CN104751131A - Fingerprint identification device, touch screen and electronic equipment - Google Patents
Fingerprint identification device, touch screen and electronic equipment Download PDFInfo
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- CN104751131A CN104751131A CN201510100409.5A CN201510100409A CN104751131A CN 104751131 A CN104751131 A CN 104751131A CN 201510100409 A CN201510100409 A CN 201510100409A CN 104751131 A CN104751131 A CN 104751131A
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Abstract
The invention provides a fingerprint identification device. The fingerprint identification device comprises a cover plate element, a base plate and a thin plate attached on the base plate, wherein the thickness of the thin plate is smaller than that of the base plate; the base plate is provided with a through hole; a fingerprint identification module comprises a flexible circuit board and a fingerprint sensor connected with the flexible circuit board; the fingerprint sensor is configured to sense fingerprints of fingers of a user; the fingerprint identification module is arranged in the through hole of the base plate so that the distance between the fingerprint identification module and finger touch of a user is approximately equal to the thickness of the thin plate; the flexible circuit board is arranged on one side of a second surface of the base plate, and the flexible circuit board is partially attached on the second surface of the base plate at least. According to the fingerprint identification device, the cover plate covers the fingerprint identification module so that electronic equipment with the fingerprint identification device has complete and good appearance, and better strength.
Description
Technical field
The present invention relates to fingerprint identification technology field, particularly relate to a kind of fingerprint identification device, touch-screen and electronic equipment.
Background technology
With development in science and technology, fingerprint identification device applies to all kinds of portable electric appts more and more widely.As an existing class is provided with the smart mobile phone of fingerprint identification device, user realizes the functions such as mobile phone unblock, fingerprint recognition payment by described fingerprint identification device.
Existing electronic product, if the electronic equipment such as mobile phone, panel computer is in order to realize fingerprint identification function, need to punch in its touch cover, and adopt LGA (Land Grid Array, Background Grid array packages) encapsulation technology electronic equipment cover plate punching place laminating fingerprint sensor, then through hole is offered to expose the touch-control sensing region of fingerprint sensor in the surface of the direct cover plate at electronic equipment, so that described fingerprint sensor can carry out fingerprint detection.But offering through hole to the surface of the cover plate of electronic equipment can affect electronic equipment outward appearance, unsightly.
Summary of the invention
There is provided that a kind of intensity is better, fingerprint induction be sensitive, the fingerprint identification device of flat appearance, touch-screen and electronic equipment.
A kind of fingerprint identification device, comprising:
One cover component; Comprise a substrate, and be attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of described substrate, and described substrate offers through hole; Described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface;
One fingerprint recognition module, comprise a flexible PCB and be connected to the fingerprint sensor of described flexible PCB, described fingerprint sensor is configured to the fingerprint of sensing user finger, described fingerprint recognition module is placed in the through hole of described substrate, make the distance of described fingerprint recognition module and user's finger touch be approximately described gauge of sheet, described flexible PCB is placed in the second surface side of described substrate and described flexible PCB fits in the second surface of described substrate at least partly.
Further, described fingerprint recognition module directly fits in described thin plate, makes the distance of described fingerprint recognition module and user's finger touch be described gauge of sheet.
Further, described cover component also comprises at least one deck color layers, and described color layers comprises at least one deck color ink layer or BM layer.
Further, described color layers be formed at described thin plate the 3rd surface or the 4th surface at least one.
Further, the thickness of described cover component is less than or equal to 300 μm.
Further, described gauge of sheet is less than or equal to 150 μm.
Further, described cover component also comprises bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and described thin plate mutually to combine closely.
Further, described bonding coat adopts Optical transparent adhesive.
Further, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
Comprise a touch-screen for fingerprint identification device, comprising:
One cover component; Comprise a substrate, and be attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of described substrate, and described substrate offers through hole; Described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface;
One fingerprint recognition module, comprise a flexible PCB and be connected to the fingerprint sensor of described flexible PCB, described fingerprint sensor is configured to the fingerprint of sensing user finger, described fingerprint recognition module is placed in the through hole of described substrate, make the distance of described fingerprint recognition module and user's finger touch be approximately described gauge of sheet, described flexible PCB is placed in the second surface side of described substrate and described flexible PCB fits in the second surface of described substrate at least partly;
Wherein said substrate is formed touch-control sensing layer.
