CN104751125A - Fingerprint identification device, touch screen and electronic equipment - Google Patents
Fingerprint identification device, touch screen and electronic equipment Download PDFInfo
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- CN104751125A CN104751125A CN201510100141.5A CN201510100141A CN104751125A CN 104751125 A CN104751125 A CN 104751125A CN 201510100141 A CN201510100141 A CN 201510100141A CN 104751125 A CN104751125 A CN 104751125A
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Abstract
The invention provides a fingerprint identification device. The fingerprint identification device comprises a cover plate element, a base plate and a first thin plate and a second thin plate which are attached on the base plate, wherein a flexible circuit board is provided with at least one control element and at least one fingerprint sensor; the at least one fingerprint induction sensor is configured to sense fingerprints of fingers of a user; the at least one control element is configured to control the fingerprint sensor; the flexible circuit board extends between the base plate and the second thin plate through the side edge of the base plate to the second surface of the base plate; the fingerprint sensor is fixedly arranged between the second thin plate and the base plate so that the at least one fingerprint sensor is mounted at the position which is closer to the fingers of the user than the base plate. According to the fingerprint identification device, the base plate is provided with the first thin plate and the second thin plate so that a flat surface without an opening is formed, and the appearance and strength are complete and good.
Description
Technical field
The present invention relates to fingerprint identification technology field, particularly relate to a kind of fingerprint identification device, touch-screen and electronic equipment.
Background technology
With development in science and technology, fingerprint identification device applies to all kinds of portable electric appts more and more widely.As an existing class is provided with the smart mobile phone of fingerprint identification device, user realizes the functions such as mobile phone unblock, fingerprint recognition payment by described fingerprint identification device.
Existing electronic product, if the electronic equipment such as mobile phone, panel computer is in order to realize fingerprint identification function, need to punch in its touch cover, and adopt LGA (Land Grid Array, Background Grid array packages) encapsulation technology electronic equipment cover plate punching place laminating fingerprint sensor, then through hole is offered to expose the touch-control sensing region of fingerprint sensor in the surface of the direct cover plate at electronic equipment, so that described fingerprint sensor can carry out fingerprint detection.But, through hole is offered to the surface of the cover plate of electronic equipment and easily causes through hole stress to increase, thus cause cover-plate glass intensity to decline.For ensureing the cover plate intensity of electronic equipment, drilling technology is complicated, and cost is higher.
If directly arrange at least one fingerprint Identification sensor module under the touch cover of electronic equipment (mobile phone, panel computer etc.).Because electronic equipment cover plate is as user's inputting interface, often accept the user behaviors such as user mobile phone touch-control pressing, therefore electronic equipment needs stronger rigid, and electronic equipment cover sheet thickness this kind of is at present greater than more than 300 microns, the coverage of current finger face and fingerprint Identification sensor is less than 100 microns.This distance is far beyond the finger face of user and the distance coverage of fingerprint Identification sensor, cause fingerprint Identification sensor inefficacy and None-identified user points line paddy ridge and forms fingerprint pattern, therefore there are two technical barriers of urgently capturing in this field: the distance one, reducing finger face and fingerprint Identification sensor; Two, the intensity strengthening the electromagnetic field of fingerprint sensor can make its intensity penetrate 300 microns with upper cover plate.
Summary of the invention
There is provided that a kind of intensity is better, fingerprint induction be sensitive, the fingerprint identification device of flat appearance, touch-screen and electronic equipment.
A kind of fingerprint identification device, comprising:
One cover component, described cover component comprises a substrate, and the first thin plate be attached on described substrate and the second thin plate; Described substrate is provided with the first surface arranged towards described cover plate, the second surface relative with described first surface, is connected to the side of described first surface and second surface; Described first thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface, and described second thin plate is provided with towards the 6th surface of described substrate and five surface relative with described 6th surface;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor is configured to the fingerprint of sensing user finger; Described at least one control element is configured to control described fingerprint sensor;
The flexible PCB being provided with at least one fingerprint sensor extends to the second surface of described substrate from the side through described substrate between described substrate and described second thin plate; Described fingerprint sensor is fixed between described second thin plate and substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate.
Further, described cover component is formed at least one deck color layers.
Further, described color layers comprises at least one deck color ink layer or BM layer.
Further, described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described second thin plate the 5th surface or the 6th surface in one.
Further, described first thin plate and the second gauge of sheet are less than or equal to 150 μm.
Further, the fingerprint sensor of described fingerprint recognition module is positioned in the position pointed closer to described user than described flexible PCB.
Further, the fingerprint sensor of described fingerprint recognition module directly fits in the 6th surface of described second thin plate.
Further, described fingerprint identification device is also provided with bonding coat, and described bonding coat is arranged between described substrate and described first thin plate and/or the second thin plate, and described bonding coat is used for described substrate and described first thin plate and/or the second thin plate mutually to combine closely.
