CN204613972U - Fingerprint identification device, touch-screen and electronic equipment - Google Patents
Fingerprint identification device, touch-screen and electronic equipment Download PDFInfo
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- CN204613972U CN204613972U CN201520130860.7U CN201520130860U CN204613972U CN 204613972 U CN204613972 U CN 204613972U CN 201520130860 U CN201520130860 U CN 201520130860U CN 204613972 U CN204613972 U CN 204613972U
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Abstract
The utility model provides a kind of fingerprint identification device, comprises a cover component; Comprise a substrate, and be attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, and at least one through slot offered by described substrate, is provided with the flexible PCB of control element and fingerprint sensor; The first surface of described substrate and/or the 4th surface of described thin plate offer recess; Described fingerprint sensor is fixed between described thin plate and substrate and is also placed in recess at least partly, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate.Fingerprint identification device of the present utility model by arranging thin plate on substrate, thus forms smooth astomous outward appearance.The electronic equipment that this fingerprint identification device is set is made to have complete, good appearance, better intensity and thinner thickness.
Description
Technical field
The utility model relates to fingerprint identification technology field, particularly relates to a kind of fingerprint identification device, touch-screen and electronic equipment.
Background technology
With development in science and technology, fingerprint identification device applies to all kinds of portable electric appts more and more widely.As an existing class is provided with the smart mobile phone of fingerprint identification device, user realizes the functions such as mobile phone unblock, fingerprint recognition payment by described fingerprint identification device.
Existing electronic product, if the electronic equipment such as mobile phone, panel computer is in order to realize fingerprint identification function, need to punch in its touch cover, and adopt LGA (Land Grid Array, Background Grid array packages) encapsulation technology electronic equipment cover plate punching place laminating fingerprint sensor, then through hole is offered to expose the touch-control sensing region of fingerprint sensor in the surface of the direct cover plate at electronic equipment, so that described fingerprint sensor can carry out fingerprint detection.But, through hole is offered to the surface of the cover plate of electronic equipment and easily causes through hole stress to increase, thus cause cover-plate glass intensity to decline.For ensureing the cover plate intensity of electronic equipment, drilling technology is complicated, and cost is higher.
If directly arrange at least one fingerprint Identification sensor module under the touch cover of electronic equipment (mobile phone, panel computer etc.).Because electronic equipment cover plate is as user's inputting interface, often accept the user behaviors such as user mobile phone touch-control pressing, therefore electronic equipment needs stronger rigid, and electronic equipment cover sheet thickness this kind of is at present greater than more than 300 microns, the coverage of current finger face and fingerprint Identification sensor is less than 100 microns.This distance is far beyond the finger face of user and the distance coverage of fingerprint Identification sensor, cause fingerprint Identification sensor inefficacy and None-identified user points line paddy ridge and forms fingerprint pattern, therefore there are two technical barriers of urgently capturing in this field: the distance one, reducing finger face and fingerprint Identification sensor; Two, the intensity strengthening the electromagnetic field of fingerprint sensor can make its intensity penetrate 300 microns with upper cover plate.
Utility model content
There is provided that a kind of intensity is better, fingerprint induction be sensitive, the fingerprint identification device of flat appearance, touch-screen and electronic equipment.
A kind of fingerprint identification device, comprising:
One cover component; Comprise a substrate, and be attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, and at least one through slot offered by described substrate; Described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface; The first surface of described substrate and/or the 4th surface of described thin plate offer recess;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor is configured to the fingerprint of sensing user finger; Described at least one control element is configured to control described fingerprint sensor;
What be provided with the flexible PCB of at least one fingerprint sensor passes described at least one through slot at least partly; Described fingerprint sensor is fixed between described thin plate and substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate, and described fingerprint sensor or described flexible PCB are placed in the recess that described substrate and/or described thin plate are offered at least partly.
Further, the groove width of described through slot is slightly larger than the thickness of described flexible PCB.
Further, described cover component is formed at least one deck color layers.
Further, described color layers comprises at least one deck color ink layer or BM layer, and described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described thin plate the 3rd surface or the 4th surface in one.
Further, described gauge of sheet is less than or equal to 150 μm.
Further, the fingerprint sensor of described fingerprint identification device is positioned in the position pointed closer to described user than described flexible PCB.
Further, the fingerprint sensor of described fingerprint identification device directly fits in the 4th surface of described thin plate.
Further, described fingerprint identification device is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
Further, described bonding coat also covers the fingerprint sensor of described fingerprint identification device and at least part of flexible PCB.
Further, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
Further, described bonding coat adopts Optical transparent adhesive.
Further, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
Comprise a touch-screen for fingerprint identification device, comprising:
One cover component; Comprise a substrate, and be attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, at least one through slot offered by described substrate, described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface; The first surface of described substrate and/or the 4th surface of described thin plate offer recess;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor is configured to the fingerprint of sensing user finger; At least one control element is configured to control described fingerprint sensor;
What be provided with the flexible PCB of at least one fingerprint sensor passes described at least one through slot at least partly; Described fingerprint sensor is fixed between described thin plate and substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate, and described fingerprint sensor or described flexible PCB are placed in the recess that described substrate and/or thin plate are offered at least partly;
Wherein said substrate is formed touch-control sensing layer.
