CN104751127A - Fingerprint identification device, touch screen and electronic equipment - Google Patents
Fingerprint identification device, touch screen and electronic equipment Download PDFInfo
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- CN104751127A CN104751127A CN201510100162.7A CN201510100162A CN104751127A CN 104751127 A CN104751127 A CN 104751127A CN 201510100162 A CN201510100162 A CN 201510100162A CN 104751127 A CN104751127 A CN 104751127A
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Abstract
The invention provides a fingerprint identification device. The fingerprint identification device comprises a cover plate element, a base plate and a thin plate attached on the base plate, wherein the thickness of the thin plate is smaller than that of the base plate; at least one color layer is formed on the cover plate element; a flexible circuit board is provided with at least one control element and at least one fingerprint sensor; the at least one fingerprint sensor is configured to sense fingerprints of fingers of a user; the at least one control element is configured to control the fingerprint sensor; the at least one fingerprint sensor is fixedly arranged between the thin plate and the base plate, so that the at least one fingerprint sensor is mounted at the position which is closer to the fingers of the user than the base plate. According to the fingerprint identification device, the base plate is provided with the color layer so that a flat appearance without an opening is formed.
Description
Technical field
The present invention relates to fingerprint identification technology field, particularly relate to a kind of fingerprint identification device, touch-screen and electronic equipment.
Background technology
With development in science and technology, fingerprint identification device applies to all kinds of portable mobile termianl more and more widely.As an existing class is provided with the smart mobile phone of fingerprint identification device, user realizes the functions such as mobile phone unblock, fingerprint recognition payment by described fingerprint identification device.
Existing electronic product, if the mobile terminal such as mobile phone, panel computer is in order to realize fingerprint identification function, need to punch in its touch cover, and adopt LGA (Land Grid Array, Background Grid array packages) encapsulation technology electronic equipment cover plate punching place laminating fingerprint sensor, then through hole is offered to expose the touch-control sensing region of fingerprint sensor in the surface of the direct cover plate at mobile terminal, so that described fingerprint sensor can carry out fingerprint detection.But, through hole is offered to the surface of the cover plate of mobile terminal and easily causes through hole stress to increase, thus cause cover-plate glass intensity to decline.For ensureing the cover plate intensity of mobile terminal, drilling technology is complicated, and cost is higher.
If directly arrange at least one fingerprint Identification sensor module under the touch cover of electronic equipment (mobile phone, panel computer etc.).Because electronic equipment cover plate is as user's inputting interface, often accept the user behaviors such as user mobile phone touch-control pressing, therefore electronic equipment needs stronger rigid, and electronic equipment cover sheet thickness this kind of is at present greater than more than 300 microns, the coverage of current finger face and fingerprint Identification sensor is less than 100 microns.This distance is far beyond the finger face of user and the distance coverage of fingerprint Identification sensor, cause fingerprint Identification sensor inefficacy and None-identified user points line paddy ridge and forms fingerprint pattern, therefore there are two technical barriers of urgently capturing in this field: the distance one, reducing finger face and fingerprint Identification sensor; Two, the intensity strengthening the electromagnetic field of fingerprint sensor can make its intensity penetrate 300 microns with upper cover plate.
Summary of the invention
There is provided that a kind of intensity is better, fingerprint induction be sensitive, the fingerprint identification device of flat appearance, touch-screen and electronic equipment.
A kind of fingerprint identification device, comprising:
One cover component; Comprise a substrate, and be attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of described substrate, described cover component is formed at least one deck color layers; Described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor is configured to the fingerprint of sensing user finger; Described at least one control element is configured to control described fingerprint sensor;
Described at least one fingerprint sensor is fixed between described thin plate and substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate.
Further, described color layers comprises at least one deck color ink layer or BM layer, and described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described thin plate the 3rd surface or the 4th surface in one.
Further, described color layers covers described flexible PCB and is arranged between described flexible PCB and described substrate.
Further, at least one through slot offered by described substrate, and what be provided with the flexible PCB of at least one fingerprint sensor passes described at least one through slot at least partly.
Further, the groove width of described through slot is slightly larger than the thickness of described flexible PCB.
Further, described substrate is provided with side, is provided with the flexible PCB of at least one fingerprint sensor from the second surface extending to described substrate between described substrate and described thin plate through the side of described substrate.
Further, described gauge of sheet is less than or equal to 150 μm.
Further, described fingerprint sensor is positioned in the position pointed closer to described user than described flexible PCB.
Further, described fingerprint sensor directly fits in the 4th surface of described thin plate.
Further, described fingerprint identification device is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
Further, described bonding coat also covers described fingerprint sensor and at least part of flexible PCB.
Further, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
Further, described bonding coat adopts Optical transparent adhesive.
Further, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
Comprise a touch-screen for fingerprint identification device, comprising:
One cover component; Comprise a substrate, and be attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, described cover component is formed at least one deck color layers; Described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor is configured to the fingerprint of sensing user finger; Described at least one control element is configured to control described fingerprint sensor;
Described at least one fingerprint sensor is fixed between described thin plate and substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate;
Wherein said substrate is formed touch-control sensing layer.
Further, described control element is arranged at the second surface of described substrate.
Further, at least one fingerprint sensor described comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.
Further, described color layers is formed at first surface or the second surface of described substrate, or described thin plate the 3rd surface or the 4th surface in one.
Further, described color layers comprises at least one deck color ink layer or BM layer.
Further, at least one through slot offered by described substrate, and what be provided with the flexible PCB of at least one fingerprint sensor passes described at least one through slot at least partly.
Further, described substrate is provided with side, is provided with the flexible PCB of at least one fingerprint sensor from the second surface extending to described substrate between described substrate and described thin plate through the side of described substrate.