Further, described fingerprint recognition module directly fits in described thin plate, makes the distance of described fingerprint recognition module and user's finger touch be described gauge of sheet.
Further, described cover component also comprises at least one deck color layers, and described color layers comprises at least one deck color ink layer or BM layer.
Further, described color layers be formed at described thin plate the 3rd surface or the 4th surface at least one.
Further, the thickness of described cover component is less than or equal to 300 μm.
Further, described gauge of sheet is less than or equal to 150 μm.
Further, described cover component also comprises bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and described thin plate mutually to combine closely.
Further, described bonding coat adopts Optical transparent adhesive.
Further, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
For an electronic equipment for fingerprint recognition sensing,
At least one display element;
One cover component; Fit with described at least one display element; Described cover component comprises a substrate further, and is attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of described substrate, and described substrate offers through hole; Described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface;
One fingerprint recognition module, comprise a flexible PCB and be connected to the fingerprint sensor of described flexible PCB, described fingerprint sensor is configured to the fingerprint of sensing user finger, described fingerprint recognition module is placed in the through hole of described substrate, make the distance of described fingerprint recognition module and user's finger touch be approximately described gauge of sheet, described flexible PCB is placed in the second surface side of described substrate and described flexible PCB fits in the second surface of described substrate at least partly;
Wherein said substrate is formed touch-control sensing layer.
Further, described fingerprint recognition module directly fits in described thin plate, makes the distance of described fingerprint recognition module and user's finger touch be described gauge of sheet.
Further, described cover component also comprises at least one deck color layers, and described color layers comprises at least one deck color ink layer or BM layer.
Further, described color layers be formed at described thin plate the 3rd surface or the 4th surface at least one.
Further, the thickness of described cover component is less than or equal to 300 μm.
Further, described gauge of sheet is less than or equal to 150 μm.
Further, described cover component also comprises bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and described thin plate mutually to combine closely.
Further, described bonding coat adopts Optical transparent adhesive.
Further, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
For an electronic equipment for fingerprint recognition sensing, described electronic equipment is provided with visible area and non-visible area, and described electronic equipment comprises:
Be arranged at a display element of visible area at least partly;
Be arranged at a fingerprint identification device of described non-visible area at least partly;
Described fingerprint identification device comprises:
One cover component; Fit with described at least one display element; Described cover component comprises a substrate further, and is attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of described substrate, and described substrate offers through hole, and described through hole is positioned at the non-visible area of described electronic equipment; Described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface;
One fingerprint recognition module, comprise a flexible PCB and be connected to the fingerprint sensor of described flexible PCB, described fingerprint sensor is configured to the fingerprint of sensing user finger, and described fingerprint recognition module is placed in the through hole of described substrate.
Fingerprint identification device of the present invention by arranging cover plate on substrate, thus is formed smooth astomous smooth.Make the mobile terminal that this fingerprint identification device is set have complete, good outward appearance and intensity, not only can avoid the perforate of mobile terminal appearance and cause stress concentrate, intensity decline, be convenient to user simultaneously and carry out touch-control and viewing.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of a kind of electronic equipment that the first embodiment of the present invention provides;
Fig. 2 is the diagrammatic cross-section of the fingerprint identification device that the first embodiment of the present invention provides;
Fig. 3 is the diagrammatic cross-section of the fingerprint identification device that the second embodiment of the present invention provides;
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
The invention provides a kind of fingerprint identification device and mobile terminal.Fingerprint identification device according to the embodiment of the present invention can be applied to the mobile terminals such as mobile phone, panel computer, notebook computer, media player, also the financial terminal equipments such as ATM (Automatic Teller Machine) (Automated Teller Machine, ATM) can be applied to.
Refer to Fig. 1 and Fig. 2, first embodiment of the invention provides a kind of fingerprint identification device 10 and is provided with the electronic equipment of this fingerprint identification device 10, and described electronic equipment comprises cover component 12, fingerprint recognition module 15, the display element 100 depended on described cover component 12.Described cover component 12 forms fingerprint identification device 10 with fingerprint recognition module 15, and described cover component 12 is covered on described display element 100.
