JPS53122652A - Net solder - Google Patents

Net solder

Info

Publication number
JPS53122652A
JPS53122652A JP3721577A JP3721577A JPS53122652A JP S53122652 A JPS53122652 A JP S53122652A JP 3721577 A JP3721577 A JP 3721577A JP 3721577 A JP3721577 A JP 3721577A JP S53122652 A JPS53122652 A JP S53122652A
Authority
JP
Japan
Prior art keywords
solder
net
semiconductor
net solder
splits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3721577A
Other languages
Japanese (ja)
Inventor
Seikichi Takashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3721577A priority Critical patent/JPS53122652A/en
Publication of JPS53122652A publication Critical patent/JPS53122652A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To provide a net solder wherein in covering a semiconductor over a radiating plate, a solder fabricated by filling meshes of a noble metal made network with a powder of molybdenum, tungsten or the like is interposed therebetween, whereby to prevent the generation of splits and cracks in the semiconductor due to thermal expansion.
JP3721577A 1977-04-01 1977-04-01 Net solder Pending JPS53122652A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3721577A JPS53122652A (en) 1977-04-01 1977-04-01 Net solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3721577A JPS53122652A (en) 1977-04-01 1977-04-01 Net solder

Publications (1)

Publication Number Publication Date
JPS53122652A true JPS53122652A (en) 1978-10-26

Family

ID=12491356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3721577A Pending JPS53122652A (en) 1977-04-01 1977-04-01 Net solder

Country Status (1)

Country Link
JP (1) JPS53122652A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104853873A (en) * 2012-12-18 2015-08-19 陶瓷技术有限责任公司 Method for pre-soldering metal surfaces onto metallised substrates using metallic gauze, metallised substrates with solder layer which has superficial structure of gauze
CN105537793A (en) * 2016-01-15 2016-05-04 东南大学 Soldering lug for welding power module
CN108788517A (en) * 2018-07-05 2018-11-13 四川广正科技有限公司 A kind of low-cost and high-performance solder and preparation method thereof
US20180375297A1 (en) * 2015-01-27 2018-12-27 Parviz Tayebati Solder-creep management in high-power laser devices

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104853873A (en) * 2012-12-18 2015-08-19 陶瓷技术有限责任公司 Method for pre-soldering metal surfaces onto metallised substrates using metallic gauze, metallised substrates with solder layer which has superficial structure of gauze
US20180375297A1 (en) * 2015-01-27 2018-12-27 Parviz Tayebati Solder-creep management in high-power laser devices
US11196234B2 (en) * 2015-01-27 2021-12-07 TeraDiode, Inc. Solder-creep management in high-power laser devices
CN105537793A (en) * 2016-01-15 2016-05-04 东南大学 Soldering lug for welding power module
CN108788517A (en) * 2018-07-05 2018-11-13 四川广正科技有限公司 A kind of low-cost and high-performance solder and preparation method thereof

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