Further, the thickness of described substrate is more than or equal to described gauge of sheet.
Further, described gauge of sheet is less than or equal to 150 μm.
Further, described fingerprint sensor is positioned in the position pointed closer to described user than described flexible PCB.
Further, described fingerprint sensor directly fits in the 4th surface of described thin plate.
Further, described touch-screen is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
Further, described bonding coat also covers described fingerprint sensor and at least part of flexible PCB.
Further, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
Further, described bonding coat adopts Optical transparent adhesive.
Further, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
For an electronic equipment for fingerprint recognition sensing, described electronic equipment comprises:
At least one display element;
Cover component; Fit with described at least one display element;
Described cover component subregion is transparent, comprises a substrate further, and is attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, described cover component is formed at least one deck color layers; Described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor is configured to the fingerprint of sensing user finger; Described at least one control element is configured to control described fingerprint sensor;
Described at least one fingerprint sensor is fixed between described thin plate and substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate.
Further, described fingerprint sensor comprises one group of capacitive element of the user fingerprints that can be coupled to user's finger in a capacitive manner.
Further, at least one fingerprint sensor described comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.
Further, the substrate of described cover component directly fits in described display element, and described control element is arranged between described cover component and described display element.
Further, at least one through slot offered by described substrate, and what be provided with the flexible PCB of at least one fingerprint sensor passes described at least one through slot at least partly.
Further, described substrate is provided with side, is provided with the flexible PCB of at least one fingerprint sensor from the second surface extending to described substrate between described substrate and described thin plate through the side of described substrate.
Further, described color layers comprises at least one deck color ink layer or BM layer, and described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described thin plate the 3rd surface or the 4th surface in one.
Further, described gauge of sheet is less than or equal to 150 μm.
Further, described fingerprint sensor is positioned in the position pointed closer to described user than described flexible PCB.
Further, described fingerprint sensor directly fits in the 4th surface of described thin plate.
Further, described fingerprint identification device is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
Further, described bonding coat also covers described fingerprint sensor and at least part of flexible PCB.
Further, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
Further, described bonding coat adopts Optical transparent adhesive.
Further, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
For an electronic equipment for fingerprint recognition sensing, described electronic equipment is provided with visible area and non-visible area, and described electronic equipment comprises:
Be arranged at a display element of visible area at least partly;
Be arranged at a fingerprint identification device of described non-visible area at least partly;
Described fingerprint identification device comprises:
One cover component, fits in described display element; Described cover component comprises a substrate, and is attached at the thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, described cover component is formed the color layers that at least one deck is arranged at the non-visible area of described electronic equipment;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor is arranged at the non-visible area of electronic equipment, and it is configured to the fingerprint of sensing user finger; Described at least one control element is configured to control described fingerprint sensor;
Described at least one fingerprint sensor is fixed between described thin plate and substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate.
Fingerprint identification device of the present invention by arranging thin plate on substrate, thus is formed smooth astomous smooth.Make the mobile terminal that this fingerprint identification device is set have complete, good outward appearance and intensity, not only can avoid the perforate of mobile terminal appearance and cause stress concentrate, intensity decline, be convenient to user simultaneously and carry out touch-control and viewing.And fingerprint identification device of the present invention arranges color layers, be fingerprint identification device and the touch-screen being provided with this fingerprint identification device, electronic equipment has good outward appearance.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of a kind of fingerprint identification device that first embodiment of the invention provides;
Fig. 2 is the structural representation of fingerprint identification device under another visual angle described in Fig. 1;
Fig. 3 is the close-up schematic view of the fingerprint identification device described in Fig. 1;
Fig. 4 is the diagrammatic cross-section of a kind of fingerprint identification device that first embodiment of the invention provides;
Fig. 5 is the diagrammatic cross-section of a kind of fingerprint identification device that second embodiment of the invention provides;
Fig. 6 is the structural representation of a kind of fingerprint identification device that third embodiment of the invention provides
Fig. 7 is the structural representation of a kind of fingerprint identification device that fourth embodiment of the invention provides;
Fig. 8 is the structural representation of a kind of fingerprint identification device that fifth embodiment of the invention provides;
Fig. 9 is the structural representation of fingerprint identification device under another visual angle described in Fig. 8;
Figure 10 is the close-up schematic view of the fingerprint identification device described in Fig. 8;
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
The invention provides a kind of fingerprint identification device and mobile terminal.Fingerprint identification device according to the embodiment of the present invention can be applied to the mobile terminals such as mobile phone, panel computer, notebook computer, media player, also the financial terminal equipments such as ATM (Automatic Teller Machine) (Automated Teller Machine, ATM) can be applied to.
Refer to Fig. 1 to Fig. 4, first embodiment of the invention provides a kind of fingerprint identification device 10 and is provided with the electronic equipment of this fingerprint identification device 10, and described electronic equipment comprises fingerprint identification device 10 and display element 100.The fingerprint recognition module 15 that described fingerprint identification device 10 comprises cover component 12 and depends on described cover component 12.Described cover component 12 is covered on display element 100.
Described cover component 12 comprises substrate 122 and is attached at the thin plate 123 on described substrate 122, and the thickness of described thin plate 123 is less than the thickness of substrate 122.
Described substrate 122 comprises first surface 1220 and the second surface 1222 relative with first surface 1220, and described thin plate 123 comprises the 3rd surface 1230 and four surface 1232 relative with the 3rd surface.Described substrate 122 by glue laminating in the mutual stacked setting of described thin plate 123, the first surface 1220 of described substrate 122 is oppositely arranged with the 4th surface 1232 of described thin plate 123, the second surface 1222 of described substrate 122 and the 3rd surface 1230 opposing settings of described thin plate 123.Described fingerprint recognition module 15 is arranged at described substrate 122, and described thin plate 123 covers described fingerprint recognition assembly and at least substrate 122 described in cover part.
