CN104853873A - 在使用金属网情况下预钎焊镀金属的基片上的金属面的方法;带有具有织网的表面结构的焊料层的镀金属的基片 - Google Patents

在使用金属网情况下预钎焊镀金属的基片上的金属面的方法;带有具有织网的表面结构的焊料层的镀金属的基片 Download PDF

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CN104853873A
CN104853873A CN201380066440.0A CN201380066440A CN104853873A CN 104853873 A CN104853873 A CN 104853873A CN 201380066440 A CN201380066440 A CN 201380066440A CN 104853873 A CN104853873 A CN 104853873A
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solder
substrate
metal covering
wire netting
soldering
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K.赫尔曼
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Ceramtec GmbH
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    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
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Abstract

本发明涉及一种用于预钎焊镀金属的基片（1a、1b）上的金属面的方法，其中，将焊料预成形坯（2a、2b）放置到所述基片（1a、1b）的金属面上或者相反，并且接下来将所述焊料预成形坯（2a、2b）熔化。为了获得焊料层的限定的均匀的高度并且不发生形成隆起的焊料并且甚至产生带有直到所述焊料层的边缘低于20μm的厚度波动的大约100μm的较厚的焊料层并且将在所述焊料层内的气孔形成降低到最小程度，提出以下方法，即在钎焊或者熔化时，平坦地将金属网（3a、3b）压到所述焊料预成形坯（2a、2b）上并且所述金属网（3a、3b）由一种焊料无法浸润的材料构成。

