CN104804241A - 一种半导体高粘膜注塑清洁材料 - Google Patents
一种半导体高粘膜注塑清洁材料 Download PDFInfo
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- CN104804241A CN104804241A CN201510208914.1A CN201510208914A CN104804241A CN 104804241 A CN104804241 A CN 104804241A CN 201510208914 A CN201510208914 A CN 201510208914A CN 104804241 A CN104804241 A CN 104804241A
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- 239000011538 cleaning material Substances 0.000 title claims abstract description 17
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 238000002347 injection Methods 0.000 title abstract 3
- 239000007924 injection Substances 0.000 title abstract 3
- 238000002156 mixing Methods 0.000 claims abstract description 19
- 229920003051 synthetic elastomer Polymers 0.000 claims abstract description 11
- 239000005061 synthetic rubber Substances 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 239000002904 solvent Substances 0.000 claims abstract description 10
- 229920001971 elastomer Polymers 0.000 claims abstract description 7
- 239000005060 rubber Substances 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims abstract description 4
- 238000005096 rolling process Methods 0.000 claims abstract description 4
- 238000010074 rubber mixing Methods 0.000 claims abstract description 4
- 239000000084 colloidal system Substances 0.000 claims description 15
- 238000001746 injection moulding Methods 0.000 claims description 15
- 210000004400 mucous membrane Anatomy 0.000 claims description 14
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical group C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 claims description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- 229920000181 Ethylene propylene rubber Polymers 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000011863 silicon-based powder Substances 0.000 claims description 6
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical group C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 5
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 5
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 5
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 4
- FCSHMCFRCYZTRQ-UHFFFAOYSA-N N,N'-diphenylthiourea Chemical compound C=1C=CC=CC=1NC(=S)NC1=CC=CC=C1 FCSHMCFRCYZTRQ-UHFFFAOYSA-N 0.000 claims description 3
- 229920000459 Nitrile rubber Polymers 0.000 claims description 3
- 150000001298 alcohols Chemical group 0.000 claims description 3
- UMGDCJDMYOKAJW-UHFFFAOYSA-N aminothiocarboxamide Natural products NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 3
- 229920003193 cis-1,4-polybutadiene polymer Polymers 0.000 claims description 3
- 150000002576 ketones Chemical class 0.000 claims description 3
- 239000012046 mixed solvent Substances 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 239000000843 powder Substances 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/16—Ethene-propene or ethene-propene-diene copolymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/02—Copolymers with acrylonitrile