In the present embodiment, described substrate 122 and described thin plate 123 cover component 12 forming electronic equipment bonded to each other, thus the types of functionality for coordinating the miscellaneous part of electronic equipment to realize electronic equipment.Described substrate 122 and described thin plate 123 can be used as the operation interface that the display interface protective device of electronic equipment or user input.As described in thin plate 123 with as described in substrate 122 user that can be used as electronic equipment carry out the display screen watched; Meanwhile, the user that described thin plate 123 and described substrate 122 also can be used as electronic equipment carries out the touch screen of touch control operation.Be understandable that, described fingerprint identification device 10 can arrange the back side being formed at electronic equipment, and substrate 122 and the thin plate 123 of described fingerprint identification device 10 can form the backboard of electronic equipment jointly.
Substrate 122 in the present invention can adopt in transparent glass, sapphire, transparent resin any one make, described thin plate 123 can adopt in glass, sapphire, transparent resin any one make.Preferably, described substrate 122 can adopt sapphire material to make.Secondary choosing, described substrate 122 also can adopt the tempered glass of Corning Incorporated to make.The thickness of described substrate can be less than or equal to 400 μm, and preferably, the thickness of described substrate 122 can be 300 μm to 400 μm.
Preferably, described thin plate 123 can adopt sapphire material to make.Secondary choosing, described thin plate 123 also can adopt the tempered glass of Corning Incorporated to make.The thickness of described substrate can be less than or equal to 150 μm, and preferably, the thickness of described substrate 122 is less than or equal to 100 μm.
Be understandable that, described substrate 122 can adopt identical or different material to make with thin plate 123, as substrate 122 and thin plate 123 can all adopt sapphire material or glass material to make, also can adopt sapphire and glass combination etc.
When described substrate 122 all adopts glass to make with thin plate 123, described substrate 122 can adopt tempered glass to make, and thin plate 123 can adopt simple glass to make.
In the present embodiment, described fingerprint recognition module 15 comprises flexible PCB 152, fingerprint sensor 153, control element 155.Fingerprint sensor 153 is located between thin plate 123 and substrate 122 at least partly, when user carries out fingerprint recognition authentication operations at described electronic equipment, the finger print face of user and the distance of fingerprint sensor 153 are about d, and the thickness of described thin plate 123 is approximately described distance d, therefore at the thin plate 123 adopting same material, its thickness is thinner, then the accuracy of its fingerprint recognition, discrimination are higher.
When the fingerprint sensor 153 of described fingerprint recognition module 15 adopts capacitance type sensor, by arranging thinner thin plate 123 thickness, make the distance in fingerprint sensor and user's finger print face shorter, thus ensure the fingerprint sensing effect of described fingerprint sensor 154.Further, the present invention is by arranging the thickness of substrate 122 and thin plate 123, make the integral thickness of the cover component 12 of electronic equipment below 500 μm, and then make the cover component 12 of electronic equipment can meet its demand as the rigid of touch-control inputting interface, electronic equipment thickness can not be increased again.Make electronic equipment cover component not in borehole situation, also dexterously fingerprint sensor 153 can be embedded among cover component 12 and solve technical matters of the present invention.
Described fingerprint sensor 153 for carrying fingerprint sensor 153 and control element 155, and is electrically connected with control element 155 by flexible PCB 152.The base material of described flexible PCB 152 can adopt Kapton (Polyimide film, PI film) to make; Further, the base material of described flexible PCB 152 can adopt two layers of polyimide resin (Polyimide resin, PI resin) to form, and it also can be made up of the protective seam resin of one deck polyimide base material in conjunction with other materials of one deck.The present invention is not as limit.
Described fingerprint sensor 153 is formed on described flexible PCB 152 one end, fingerprint sensor 153 for finger sensing to the pressing of described thin plate 123 and gather user finger finger print information.In the present embodiment, described fingerprint sensor 153 can adopt hyperchannel fingerprint sensor 153.Be understandable that, described fingerprint sensor 153 can arrange sensing circuit to carry out fingerprint collecting and simulating signal generation, and described fingerprint sensor 153 can be encapsulated in single in-line packages (single in-line, SiP).Described fingerprint sensor 153 also can adopt single chips and protect by filling colloid.Described sensing circuit can be packaged in epoxy resin or other elastomeric material, makes described sensing circuit to obtain Reasonable Protection, avoids being damaged by collision during assembling.In the present embodiment, described fingerprint sensor 153 is positioned in the position pointed closer to described user than described flexible PCB 152.Described fingerprint sensor 153 comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.The present invention by covering thin plate 122 on fingerprint sensor 153, thus makes fingerprint identification device 40 have good, smooth outward appearance, and can ensure that fingerprint identification device 40 has higher fingerprint recognition precision, user-friendly.
Further, described fingerprint sensor 153 can adopt optical fingerprint sensor, capacitive fingerprint sensing device, piezoelectricity fingerprint sensor or ultrasonic fingerprint sensor.Described fingerprint sensor 153 can adopt the scratching formula sensor of the distribution in strip type, also can be the push type sensor of the distribution in array.Described fingerprint sensor 153 also can adopt other devices that can respond to user's fingerprint, identify, does not repeat them here.