Further, described bonding coat also covers the fingerprint sensor of described fingerprint recognition module and at least part of flexible PCB.
Further, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
Further, described bonding coat adopts Optical transparent adhesive.
Further, any one in described substrate employing glass, sapphire, transparent resin is made; Described first thin plate and the second thin plate adopt in glass, sapphire, transparent resin any one make.
Comprise a touch-screen for fingerprint identification device, described touch-screen is provided with visible area and non-visible area, comprising:
One cover component, described base component comprises a substrate, and the first thin plate be attached on described substrate and the second thin plate; Described first thin plate is arranged at the visible area of described touch-screen, and described second thin plate is arranged at the non-visible area of described touch-screen; Described substrate is provided with the first surface arranged towards described cover plate, the second surface relative with described first surface, is connected to the side of described first surface and second surface, described first thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface, and described second thin plate is provided with towards the 6th surface of described substrate and five surface relative with described 6th surface;
Be connected with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor be arranged at touch-screen non-visible area and be configured to sensing user finger fingerprint; At least one control element is configured to control described fingerprint sensor;
The flexible PCB being provided with at least one fingerprint sensor extends to the second surface of described substrate from the side through described substrate between described substrate and described second thin plate; Described fingerprint sensor is fixed between described thin plate and substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate;
Wherein said substrate is formed touch-control sensing layer.
Further, described control element is arranged at the second surface of described substrate.
Further, at least one fingerprint sensor described comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.
Further, described base component is formed at least one deck color layers.
Further, described color layers comprises at least one deck color ink layer or BM layer.
Further, described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described second thin plate the 5th surface or the 6th surface in one.
Further, described first thin plate and the second gauge of sheet are less than or equal to 150 μm.
Further, described fingerprint sensor is positioned in the position pointed closer to described user than described flexible PCB.
Further, described fingerprint sensor directly fits in the 6th surface of described second thin plate.
Further, described touch-screen is also provided with bonding coat, and described bonding coat is arranged between described substrate and described first thin plate and/or the second thin plate, and described bonding coat is used for described substrate and described first thin plate and/or the second thin plate mutually to combine closely.
Further, described bonding coat also covers the fingerprint sensor of described fingerprint recognition module and at least part of flexible PCB.
Further, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
Further, described bonding coat adopts Optical transparent adhesive.
Further, any one in described substrate employing glass, sapphire, transparent resin is made; Described first thin plate and the second thin plate adopt in glass, sapphire, transparent resin any one make.
For an electronic equipment for fingerprint recognition sensing, described electronic equipment is provided with visible area and non-visible area, and described electronic equipment comprises:
Be arranged at a display element of visible area at least partly;
Cover component; Fit with described at least one display element;
Described cover component subregion is transparent, and described base component comprises a substrate, and the first thin plate be attached on described substrate and the second thin plate; Described first thin plate is arranged at the visible area of described touch-screen, described second thin plate is arranged at the non-visible area of described touch-screen, described substrate is provided with the first surface arranged towards described cover plate, the second surface relative with described first surface, is connected to the side of described first surface and second surface, described first thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface, and described second thin plate is provided with towards the 6th surface of described substrate and five surface relative with described 6th surface;
Be connected with a flexible PCB of at least one control element and at least one fingerprint sensor, described at least one fingerprint sensor be arranged at described electronic equipment visible area and be configured to sensing user finger fingerprint; At least one control element is configured to control described fingerprint sensor;
The flexible PCB being provided with at least one fingerprint sensor extends to the second surface of described substrate from the side through described substrate between described substrate and described second thin plate; Described fingerprint sensor is fixed between described second thin plate and substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate.
Further, described fingerprint sensor comprises one group of capacitive element of the user fingerprints that can be coupled to user's finger in a capacitive manner.
Further, at least one fingerprint sensor described comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.
Further, the substrate of described cover component directly fits in described display element, and described control element is arranged between described cover component and described display element.
Further, described base component is formed at least one deck color layers.
Further, described color layers comprises at least one deck color ink layer or BM layer.
Further, described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described second thin plate the 5th surface or the 6th surface in one.
Further, described first thin plate and the second gauge of sheet are less than or equal to 150 μm.
Further, described fingerprint sensor is positioned in the position pointed closer to described user than described flexible PCB.
Further, described fingerprint sensor directly fits in the 6th surface of described second thin plate.
Further, described electronic equipment is also provided with bonding coat, and described bonding coat is arranged between described substrate and described first thin plate and/or the second thin plate, and described bonding coat is used for described substrate and described first thin plate and/or the second thin plate mutually to combine closely.
Further, described bonding coat also covers the fingerprint sensor of described fingerprint recognition module and at least part of flexible PCB.
Further, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
Further, any one in described substrate employing glass, sapphire, transparent resin is made; Described first thin plate and/or the second thin plate adopt in glass, sapphire, transparent resin any one make.