Further, described control element is arranged on the second surface of described substrate.
Further, at least one fingerprint sensor described comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.
Further, described base component is formed at least one deck color layers.
Further, described color layers comprises at least one deck color ink layer or BM layer, and described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described thin plate the 3rd surface or the 4th surface in one.
Further, the groove width of described through slot is slightly larger than the thickness of described flexible PCB.
Further, described gauge of sheet is less than or equal to 150 μm.
Further, described fingerprint sensor is positioned in the position pointed closer to described user than described flexible PCB.
Further, described fingerprint sensor directly fits in four surface of described thin plate towards described substrate.
Further, described touch-screen is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
Further, described bonding coat also covers described fingerprint sensor and at least part of flexible PCB.
Further, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
Further, described bonding coat adopts Optical transparent adhesive.
Further, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
For an electronic equipment for fingerprint recognition sensing, described electronic equipment comprises:
At least one display element;
Cover component; Fit with described at least one display element;
Described cover component subregion is transparent, comprises a substrate further, and is attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, at least one through slot offered by described substrate, described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface; The first surface of described substrate and/or the 4th surface of described thin plate offer recess;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor, described at least one fingerprint sensor is configured to the fingerprint of sensing user finger; At least one control element is configured to control described fingerprint sensor;
Be provided with partially passing through described at least one through slot and being fixed between described thin plate and substrate of the flexible PCB of at least one fingerprint sensor, and described fingerprint sensor or described flexible PCB are placed in the recess that described substrate and/or described thin plate are offered at least partly; Described at least one fingerprint sensor is positioned in the position of carrying out touch-control than described substrate near described user's finger, to make the distance of at least one fingerprint sensor described and user's finger touch be approximately described gauge of sheet.
Further, described fingerprint sensor comprises one group of capacitive element of the user fingerprints that can be coupled to user's finger in a capacitive manner.
Further, at least one fingerprint sensor described comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.
Further, the substrate of described cover component directly fits in described display element, and described control element is arranged between described cover component and described display element.
Further, described base component is formed at least one deck color layers.
Further, described color layers comprises at least one deck color ink layer or BM layer, and described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described thin plate the 3rd surface or the 4th surface in one.
Further, the groove width of described through slot is slightly larger than the thickness of described flexible PCB.
Further, described gauge of sheet is less than or equal to 150 μm.
Further, described fingerprint sensor is positioned in the position pointed closer to described user than described flexible PCB.
Further, described fingerprint sensor directly fits in four surface of described thin plate towards described substrate.
Further, described electronic equipment is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
Further, described bonding coat also covers described fingerprint sensor and at least part of flexible PCB.
Further, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
Further, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
For an electronic equipment for fingerprint recognition sensing, described electronic equipment is provided with visible area and non-visible area, and described electronic equipment comprises:
Be arranged at a display element of visible area at least partly;
Be arranged at a fingerprint identification device of described non-visible area at least partly;
Described fingerprint identification device comprises:
One cover component, fits in described display element; Described cover component comprises a substrate, and is attached at the thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, and at least one through slot offered by described substrate; Described substrate and/or described thin plate offer recess;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor is arranged at the non-visible area of electronic equipment, and it is configured to the fingerprint of sensing user finger; Described at least one control element is configured to control described fingerprint sensor;
What be provided with the flexible PCB of at least one fingerprint sensor passes described at least one through slot at least partly; Described at least one fingerprint sensor is positioned in the position pointed closer to described user than described substrate, and described fingerprint sensor or flexible PCB are placed in the recess that described substrate and/or described thin plate are offered at least partly.
Fingerprint identification device of the present utility model by arranging thin plate on substrate, thus is formed smooth astomous smooth.Make the electronic equipment that this fingerprint identification device is set have complete, good outward appearance and intensity, not only can avoid the perforate of electronic equipment appearance and cause stress concentrate, intensity decline, be convenient to user simultaneously and carry out touch-control and viewing.And fingerprint identification device of the present utility model by offering recess on substrate or thin plate, being convenient to fingerprint identification device and arranging and can ensure that cover component has thinner thickness.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of structural representation being provided with the electronics of fingerprint identification device that the utility model first embodiment provides;
Fig. 2 is the structural representation of fingerprint identification device under another visual angle described in Fig. 1;
Fig. 3 is the close-up schematic view of the fingerprint identification device described in Fig. 1;
Fig. 4 is the diagrammatic cross-section of a kind of fingerprint identification device that the utility model first embodiment provides;
Fig. 5 is the diagrammatic cross-section of a kind of fingerprint identification device that the utility model second embodiment provides;
Fig. 6 is the structural representation of a kind of fingerprint identification device that the utility model the 3rd embodiment provides
Fig. 7 is the close-up schematic view of the fingerprint identification device described in Fig. 6;
Fig. 8 is the diagrammatic cross-section of a kind of fingerprint identification device that the utility model the 3rd embodiment provides;
Fig. 9 is the structural representation of a kind of fingerprint identification device that the utility model the 4th embodiment provides.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
The utility model provides a kind of fingerprint identification device and electronic equipment.Fingerprint identification device according to the utility model embodiment can be applied to the electronic equipments such as mobile phone, panel computer, notebook computer, media player, also the financial terminal equipments such as ATM (Automatic Teller Machine) (Automated Teller Machine, ATM) can be applied to.