Further, the surface of described fingerprint sensor 153 also can form protective seam (not shown).Described protective seam is formed at the top of fingerprint recognition module 15, with to fingerprint recognition module 15, especially protects fingerprint sensor 153.Protective seam passes through spraying technology or printing technology or vacuum evaporation technology and is formed; its material such as comprises UV curing type PMMA glue (ultraviolet curing transparent glue), thermohardening type PMMA glue or diamond like carbon (Diamond-likeCarbon; DLC), wherein DLC adopts plated film mode to form protective seam.In certain embodiments; protective seam can also be formed by the material of glass, pottery, sapphire, quartz or other durables, the organic films such as such as polymethylmethacrylate (PMMA), polyethylene terephthalate (PET), polyimide (PI).Be understandable that, described protective seam can be set to individual layer, also can be set to multilayer.
Described control element 155 is electrically connected with flexible PCB 152.Described control element 155 can adopt control chip maybe can realize the control circuit of controlling functions, as application-specific IC (ApplicationSpecific Integrated Circuits, ASIC).
Described control element 155 can adopt any suitable prior art with the electric connection mode of described flexible PCB 152.As the control element 155 in the present invention can adopt bonding wire, through-silicon via structure or upside-down mounting mode to be electrically connected on flexible PCB 152, the present invention is not as limit.
Fingerprint sensor 153 and the control element 155 of the fingerprint recognition module 15 of fingerprint identification device 10 of the present invention are not packaged in the integral type encapsulating structure in same chip, but be arranged at the homonymy of flexible PCB 152 independently of one another, discretely, and be electrically connected with flexible PCB 152 respectively.Control element 155 is electrically connected with fingerprint sensor 153 by flexible PCB 152, thus the Signal transmissions of fingerprint sensor 153 is processed in control element 155.
Fingerprint recognition module 15, described fingerprint recognition module 15 identifies for carrying out induction to fingerprint.Be understandable that, the constitution and principle of described fingerprint recognition module 15 can adopt any suitable prior art, does not repeat them here.
In the present embodiment, described fingerprint identification device 10 is provided with at least one deck color layers 19, and described color layers 19 is formed at described base component 12.In the present embodiment, described color layers 19 fits in the 4th surface 1232 of described cover plate 123.Described color layers 19 is for blocking all kinds of devices of first surface 1220 side of described substrate 122, thus the mobile terminal making fingerprint identification device 10 and be provided with this fingerprint identification device 10 has good appearance.
Further, described color layers 19 can apply or be sprayed at first surface 1220 and/or the second surface 1222 of substrate 122; Described color layers 19 also can be coated on the 3rd surface 1230 and/or the 4th surface 1232 of thin plate 123.Described color once 19 comprised at least one deck color ink layer or BM (Black Matrix, black matrix") layer.
Be understandable that, by described color layers 19 being coated on the non-visible area of described fingerprint identification device 10, thus block fingerprint identification device 10 or be provided with the touch screen of fingerprint identification device 10, the electronic component of electronic equipment, thus make fingerprint identification device 10 or be provided with the touch screen of fingerprint identification device 10, electronic equipment has good outward appearance.
Further, described color layers 19 is identical with the color of the protective seam on described fingerprint induction chip 153 surface.
Described fingerprint recognition module 15 can adopt various ways to be arranged at described base component 12.In the present embodiment, described substrate 122 offers through slot 1225, is provided with the flexible PCB 152 of fingerprint sensor 153 one end through described through slot 1225, and is bonded in by glue on the first surface on substrate.The sensitive surface of fingerprint sensor 153 is towards thin plate 123, and flexible PCB 152 depends on the one end being provided with fingerprint sensor 153 and is clipped between described thin plate 123 and described substrate 122; At least one fingerprint sensor 153 described is made to be positioned in the position pointed closer to described user than described substrate 122.User is when doing the input of fingerprint recognition authentication, and the distance of its finger print face and fingerprint sensor 153 is suitable with described gauge of sheet, ensures the reliability of fingerprint sensor 153 like this.
The groove width of described through slot 1225, slightly larger than the thickness of described flexible PCB 152, makes described flexible PCB 152 be arranged in described through slot 1225 and is also firmly arranged in through slot 1225.
The one end being provided with the flexible PCB 152 of control element 155 is bonded on described substrate 122 first surface 1220, flexible circuit board 152 is provided with connector (not shown), described flexible circuit board 152 is electrically connected with the mainboard (not shown) of electronic equipment by described connector.Be understandable that, the shape of described through slot 1225 can adopt bar shaped, and its size can be adaptive with described flexible PCB 152.Described through slot 1225 also can adopt circle or other suitable shapes, only need ensure that it can pass for flexible PCB 152.
Substrate 122 in the present embodiment carries the fingerprint sensor 153 of fingerprint recognition module 15 by its first surface 1220, and is convenient to the setting of flexible PCB 152 by the through slot 1225 being opened in described substrate 122.
As shown in Figure 1, the through slot 1225 of described substrate 122 can perpendicular to the plane at described substrate 122 place.The through slot 1225 of described substrate 122 also can relative to the planar tilt at described substrate 122 place, thus is convenient to described flexible PCB 152 and is arranged in described through slot 1225.
Fingerprint identification device 10 in the present embodiment by arranging thin plate 123 on a substrate 122, thus is formed smooth astomous smooth.Make the mobile terminal that this fingerprint identification device 10 is set have complete, good outward appearance and intensity, not only can avoid the perforate of mobile terminal appearance and cause stress concentrate, intensity decline, be convenient to user simultaneously and carry out touch-control and viewing.And the fingerprint identification device 10 in the present embodiment passes through to offer through slot 1225 on a substrate 122 thus the setting being convenient to flexible PCB 152 and upper device thereof, ensure that fingerprint identification device 10 has thinner thickness, be beneficial to the fingerprint recognition precision promoting fingerprint identification device 10.