Described cover component 12 comprises substrate 122 and is attached at the thin plate 123 on described substrate 122, and the thickness of described thin plate 123 is less than the thickness of substrate 122.
Described substrate 122 comprises first surface 1220 and the second surface 1222 relative with first surface 1220, and described thin plate 123 comprises the 3rd surface 1230 and four surface 1232 relative with the 3rd surface.Described substrate 122 by glue laminating in the mutual stacked setting of described thin plate 123, the first surface 1220 of described substrate 122 is oppositely arranged with the 4th surface 1232 of described thin plate 123, the second surface 1222 of described substrate 122 and the 3rd surface 1230 opposing settings of described thin plate 123.
Described substrate 122 offers through through hole 1226, and described fingerprint identification device 15 is placed in the through hole 1226 of described substrate 122 at least partly, and described thin plate 123 covers described fingerprint identification device 15 and at least substrate 122 described in cover part.
In the present embodiment, described substrate 122 and described thin plate 123 cover component 12 forming electronic equipment bonded to each other, thus the types of functionality for coordinating the miscellaneous part of electronic equipment to realize electronic equipment.Described substrate 122 and described thin plate 123 can be used as the operation interface that the display interface protective device of electronic equipment or user input.As described in thin plate 123 with as described in substrate 122 user that can be used as electronic equipment carry out the display screen watched; Meanwhile, the user that described thin plate 123 and described substrate 122 also can be used as electronic equipment carries out the touch screen of touch control operation.Be understandable that, described fingerprint identification device 10 can arrange the back side being formed at electronic equipment, and substrate 122 and the thin plate 123 of described fingerprint identification device 10 can form the backboard of electronic equipment jointly.
In the present embodiment, the thickness of described cover component 12 is less than or equal to 300 μm.The thickness of described cover component 12 is to described thin plate 123, substrate 122 and the gross thickness being arranged at other functional layers between described thin plate 123 and substrate 122.That is, the air line distance of the second surface 1222 of the 3rd surface 1230 to substrate 122 of described thin plate 123.
Substrate 122 in the present invention can adopt in transparent glass, sapphire, transparent resin any one make, described thin plate 123 can adopt in glass, sapphire, transparent resin any one make.Preferably, described substrate 122 can adopt sapphire material to make.Secondary choosing, described substrate 122 also can adopt the tempered glass of Corning Incorporated to make.
Preferably, described thin plate 123 can adopt sapphire material to make.Secondary choosing, described thin plate 123 also can adopt the tempered glass of Corning Incorporated to make.The thickness of described substrate can be less than or equal to 150 μm, and preferably, the thickness of described substrate 122 is less than or equal to 100 μm.
Be understandable that, described substrate 122 can adopt identical or different material to make with thin plate 123, as substrate 122 and thin plate 123 can all adopt sapphire material or glass material to make, also can adopt sapphire and glass combination etc.
When described substrate 122 all adopts glass to make with thin plate 123, described substrate 122 can adopt tempered glass to make, and thin plate 123 can adopt simple glass to make.
Fingerprint recognition module 15 comprises with flexible PCB 152 and the fingerprint sensor 153 being connected to described flexible PCB 152.Flexible PCB 152 is provided with connector (not shown) for connection control element (not shown), described fingerprint sensor 153 can be placed in the through hole 1226 of described substrate 122, described fingerprint sensor 153 directly can fit in the 4th surface 1232 of described thin plate 123, also can and the 4th surface 1232 of described thin plate 123 between gap or other filling materials are set.
Fingerprint sensor 153 is located between thin plate 123 and substrate 122 at least partly, when user carries out fingerprint recognition authentication operations at described electronic equipment, the finger print face of user and the distance of fingerprint sensor 153 are about d, and the thickness of described thin plate 123 is approximately described distance d, therefore at the thin plate 123 adopting same material, its thickness is thinner, then the accuracy of its fingerprint recognition, discrimination are higher.