Description

在使用金属网情况下预钎焊镀金属的基片上的金属面的方法;带有具有织网的表面结构的焊料层的镀金属的基片
技术领域
本发明涉及一种用于预钎焊镀金属的基片上的金属面的方法，其中，将焊料预成形坯放置到基片的金属面上或者相反，并且接下来将焊料预成形坯进行熔化，由此利用焊料预成形坯的焊料来钎焊金属面并且该焊料形成焊料层。
背景技术
通常将电气部件安装到镀金属的基片（例如镀金属的陶瓷或者金属涂覆的合成材料或者例如等级FR4的合成材料电路板）的金属面上。带有金属面的基片是特别有利的，该带有金属面的基片已经进行预钎焊并且因此例如能够在连续式加热炉中同时地装配部件。
特别符合期望的预钎焊件是：该预钎焊件没有示出通常的弯月面形，从而放置的待钎焊的部件不能够晃动以及移动。在通常用镍基或者银基或者银/钯基的焊料、用筛网压制的焊料球或者用焊料箔冲压件对金属面进行预钎焊时，液态的焊料形成清晰的接触角。
直到目前为止尽管将焊料预成形坯在熔化时平坦地压成复杂的形状，但是这还是产生不令人满意的表面。
发明内容
本发明的任务为，如此改进根据权利要求1的前序部分所述的方法，使得获得焊料层的限定的均匀的高度并且不发生形成隆起的焊料。此外，甚至应该产生带有直到焊料层的边缘低于20μm的厚度波动的大约100μm的较厚的焊料层。在焊料层内的气孔形成也应该降低到最小程度。
根据发明，该任务通过权利要求1所述的特征得到解决。
因为在钎焊或者熔化时，平坦地将金属网压到焊料预成形坯上并且该金属网由焊料无法浸润的材料构成，获得焊料层的限定的均匀的高度并且不会发生形成隆起的焊料。此外，甚至产生带有直到焊料层的边缘低于20或者甚至低于15μm的厚度波动的大约100μm的较厚的焊料层。在焊料层内的气孔形成也应该降低到最小程度。由此能够在后来的工序中将电气的或者电子的器件（如芯片/晶体管等）放置到均匀厚的焊料层上。由器件向基片中的热量传导变得更均匀并且更能够估算。
在本说明书中，焊料预成形坯的概念也包括仅仅一个唯一的焊料预成形坯。金属网也称作金属的筛网并且例如在筛网压制时应用。
应该将金属网尽可能平坦地压盖（优选张紧地）到焊料预成形坯上，由此焊料层变得均匀地高的。
本发明的构思是，借助于扁平的优选张紧的金属网（其例如在筛网压制中应用的那样）平坦地挤压熔化的焊料，该金属网由一种合适的、焊料无法浸润的材料形成。
钎焊炉中的气体能够通过金属网中的孔逸出并且在焊料中或者在焊料层的表面上不会形成气泡。
该金属网由一种焊料无法浸润的材料构成，使得该金属网不与通常的锡基的软焊料混合。此外，金属网在中性的或者还原性的氛围中不会氧化。该金属网优选为优质钢网。
利用金属网的厚度或者高度能够限定地调节金属面上的焊料层的厚度或者高度。
优选地应用扁平的叶形的焊料冲压件作为焊料预成形坯，这些焊料冲压件能够容易地放置在金属面上并且焊料冲压件存在于每个期望的厚度。该能够应用的焊料优选为现代的无铅的软焊料（例如焊料SnCuxAgy族）。优选地，该焊料由SnAg3Cu0.5构成。
优选地，将焊料预成形坯的高度（厚度）以及金属网的金属丝之间的容积如此互相协调，使得熔化的焊料最大化地填满该容积，但是不会“溢出”并且没有挤压到侧边上超过该金属面的边缘。如果应用过高的焊料预成形坯，那么会发生“溢出”。如果应用过低的或者说过薄的焊料预成形坯，焊料没有完全填满金属网的金属丝之间的空间，使得没有限定后来的焊料层的高度。
在基片具有两侧的金属面时，在用于钎焊的本方法的优选的实施方式中，由以下的互相重叠布置的部分形成夹层结构：
a. 优选由陶瓷构成的扁平的底板，
b. 金属网，
c． 焊料预成形坯，
d． 带有两侧的金属面的基片，
e. 焊料预成形坯，
f． 金属网，
g． 优选由陶瓷构成的扁平的盖板；
将该夹层结构（必要时还要在加压的条件下）在炉子中加热直到焊料预成形坯熔化并且熔化的焊料钎焊金属面。而后将夹层结构从炉子中取出并且进行冷却。最后将金属网从基片中取下并且金属网能够进行再次应用。
在仅仅一侧上具有金属面的基片中，取消字母e和f，也就是说直接将盖板放置到没有金属面的基片的一侧。
金属网的网眼尺寸优选地处于300与450mesh之间，优选为325mesh或者400mesh。在这些网眼尺寸情况中产生最好的结果。例如VA325或者VA280的优质钢网是优选的（该数字描述每英寸的线数）。
在根据本发明的带有经过钎焊的金属面（尤其是用以上说明的方法生产的）的镀金属的基片中，金属面上的焊料层具有织网类型的表面结构。该焊料层具有均匀的高度并且不具有隆起。在金属面上的焊料层的厚度波动低于20μm。