Fingerprint identification device of the present invention by arranging the first thin plate, the second thin plate on substrate, thus form smooth astomous flat surface, the electronic equipment that this fingerprint identification device is set is made to have complete, good outward appearance and intensity, not only can avoid the perforate of electronic equipment appearance and cause stress concentrate, intensity decline, be also convenient to user simultaneously and carry out touch-control and viewing.And fingerprint identification device of the present invention is by arranging fingerprint sensor in visible area, is convenient to user and carries out fingerprint recognition sense operation in visible area, there is good operating experience.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of a kind of fingerprint identification device that the first embodiment provides;
Fig. 2 is the close-up schematic view of the fingerprint identification device described in Fig. 1;
Fig. 3 is the diagrammatic cross-section of a kind of fingerprint identification device that the first embodiment provides;
Fig. 4 is the diagrammatic cross-section of a kind of fingerprint identification device that the second embodiment provides;
Fig. 5 is the diagrammatic cross-section of a kind of fingerprint identification device that the 3rd embodiment provides.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
The invention provides a kind of fingerprint identification device and electronic equipment.Fingerprint identification device according to the embodiment of the present invention can be applied to the electronic equipments such as mobile phone, panel computer, notebook computer, media player, also the financial terminal equipments such as ATM (Automatic Teller Machine) (Automated Teller Machine, ATM) can be applied to.
Refer to Fig. 1 to Fig. 3, first embodiment of the invention provides a kind of electronic equipment being provided with fingerprint identification device 10, and described fingerprint identification device 10 comprises cover component 12, fingerprint recognition module 15.Described electronic equipment is also provided with display element 100.Described cover component 12 is covered on display element 100.
Described electronic equipment comprises visible area and is arranged at the non-visible area of periphery, visible area.Non-visible area is positioned at the surrounding of visible area and forms a frame, avoids user directly to see the assemblies such as the circuit of corresponding setting in non-visible area when operating.Visible area then for user's institute's touch-control and operation part.
Described cover component 12 comprises substrate 122 and is attached at the first thin plate 123, second thin plate 124 of described substrate 122, and the thickness of described first thin plate 123 and the second thin plate 124 is less than the thickness of substrate 122.
Described substrate 122 is provided with the first surface 1220 and second surface 1222 and the side 1223 being connected to described first surface 1220 and second surface 1222 that are oppositely arranged, described first thin plate 123 is provided with the 3rd surface 1230 and the 4th surface 1232 be oppositely arranged, and described second thin plate 124 is provided with the 5th surface 1240 and the 6th surface 1242 be oppositely arranged.Described substrate 122 and the mutual stacked setting of described first thin plate 123, second thin plate 124, the first surface 1220 of described substrate 122 is oppositely arranged with the 6th surface 1242 of the 4th surface 1232, second thin plate 124 of described first thin plate 123, the 5th surface 1240 opposing settings of the second surface 1222 of described substrate 122 and the 3rd surface 1230, second thin plate 124 of described first thin plate 123.Described fingerprint recognition module 15 is arranged at described substrate 122, and described first thin plate 123 and the second thin plate 124 cover described fingerprint recognition module 15 and at least substrate 122 described in cover part.
Further, described first thin plate 123 is arranged at the visible area of described electronic equipment, and described second thin plate 124 is arranged at the non-visible area of described electronic equipment.
In the present embodiment, described substrate 122 and described first thin plate 123, second thin plate 124 cover component 12 forming electronic equipment bonded to each other, thus the types of functionality for coordinating the miscellaneous part of electronic equipment to realize electronic equipment.Described substrate 122 and described first thin plate 123, second thin plate 124 can be used as the operation interface that the display interface protective device of electronic equipment or user input.As described in the first thin plate 123, second thin plate 124 with as described in substrate 122 user that can be used as electronic equipment carry out the display screen watched; Meanwhile, the user that described first thin plate 123, second thin plate 124 and described substrate 122 also can be used as electronic equipment carries out the touch screen of touch control operation.Be understandable that, described fingerprint identification device 10 can arrange the back side being formed at electronic equipment, and the substrate 122 of described fingerprint identification device 10 and the first thin plate 123, second thin plate 124 can form the backboard of electronic equipment jointly.
Substrate 122 in the present invention can adopt in transparent glass, sapphire, transparent resin any one make, described first thin plate 123, second thin plate 124 can adopt in glass, sapphire, transparent resin any one make.Preferably, described substrate 122 can adopt sapphire material to make.Secondary choosing, described substrate 122 also can adopt the tempered glass of Corning Incorporated to make.The thickness of described substrate can be less than or equal to 400 μm, and preferably, the thickness of described substrate 122 can be 300 μm to 400 μm.