Refer to Fig. 1 to Fig. 4, the utility model first embodiment provides a kind of fingerprint identification device 10 and is provided with the electronic equipment of this fingerprint identification device 10, and described electronic equipment comprises fingerprint identification device 10 and display element 100.The fingerprint recognition module 15 that described fingerprint identification device 10 comprises cover component 12 and depends on described cover component 12.Described cover component 12 is covered on display element 100.
Described cover component 12 comprises substrate 122 and is attached at the thin plate 123 on described substrate 122, and the thickness of described thin plate 123 is less than the thickness of substrate 122.
Described substrate 122 comprises first surface 1220 and the second surface 1222 relative with first surface 1220, and described thin plate 123 comprises the 3rd surface 1230 and four surface 1232 relative with the 3rd surface.Described substrate 122 by glue laminating in the mutual stacked setting of described thin plate 123, the first surface 1220 of described substrate 122 is oppositely arranged with the 4th surface 1232 of described thin plate 123, the second surface 1222 of described substrate 122 and the 3rd surface 1230 opposing settings of described thin plate 123.Described fingerprint recognition module 15 is arranged at described substrate 122, and described thin plate 123 covers described fingerprint recognition assembly and at least substrate 122 described in cover part.
In the present embodiment, described substrate 122 and described thin plate 123 cover component 12 forming electronic equipment bonded to each other, thus the types of functionality for coordinating the miscellaneous part of electronic equipment to realize electronic equipment.Described substrate 122 and described thin plate 123 can be used as the operation interface that the display interface protective device of electronic equipment or user input.As described in thin plate 123 with as described in substrate 122 user that can be used as electronic equipment carry out the display screen watched; Meanwhile, the user that described thin plate 123 and described substrate 122 also can be used as electronic equipment carries out the touch screen of touch control operation.Be understandable that, described fingerprint identification device 10 can arrange the back side being formed at electronic equipment, and substrate 122 and the thin plate 123 of described fingerprint identification device 10 can form the backboard of electronic equipment jointly.
Substrate 122 in the utility model can adopt in transparent glass, sapphire, transparent resin any one make, described thin plate 123 can adopt in glass, sapphire, transparent resin any one make.Preferably, described substrate 122 can adopt sapphire material to make.Secondary choosing, described substrate 122 also can adopt the tempered glass of Corning Incorporated to make.The thickness of described substrate can be less than or equal to 400 μm, and preferably, the thickness of described substrate 122 can be 300 μm to 400 μm.
Preferably, described thin plate 123 can adopt sapphire material to make.Secondary choosing, described thin plate 123 also can adopt the tempered glass of Corning Incorporated to make.The thickness of described substrate can be less than or equal to 150 μm, and preferably, the thickness of described substrate 122 is less than or equal to 100 μm.
Be understandable that, described substrate 122 can adopt identical or different material to make with thin plate 123, as substrate 122 and thin plate 123 can all adopt sapphire material or glass material to make, also can adopt sapphire and glass combination etc.
When described substrate 122 all adopts glass to make with thin plate 123, described substrate 122 can adopt tempered glass to make, and thin plate 123 can adopt simple glass to make.
In the present embodiment, described fingerprint recognition module 15 comprises flexible PCB 152, fingerprint sensor 153, control element 155.Fingerprint sensor 153 is located between thin plate 123 and substrate 122 at least partly, when user carries out fingerprint recognition authentication operations at described electronic equipment, the finger print face of user and the distance of fingerprint sensor 153 are about d, and the thickness of described thin plate 123 is approximately described distance d, therefore at the thin plate 123 adopting same material, its thickness is thinner, then the accuracy of its fingerprint recognition, discrimination are higher.
When the fingerprint sensor 153 of described fingerprint recognition module 15 adopts capacitance type sensor, by arranging thinner thin plate 123 thickness, make the distance in fingerprint sensor and user's finger print face shorter, thus ensure the fingerprint sensing effect of described fingerprint sensor 154.Further, the utility model is by arranging the thickness of substrate 122 and thin plate 123, make the integral thickness of the cover component 12 of electronic equipment below 500 μm, and then make the cover component 12 of electronic equipment can meet its demand as the rigid of touch-control inputting interface, electronic equipment thickness can not be increased again.Make electronic equipment cover component not in borehole situation, also dexterously fingerprint sensor 153 can be embedded among cover component 12 and solve technical matters of the present utility model.
Described fingerprint sensor 153 for carrying fingerprint sensor 153 and control element 155, and is electrically connected with control element 155 by flexible PCB 152.The base material of described flexible PCB 152 can adopt Kapton (Polyimide film, PI film) to make; Further, the base material of described flexible PCB 152 can adopt two layers of polyimide resin (Polyimide resin, PI resin) to form, and it also can be made up of the protective seam resin of one deck polyimide base material in conjunction with other materials of one deck.The utility model is not as limit.
