共聚物的阴离子,以合成纳米线。
7.根据权利要求1-6中任意一项所述的方法,其中,所述混合溶液还含有离子液体,且基于1mol的所述银盐前驱体,使用1-2mol的封端剂和0.001-0.2mol的咪唑鎓盐类离子液体。
8.根据权利要求7所述的方法,其中,所述银盐前驱体为含有银离子和有机或无机阴离子的化合物,并且包括AgNO3、AgClO4、AgBF4、AgPF6、CH3COOAg、AgCF3SO3、Ag2SO4和CH3COCH=COCH3Ag。
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CN114277435A (zh) * | 2021-12-06 | 2022-04-05 | 浙江大学杭州国际科创中心 | 一种动态共价键功能化银纳米线及其制备方法和应用 |
CN114277435B (zh) * | 2021-12-06 | 2022-10-28 | 浙江大学杭州国际科创中心 | 一种动态共价键功能化银纳米线及其制备方法和应用 |
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JP2016507641A (ja) | 2016-03-10 |
WO2014092501A1 (ko) | 2014-06-19 |
US20150336173A1 (en) | 2015-11-26 |
KR20140080710A (ko) | 2014-07-01 |
KR101448361B1 (ko) | 2014-10-14 |
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