Further, fingerprint identification device 10 of the present invention is also provided with bonding coat 17 between described substrate 122 and thin plate 123, for mutually being combined closely with thin plate 123 by described substrate 122.Described bonding coat 17 can adopt optical clear resin (Optical Clear Resin, OCR) or optical adhesive tape (Optical Clear Adhesive, OCA).
Further, described bonding coat 17 covers the fingerprint sensor 153 of described fingerprint recognition module 15 or is covered to small part flexible PCB 152.
In the present embodiment, described bonding coat 17 can be covered in the side that described flexible PCB 152 is provided with described fingerprint sensor 153.Namely, described fingerprint sensor 153 is arranged at the side of described flexible PCB 152 towards the 4th surface 1232 of described thin plate 123, described bonding coat 17 is covered in the side of described flexible PCB 152 towards the 4th surface 1232 of described thin plate 123, and covers described fingerprint sensor 153 and/or at least part of flexible PCB 152.
Described bonding coat 17 also can be covered in the side that described flexible PCB 152 does not arrange fingerprint sensor 153.That is, described fingerprint sensor 153 is arranged at the side of described flexible PCB 152 towards the 4th surface 1232 of described thin plate 123; Described bonding coat 17 is covered in the side of described flexible PCB 152 towards the first surface 1220 of described substrate 122, and described bonding coat 17 at least flexible PCB 152 described in cover part.
Described bonding coat 17 not only can strengthen the strength of joint between described substrate 122 and described thin plate 123, also can be convenient to described fingerprint recognition module 15 and stably be arranged between described substrate 122 and described thin plate 123.Further, described bonding coat 17 can be used for strengthening the strength of joint between described fingerprint sensor 153 and described flexible PCB 152.And, when described bonding coat 17 is arranged between flexible PCB 152 and described substrate 122, can not increase described fingerprint sensor 153 to described thin plate 123 the 3rd surface 1230 between thickness, and then the sensing accuracy of identification of described fingerprint sensor 153 can be ensured.
As shown in Figure 5, the second embodiment of the present invention provides a kind of electronic equipment being provided with fingerprint identification device 20, and it is roughly the same with the first embodiment, and described fingerprint identification device 20 comprises cover component, fingerprint recognition module 25.Described cover component comprises substrate 222 and is attached at the thin plate 223 of substrate, and the thickness of described thin plate 223 is less than the thickness of substrate 222.Described substrate 222 is provided with first surface 2220 and the second surface 2222 of opposing setting, and described thin plate 223 is provided with the 3rd surface 2230 and the 4th surface 2232 of opposing setting.Described fingerprint recognition module 25 comprises flexible PCB 252, fingerprint sensor 253, control element 255.Substrate 222 offers through slot 2225.Bonding coat 27 is provided with between substrate 222 and thin plate 223.Described cover component is provided with color layers 29.
Difference is, in the present embodiment, described color layers 29 is directly formed at the first surface 2220 of described substrate 222, the 4th surface 2232 of the direct attaching sheet 223 of described fingerprint induction chip 253.
In the present embodiment, by the 4th surface 2232 by direct for described fingerprint sensor 253 attaching sheet 223, thus reduce fingerprint sensor 253 and user point between air line distance, be convenient to user and carry out fingerprint induction, identification by the 3rd surface 2231 of the described thin plate 223 of touch to make described fingerprint recognition module 25.
As shown in Figure 6, the third embodiment of the present invention provides a kind of electronic equipment being provided with fingerprint identification device 30, and it is roughly the same with the first embodiment, and fingerprint identification device 30 comprises cover component 32, fingerprint recognition module 35.Described electronic equipment is also provided with display element 100.Described cover component 32 comprises substrate 322 and is attached at the thin plate 323 of substrate, and the thickness of described thin plate 323 is less than the thickness of substrate 322.Described substrate 322 is provided with first surface 3220 and the second surface 3222 of opposing setting, and described thin plate 323 is provided with the 3rd surface 3230 and the 4th surface 3232 of opposing setting.Described fingerprint recognition module 35 comprises flexible PCB 352, fingerprint sensor 353, control element 355.Substrate 322 offers through slot 3225.Bonding coat 37 is provided with between substrate 322 and thin plate 323.Described cover component is provided with color layers 39.
Difference is, in the present embodiment, described fingerprint identification device 30 is provided with two-layer color layers 39, and wherein one deck color layers 39 is formed at the 3rd surface 3220 of described substrate 322, and one deck color layers 39 is formed at the first surface 3220 of described thin plate 323 in addition.
As shown in Figure 7, the fourth embodiment of the present invention provides a kind of electronic equipment being provided with fingerprint identification device 40, and it is roughly the same with the first embodiment, comprises cover component 42, fingerprint recognition module 45.Described cover component 42 comprises substrate 422 and is attached at the thin plate 423 of substrate, and the thickness of described thin plate 423 is less than the thickness of substrate 422.Described substrate 422 is provided with first surface 4220 and the second surface 4222 of opposing setting, and described thin plate 423 is provided with the 3rd surface 4230 and the 4th surface 4232 of opposing setting.Described fingerprint recognition module 45 comprises flexible PCB 452, fingerprint sensor 453, control element 455.Substrate 422 offers through slot 4225.Bonding coat 47 is provided with between substrate 422 and thin plate 423.Described cover component is provided with color layers 49.
Difference is, in the present embodiment, described fingerprint identification device 30 is provided with two-layer color layers 39, wherein one deck color layers 39 is formed at the 3rd surface 3220 of described substrate 322 and covers described fingerprint induction chip 453, and one deck color layers 39 is formed at the first surface 3220 of described thin plate 323 in addition.