因此，本发明还说明了一种方法，即如何能够实施预钎焊从而在此在基片上获得限定的均匀的厚度的扁平的焊料存储部。该方法不仅能够应用于基片的单侧的钎焊，还能够应用于基片的双侧的钎焊。
本发明的其他的特征由后续进行说明的附图中给出。
具体实施方式
图1示出了一种熔炼形状(schmelzform)或者一种夹层结构6，利用其将钎焊件或者焊料层5（见图3）施加在镀金属的基片1的金属面上。该熔炼形状或者该夹层结构由以下互相上下堆叠的部件构成。
图1和2中的夹层结构6的各个层或者说部件没有按比例进行描述。应当仅仅清楚说明了熔炼形状的分层或者结构。
由石墨、铝或者陶瓷构成的扁平的底板4a位于最下方。陶瓷是优选的。由一种焊料无法浸润的材料构成的金属网3a处于所述底板4a上方。在此该金属网3a是钢网，也就是说金属网3a由逐条钢丝构成。该金属网3a的网眼尺寸为325mesh或者400mesh。金属网3a优选是张紧的。例如该金属网能够张紧地固定在底板4a上。然而，也能够将该金属网简单地放置到底板4a上，因为夹层结构6在钎焊时通过板4a、4b压住或者额外地还要进行夹紧。
在金属网3a上布置了一个焊料预成形坯2a或者多个焊料预成形坯。各个焊料预成形坯2必须布置在基片1的待钎焊的金属面的位置处。
在附图中，镀金属的基片连同其金属面用附图标记1a、1b表示。熔炼形状或者夹层结构在图1中具有在两个侧面上带有金属面的基片1a。
为了对基片1a的另一侧面进行钎焊，在该基片上面布置了一个焊料预成形坯2b或者多个焊料预成形坯。在该焊料预成形坯2b上放置了另一金属网3b。在夹层结构6的最上方布置了扁平的盖板4b。
图2示出了用于对基片的仅仅一侧进行钎焊的熔炼形状或者夹层结构。
由陶瓷构成的扁平的底板4a位于最下方。由一种焊料无法浸润的材料构成的金属网3a(此处为钢网)处于其上方。该金属网3a的网眼尺寸为325mesh或者400mesh。该金属网3a张紧地固定在底板4a上（在该图中不能识别出）。然而，该金属网也能够简单地放置到底板4a上，因为夹层结构6在钎焊时通过该板压住或者额外地还要进行夹紧。
在金属网3a上布置了一个焊料预成形坯2a或者多个焊料预成形坯。各个焊料预成形坯2必须布置在基片1的待钎焊的金属面的位置处。
用附图标记1b表示待钎焊的基片。图1中的熔炼形状或者夹层结构6具有仅仅在一个侧面上带有金属面的基片1b。用盖板4b（此处由陶瓷构成）盖住该夹层结构。
此外，在所有的实施例中，该基片用W玻璃加NiP(可能也还要加上Au)进行预镀金属。
该夹层结构例如在履带炉(Gliederbandofen)或者在间歇式炉(Batchofen)或者其他的加热设备（IR炉或诸如此类的）中进行处理，用以进行钎焊。
炉内气氛必须与材料相匹配，该炉内气氛优选地由氮气或者由氮气和氢气的混合气体构成。炉子中的最高温度与焊料进行匹配并且优选地处于300-600℃的范围内，焊料的熔化时间必须保持尽可能短，该熔化时间低于5分钟。
镀金属的基片例如是镀金属的陶瓷或者金属涂覆的合成材料或者合成材料电路板。
原则上，在钎焊时，优选由陶瓷形成的扁平的（例如磨光的）板4a、4b在一侧平坦地铺设或者绷紧有由优质钢构成的金属网。在确定的位置处将焊料预成形坯、也就是说扁平的叶形的焊料冲压件放置到扁平的金属网上。这能够借助机器人完成。然后，将待钎焊的基片连同其底层镀金属，例如W-Ni或者Cu-Ni或者类似物安放到焊料预成形坯上。
如果该基片在两侧镀金属，现在也能够将焊料预成形坯放置到待钎焊的上侧的表面上。然后，也将金属网放置到覆盖的上侧上并且扁平的陶瓷板作为盖板4b。
该“夹层结构”还能够通过用于改善接触的其他的重量额外地进行压住。将夹层结构接下来运送经过炉子并且将焊料预成形坯熔化。焊料预成形坯的厚度和金属网的“色容积（Farbvolumen）”如此相互协调，使得焊料最大化地填满金属丝之间的空着的空间，但是没有“溢出”并且没有挤压到侧边上超过待钎焊的金属面的边缘。通过下方的底板4a和上方的盖板4b把钎焊表面压平。
本方法的背景是优质钢（金属网）通过许多含锡的焊料的差的浸润。这样，能够在预钎焊后将金属网从再次硬化的焊料中容易地取出并且能够再次应用该金属网。
通过无法浸润的辅助件（此处为金属网或者筛网）给出焊料层的结构是本发明的一个重要的技术特征，利用该辅助件也能够利用焊料预成形坯的高度或者厚度一起对钎焊厚度进行控制。
图3以焊料层5示出了在根据本发明的基片1上的焊料层。该焊料层5布置在金属面（焊料层5的下方，因此不可见）上并且具有织网类型的表面结构。
焊料层5具有均匀的高度并且不具有隆起。金属面上的焊料层5的厚度波动低于20μm，优选低于15μm。