Described fingerprint sensor 153 is formed on described flexible PCB 152 one end, fingerprint sensor 153 for finger sensing to the pressing of described thin plate 123 and gather user finger finger print information.In the present embodiment, described fingerprint sensor 153 can adopt hyperchannel fingerprint sensor 153.Be understandable that, described fingerprint sensor 153 can arrange sensing circuit to carry out fingerprint collecting and simulating signal generation, and described fingerprint sensor 153 can be encapsulated in single in-line packages (single in-line, SiP).Described fingerprint sensor 153 also can adopt single chips and protect by filling colloid.Described sensing circuit can be packaged in epoxy resin or other elastomeric material, makes described sensing circuit to obtain Reasonable Protection, avoids being damaged by collision during assembling.In the present embodiment, described fingerprint sensor 153 is positioned in the position pointed closer to described user than described flexible PCB 152.Described fingerprint sensor 153 comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.The utility model by covering thin plate 122 on fingerprint sensor 153, thus makes fingerprint identification device 40 have good, smooth outward appearance, and can ensure that fingerprint identification device 40 has higher fingerprint recognition precision, user-friendly.
Further, described fingerprint sensor 153 can adopt optical fingerprint sensor, capacitive fingerprint sensing device, piezoelectricity fingerprint sensor or ultrasonic fingerprint sensor.Described fingerprint sensor 153 can adopt the scratching formula sensor of the distribution in strip type, also can be the push type sensor of the distribution in array.Described fingerprint sensor 153 also can adopt other devices that can respond to user's fingerprint, identify, does not repeat them here.
Further, the surface of described fingerprint sensor 153 also can form protective seam (not shown).Described protective seam is formed at the top of fingerprint recognition module 15, with to fingerprint recognition module 15, especially protects fingerprint sensor 153.Protective seam passes through spraying technology or printing technology or vacuum evaporation technology and is formed; its material such as comprises UV curing type PMMA glue (ultraviolet curing transparent glue), thermohardening type PMMA glue or diamond like carbon (Diamond-likeCarbon; DLC), wherein DLC adopts plated film mode to form protective seam.In certain embodiments; protective seam can also be formed by the material of glass, pottery, sapphire, quartz or other durables, the organic films such as such as polymethylmethacrylate (PMMA), polyethylene terephthalate (PET), polyimide (PI).Be understandable that, described protective seam can be set to individual layer, also can be set to multilayer.
Described control element 155 is electrically connected with flexible PCB 152.Described control element 155 can adopt control chip maybe can realize the control circuit of controlling functions, as application-specific IC (ApplicationSpecific Integrated Circuits, ASIC).
Described control element 155 can adopt any suitable prior art with the electric connection mode of described flexible PCB 152.As the control element 155 in the utility model can adopt bonding wire, through-silicon via structure or upside-down mounting mode to be electrically connected on flexible PCB 152, the utility model is not as limit.
Fingerprint sensor 153 and the control element 155 of the fingerprint recognition module 15 of fingerprint identification device 10 of the present utility model are not packaged in the integral type encapsulating structure in same chip, but be arranged at the homonymy of flexible PCB 152 independently of one another, discretely, and be electrically connected with flexible PCB 152 respectively.Control element 155 is electrically connected with fingerprint sensor 153 by flexible PCB 152, thus the Signal transmissions of fingerprint sensor 153 is processed in control element 155.
Fingerprint recognition module 15, described fingerprint recognition module 15 identifies for carrying out induction to fingerprint.
In the present embodiment, described substrate 122 offers through slot 1225, is provided with the flexible PCB 152 of fingerprint sensor 153 one end through described through slot 1225, and is bonded in by glue on the first surface on substrate.The sensitive surface of fingerprint sensor 153 is towards thin plate 123, and flexible PCB 152 depends on the one end being provided with fingerprint sensor 153 and is clipped between described thin plate 123 and described substrate 122; At least one fingerprint sensor 153 described is made to be positioned in the position pointed closer to described user than described substrate 122.User is when doing the input of fingerprint recognition authentication, and the distance of its finger print face and fingerprint sensor 153 is suitable with described gauge of sheet, ensures the reliability of fingerprint sensor 153 like this.
The groove width of described through slot 1225, slightly larger than the thickness of described flexible PCB 152, makes described flexible PCB 152 be arranged in described through slot 1225 and is also firmly arranged in through slot 1225.
The one end being provided with the flexible PCB 152 of control element 155 is bonded on described substrate 122 first surface 1220, flexible circuit board 152 is provided with connector (not shown), described flexible circuit board 152 is electrically connected with the mainboard (not shown) of electronic equipment by described connector.Be understandable that, the shape of described through slot 1225 can adopt bar shaped, and its size can be adaptive with described flexible PCB 152.Described through slot 1225 also can adopt circle or other suitable shapes, only need ensure that it can pass for flexible PCB 152.
Substrate 122 in the present embodiment carries the fingerprint sensor 153 of fingerprint recognition module 15 by its first surface 1220, and is convenient to the setting of flexible PCB 152 by the through slot 1225 being opened in described substrate 122.
As shown in Figure 1, the through slot 1225 of described substrate 122 can perpendicular to the plane at described substrate 122 place.The through slot 1225 of described substrate 122 also can relative to the planar tilt at described substrate 122 place, thus is convenient to described flexible PCB 152 and is arranged in described through slot 1225.