Preferably, described first thin plate 123, second thin plate 124 can adopt sapphire material to make.Secondary choosing, described first thin plate 123, second thin plate 124 also can adopt the tempered glass of Corning Incorporated to make.The thickness of described substrate can be less than or equal to 150 μm, and preferably, the thickness of described substrate 122 is less than or equal to 100 μm.
Be understandable that, described substrate 122 and the first thin plate 123, second thin plate 124 can adopt identical or different material to make, as substrate 122 and the first thin plate 123, second thin plate 124 can all adopt sapphire material or glass material to make, also sapphire and glass combination etc. can be adopted.
When described substrate 122 and the first thin plate 123, second thin plate 124 all adopt glass to make, described substrate 122 can adopt tempered glass to make, and the first thin plate 123, second thin plate 124 can adopt simple glass to make.
In the present embodiment, described fingerprint recognition module 15 comprises flexible PCB 152, fingerprint sensor 153, control element 155.Fingerprint sensor 153 is located between the second thin plate 124 and substrate 122 at least partly, when user carries out fingerprint recognition authentication operations at described electronic equipment, the finger print face of user and the distance of fingerprint sensor 153 are about d, and the thickness of described second thin plate 124 is approximately described distance d, therefore the second thin plate 124 of same material is adopted, its thickness is thinner, then the accuracy of its fingerprint recognition, discrimination are higher.
By arranging the second thinner thin plate 124 thickness, making the distance in fingerprint sensor and user's finger print face shorter, thus ensureing the fingerprint sensing effect of described fingerprint sensor 154.Further, the present invention is by arranging the thickness of substrate 122 and the second thin plate 124, make the integral thickness of the cover component 12 of electronic equipment below 500 μm, and then make the cover component 12 of electronic equipment can meet its demand as the rigid of touch-control inputting interface, electronic equipment thickness can not be increased again.Make electronic equipment cover component not in borehole situation, also dexterously fingerprint sensor 153 can be embedded among cover component 12 and solve technical matters of the present invention.
Described fingerprint sensor 153 for carrying fingerprint sensor 153 and control element 155, and is electrically connected with control element 155 by flexible PCB 152.The base material of described flexible PCB 152 can adopt Kapton (Polyimide film, PI film) to make; Further, the base material of described flexible PCB 152 can adopt two layers of polyimide resin (Polyimide resin, PI resin) to form, and it also can be made up of the protective seam resin of one deck polyimide base material in conjunction with other materials of one deck.The present invention is not as limit.
Described fingerprint sensor 153 is formed on described flexible PCB 152 one end, fingerprint sensor 153 for finger sensing to the pressing of described thin plate 123 and gather user finger finger print information.In the present embodiment, described fingerprint sensor 153 can adopt hyperchannel fingerprint sensor 153.Be understandable that, described fingerprint sensor 153 can arrange sensing circuit to carry out fingerprint collecting and simulating signal generation, and described fingerprint sensor 153 can be encapsulated in single in-line packages (single in-line, SiP).Described fingerprint sensor 153 also can adopt single chips and protect by filling colloid.Described sensing circuit can be packaged in epoxy resin or other elastomeric material, makes described sensing circuit to obtain Reasonable Protection, avoids being damaged by collision during assembling.In the present embodiment, described fingerprint sensor 153 is positioned in the position pointed closer to described user than described flexible PCB 152.Described fingerprint sensor 153 comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.The present invention by covering thin plate 122 on fingerprint sensor 153, thus makes fingerprint identification device 40 have good, smooth outward appearance, and can ensure that fingerprint identification device 40 has higher fingerprint recognition precision, user-friendly.
Further, described fingerprint sensor 153 can adopt optical fingerprint sensor, capacitive fingerprint sensing device, piezoelectricity fingerprint sensor or ultrasonic fingerprint sensor.Described fingerprint sensor 153 can adopt the scratching formula sensor of the distribution in strip type, also can be the push type sensor of the distribution in array.Described fingerprint sensor 153 also can adopt other devices that can respond to user's fingerprint, identify, does not repeat them here.
Further, the surface of described fingerprint sensor 153 also can form protective seam (not shown).Described protective seam is formed at the top of fingerprint recognition module 15, with to fingerprint recognition module 15, especially protects fingerprint sensor 153.Protective seam passes through spraying technology or printing technology or vacuum evaporation technology and is formed; its material such as comprises UV curing type PMMA glue (ultraviolet curing transparent glue), thermohardening type PMMA glue or diamond like carbon (Diamond-likeCarbon; DLC), wherein DLC adopts plated film mode to form protective seam.In certain embodiments; protective seam can also be formed by the material of glass, pottery, sapphire, quartz or other durables, the organic films such as such as polymethylmethacrylate (PMMA), polyethylene terephthalate (PET), polyimide (PI).Be understandable that, described protective seam can be set to individual layer, also can be set to multilayer.
Described control element 155 is electrically connected with flexible PCB 152.Described control element 155 can adopt control chip maybe can realize the control circuit of controlling functions, as application-specific IC (ApplicationSpecific Integrated Circuits, ASIC).
