TW201436681A - 將基材上的金屬面預上銲料的方法 - Google Patents

將基材上的金屬面預上銲料的方法 Download PDF

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TW201436681A
TW201436681A TW102146046A TW102146046A TW201436681A TW 201436681 A TW201436681 A TW 201436681A TW 102146046 A TW102146046 A TW 102146046A TW 102146046 A TW102146046 A TW 102146046A TW 201436681 A TW201436681 A TW 201436681A
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solder
mesh
metal
model
metal surface
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TW102146046A
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Klaus Herrmann
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Ceramtec Gmbh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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Abstract

一種用於將在鍍金屬的基材上的金屬面預上銲料的方法，其將銲料前模型(2a)(2b)放到該基材(1a)(1b)的金屬面上，或反之將基材(1a)(1b)的金屬面放到銲料前模型(2a)(2b)上，然後將該銲料前模型(2a)(2b)熔化，如此該金屬面與銲料前模型(2a)(2b)的銲料銲合，且該銲料形成一銲料層(5)，為了達成銲料層一定的均勻高度且不能形成隆起的銲料，且一直到銲料層的邊緣為止，即使是100微米的較厚銲料層，其厚度變動小於20微米，且將銲料層中孔隙形成的情事減到最少，故在銲合或在熔融時將一金屬網(3a)(3b)平平壓到該銲料前模型(2a)(2b)上，且該金屬網(3a)(3b)由一種不被銲料浸潤的材料構成。此外還關於一種具有軟銲之金屬面的鍍金屬基材，其係特別利用上述方法製造者，其中，該金屬面上的銲料層(5)具有一種網布方式的表面構造。(圖1)