When the fingerprint sensor 153 of described fingerprint recognition module 15 adopts capacitance type sensor, by arranging thinner thin plate 123 thickness, make the distance in fingerprint sensor and user's finger print face shorter, thus ensure the fingerprint sensing effect of described fingerprint sensor 154.Further, the present invention is by arranging the thickness of substrate 122 and thin plate 123, make the integral thickness of the cover component 12 of electronic equipment below 500 μm, and then make the cover component 12 of electronic equipment can meet its demand as the rigid of touch-control inputting interface, electronic equipment thickness can not be increased again.Make electronic equipment cover component not in borehole situation, also dexterously fingerprint sensor 153 can be embedded among cover component 12 and solve technical matters of the present invention.
In the present embodiment, described flexible PCB 152 is placed in second surface 1222 side of described substrate 122 and described flexible PCB 152 fits in the second surface 1222 of described substrate 122 at least partly.The base material of described flexible PCB 152 can adopt Kapton (Polyimide film, PI film) to make; Further, the base material of described flexible PCB 152 can adopt two layers of polyimide resin (Polyimide resin, PI resin) to form, and it also can be made up of the protective seam resin of one deck polyimide base material in conjunction with other materials of one deck.The present invention is not as limit.
Described flexible PCB 152 is arranged at the second surface 1222 of described substrate 122, is convenient to fingerprint sensor 153 and arranges near described thin plate 123, is convenient to reduce the air line distance between user's finger to described fingerprint sensor 153, can improve fingerprint recognition precision.
In the present embodiment, described fingerprint sensor 153 can adopt hyperchannel fingerprint sensor 153.Be understandable that, described fingerprint sensor 153 can arrange sensing circuit to carry out fingerprint collecting and simulating signal generation, and described fingerprint sensor 153 can be encapsulated in single in-line packages (single in-line, SiP).Described fingerprint sensor 153 also can adopt single chips and protect by filling colloid.Described sensing circuit can be packaged in epoxy resin or other elastomeric material, makes described sensing circuit to obtain Reasonable Protection, avoids being damaged by collision during assembling.In the present embodiment, described fingerprint sensor 153 is positioned in the position pointed closer to described user than described flexible PCB 152.Described fingerprint sensor 153 comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.The present invention by covering thin plate 122 on fingerprint sensor 153, thus makes fingerprint identification device 40 have good, smooth outward appearance, and can ensure that fingerprint identification device 40 has higher fingerprint recognition precision, user-friendly.
Further, described fingerprint sensor 153 can adopt optical fingerprint sensor, capacitive fingerprint sensing device, piezoelectricity fingerprint sensor or ultrasonic fingerprint sensor.Described fingerprint sensor 153 can adopt the scratching formula sensor of the distribution in strip type, also can be the push type sensor of the distribution in array.Described fingerprint sensor 153 also can adopt other devices that can respond to user's fingerprint, identify, does not repeat them here.
Further, the surface of described fingerprint sensor 153 also can form protective seam (not shown).Described protective seam is formed at the top of fingerprint recognition module 15, with to fingerprint recognition module 15, especially protects fingerprint sensor 153.Protective seam passes through spraying technology or printing technology or vacuum evaporation technology and is formed; its material such as comprises UV curing type PMMA glue (ultraviolet curing transparent glue), thermohardening type PMMA glue or diamond like carbon (Diamond-likeCarbon; DLC), wherein DLC adopts plated film mode to form protective seam.In certain embodiments; protective seam can also be formed by the material of glass, pottery, sapphire, quartz or other durables, the organic films such as such as polymethylmethacrylate (PMMA), polyethylene terephthalate (PET), polyimide (PI).Be understandable that, described protective seam can be set to individual layer, also can be set to multilayer.
Further, fingerprint identification device 10 of the present invention is also provided with bonding coat 17 between described substrate 122 and thin plate 123, for mutually being combined closely with thin plate 123 by described substrate 122.Described bonding coat 17 can adopt Optical transparent adhesive, optical clear resin (Optical Clear Resin, OCR) or optical adhesive tape (OpticalClear Adhesive, OCA).