Described control element 155 can adopt any suitable prior art with the electric connection mode of described flexible PCB 152.As the control element 155 in the present invention can adopt bonding wire, through-silicon via structure or upside-down mounting mode to be electrically connected on flexible PCB 152, the present invention is not as limit.
Fingerprint sensor 153 and the control element 155 of the fingerprint recognition module 15 of fingerprint identification device 10 of the present invention are not packaged in the integral type encapsulating structure in same chip, but be arranged at the homonymy of flexible PCB 152 independently of one another, discretely, and be electrically connected with flexible PCB 152 respectively.Control element 155 is electrically connected with fingerprint sensor 153 by flexible PCB 152, thus the Signal transmissions of fingerprint sensor 153 is processed in control element 155.
Described fingerprint recognition module 15 identifies for carrying out induction to fingerprint.In the present embodiment, described fingerprint recognition module 15 is assembled in described cover component 12.
In the present embodiment, the flexible PCB 152 of described fingerprint recognition module 15 is between the first surface 1220 and the 6th surface 1242 of described second thin plate 124 of described substrate 122, and the side 1223 through described substrate 122 extends to the second surface 112 of described substrate 122.
Described fingerprint sensor 153 is electrically connected on one end of described flexible PCB 152, and described fingerprint sensor 153 is arranged between the first surface 1220 of described substrate 122 and the 6th surface 1242 of described second thin plate 124; Described control element 155 is electrically connected on the other end of described flexible PCB 152, and second surface 112 side of substrate 122 described in described control element 155.The flexible PCB 152 of described fingerprint recognition module 15, being arranged in the process of described cover component 12 around folding, can keep fitting in described substrate 122.Further, described flexible PCB 152 is bonded in described substrate 122 by optical cement.
Fingerprint identification device 10 in the present embodiment is by arranging the first thin plate 123 and the second thin plate 124 on a substrate 122, thus form smooth astomous surface, corresponding second thin plate 124 of fingerprint sensor 153 is arranged at non-visible area simultaneously, the electronic equipment that this fingerprint identification device 10 is set is made to have complete, good outward appearance and intensity, not only can avoid the perforate of electronic equipment appearance and cause stress concentrate, intensity decline, be convenient to user simultaneously and carry out touch-control and viewing.And the fingerprint identification device 10 in the present embodiment arranges the first thin plate 123 and the second thin plate 124, local can be realized and replace.And the fingerprint identification device 10 in the present embodiment is by arranging the side 1223 of flexible PCB 152 from substrate 122 around folding, the surface integrity destroying substrate 122 can be avoided also can be convenient to arrange fingerprint induction chip 153 and control element 155, ensure that fingerprint identification device 10 has thinner thickness, be beneficial to the fingerprint recognition precision promoting fingerprint identification device 10.
Further, fingerprint identification device 10 of the present invention is also provided with bonding coat 17 between described substrate 122 and thin plate 123, for mutually being combined closely with thin plate 123 by described substrate 122.Described bonding coat 17 can adopt optical clear resin (Optical Clear Resin, OCR) or optical adhesive tape (Optical Clear Adhesive, OCA).
Further, described bonding coat 17 covers the fingerprint sensor 153 of described fingerprint recognition module 15 or is covered to small part flexible PCB 152.
In the present embodiment, described bonding coat 17 can be covered in the side that described flexible PCB 152 is provided with described fingerprint sensor 153.Namely, described fingerprint sensor 153 is arranged at the side of described flexible PCB 152 towards the 4th surface 1232 of described thin plate 123, described bonding coat 17 is covered in the side of described flexible PCB 152 towards the 4th surface 1232 of described thin plate 123, and covers described fingerprint sensor 153 and/or at least part of flexible PCB 152.
Described bonding coat 17 also can be covered in the side that described flexible PCB 152 does not arrange fingerprint sensor 153.That is, described fingerprint sensor 153 is arranged at the side of described flexible PCB 152 towards the 4th surface 1232 of described thin plate 123; Described bonding coat 17 is covered in the side of described flexible PCB 152 towards the first surface 1220 of described substrate 122, and described bonding coat 17 at least flexible PCB 152 described in cover part.
Described bonding coat 17 not only can strengthen the strength of joint between described substrate 122 and described thin plate 123, also can be convenient to described fingerprint recognition module 15 and stably be arranged between described substrate 122 and described thin plate 123.Further, described bonding coat 17 can be used for strengthening the strength of joint between described fingerprint sensor 153 and described flexible PCB 152.And, when described bonding coat 17 is arranged between flexible PCB 152 and described substrate 122, can not increase described fingerprint sensor 153 to described thin plate 123 the 3rd surface 1230 between thickness, and then the sensing accuracy of identification of described fingerprint sensor 153 can be ensured.