Fingerprint identification device 10 in the present embodiment by arranging thin plate 123 on a substrate 122, thus is formed smooth astomous smooth.Make the electronic equipment that this fingerprint identification device 10 is set have complete, good outward appearance and intensity, not only can avoid the perforate of electronic equipment appearance and cause stress concentrate, intensity decline, be convenient to user simultaneously and carry out touch-control and viewing.And the fingerprint identification device 10 in the present embodiment is by offering through slot 1225 on a substrate 122, thus be convenient to the setting of flexible PCB 152 and upper device thereof, ensure that fingerprint identification device 10 has thinner thickness, be beneficial to the fingerprint recognition precision promoting fingerprint identification device 10.
Further, fingerprint identification device 10 of the present utility model is also provided with bonding coat 17 between described substrate 122 and thin plate 123, for mutually being combined closely with thin plate 123 by described substrate 122.Described bonding coat 17 can adopt optical clear resin (Optical Clear Resin, OCR) or optical adhesive tape (Optical ClearAdhesive, OCA).
Further, described bonding coat 17 covers the fingerprint sensor 153 of described fingerprint recognition module 15 or is covered to small part flexible PCB 152.
In the present embodiment, described bonding coat 17 can be covered in the side that described flexible PCB 152 is provided with described fingerprint sensor 153.Namely, described fingerprint sensor 153 is arranged at the side of described flexible PCB 152 towards the 4th surface 1232 of described thin plate 123, described bonding coat 17 is covered in the side of described flexible PCB 152 towards the 4th surface 1232 of described thin plate 123, and covers described fingerprint sensor 153 and/or at least part of flexible PCB 152.
Described bonding coat 17 also can be covered in the side that described flexible PCB 152 does not arrange fingerprint sensor 153.That is, described fingerprint sensor 153 is arranged at the side of described flexible PCB 152 towards the 4th surface 1232 of described thin plate 123; Described bonding coat 17 is covered in the side of described flexible PCB 152 towards the first surface 1220 of described substrate 122, and described bonding coat 17 at least flexible PCB 152 described in cover part.
Described bonding coat 17 not only can strengthen the strength of joint between described substrate 122 and described thin plate 123, also can be convenient to described fingerprint recognition module 15 and stably be arranged between described substrate 122 and described thin plate 123.Further, described bonding coat 17 can be used for strengthening the strength of joint between described fingerprint sensor 153 and described flexible PCB 152.And, when described bonding coat 17 is arranged between flexible PCB 152 and described substrate 122, can not increase described fingerprint sensor 153 to described thin plate 123 the 3rd surface 1230 between thickness, and then the sensing accuracy of identification of described fingerprint sensor 153 can be ensured.
As shown in Figure 5, the second embodiment of the present utility model provides a kind of electronic equipment being provided with fingerprint identification device 20, and it is roughly the same with the first embodiment, and described fingerprint identification device 20 comprises cover component, fingerprint recognition module 25.Described cover component comprises substrate 222 and is attached at the thin plate 223 of substrate, and the thickness of described thin plate 223 is less than the thickness of substrate 222.Described substrate 222 is provided with first surface 2220 and the second surface 2222 of opposing setting, and described thin plate 223 is provided with the 3rd surface 2230 and the 4th surface 2232 of opposing setting.Described fingerprint recognition module 25 comprises flexible PCB 252, fingerprint sensor 253, control element 255.Substrate 222 offers through slot 2225.Bonding coat 27 is provided with between substrate 222 and thin plate 223.4th surface 2232 of described thin plate 223 offers recess 2236.
Difference is, in the present embodiment, described fingerprint sensor 253 is placed in the recess 2236 of described thin plate 223, and fingerprint sensor 253 directly fits in the 4th surface 2232 of described thin plate 223.
In the present embodiment, by the 4th surface 2232 by direct for described fingerprint sensor 253 attaching sheet 223, thus reduce fingerprint sensor 253 and user point between air line distance, be convenient to user and carry out fingerprint induction, identification by the 3rd surface 2231 of the described thin plate 223 of touch to make described fingerprint recognition module 25.
As shown in Figure 6 to 8, the 3rd embodiment of the present utility model provides a kind of electronic equipment being provided with fingerprint identification device 30, and it is roughly the same with the first embodiment, and fingerprint identification device 30 comprises cover component 32, fingerprint recognition module 35.Described electronic equipment is also provided with display element 100.Described cover component 32 comprises substrate 322 and is attached at the thin plate 323 of substrate, and the thickness of described thin plate 323 is less than the thickness of substrate 322.Described substrate 322 is provided with first surface 3220 and the second surface 3222 of opposing setting, and described thin plate 323 is provided with the 3rd surface 3230 and the 4th surface 3232 of opposing setting.Described fingerprint recognition module 35 comprises flexible PCB 352, fingerprint sensor 353, control element 355.Bonding coat 37 is provided with between substrate 322 and thin plate 323.
Difference is, in the present embodiment, described substrate 322 is also provided with the side 3223 being connected to described first surface 3220 and second surface 3222.And the first surface 3220 of described substrate 322 closes on described side 3223 also offers recess 3226.The flexible PCB 352 of described fingerprint recognition module 35 is between the first surface 3220 and the 4th surface 3232 of described thin plate 323 of described substrate 322, and the side 3223 through described substrate 322 extends to the second surface 3222 of described substrate 322.The flexible PCB 352 of described fingerprint recognition module 35 and the fingerprint sensor 353 being arranged at flexible PCB 352 are placed in described recess 3226 at least partly.