As shown in Figure 3, the second embodiment of the present invention provides a kind of electronic equipment being provided with fingerprint identification device 20, and it is roughly the same with the first embodiment, and fingerprint identification device 20 comprises cover component 22 and fingerprint recognition module 25.Cover component 22 comprises substrate 222 and is attached at the thin plate 223 on described substrate 222, and the thickness of described thin plate 223 is less than the thickness of substrate 222.Described substrate 222 comprises first surface 2220 and the second surface 2222 relative with first surface 2220, and described thin plate 223 comprises the 3rd surface 2230 and four surface 2232 relative with the 3rd surface.
Described substrate 222 offers through through hole 2226, and described fingerprint identification device 25 is placed in the through hole 2226 of described substrate 222 at least partly, and described thin plate 223 covers described fingerprint identification device 25 and at least substrate 222 described in cover part.
Difference is, in the present embodiment, described cover component 22 is formed at least one deck color layers 29, and described color layers 29 comprises at least one deck color ink layer or BM (Black Matrix, black matrix") layer.
Further, described color layers 29 can be coated on the 3rd surface 2230 and the 4th surface 2232 of described thin plate 223.Described color layers 29 also can be coated on first surface 2220 and the second surface 2222 of described substrate 222.In the present embodiment, described color layers 29 is formed at the 4th surface 2232 of described thin plate 223, thus blocks fingerprint recognition module 25.
Described color layers 29 can be coated on the non-visible area of described electronic equipment, thus blocks described fingerprint recognition module 25 and other the electrical equipment that is arranged at described electronic equipment.Thus make fingerprint identification device 20 or be provided with the touch screen of fingerprint identification device 20, electronic equipment has good outward appearance.
The present invention also provides a kind of touch-screen comprising fingerprint identification device, adopts fingerprint identification device as above, and forms touch-control sensing layer (not shown) on the substrate, thus realizes the touch control operation of user.
The present invention also provides a kind of electronic equipment for fingerprint recognition sensing, comprises display element and fingerprint identification device as above, and the cover component subregion of described fingerprint identification device is transparent and fit in described display element.Described electronic equipment comprises visible area and non-visible area, and the through hole of described substrate is arranged at the non-visible area of described electronic equipment.
In describing the invention, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " axis ", " radial direction ", orientation or the position relationship of the instruction such as " circumference " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore limitation of the present invention can not be interpreted as.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In describing the invention, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or integral; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be that the first and second features directly contact, or the first and second features are by intermediary indirect contact.And, fisrt feature second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " can be fisrt feature immediately below second feature or tiltedly below, or only represent that fisrt feature level height is less than second feature.
In the description of this instructions, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in one or more embodiment in office or example in an appropriate manner.In addition, when not conflicting, the feature of the different embodiment described in this instructions or example and different embodiment or example can carry out combining and combining by those skilled in the art.
Above disclosedly be only a kind of preferred embodiment of the present invention, certainly the interest field of the present invention can not be limited with this, one of ordinary skill in the art will appreciate that all or part of flow process realizing above-described embodiment, and according to the equivalent variations that the claims in the present invention are done, still belong to the scope that invention is contained.
Claims (28)
1. a fingerprint identification device, is characterized in that, comprising:
One cover component; Comprise a substrate, and be attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of described substrate, and described substrate offers through hole; Described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface;
One fingerprint recognition module, comprise a flexible PCB and be connected to the fingerprint sensor of described flexible PCB, described fingerprint sensor is configured to the fingerprint of sensing user finger, described fingerprint recognition module is placed in the through hole of described substrate, make the distance of described fingerprint recognition module and user's finger touch be approximately described gauge of sheet, described flexible PCB is placed in the second surface side of described substrate and described flexible PCB fits in the second surface of described substrate at least partly.
2. fingerprint identification device as claimed in claim 1, it is characterized in that, described fingerprint recognition module directly fits in described thin plate, makes the distance of described fingerprint recognition module and user's finger touch be described gauge of sheet.
3. fingerprint identification device as claimed in claim 1, it is characterized in that, described cover component also comprises at least one deck color layers, and described color layers comprises at least one deck color ink layer or BM layer.
4. fingerprint identification device as claimed in claim 3, is characterized in that, described color layers is formed at least one in the 3rd surface of described thin plate or the 4th surface.