As shown in Figure 4, the second embodiment of the present invention provides a kind of electronic equipment being provided with fingerprint identification device 20, and it is roughly the same with the first embodiment, and described electronic equipment is provided with visible area and non-visible area.Described fingerprint identification device 20 comprises cover component, fingerprint recognition module 25.Described cover component comprises the first thin plate 223, second thin plate 224 of substrate 222 and attaching and substrate, and the thickness of described first thin plate 223, second thin plate 224 is less than the thickness of substrate 222.Described substrate 222 be provided be oppositely arranged first surface 2220, second surface 2222, be connected to the side 2223 of first surface 2220 and second surface 2222.Described first thin plate 223 is arranged at the visible area of electronic equipment, and described second thin plate 224 is arranged at the non-visible area of electronic equipment.Described first thin plate 223 is provided with the 3rd surface 2230 and the 4th surface 2232 be oppositely arranged.Described second thin plate 224 is provided with the 5th surface 2240 and the 6th surface 2242 be oppositely arranged.Described fingerprint recognition module 25 comprises flexible PCB 252, fingerprint sensor 253, control element 255.Fingerprint sensor 253 is arranged at the non-visible area of described fingerprint identification device 20.
Difference is, in the present embodiment, described fingerprint sensor 253 directly fits in the 4th surface 2232 of thin plate 223 described in first.
In the present embodiment, by the 4th surface 2232 of the first thin plate 223 that described fingerprint sensor 253 is directly fitted, thus reduce fingerprint sensor 253 and user point between air line distance, be convenient to user and carry out fingerprint induction, identification by the 3rd surface 2230 of described first thin plate 223 of touch to make described fingerprint recognition module 25.
As shown in Figure 5, the third embodiment of the present invention provides a kind of electronic equipment being provided with fingerprint identification device 30, and it is roughly the same with the first embodiment, and fingerprint identification device 30 comprises cover component 32, fingerprint recognition module 35.Described electronic equipment is also provided with display element 100.Described cover component 32 comprises the first thin plate 323 and the second thin plate 324 of substrate 322 and attaching and substrate 322, and the thickness of described first thin plate 323 and the second thin plate 324 is less than the thickness of substrate 322.Described substrate 322 be provided be oppositely arranged first surface 3220, second surface 3222, be connected to the side 2223 of first surface 2220 and second surface 2222.Described first thin plate 323 is provided with the 3rd surface 3230 and the 4th surface 3232 be oppositely arranged.Described second thin plate 324 is provided with the 5th surface 3240 and the 6th surface 3242 be oppositely arranged.
Described fingerprint recognition module 35 comprises flexible PCB 352, fingerprint sensor 353, control element 355.Bonding coat 37 is provided with between substrate 322 and the first thin plate 323, second thin plate 324.Fingerprint sensor 353 is arranged at the non-visible area of described fingerprint identification device 30.
Difference is, in the present embodiment, described fingerprint identification device 30 is also provided with at least one deck color layers 39, described color layers 39 comprises at least one deck color ink layer or BM (Black Matrix, black matrix") layer be coated on described substrate 322 and/or described second thin plate 324.Be understandable that, described color layers 39 can be formed at first surface 3220 and/or the second surface 3222 of described substrate 322, or is formed at the 5th surface 3240 and/or the 6th surface 3242 of described second thin plate 324.
Described color layers 39 is for blocking all kinds of device, thus the electronic equipment making fingerprint identification device 30 and be provided with this fingerprint identification device 30 has good appearance.
Further, described color layers 39 is identical with the color of the protective seam on described fingerprint sensor 353 surface.Described color layers 39 of the present invention can be formed at any side of described cover component.The present invention is by being arranged at the non-visible area of cover component by described color layers 39, thus block fingerprint identification device 30 or be provided with the touch screen of fingerprint identification device 30, the electronic component of electronic equipment, thus make fingerprint identification device 30 or be provided with the touch screen of fingerprint identification device 30, electronic equipment has good outward appearance.
The present invention also provides a kind of touch-screen comprising fingerprint identification device, adopts fingerprint identification device as above, and forms touch-control sensing layer (not shown) on the substrate, thus realizes the touch control operation of user.
The present invention also provides a kind of electronic equipment for fingerprint recognition sensing, comprises display element and fingerprint identification device as above, and the cover component subregion of described fingerprint identification device is transparent and fit in described display element.
Further, in another embodiment of the invention, described electronic equipment is provided with visible area and non-visible area, and described electronic equipment is provided with fingerprint identification device as above, and the fingerprint sensor of described fingerprint identification device is arranged in the non-visible area of described electronic equipment.Described substrate is visible area, cover part at least.
In describing the invention, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " axis ", " radial direction ", orientation or the position relationship of the instruction such as " circumference " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore limitation of the present invention can not be interpreted as.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In describing the invention, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or integral; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be that the first and second features directly contact, or the first and second features are by intermediary indirect contact.And, fisrt feature second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " can be fisrt feature immediately below second feature or tiltedly below, or only represent that fisrt feature level height is less than second feature.