Described fingerprint sensor 353 is electrically connected on one end of described flexible PCB 352, and described fingerprint sensor is arranged between the first surface 3220 of described substrate 322 and the 4th surface 3232 of described thin plate 323; Described control element 355 is electrically connected on the other end of described flexible PCB 352, and second surface 312 side of substrate 322 described in described control element 355.
Be understandable that, similar with the fingerprint identification device 10 of the first embodiment, the substrate 322 in the present embodiment and thin plate 323 can be used as thin plate or the backboard of electronic equipment, and also can use by the frame be equipped with further in the periphery of described electronic equipment.Described frame can enclose the periphery of the substrate 322 in described fingerprint identification device 30 and thin plate 323, thus hides flexible PCB 352 and form protection to the substrate 322 of fingerprint identification device 30, thin plate 323 and flexible PCB 352.
The flexible PCB 352 of the fingerprint identification device 30 in the present embodiment from the side of substrate 322 around folding to the second surface 312 of substrate 322, thus be convenient to the setting of control element 355 and substrate 322 complete as electronic equipment thin plate can be ensured, the bulk strength of substrate 322 can be promoted.And by arranging recess 3226 on substrate 322, the fingerprint sensor 353 be convenient to flexible PCB 352 and be arranged at flexible PCB 352 is arranged, prevent the size restriction due to flexible PCB 352 and the fingerprint sensor 353 that is arranged at flexible PCB 352 from causing the thickness of cover component thicker, thus the electronic equipment that can ensure fingerprint identification device 30 and be provided with this fingerprint identification device 30 have thinner integral thickness.
As shown in Figure 9, the 4th embodiment of the present utility model provides a kind of electronic equipment being provided with fingerprint identification device 40, and it is roughly the same with the first embodiment, comprises cover component, fingerprint recognition module 45.Described cover component 42 comprises substrate 422 and is attached at the thin plate 423 of substrate 422, and the thickness of described thin plate 423 is less than the thickness of substrate 422.Described substrate 422 is provided with first surface 4220 and the second surface 4222 of opposing setting, and described thin plate 423 is provided with the 3rd surface 4230 and the 4th surface 4232 of opposing setting.Described fingerprint recognition module 45 comprises flexible PCB 452, fingerprint sensor 453, control element 455.Substrate 422 offers through slot 4225.Bonding coat 47 is provided with between substrate 422 and thin plate 423.
Difference is, in the present embodiment, the first surface 4220 of the substrate 422 of described cover component offers recess 4226, and the 4th surface 4232 of described thin plate 423 offers recess 4236.
The fingerprint sensor 453 of described line recognition device 45 is placed in the recess 4226 of substrate 422 and the recess 4236 of thin plate 423, thus the setting due to fingerprint sensor 453 can be avoided to cause cover component thickness thicker.And the air line distance between the first surface 4220 that can reduce fingerprint sensor 453 and thin plate 423, user is when doing the input of fingerprint recognition authentication, and the distance of its finger print face and fingerprint sensor 153 is shorter.
Further, in the present embodiment, described fingerprint identification device 40 is also provided with at least one deck color layers 49, and described color layers 49 comprises at least one deck color ink layer or BM (Black Matrix, black matrix") layer be coated on described substrate 422 and/or described thin plate 423.Be understandable that, described color layers 49 can be formed at first surface 4220 and the second surface 4222 of described substrate 422, or is formed at the 3rd surface 4230 and the 4th surface 4232 of described thin plate 423.Described color of the present utility model is 49 can be formed at described cover component, further, described color layers 49 can be arranged at the non-visible area of cover component, thus block fingerprint identification device 40 or be provided with the touch screen of fingerprint identification device 40, the electronic component of electronic equipment, thus make fingerprint identification device 40 or be provided with the touch screen of fingerprint identification device 40, electronic equipment has good outward appearance.
Concrete, in the present embodiment, described color layers 49 is formed at the 4th surface 4232 of described thin plate 423, and the fingerprint sensor 453 of described fingerprint recognition module 45 directly can fit in described color layers 49, also can arrange bonding coat 47 between color layers 49 and fingerprint sensor 453.
Further, described color layers 49 is identical with the color of the protective seam on described fingerprint sensor 453 surface.
The utility model also provides a kind of touch-screen comprising fingerprint identification device, adopts fingerprint identification device as above, and forms touch-control sensing layer (not shown) on the substrate, thus realizes the touch control operation of user.
The utility model also provides a kind of electronic equipment for fingerprint recognition sensing, comprises display element and fingerprint identification device as above, and the cover component subregion of described fingerprint identification device is transparent and fit in described display element.
Further, in another embodiment of the present utility model, described electronic equipment is provided with visible area and non-visible area, and described electronic equipment is provided with fingerprint identification device as above, and the fingerprint sensor of described fingerprint identification device is arranged in the non-visible area of described electronic equipment.Described substrate is visible area, cover part at least.