Description

將基材上的金屬面預上銲料的方法
本發明關於一種用於將在鍍金屬的基材上的金屬面預上銲料(Vorbeloten，英：pre-soldering)的方法，其將銲料前模型放到該基材的金屬面上，或反之將基材的金屬面放到銲料前模型上，然後將該銲料前模型熔化，如此該金屬面與銲料前模型的銲料銲合，且該銲料形成一銲料層。
電元件往往放在鍍金屬的基材〔如鍍金屬的陶瓷或用金屬施覆的塑膠或塑膠板(如FR4)的金屬面上〕，特別有用的是具有金屬面的基材，該金屬面係已預上銲料，因此舉例而言，在一「連續通過爐」(Durchlaufofen)中可同樣地設以元件。
特佳者為一種不會顯出一般的凹凸面(Meniskus)的預上銲料，因此放上去之要軟銲的元件不會搖擺(wackeln)及移動，在金屬面用銲料作一般的預上銲料的場合(銲料大多以鎳或銀或銀/鈀為基礎)或用網版印刷的銲料珠或用銲料鏌沖壓件時，該液態銲料形成明顯的邊緣角度。
迄今，銲料的前模型(Preform)係在複雜的模中在熔融時壓平，但這點會造成令人不滿意的表面。
本發明的目的在將具有申請專利範圍第1項引文的非特徵 部分的方法改善，以達成銲料層的一定均勻的高度且不會形成隆起的銲料。且外部即使100微米的較厚銲料層，一直到邊緣為止，其厚度變動都在20微米以下，且銲料層中孔隙形成的情事要減到最少。
依本發明，這種目的利用申請專利範圍第1項的特徵達到。
這些特徵為在銲合或在熔融時將一金屬網平平壓到該銲料前模型上，且該金屬網由一種不被銲料浸潤的材料構成。如此可達成銲炓層之一定均勻的高度，且不會形成隆起的銲料，此外，即使是100微米的較厚銲料層，一直到銲料層的邊緣為止，厚度變動在20微米甚至15微米以下，且在銲料層中孔隙形成的情事減到最小。如此，在稍後的程序中，電構件或電子構件，如晶片/電晶體等，可放到一均勻厚度的銲料層上，從構件到基材的熱係導更均勻且可計算。
「銲料前模型」(Lot-Preformen，英：solder preform)一詞，在說明書中也包含只有單一的銲料前模型。「金屬網」也稱金屬篩網，例如在網版印刷時使用。
金屬網要儘量平坦地壓到銲料前模型上(且宜張緊地壓上去)，如此銲料層高度均勻。
本發明係根據一概念：利用平坦(且宜張緊的)金屬網(例如在網版印刷時使用者)(它係由不會被銲料浸透的材料構成)將熔化的銲料平坦地加壓。
在軟銲爐中，氣體可透過金屬網的開口跑掉，且不會在銲料中或銲料層的表面形成氣泡。
金屬網係由不會被銲料浸透的材料構成，因此它不會和以錫 為基礎的習知軟銲料結合，此外，金屬網在中性或還原性的大氣中不會生銹垢，金屬網宜為一不銹鋼網。
利用金屬網的厚度或高度可確定地調金屬面上的銲料層的厚度或高度。
宜使用頁片狀之銲料沖壓件當作銲料前模型，它們可很容易地放到金屬面上，且可造成各種所要之厚度。可用的銲料宜為現代之無鉛軟銲料，例如銲料SnCuxAgy一族，最好銲料由SnAg3Cu0.5構成。
銲料的高度(厚度)以及金屬網的金屬線間的體積宜互相配合設定，使熔解的銲料至多充滿此體積但不會「溢流」以及被壓到側邊越過金屬面的邊緣，如果使用太高的銲料前模型則會發生「溢流」。如果用太低或太薄的銲料前模型，則銲料不能完全充滿金屬網的金屬線之間的空間，如此以後之銲料層的厚度不能確定。
當基材兩面具有金屬面時，在此用於上銲料的方法的一較佳實施例中，形成一夾層構造，由以下上下重疊設置的部分形成：a)一平坦的底板，宜由陶瓷構成，b)金屬網，c)銲料前模型，d)基材，兩側有金屬面，e)銲料前模型，f)金屬網，g)平坦蓋板，宜由陶瓷構成，此夾層(它可仍處在壓力下)在一爐中加熱，直到銲料前模型熔解且 熔解的銲料將金屬面上銲料為止。然後將夾層從爐拿出來冷卻，最後將金屬網從基材拿開並可再使用。
當基材只在一側有金屬面時，則e)和f)省卻，換言之，將蓋板直接放到基材之無金屬面的那一側。
金屬網的網目寬宜在300~450網目，且宜在325網目或400網目。在這種網目寬度產生最好結果。較佳者為不銹鋼網如VA325或VA280(此數目表示線數/每磅)。
當本發明之鍍金屬基材具有上銲料的金屬面(特別是用上述方法製造者)，金屬面上的銲料層有一表構造，呈一網的方式。銲料層有均勻高度且無隆起，金屬面上銲料層的厚度變動在20微米以下。
本發明因此也提到一種作預上銲料的方法，俾將銲料以一定均勻的厚度沈積在一基材上，此方法可用於將基材的一側及兩側上銲料。
本發明的其他特點見於以下說明的圖式。
(1)‧‧‧鍍金屬的基材
(1a)(1b)‧‧‧基材
(2a)(2b)‧‧‧銲料前模型
(3a)(3b)‧‧‧金屬網
(4a)‧‧‧底板
(4b)‧‧‧蓋板
(5)‧‧‧銲料層
(6)‧‧‧熔融物模型(或夾層物)
圖1係一熔融物模型或一夾層物的示意圖；圖2係一熔融物模型或一夾層物的示意圖，它用於只在一基材的一側預上銲料；圖3係一基材上的銲料層，其具有網布方式的表面構造。
圖1顯示一熔融物模型或一夾層物(6)，利用它將一鍍金屬的基材(1)的金屬面上銲料或將一銲料層(5)(見圖3)施到其上。熔融物模 或夾層(6)由以下部分構成，該些部分先後施覆。
在圖1及圖2中夾層物(6)的個別層或部分並非以正確比例顯示，它只表示熔融物模的層序或結構。
最下方有一平坦底板(4a)，由石墨、鋁或陶瓷構成，陶瓷較佳。其上方有一金屬網(3a)，由不被銲料浸透的材料構成。此處它係一鋼網，亦即由個別鋼線構成的一金屬網(3a)。金屬網(3a)的網目寬度為325網目或400網目，金屬網(3a)宜張緊。舉例而言，它可繃緊固定在底板(4a)上。但它也可簡單地放到底板(4a)上，因為夾層物(6)在上銲料上由於板(4a)(4b)而變重，或者另外還被繃緊。
在金屬網(3a)上設一銲料前模型(2a)或設數個銲料前模型。個別的銲料前模型(2)須設在基材(1)之要上銲料的金屬面的位置。
(1b)表示要上銲料的基材。圖1中的熔融物模或夾層物(6)有一基材(1b)，它只在一側有金屬面，此夾夾層物用一蓋板(4b)(此處係由陶瓷構成)蓋住。
此外在所有實例中，基材用鎢玻璃+磷化鎳(NiP)(還可有Au)，作預鍍金屬。
要上銲料，將夾層例如在一節帶爐(Gliederbandofen)或在一批次爐(Batchofen)或其他加熱設備(紅內線爐或其他)處理。
爐中大氣須配合材料，宜由氮或氮+氫混合物構成。爐中尖峰溫度配合銲料，且宜在300~600℃範圍。銲料的熔解時間須保持儘量短，在5分以下。
舉例而言，鍍金屬的基材為鍍金屬的陶瓷或鍍金屬的塑膠或 塑膠板。
基本上在上銲料時，將一平坦的(例如研磨過的)板(4a)(4b)(它由陶瓷構成者)的一側用一由不銹鋼構成的金屬網平平放或張設。將銲料前模型(亦即扁平之片狀銲料沖壓件)放到該扁平金屬網的一定位置。這點可用一機器人做，然後把要上銲料的基材以其基本鍍金屬層(如W-Ni或Cu-Ni或類似物)放到該銲料前模型上。
如果該基材兩側鍍金屬，則此時也可將銲料前模型放到上側之所要上銲料的面上。然後將一金屬網放在該施覆之上側，並放一平坦陶瓷板當作蓋板(4b)。
「夾層物」(Sandwich)可利用進一步的重量變重以改善接觸，然後夾層物通過一爐而銲料前模型熔化。此銲料前模型的厚度和金屬網的「漆體積」互相電合設定，使銲料至多充滿金屬線間的空間，但不致「溢流」被壓到邊側，超過所要上銲料的金屬面的邊緣流出，利用下底板(4a)及上蓋板(4b)將銲料表面蓋住。
此方法之根據為不銹鋼(金屬網)對許多含錫的銲料不易浸透。因此在預上銲料後可將金屬網由再凝固的銲料簡單地拉離並再作用。
銲料層利用不會浸透的輔手段(此處為一金屬網或一篩網)賦與構造為本發明一種要特徵，用高網可一起控制銲料前模型的高度或厚度。
圖3顯示在一本發明的基材(1)上的銲料層(5)，銲料層(5)設在金屬面(在銲料層(5)下方，因此看不到)上，且具一表面構造，呈一網形式。
錫料層(5)具均勻高度，且無隆起，在金屬面上的銲料層(5)的厚度變動在20微米以下，且宜在15微米以下。
(1a)‧‧‧基材
(2a)(2b)‧‧‧銲料前模型
(3a)(3b)‧‧‧金屬網
(4a)‧‧‧底板
(4b)‧‧‧蓋板
(6)‧‧‧熔融物模型(或夾層物)