As shown in Fig. 8 to Figure 10, the fifth embodiment of the present invention provides a kind of fingerprint identification device 50, and it is roughly the same with the 4th embodiment, and fingerprint identification device 50 comprises cover component 52, fingerprint recognition module 55.Described electronic equipment is also provided with display element 100.Described cover component 52 comprises substrate 522 and is attached at the thin plate 523 of substrate, and the thickness of described thin plate 523 is less than the thickness of substrate 522.Described substrate 522 is provided with first surface 5220 and the second surface 5222 of opposing setting, and described thin plate 523 is provided with the 3rd surface 5230 and the 4th surface 5232 of opposing setting.Described fingerprint recognition module 55 comprises flexible PCB 552, fingerprint sensor 553, control element 555.Bonding coat 57 is provided with between substrate 522 and thin plate 523.Described cover component is provided with color layers 59.
Difference is, in the present embodiment, described thin plate 523 is also provided with the side 5223 being connected to described first surface 5220 and second surface 5222, the flexible PCB 552 of described fingerprint recognition module 55 is between the first surface 5220 and the 4th surface 5232 of described thin plate 523 of described substrate 522, and the side 5223 through described substrate 522 extends to the second surface 5222 of described substrate 522.
Described fingerprint sensor 553 is electrically connected on one end of described flexible PCB 552, and described fingerprint sensor is arranged between the first surface 5220 of described substrate 522 and the 4th surface 5232 of described thin plate 523; Described control element 555 is electrically connected on the other end of described flexible PCB 552, and second surface 512 side of substrate 522 described in described control element 555.
Described fingerprint identification device 50 arranges at least one deck color layers 59, and described color layers 59 is coated on described substrate 51 and/or described cover plate 53.Described color layers 59 is for blocking all kinds of devices of described substrate 51 first surface 511 side, thus the mobile terminal making fingerprint identification device 50 and be provided with this fingerprint identification device 50 has good appearance
The present invention also provides a kind of touch-screen comprising fingerprint identification device, adopts fingerprint identification device as above, and forms touch-control sensing layer (not shown) on the substrate, thus realizes the touch control operation of user.
The present invention also provides a kind of electronic equipment for fingerprint recognition sensing, comprises display element and fingerprint identification device as above, and the cover component subregion of described fingerprint identification device is transparent and fit in described display element.
Further, in another embodiment of the invention, described electronic equipment is provided with visible area and non-visible area, and described electronic equipment is provided with fingerprint identification device as above, and the fingerprint sensor of described fingerprint identification device is arranged in the non-visible area of described electronic equipment.Described substrate is visible area, cover part at least.
In describing the invention, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " axis ", " radial direction ", orientation or the position relationship of the instruction such as " circumference " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore limitation of the present invention can not be interpreted as.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In describing the invention, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or integral; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be that the first and second features directly contact, or the first and second features are by intermediary indirect contact.And, fisrt feature second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " can be fisrt feature immediately below second feature or tiltedly below, or only represent that fisrt feature level height is less than second feature.
In the description of this instructions, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in one or more embodiment in office or example in an appropriate manner.In addition, when not conflicting, the feature of the different embodiment described in this instructions or example and different embodiment or example can carry out combining and combining by those skilled in the art.
Above disclosedly be only a kind of preferred embodiment of the present invention, certainly the interest field of the present invention can not be limited with this, one of ordinary skill in the art will appreciate that all or part of flow process realizing above-described embodiment, and according to the equivalent variations that the claims in the present invention are done, still belong to the scope that invention is contained.
Claims (46)
1. a fingerprint identification device, is characterized in that, comprising:
One cover component; Comprise a substrate, and be attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of described substrate, described cover component is formed at least one deck color layers; Described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor is configured to the fingerprint of sensing user finger; Described at least one control element is configured to control described fingerprint sensor;
Described at least one fingerprint sensor is fixed between described thin plate and substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate.
2. fingerprint identification device as claimed in claim 1, it is characterized in that, described color layers comprises at least one deck color ink layer or BM layer, described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described thin plate the 3rd surface or the 4th surface in one.
3. fingerprint identification device as claimed in claim 1, it is characterized in that, described color layers covers described flexible PCB and is arranged between described flexible PCB and described substrate.
4. fingerprint identification device as claimed in claim 1, it is characterized in that, at least one through slot offered by described substrate, and what be provided with the flexible PCB of at least one fingerprint sensor passes described at least one through slot at least partly.
5. fingerprint identification device as claimed in claim 4, is characterized in that, the groove width of described through slot is slightly larger than the thickness of described flexible PCB.
6. fingerprint identification device as claimed in claim 1, it is characterized in that, described substrate is provided with side, is provided with the flexible PCB of at least one fingerprint sensor from the second surface extending to described substrate between described substrate and described thin plate through the side of described substrate.
7. fingerprint identification device as claimed in claim 1, it is characterized in that, described gauge of sheet is less than or equal to 150 μm.
8. the fingerprint identification device according to any one of claim 1 to 7, is characterized in that, the fingerprint sensor of described fingerprint identification device is positioned in the position pointed closer to described user than described flexible PCB.
9. the fingerprint identification device according to any one of claim 1 to 7, is characterized in that, the fingerprint sensor of described fingerprint identification device directly fits in the 4th surface of described thin plate.
10. the fingerprint identification device according to any one of claim 1 to 7, it is characterized in that, described fingerprint identification device is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
11. fingerprint identification devices as claimed in claim 10, is characterized in that, described bonding coat also covers the fingerprint sensor of described fingerprint identification device and at least part of flexible PCB.
12. fingerprint identification devices as claimed in claim 10, is characterized in that, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
13. fingerprint identification devices as claimed in claim 10, is characterized in that, described bonding coat adopts Optical transparent adhesive.