In the description of this instructions, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in one or more embodiment in office or example in an appropriate manner.In addition, when not conflicting, the feature of the different embodiment described in this instructions or example and different embodiment or example can carry out combining and combining by those skilled in the art.
Above disclosedly be only a kind of preferred embodiment of the present invention, certainly the interest field of the present invention can not be limited with this, one of ordinary skill in the art will appreciate that all or part of flow process realizing above-described embodiment, and according to the equivalent variations that the claims in the present invention are done, still belong to the scope that invention is contained.
Claims (40)
1. a fingerprint identification device, is characterized in that, comprising:
One cover component, described cover component comprises a substrate, and the first thin plate be attached on described substrate and the second thin plate; Described substrate be provided with arrange towards described cover plate first surface, with the opposing second surface of described first surface, the side being connected to described first surface and second surface; Described first thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface, and described second thin plate is provided with towards the 6th surface of described substrate and five surface relative with described 6th surface;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor is configured to the fingerprint of sensing user finger; Described at least one control element is configured to control described fingerprint sensor;
The flexible PCB being provided with at least one fingerprint sensor extends to the second surface of described substrate from the side through described substrate between described substrate and described second thin plate; Described fingerprint sensor is fixed between described second thin plate and substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate.
2. fingerprint identification device as claimed in claim 1, is characterized in that, described cover component is formed at least one deck color layers.
3. fingerprint identification device as claimed in claim 2, it is characterized in that, described color layers comprises at least one deck color ink layer or BM layer.
4. fingerprint identification device as claimed in claim 3, it is characterized in that, described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or in the 5th surface of described second thin plate or the 6th surface one.
5. fingerprint identification device as claimed in claim 1, it is characterized in that, described first thin plate and the second gauge of sheet are less than or equal to 150 μm.
6. the fingerprint identification device according to any one of claim 1 to 5, is characterized in that, the fingerprint sensor of described fingerprint recognition module is positioned in the position pointed closer to described user than described flexible PCB.
7. the fingerprint identification device according to any one of claim 1 to 5, is characterized in that, the fingerprint sensor of described fingerprint recognition module directly fits in the 6th surface of described second thin plate.
8. the fingerprint identification device according to any one of claim 1 to 5, it is characterized in that, described fingerprint identification device is also provided with bonding coat, described bonding coat is arranged between described substrate and described first thin plate and/or the second thin plate, and described bonding coat is used for described substrate and described first thin plate and/or the second thin plate mutually to combine closely.
9. fingerprint identification device as claimed in claim 8, is characterized in that, described bonding coat also covers the fingerprint sensor of described fingerprint recognition module and at least part of flexible PCB.
10. fingerprint identification device as claimed in claim 8, it is characterized in that, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
11. fingerprint identification devices as claimed in claim 8, is characterized in that, described bonding coat adopts Optical transparent adhesive.
12. fingerprint identification devices as claimed in claim 1, is characterized in that, any one in described substrate employing glass, sapphire, transparent resin is made; Described first thin plate and the second thin plate adopt in glass, sapphire, transparent resin any one make.
13. 1 kinds of touch-screens comprising fingerprint identification device, described touch-screen is provided with visible area and non-visible area, it is characterized in that, comprising:
One cover component, described base component comprises a substrate, and the first thin plate be attached on described substrate and the second thin plate; Described first thin plate is arranged at the visible area of described touch-screen, and described second thin plate is arranged at the non-visible area of described touch-screen; Described substrate is provided with the first surface arranged towards described cover plate, the second surface relative with described first surface, is connected to the side of described first surface and second surface, described first thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface, and described second thin plate is provided with towards the 6th surface of described substrate and five surface relative with described 6th surface;
Be connected with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor be arranged at touch-screen non-visible area and be configured to sensing user finger fingerprint; At least one control element is configured to control described fingerprint sensor;
The flexible PCB being provided with at least one fingerprint sensor extends to the second surface of described substrate from the side through described substrate between described substrate and described second thin plate; Described fingerprint sensor is fixed between described second thin plate and described substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate;
Wherein said substrate is formed touch-control sensing layer.
14. touch-screens as claimed in claim 13, it is characterized in that, described control element is arranged at the second surface of described substrate.
15. touch-screens as claimed in claim 13, is characterized in that, at least one fingerprint sensor described comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.
16. touch-screens as claimed in claim 13, is characterized in that, described base component is formed at least one deck color layers.
17. touch-screens as claimed in claim 16, is characterized in that, described color layers comprises at least one deck color ink layer or BM layer.
18. touch-screens as claimed in claim 17, it is characterized in that, described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, described second thin plate the 5th surface or the 6th surface in one.