In description of the present utility model, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " axis ", " radial direction ", orientation or the position relationship of the instruction such as " circumference " are based on orientation shown in the drawings or position relationship, only the utility model and simplified characterization for convenience of description, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as restriction of the present utility model.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In description of the present utility model, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In the utility model, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or integral; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements.For the ordinary skill in the art, the concrete meaning of above-mentioned term in the utility model can be understood as the case may be.
In the utility model, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be that the first and second features directly contact, or the first and second features are by intermediary indirect contact.And, fisrt feature second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " can be fisrt feature immediately below second feature or tiltedly below, or only represent that fisrt feature level height is less than second feature.
In the description of this instructions, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present utility model or example.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in one or more embodiment in office or example in an appropriate manner.In addition, when not conflicting, the feature of the different embodiment described in this instructions or example and different embodiment or example can carry out combining and combining by those skilled in the art.
Above disclosedly be only a kind of preferred embodiment of the utility model, certainly the interest field of the utility model can not be limited with this, one of ordinary skill in the art will appreciate that all or part of flow process realizing above-described embodiment, and according to the equivalent variations that the utility model claim is done, still belong to the scope that utility model contains.
Claims (41)
1. a fingerprint identification device, is characterized in that, comprising:
One cover component; Comprise a substrate, and be attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of described substrate, and at least one through slot offered by described substrate; Described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface; The first surface of described substrate and/or the 4th surface of described thin plate offer recess;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor is configured to the fingerprint of sensing user finger; Described at least one control element is configured to control described fingerprint sensor;
What be provided with the flexible PCB of at least one fingerprint sensor passes described at least one through slot at least partly; Described fingerprint sensor is fixed between described thin plate and substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate, and described fingerprint sensor or described flexible PCB are placed in the recess that described substrate and/or described thin plate are offered at least partly.
2. fingerprint identification device as claimed in claim 1, is characterized in that, the groove width of described through slot is slightly larger than the thickness of described flexible PCB.
3. fingerprint identification device as claimed in claim 1, is characterized in that, described cover component is formed at least one deck color layers.
4. fingerprint identification device as claimed in claim 3, it is characterized in that, described color layers comprises at least one deck color ink layer or BM layer, described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described thin plate the 3rd surface or the 4th surface in one.
5. fingerprint identification device as claimed in claim 1, it is characterized in that, described gauge of sheet is less than or equal to 150 μm.
6. the fingerprint identification device according to any one of claim 1 to 5, is characterized in that, the fingerprint sensor of described fingerprint identification device is positioned in the position pointed closer to described user than described flexible PCB.
7. the fingerprint identification device according to any one of claim 1 to 5, is characterized in that, the fingerprint sensor of described fingerprint identification device directly fits in the 4th surface of described thin plate.
8. the fingerprint identification device according to any one of claim 1 to 5, it is characterized in that, described fingerprint identification device is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
9. fingerprint identification device as claimed in claim 8, is characterized in that, described bonding coat also covers the fingerprint sensor of described fingerprint identification device and at least part of flexible PCB.
10. fingerprint identification device as claimed in claim 8, it is characterized in that, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
11. fingerprint identification devices as claimed in claim 8, is characterized in that, described bonding coat adopts Optical transparent adhesive.
12. fingerprint identification devices as claimed in claim 1, is characterized in that, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
13. 1 kinds of touch-screens comprising fingerprint identification device, is characterized in that, comprising:
One cover component; Comprise a substrate, and be attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, at least one through slot offered by described substrate, described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface; The first surface of described substrate and/or the 4th surface of described thin plate offer recess;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor is configured to the fingerprint of sensing user finger; At least one control element is configured to control described fingerprint sensor;
What be provided with the flexible PCB of at least one fingerprint sensor passes described at least one through slot at least partly; Described fingerprint sensor is fixed between described thin plate and substrate, to make at least one fingerprint sensor described be positioned in the position pointed closer to described user than described substrate, and described fingerprint sensor or described flexible PCB are placed in the recess that described substrate and/or thin plate are offered at least partly;
Wherein said substrate is formed touch-control sensing layer.
14. touch-screens as claimed in claim 13, it is characterized in that, described control element is arranged on the second surface of described substrate.
15. touch-screens as claimed in claim 13, is characterized in that, at least one fingerprint sensor described comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.
16. touch-screens as claimed in claim 13, is characterized in that, described base component is formed at least one deck color layers.
17. touch-screens as claimed in claim 16, it is characterized in that, described color layers comprises at least one deck color ink layer or BM layer, described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described thin plate the 3rd surface or the 4th surface in one.
18. touch-screens as claimed in claim 13, is characterized in that, the groove width of described through slot is slightly larger than the thickness of described flexible PCB.
19. touch-screens as claimed in claim 13, it is characterized in that, described gauge of sheet is less than or equal to 150 μm.
20. touch-screens according to any one of claim 13 to 19, it is characterized in that, described fingerprint sensor is positioned in the position pointed closer to described user than described flexible PCB.
21. touch-screens according to any one of claim 13 to 19, is characterized in that, described fingerprint sensor directly fits in four surface of described thin plate towards described substrate.
22. touch-screens according to any one of claim 13 to 19, it is characterized in that, described touch-screen is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
23. touch-screens as claimed in claim 22, is characterized in that, described bonding coat also covers described fingerprint sensor and at least part of flexible PCB.