14. fingerprint identification devices as claimed in claim 1, is characterized in that, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
15. 1 kinds of touch-screens comprising fingerprint identification device, is characterized in that, comprising:
One cover component; Comprise a substrate, and be attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, described cover component is formed at least one deck color layers; Described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor is configured to the fingerprint of sensing user finger; Described at least one control element is configured to control described fingerprint sensor;
Described at least one fingerprint sensor is fixed between described thin plate and substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate;
Wherein said substrate is formed touch-control sensing layer.
16. touch-screens as claimed in claim 15, it is characterized in that, described control element is arranged at the second surface of described substrate.
17. touch-screens as claimed in claim 15, is characterized in that, at least one fingerprint sensor described comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.
18. touch-screens as claimed in claim 15, it is characterized in that, described color layers is formed at first surface or the second surface of described substrate, described thin plate the 3rd surface or the 4th surface in one.
19. touch-screens as claimed in claim 18, is characterized in that, described color layers comprises at least one deck color ink layer or BM layer.
20. touch-screens as claimed in claim 15, it is characterized in that, at least one through slot offered by described substrate, and what be provided with the flexible PCB of at least one fingerprint sensor passes described at least one through slot at least partly.
21. touch-screens as claimed in claim 15, is characterized in that, the groove width of described through slot is slightly larger than the thickness of described flexible PCB.
22. touch-screens as claimed in claim 15, it is characterized in that, described substrate is provided with side, is provided with the flexible PCB of at least one fingerprint sensor from the second surface extending to described substrate between described substrate and described thin plate through the side of described substrate.
23. touch-screens as claimed in claim 15, it is characterized in that, described gauge of sheet is less than or equal to 150 μm.
24. touch-screens according to any one of claim 15 to 23, it is characterized in that, described fingerprint sensor is positioned in the position pointed closer to described user than described flexible PCB.
25. touch-screens according to any one of claim 15 to 23, is characterized in that, described fingerprint sensor directly fits in the 4th surface of described thin plate.
26. touch-screens according to any one of claim 15 to 23, it is characterized in that, described touch-screen is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
27. touch-screens as claimed in claim 26, is characterized in that, described bonding coat also covers described fingerprint sensor and at least part of flexible PCB.
28. touch-screens as claimed in claim 26, is characterized in that, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
29. touch-screens as claimed in claim 26, is characterized in that, described bonding coat adopts Optical transparent adhesive.
30. touch-screens as claimed in claim 15, is characterized in that, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
31. 1 kinds of electronic equipments for fingerprint recognition sensing, it is characterized in that, described electronic equipment comprises:
At least one display element;
Cover component; Fit with described at least one display element;
Described cover component subregion is transparent, comprises a substrate further, and is attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, described cover component is formed at least one deck color layers; Described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor is configured to the fingerprint of sensing user finger; Described at least one control element is configured to control described fingerprint sensor;
Described at least one fingerprint sensor is fixed between described thin plate and substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate.
32. electronic equipments as claimed in claim 31, is characterized in that, described fingerprint sensor comprises one group of capacitive element of the user fingerprints that can be coupled to user's finger in a capacitive manner.
33. electronic equipments as claimed in claim 31, is characterized in that, at least one fingerprint sensor described comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.
34. electronic equipments as claimed in claim 31, it is characterized in that, the substrate of described cover component directly fits in described display element, and described control element is arranged between described cover component and described display element.
35. electronic equipments as claimed in claim 31, it is characterized in that, at least one through slot offered by described substrate, and what be provided with the flexible PCB of at least one fingerprint sensor passes described at least one through slot at least partly.
36. electronic equipments as claimed in claim 31, it is characterized in that, described substrate is provided with side, is provided with the flexible PCB of at least one fingerprint sensor from the second surface extending to described substrate between described substrate and described thin plate through the side of described substrate.
37. electronic equipments as claimed in claim 31, it is characterized in that, described color layers comprises at least one deck color ink layer or BM layer, described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described thin plate the 3rd surface or the 4th surface in one.
38. electronic equipments as claimed in claim 31, it is characterized in that, described gauge of sheet is less than or equal to 150 μm.
39. electronic equipments according to any one of claim 31 to 38, it is characterized in that, described fingerprint sensor is positioned in the position pointed closer to described user than described flexible PCB.
40. electronic equipments according to any one of claim 31 to 38, is characterized in that, described fingerprint sensor directly fits in the 4th surface of described thin plate.
41. fingerprint identification devices according to any one of claim 31 to 38, it is characterized in that, described electronic equipment is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
42. electronic equipments as claimed in claim 41, is characterized in that, described bonding coat also covers described fingerprint sensor and at least part of flexible PCB.
43. electronic equipments as claimed in claim 41, is characterized in that, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
44. electronic equipments as claimed in claim 41, is characterized in that, described bonding coat adopts Optical transparent adhesive.
45. electronic equipments as claimed in claim 31, is characterized in that, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
46. 1 kinds of electronic equipments for fingerprint recognition sensing, described electronic equipment is provided with visible area and non-visible area, it is characterized in that, described electronic equipment comprises:
Be arranged at a display element of visible area at least partly;
Be arranged at a fingerprint identification device of described non-visible area at least partly;
Described fingerprint identification device comprises:
One cover component, fits in described display element; Described cover component comprises a substrate, and is attached at the thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, described cover component is formed the color layers that at least one deck is arranged at the non-visible area of described electronic equipment;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor is arranged at the non-visible area of described electronic equipment, and it is configured to the fingerprint of sensing user finger; Described at least one control element is configured to control described fingerprint sensor;
Described at least one fingerprint sensor is fixed between described thin plate and substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate.