Claims (11)

  1. 一種用於將在鍍金屬的基材上的金屬面預上銲料的方法，其將銲料前模型(2a)(2b)放到該基材(1a)(1b)的金屬面上，或反之將基材(1a)(1b)的金屬面放到銲料前模型(2a)(2b)上，然後將該銲料前模型(2a)(2b)熔化，如此該金屬面與銲料前模型(2a)(2b)的銲料銲合，且該銲料形成一銲料層(5)，其特徵在：在銲合或在熔融時將一金屬網(3a)(3b)平平壓到該銲料前模型(2a)(2b)上，且該金屬網(3a)(3b)由一種不被銲料浸潤的材料構成。
  2. 如申請專利範圍第1項之方法，其中：所用之銲料前模型(2a)(2b)係為扁平頁狀銲料沖刷件。
  3. 如申請專利範圍第1或第2項之方法，其中：該金屬網(3a)(3b)為一不銹鋼網。
  4. 如申請專利範圍第1~3項任一項之方法，其中：該銲料前模型(2a)(2b)的高度和該金屬網(3a)(3b)的金屬面之間的體積互相配合設定，使熔融的銲料至多充滿這種體積但不會溢流及被壓到旁邊超出金屬面的邊緣出去。
  5. 如申請專利範圍第1~4項任一項之方法，其中：當基材(1a)兩側具有要軟銲的金屬面時，形成一種夾層物(6)，該夾層由以下之上下重疊排列的部分構成：a)一平場的底板(4a)，宜由陶瓷構成b)金屬網(3a)；c)銲料前模型(2a)； d)基材(1a)，其兩面有金屬面；e)銲料前模型(2b)；f)金屬網(3b)；g)平垾蓋板(4a)，宜由陶瓷構成；且該夾層物(6)(它可仍受壓力)在一爐中加熱直到該銲料前模型(2a)(2b)熔化且熔化的銲料將金屬面銲合為止，然後將該夾層物(6)從爐拿出並冷卻，並將金屬網(3a)(3b)從基材(1a)拿掉且可再使用。
  6. 如申請專利範圍第5項之方法，其中：當基(1b)只在一面有金屬面時，則上述之e)銲料前模型(2b)及f)金屬網(3b)省卻。
  7. 如申請專利範圍第1~6項之方法，其中：該金屬網(3a)(3b)的網目度在300~450網目間，且宜在325網目或400網目。
  8. 如申請專利範圍第1~7項之方法，其中：該銲前前模型(2a)(2b)由SnAg3Cu0.5構成。
  9. 一種具有軟銲之金屬面的鍍金屬基材，其係特別利用申請專利範圍第1~第8項任一項之方法製造者，其特徵在：該金屬面上的銲料層(5)具有一種網布方形的表面構造。
  10. 如申請專利範圍第9項之鍍金屬基材，其中：該銲料層(5)有均勻高度且無隆起。
  11. 如申請專利範圍第9或第10項之鍍金屬基材，其中：該金屬面上的銲料層(5)的厚度變動在20微米以下，且宜在15微米以 下。
TW102146046A 2012-12-18 2013-12-13 將基材上的金屬面預上銲料的方法 TW201436681A (zh)

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