5. the fingerprint identification device according to any one of Claims 1-4, is characterized in that, the thickness of described cover component is less than or equal to 300 μm.
6. the fingerprint identification device according to any one of Claims 1-4, is characterized in that, described gauge of sheet is less than or equal to 150 μm.
7. fingerprint identification device as claimed in claim 1, it is characterized in that, described cover component also comprises bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and described thin plate mutually to combine closely.
8. fingerprint identification device as claimed in claim 1, is characterized in that, described bonding coat adopts Optical transparent adhesive.
9. fingerprint identification device as claimed in claim 1, is characterized in that, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
10. comprise a touch-screen for fingerprint identification device, it is characterized in that, comprising:
One cover component; Comprise a substrate, and be attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of described substrate, and described substrate offers through hole; Described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface;
One fingerprint recognition module, comprise a flexible PCB and be connected to the fingerprint sensor of described flexible PCB, described fingerprint sensor is configured to the fingerprint of sensing user finger, described fingerprint recognition module is placed in the through hole of described substrate, make the distance of described fingerprint recognition module and user's finger touch be approximately described gauge of sheet, described flexible PCB is placed in the second surface side of described substrate and described flexible PCB fits in the second surface of described substrate at least partly;
Wherein said substrate is formed touch-control sensing layer.
11. touch-screens as claimed in claim 10, it is characterized in that, described fingerprint recognition module directly fits in described thin plate, makes the distance of described fingerprint recognition module and user's finger touch be described gauge of sheet.
12. touch-screens as claimed in claim 10, it is characterized in that, described cover component also comprises at least one deck color layers, and described color layers comprises at least one deck color ink layer or BM layer.
13. touch-screens as claimed in claim 12, is characterized in that, described color layers be formed at described thin plate the 3rd surface or the 4th surface at least one.
14. touch-screens according to any one of claim 10 to 13, it is characterized in that, the thickness of described cover component is less than or equal to 300 μm.
15. touch-screens according to any one of claim 10 to 13, it is characterized in that, described gauge of sheet is less than or equal to 150 μm.
16. touch-screens as claimed in claim 10, it is characterized in that, described cover component also comprises bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and described thin plate mutually to combine closely.
17. touch-screens as claimed in claim 16, is characterized in that, described bonding coat adopts Optical transparent adhesive.
18. touch-screens as claimed in claim 10, is characterized in that, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
19. 1 kinds, for the electronic equipment of fingerprint recognition sensing, is characterized in that,
At least one display element;
One cover component; Fit with described at least one display element; Described cover component comprises a substrate further, and is attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of described substrate, and described substrate offers through hole; Described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface;
One fingerprint recognition module, comprise a flexible PCB and be connected to the fingerprint sensor of described flexible PCB, described fingerprint sensor is configured to the fingerprint of sensing user finger, described fingerprint recognition module is placed in the through hole of described substrate, make the distance of described fingerprint recognition module and user's finger touch be approximately described gauge of sheet, described flexible PCB is placed in the second surface side of described substrate and described flexible PCB fits in the second surface of described substrate at least partly;
Wherein said substrate is formed touch-control sensing layer.
20. electronic equipments as claimed in claim 19, it is characterized in that, described fingerprint recognition module directly fits in described thin plate, makes the distance of described fingerprint recognition module and user's finger touch be described gauge of sheet.
21. electronic equipments as claimed in claim 19, it is characterized in that, described cover component also comprises at least one deck color layers, and described color layers comprises at least one deck color ink layer or BM layer.
22. electronic equipments as claimed in claim 21, is characterized in that, described color layers be formed at described thin plate the 3rd surface or the 4th surface at least one.
23. electronic equipments according to any one of claim 19 to 22, it is characterized in that, the thickness of described cover component is less than or equal to 300 μm.
24. electronic equipments according to any one of claim 19 to 22, it is characterized in that, described gauge of sheet is less than or equal to 150 μm.
25. electronic equipments as claimed in claim 19, it is characterized in that, described cover component also comprises bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and described thin plate mutually to combine closely.
26. electronic equipments as claimed in claim 25, is characterized in that, described bonding coat adopts Optical transparent adhesive.