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| CN201510100162.7A CN104751127A (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, touch screen and electronic equipment |
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| CN201510100162.7A CN104751127A (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, touch screen and electronic equipment |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105161426A (en) * | 2015-09-21 | 2015-12-16 | 业成光电（深圳）有限公司 | Conductive substrate and manufacturing method thereof |
| CN105404880A (en) * | 2015-12-25 | 2016-03-16 | 成都费恩格尔微电子技术有限公司 | Electronic device with fingerprint sensor assembly |
| CN105528569A (en) * | 2015-07-03 | 2016-04-27 | 宸鸿科技(厦门)有限公司 | Touch control device |
| CN105796114A (en) * | 2016-04-25 | 2016-07-27 | 深圳信炜科技有限公司 | Packaging structure of biosensor and electronic equipment |
| CN105938550A (en) * | 2016-06-20 | 2016-09-14 | 深圳天珑无线科技有限公司 | Fingerprint identification module with pressure sensing, and electronic device |
| WO2017067075A1 (en) * | 2015-10-20 | 2017-04-27 | 乐视移动智能信息技术（北京）有限公司 | Glass coating layer structure, fingerprint detection device, and mobile terminal |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130009651A1 (en) * | 2010-01-15 | 2013-01-10 | Picofield Technologies Inc. | Biometric Image Sensing |
| CN104035626A (en) * | 2014-07-02 | 2014-09-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition method, touch screen with fingerprint recognition function and terminal device |
| CN104077573A (en) * | 2014-07-02 | 2014-10-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition sensor, fingerprint recognition detection assembly and terminal device |
| CN104156710A (en) * | 2014-08-26 | 2014-11-19 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition device and terminal device |
| CN104166846A (en) * | 2014-08-26 | 2014-11-26 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition sensor packaging structure and ultra-thin glass manufacturing method |
| CN104194485A (en) * | 2014-08-26 | 2014-12-10 | 南昌欧菲生物识别技术有限公司 | Noctilucent ink, fingerprint identification device using same and terminal equipment |
| CN104217198A (en) * | 2014-08-26 | 2014-12-17 | 南昌欧菲生物识别技术有限公司 | Fingerprint identifying device and terminal apparatus |
| CN104318204A (en) * | 2014-09-29 | 2015-01-28 | 上海箩箕技术有限公司 | Fingerprint imaging system and method, fingerprint identification system, electronic apparatus |
| CN204808348U (en) * | 2015-03-06 | 2015-11-25 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device , touch -sensitive screen and electronic equipment |
-
2015
- 2015-03-06 CN CN201510100162.7A patent/CN104751127A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130009651A1 (en) * | 2010-01-15 | 2013-01-10 | Picofield Technologies Inc. | Biometric Image Sensing |
| CN104035626A (en) * | 2014-07-02 | 2014-09-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition method, touch screen with fingerprint recognition function and terminal device |
| CN104077573A (en) * | 2014-07-02 | 2014-10-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition sensor, fingerprint recognition detection assembly and terminal device |
| CN104156710A (en) * | 2014-08-26 | 2014-11-19 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition device and terminal device |
| CN104166846A (en) * | 2014-08-26 | 2014-11-26 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition sensor packaging structure and ultra-thin glass manufacturing method |
| CN104194485A (en) * | 2014-08-26 | 2014-12-10 | 南昌欧菲生物识别技术有限公司 | Noctilucent ink, fingerprint identification device using same and terminal equipment |
| CN104217198A (en) * | 2014-08-26 | 2014-12-17 | 南昌欧菲生物识别技术有限公司 | Fingerprint identifying device and terminal apparatus |
| CN104318204A (en) * | 2014-09-29 | 2015-01-28 | 上海箩箕技术有限公司 | Fingerprint imaging system and method, fingerprint identification system, electronic apparatus |
| CN204808348U (en) * | 2015-03-06 | 2015-11-25 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device , touch -sensitive screen and electronic equipment |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105528569A (en) * | 2015-07-03 | 2016-04-27 | 宸鸿科技(厦门)有限公司 | Touch control device |
| CN105528569B (en) * | 2015-07-03 | 2017-07-28 | 宸鸿科技(厦门)有限公司 | Contactor control device |
| CN105161426A (en) * | 2015-09-21 | 2015-12-16 | 业成光电（深圳）有限公司 | Conductive substrate and manufacturing method thereof |
| WO2017067075A1 (en) * | 2015-10-20 | 2017-04-27 | 乐视移动智能信息技术（北京）有限公司 | Glass coating layer structure, fingerprint detection device, and mobile terminal |
| CN105404880A (en) * | 2015-12-25 | 2016-03-16 | 成都费恩格尔微电子技术有限公司 | Electronic device with fingerprint sensor assembly |
| CN105796114A (en) * | 2016-04-25 | 2016-07-27 | 深圳信炜科技有限公司 | Packaging structure of biosensor and electronic equipment |
| CN105796114B (en) * | 2016-04-25 | 2018-11-23 | 深圳信炜科技有限公司 | The encapsulating structure and electronic equipment of biosensor |
| CN105938550A (en) * | 2016-06-20 | 2016-09-14 | 深圳天珑无线科技有限公司 | Fingerprint identification module with pressure sensing, and electronic device |
| CN108062143A (en) * | 2016-11-09 | 2018-05-22 | 南昌欧菲生物识别技术有限公司 | Mobile terminal and its control method, control device |
| CN109753844A (en) * | 2017-11-02 | 2019-05-14 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor structure and electronic equipment |
| CN109753844B (en) * | 2017-11-02 | 2024-03-08 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor structure and electronic equipment |
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