Claims (11)

1.一种用于预钎焊镀金属的基片（1a、1b）上的金属面的方法，其中，将焊料预成形坯（2a、2b）放置到所述基片（1a、1b）的金属面上或者相反，并且接下来将所述焊料预成形坯（2a、2b）熔化，由此利用所述焊料预成形坯（2a、2b）的焊料来钎焊所述金属面并且所述焊料形成焊料层（5），其特征在于，在钎焊或者说熔化时，将金属网（3a、3b）平坦地压到所述焊料预成形坯（2a、2b）上并且所述金属网（3a、3b）由焊料无法浸润的材料构成。
2.根据权利要求1所述的方法，其特征在于，应用扁平的叶形的焊料冲压件作为焊料预成形坯（2a、2b）。
3.根据权利要求1或2所述的方法，其特征在于，所述金属网（3a、3b）是优质钢网。
4.根据权利要求1到3中任一项所述的方法，其特征在于，所述焊料预成形坯（2a、2b）的高度以及所述金属网（3a、3b）的金属丝之间的容积相互协调，使得熔化的焊料最大化地填满所述容积，但是没有“溢出”并且没有挤压到侧边上超过所述金属面的边缘。
5.根据权利要求1到4中任一项所述的方法，其特征在于，在基片（1a）具有两侧的用于钎焊的金属面的情况下，由以下互相重叠布置的部分形成夹层结构（6）：
a.优选由陶瓷构成的扁平的底板（4a），
b.金属网(3a)，
c．焊料预成形坯（2a），
d．带有两侧的金属面的基片（1a），
e.焊料预成形坯（2b），
f．金属网（3b），
g．优选由陶瓷形成的扁平的盖板（4b）；
并且将所述夹层结构必要时还要在压力下在炉子中进行加热直到所述焊料预成形坯（2a、2b）熔化并且熔化的焊料钎焊所述金属面并且而后将所述夹层结构从所述炉子中取出并且进行冷却并且能够将所述金属网（3a、3b）从所述基片（1a）中取下并且进行再次应用。
6.根据权利要求5所述的方法，其特征在于，在仅仅一侧上带有金属面的基片（1b）中，取消字母e和f。
7.根据权利要求1到6中任一项所述的方法，其特征在于，所述金属网（3a、3b）的网眼尺寸处于300与450mesh之间，优选为325mesh或者400mesh。
8.根据权利要求1到7中任一项所述的方法，其特征在于，所述焊料预成形坯（2a、2b）由SnAg3Cu0.5构成。
9.镀金属的基片，带有经过钎焊的金属面，尤其以根据权利要求1到8中任一项所述的方法所生产，其特征在于，所述金属面上的所述焊料层（5）具有织网类型的表面结构。
10.根据权利要求9所述的镀金属的基片，其特征在于，所述焊料层（5）具有均匀的高度并且不具有隆起。
11.根据权利要求9或者10所述的镀金属的基片，其特征在于，在所述金属面上的所述焊料层（5）的厚度波动低于20μm，优选低于15μm。
CN201380066440.0A 2012-12-18 2013-12-13 在使用金属网情况下预钎焊镀金属的基片上的金属面的方法;带有具有织网的表面结构的焊料层的镀金属的基片 Pending CN104853873A (zh)

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