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/06—Copolymers with styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Detergent Compositions (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本发明提供一种半导体高粘膜注塑清洁材料，将合成橡胶100份、硅微粉20-40份混合均匀置入炼胶机，80℃-90℃温度中混炼0.8-1小时，获得胶体；将溶剂3-8份、硫化剂3-5份、促进剂5-10份混合均匀，加入合成橡胶与硅粉的混合胶体再进行混炼；将第二步所得的混炼胶体用压延机压平后切割，塑封包装，本发明获得的注塑清洁材料具有良好的粘结作用，达到从模具表面拉出清理污垢的效果，且成本降低，提高了产品的竞争力。
Description
技术领域
本发明涉及半导体技术领域，特别涉及一种半导体高粘膜注塑清洁材料。
背景技术
橡胶、塑料及其他复合材料在进行模压、注塑等操作时，必然在模具表面残留有注塑材料，会影响到产品的质量没同时还可能对模具产生腐蚀并影响生产效率，目前模具清理有很多方法，传统清模方法往往耗时长，同时也消耗大量的引线框架，为解决这个问题，清模胶片逐渐为封装工艺中采用。
发明内容
针对现有传统清模方法耗时长等问题，本发明提供一种半导体高粘膜注塑清洁材料，为了达到上述目的，本发明采用以下技术方案：一种半导体高粘膜注塑清洁材料，包括合成橡胶100份、硅微粉20-40份、溶剂3-8份、硫化剂3-5份、促进剂5-10份。
优选地，所述合成橡胶为顺丁橡胶、乙丙橡胶、丁苯橡胶和丁氰橡胶之中的至少两种以上混合物。
优选地，所述溶剂为醇类、酮类、醚类有机溶剂任一种或者至少二者混合溶剂。
优选地，所述硫化剂为有机过氧化物，为过氧化二异丙苯、过氧化苯甲酰。
优选地，所述有机过氧化物为过氧化二异丙苯、过氧化苯甲酰。
优选地，所述促进剂为2-巯基苯并噻唑、二苯基硫脲和N、N-二正丁基硫脲。
优选地，一种半导体高粘膜注塑清洁材料的制备工艺包括以下步骤：第一步：将合成橡胶、硅微粉混合搅拌均匀置入炼胶机，80℃-90℃温度中中混炼0.8-1小时，获得胶体；第二步：将溶剂、硫化剂、促进剂混合均匀与第一步所得的胶体混炼，获得混炼胶体；第三步：将第二步所得的混炼胶体胶体用压延机压平后切割，塑封包装。
本发明的有益效果：本发明具有良好的粘结作用，达到从模具表面拉出清理污垢的效果，且成本降低，提高了产品的竞争力。
具体实施方式
本发明本发明一种半导体高粘膜注塑清洁材料，包括合成橡胶100份、硅微粉20-40份、溶剂3-8份、硫化剂3-5份、促进剂5-10份。
优选地，所述合成橡胶为顺丁橡胶、乙丙橡胶、丁苯橡胶和丁氰橡胶之中的至少两种以上混合物。
优选地，所述溶剂为醇类、酮类、醚类有机溶剂任一种或者至少二者混合溶剂。
优选地，所述硫化剂为有机过氧化物，为过氧化二异丙苯、过氧化苯甲酰。
优选地，所述有机过氧化物为过氧化二异丙苯、过氧化苯甲酰。
优选地，所述促进剂为2-巯基苯并噻唑、二苯基硫脲和N、N-二正丁基硫脲。
优选地，一种半导体高粘膜注塑清洁材料的制备工艺包括以下步骤：第一步：将合成橡胶、硅微粉混合搅拌均匀置入炼胶机，80℃温度中中混炼0.8小时，获得胶体；第二步：将溶剂、硫化剂、促进剂混合均匀与第一步所得的胶体混炼，获得混炼胶体；第三步：将第二步所得的混炼胶体胶体用压延机压平后切割，塑封包装。
Claims (7)
1.一种半导体高粘膜注塑清洁材料，其特征在于：包括合成橡胶100份、硅微粉20-40份、溶剂3-8份、硫化剂3-5份、促进剂5-10份。
2.根据权利要求1所述的一种半导体高粘膜注塑清洁材料，其特征在于：所述合成橡胶为顺丁橡胶、乙丙橡胶、丁苯橡胶和丁氰橡胶之中的至少两种以上混合物。
3.根据权利要求1所述的一种半导体高粘膜注塑清洁材料，其特征在于：所述溶剂为醇类、酮类、醚类有机溶剂任一种或者至少二者混合溶剂。
4.根据权利要求1所述的一种半导体高粘膜注塑清洁材料，其特征在于：所述硫化剂为有机过氧化物。
5.根据权利要求4所述的一种半导体高粘膜注塑清洁材料，其特征在于：所述有机过氧化物为过氧化二异丙苯、过氧化苯甲酰。
6.根据权利要求1所述的一种半导体高粘膜注塑清洁材料，其特征在于：所述促进剂为2-巯基苯并噻唑、二苯基硫脲和N、N-二正丁基硫脲。
7.根据权利要求1至5任一权利要求，其特征在于：一种半导体高粘膜注塑清洁材料的制备工艺包括以下步骤：第一步：将合成橡胶、硅微粉混合搅拌均匀置入炼胶机，80℃-90℃温度中中混炼0.8-1小时，获得胶体；第二步：将溶剂、硫化剂、促进剂混合均匀与第一步所得的胶体混炼，获得混炼胶体；第三步：将第二步所得的混炼胶体胶体用压延机压平后切割，塑封包装。
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1952032A (zh) * | 2006-09-28 | 2007-04-25 | 无锡乐东微电子有限公司 | 一种集成电路封装用的清模料 |
| CN102766284A (zh) * | 2012-08-07 | 2012-11-07 | 天津德高化成电子材料有限公司 | 无味的半导体封装模具用清模材料 |
| CN102786725A (zh) * | 2012-08-07 | 2012-11-21 | 天津德高化成电子材料有限公司 | 无味的半导体封装模具用清模和润模双功能材料 |
| CN103205032A (zh) * | 2013-03-14 | 2013-07-17 | 西北工业大学 | 一种原位清洗模具用清模胶及其制备方法 |
| CN104086827A (zh) * | 2014-07-29 | 2014-10-08 | 南通大学 | 一种电子封装模具清理橡胶的制备方法 |
| CN104119817A (zh) * | 2014-07-11 | 2014-10-29 | 烟台恒迪克能源科技有限公司 | 一种电子分立器件塑封模具清模胶条 |
| CN104262797A (zh) * | 2014-09-19 | 2015-01-07 | 无锡晶睿光电新材料有限公司 | 一种未硫化橡胶组合物 |
-
2015
- 2015-04-29 CN CN201510208914.1A patent/CN104804241A/zh active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1952032A (zh) * | 2006-09-28 | 2007-04-25 | 无锡乐东微电子有限公司 | 一种集成电路封装用的清模料 |
| CN102766284A (zh) * | 2012-08-07 | 2012-11-07 | 天津德高化成电子材料有限公司 | 无味的半导体封装模具用清模材料 |
| CN102786725A (zh) * | 2012-08-07 | 2012-11-21 | 天津德高化成电子材料有限公司 | 无味的半导体封装模具用清模和润模双功能材料 |
| CN103205032A (zh) * | 2013-03-14 | 2013-07-17 | 西北工业大学 | 一种原位清洗模具用清模胶及其制备方法 |
| CN104119817A (zh) * | 2014-07-11 | 2014-10-29 | 烟台恒迪克能源科技有限公司 | 一种电子分立器件塑封模具清模胶条 |
| CN104086827A (zh) * | 2014-07-29 | 2014-10-08 | 南通大学 | 一种电子封装模具清理橡胶的制备方法 |
| CN104262797A (zh) * | 2014-09-19 | 2015-01-07 | 无锡晶睿光电新材料有限公司 | 一种未硫化橡胶组合物 |
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