27. electronic equipments as claimed in claim 19, is characterized in that, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
28. 1 kinds of electronic equipments for fingerprint recognition sensing, described electronic equipment is provided with visible area and non-visible area, it is characterized in that, described electronic equipment comprises:
Be arranged at a display element of visible area at least partly;
Be arranged at a fingerprint identification device of described non-visible area at least partly;
Described fingerprint identification device comprises:
One cover component; Fit with described at least one display element; Described cover component comprises a substrate further, and is attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of described substrate, and described substrate offers through hole, and described through hole is positioned at the non-visible area of described electronic equipment; Described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface;
One fingerprint recognition module, comprise a flexible PCB and be connected to the fingerprint sensor of described flexible PCB, described fingerprint sensor is configured to the fingerprint of sensing user finger, and described fingerprint recognition module is placed in the through hole of described substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510100409.5A CN104751131A (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, touch screen and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510100409.5A CN104751131A (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, touch screen and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104751131A true CN104751131A (en) | 2015-07-01 |
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| CN201510100409.5A Pending CN104751131A (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, touch screen and electronic equipment |
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| CN104965613A (en) * | 2015-07-13 | 2015-10-07 | 伯恩光学(惠州)有限公司 | Touch screen |
| CN105447453A (en) * | 2015-11-16 | 2016-03-30 | 深圳市国显科技股份有限公司 | Structure for improving fingerprint identification |
| CN106385473A (en) * | 2016-10-29 | 2017-02-08 | 广东欧珀移动通信有限公司 | Shell, fingerprint module and mobile terminal |
| CN106446752A (en) * | 2015-08-04 | 2017-02-22 | 上海箩箕技术有限公司 | Electronic product |
| CN107652739A (en) * | 2017-09-22 | 2018-02-02 | 南昌欧菲生物识别技术有限公司 | Anti-soil film, fingerprint module, the preparation method of anti-soil film |
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| CN107852432A (en) * | 2016-07-08 | 2018-03-27 | 华为技术有限公司 | A kind of battery cover and electronic equipment |
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| CN108664081A (en) * | 2017-03-31 | 2018-10-16 | 华为技术有限公司 | Fingerprint identification device and terminal device |
| CN109460695A (en) * | 2017-09-06 | 2019-03-12 | 蓝思科技（长沙）有限公司 | Fingerprint sensing device and intelligent terminal |
| CN109460692A (en) * | 2017-09-06 | 2019-03-12 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor, terminal device and optical fingerprint sensor processing technology |
| CN109753844A (en) * | 2017-11-02 | 2019-05-14 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor structure and electronic equipment |
| CN112069869A (en) * | 2020-07-13 | 2020-12-11 | 欧菲微电子技术有限公司 | Fingerprint module, manufacturing method thereof, display screen assembly and electronic equipment |
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| CN104965613A (en) * | 2015-07-13 | 2015-10-07 | 伯恩光学(惠州)有限公司 | Touch screen |
| CN104965613B (en) * | 2015-07-13 | 2019-04-16 | 伯恩光学(惠州)有限公司 | Touch screen |
| CN106446752B (en) * | 2015-08-04 | 2019-07-02 | 上海箩箕技术有限公司 | Electronic product |
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| CN105447453A (en) * | 2015-11-16 | 2016-03-30 | 深圳市国显科技股份有限公司 | Structure for improving fingerprint identification |
| CN107852432A (en) * | 2016-07-08 | 2018-03-27 | 华为技术有限公司 | A kind of battery cover and electronic equipment |
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| CN107652739A (en) * | 2017-09-22 | 2018-02-02 | 南昌欧菲生物识别技术有限公司 | Anti-soil film, fingerprint module, the preparation method of anti-soil film |
| CN109753844A (en) * | 2017-11-02 | 2019-05-14 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor structure and electronic equipment |
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| CN107819910A (en) * | 2017-12-06 | 2018-03-20 | 广东欧珀移动通信有限公司 | Cover plate assembly, display panel and electronic equipment |
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| CN112069869A (en) * | 2020-07-13 | 2020-12-11 | 欧菲微电子技术有限公司 | Fingerprint module, manufacturing method thereof, display screen assembly and electronic equipment |
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