19. touch-screens as claimed in claim 13, it is characterized in that, described first thin plate and the second gauge of sheet are less than or equal to 150 μm.
20. touch-screens according to any one of claim 13 to 19, it is characterized in that, described fingerprint sensor is positioned in the position pointed closer to described user than described flexible PCB.
21. touch-screens according to any one of claim 13 to 19, is characterized in that, described fingerprint sensor directly fits in the 6th surface of described second thin plate.
22. touch-screens according to any one of claim 13 to 19, it is characterized in that, described touch-screen is also provided with bonding coat, described bonding coat is arranged between described substrate and described first thin plate and/or the second thin plate, and described bonding coat is used for described substrate and described first thin plate and/or the second thin plate mutually to combine closely.
23. touch-screens as claimed in claim 22, is characterized in that, described bonding coat also covers the fingerprint sensor of described fingerprint recognition module and at least part of flexible PCB.
24. touch-screens as claimed in claim 22, is characterized in that, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
25. touch-screens as claimed in claim 22, is characterized in that, described bonding coat adopts Optical transparent adhesive.
26. touch-screens as claimed in claim 13, is characterized in that, any one in described substrate employing glass, sapphire, transparent resin is made; Described first thin plate and the second thin plate adopt in glass, sapphire, transparent resin any one make.
27. 1 kinds of electronic equipments for fingerprint recognition sensing, described electronic equipment is provided with visible area and non-visible area, it is characterized in that, described electronic equipment comprises:
Be arranged at a display element of visible area at least partly;
Cover component; Fit with described at least one display element;
Described cover component subregion is transparent, and described base component comprises a substrate, and the first thin plate be attached on described substrate and the second thin plate; Described first thin plate is arranged at the visible area of described touch-screen, described second thin plate is arranged at the non-visible area of described touch-screen, described substrate is provided with the first surface arranged towards described cover plate, the second surface relative with described first surface, is connected to the side of described first surface and second surface, described first thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface, and described second thin plate is provided with towards the 6th surface of described substrate and five surface relative with described 6th surface;
Be connected with a flexible PCB of at least one control element and at least one fingerprint sensor, described at least one fingerprint sensor be arranged at described electronic equipment visible area and be configured to sensing user finger fingerprint; At least one control element is configured to control described fingerprint sensor;
The flexible PCB being provided with at least one fingerprint sensor extends to the second surface of described substrate from the side through described substrate between described substrate and described second thin plate; Described fingerprint sensor is fixed between described second thin plate and substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate.
28. electronic equipments as claimed in claim 27, is characterized in that, described fingerprint sensor comprises one group of capacitive element of the user fingerprints that can be coupled to user's finger in a capacitive manner.
29. electronic equipments as claimed in claim 27, is characterized in that, at least one fingerprint sensor described comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.
30. electronic equipments as claimed in claim 27, it is characterized in that, the substrate of described cover component directly fits in described display element, and described control element is arranged between described cover component and described display element.
31. electronic equipments as claimed in claim 27, is characterized in that, described base component is formed at least one deck color layers.
32. electronic equipments as claimed in claim 31, is characterized in that, described color layers comprises at least one deck color ink layer or BM layer.
33. electronic equipments as claimed in claim 32, it is characterized in that, described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, described second thin plate the 5th surface or the 6th surface in one.
34. electronic equipments as claimed in claim 27, it is characterized in that, described first thin plate and the second gauge of sheet are less than or equal to 150 μm.
35. electronic equipments as claimed in claim 27, it is characterized in that, described fingerprint sensor is positioned in the position pointed closer to described user than described flexible PCB.
36. electronic equipments as claimed in claim 27, is characterized in that, described fingerprint sensor directly fits in the 6th surface of described second thin plate.
37. electronic equipments as claimed in claim 27, it is characterized in that, described electronic equipment is also provided with bonding coat, described bonding coat is arranged between described substrate and described first thin plate and/or the second thin plate, and described bonding coat is used for described substrate and described first thin plate and/or the second thin plate mutually to combine closely.
38. electronic equipments as claimed in claim 37, is characterized in that, described bonding coat also covers the fingerprint sensor of described fingerprint recognition module and at least part of flexible PCB.
39. electronic equipments as claimed in claim 37, is characterized in that, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
40. electronic equipments as claimed in claim 27, is characterized in that, any one in described substrate employing glass, sapphire, transparent resin is made; Described first thin plate and/or the second thin plate adopt in glass, sapphire, transparent resin any one make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510100141.5A CN104751125A (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, touch screen and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510100141.5A CN104751125A (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, touch screen and electronic equipment |
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| CN104751125A true CN104751125A (en) | 2015-07-01 |
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| CN201510100141.5A Pending CN104751125A (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, touch screen and electronic equipment |
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| CN105930799A (en) * | 2016-04-21 | 2016-09-07 | 蓝思科技（长沙）有限公司 | Fingerprint recognition module group and preparation method thereof |
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