24. touch-screens as claimed in claim 22, is characterized in that, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
25. touch-screens as claimed in claim 22, is characterized in that, described bonding coat adopts Optical transparent adhesive.
26. touch-screens as claimed in claim 13, is characterized in that, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
27. 1 kinds of electronic equipments for fingerprint recognition sensing, it is characterized in that, described electronic equipment comprises:
At least one display element;
Cover component; Fit with described at least one display element;
Described cover component subregion is transparent, comprises a substrate further, and is attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, at least one through slot offered by described substrate, described substrate is provided with towards the first surface of described thin plate and the second surface relative with described first surface, and described thin plate is provided with towards the 4th surface of described substrate and three surface relative with described 4th surface; The first surface of described substrate and/or the 4th surface of described thin plate offer recess;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor, described at least one fingerprint sensor is configured to the fingerprint of sensing user finger; At least one control element is configured to control described fingerprint sensor;
Be provided with partially passing through described at least one through slot and being fixed between described thin plate and substrate of the flexible PCB of at least one fingerprint sensor, and described fingerprint sensor or described flexible PCB are placed in the recess that described substrate and/or described thin plate are offered at least partly; Described at least one fingerprint sensor is positioned in the position of carrying out touch-control than described substrate near described user's finger, to make the distance of at least one fingerprint sensor described and user's finger touch be approximately described gauge of sheet.
28. electronic equipments as claimed in claim 27, is characterized in that, described fingerprint sensor comprises one group of capacitive element of the user fingerprints that can be coupled to user's finger in a capacitive manner.
29. electronic equipments as claimed in claim 27, is characterized in that, at least one fingerprint sensor described comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.
30. electronic equipments as claimed in claim 27, it is characterized in that, the substrate of described cover component directly fits in described display element, and described control element is arranged between described cover component and described display element.
31. electronic equipments as claimed in claim 27, is characterized in that, described base component is formed at least one deck color layers.
32. electronic equipments as claimed in claim 31, it is characterized in that, described color layers comprises at least one deck color ink layer or BM layer, described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described thin plate the 3rd surface or the 4th surface in one.
33. electronic equipments as claimed in claim 27, is characterized in that, the groove width of described through slot is slightly larger than the thickness of described flexible PCB.
34. electronic equipments as claimed in claim 27, it is characterized in that, described gauge of sheet is less than or equal to 150 μm.
35. electronic equipments as claimed in claim 27, it is characterized in that, described fingerprint sensor is positioned in the position pointed closer to described user than described flexible PCB.
36. electronic equipments as claimed in claim 27, is characterized in that, described fingerprint sensor directly fits in four surface of described thin plate towards described substrate.
37. electronic equipments as claimed in claim 27, it is characterized in that, described electronic equipment is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
38. electronic equipments as claimed in claim 37, is characterized in that, described bonding coat also covers described fingerprint sensor and at least part of flexible PCB.
39. electronic equipments as claimed in claim 37, is characterized in that, described bonding coat is also covered in described flexible PCB described fingerprint sensor side dorsad.
40. electronic equipments as claimed in claim 27, is characterized in that, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
41. 1 kinds of electronic equipments for fingerprint recognition sensing, described electronic equipment is provided with visible area and non-visible area, it is characterized in that, described electronic equipment comprises:
Be arranged at a display element of visible area at least partly;
Be arranged at a fingerprint identification device of described non-visible area at least partly;
Described fingerprint identification device comprises:
One cover component, fits in described display element; Described cover component comprises a substrate, and is attached at the thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, and at least one through slot offered by described substrate; Described substrate and/or described thin plate offer recess;
Be provided with a flexible PCB of at least one control element and at least one fingerprint sensor;
Described at least one fingerprint sensor is arranged at the non-visible area of electronic equipment, and it is configured to the fingerprint of sensing user finger; Described at least one control element is configured to control described fingerprint sensor;
What be provided with the flexible PCB of at least one fingerprint sensor passes described at least one through slot at least partly; Described at least one fingerprint sensor is positioned in the position pointed closer to described user than described substrate, and described fingerprint sensor or flexible PCB are placed in the recess that described substrate and/or described thin plate are offered at least partly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520130860.7U CN204613972U (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, touch-screen and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520130860.7U CN204613972U (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, touch-screen and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN204613972U true CN204613972U (en) | 2015-09-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520130860.7U Expired - Fee Related CN204613972U (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, touch-screen and electronic equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104751134A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
| TWI609335B (en) * | 2015-09-25 | 2017-12-21 | 業成光電（深圳）有限公司 | Fingerprint identification device and manufacturing method thereof |
| EP3379391A4 (en) * | 2017-01-19 | 2018-09-26 | Shenzhen Goodix Technology Co., Ltd. | Fingerprint recognition device and manufacturing method therefor |
-
2015
- 2015-03-06 CN CN201520130860.7U patent/CN204613972U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104751134A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
| TWI609335B (en) * | 2015-09-25 | 2017-12-21 | 業成光電（深圳）有限公司 | Fingerprint identification device and manufacturing method thereof |
| EP3379391A4 (en) * | 2017-01-19 | 2018-09-26 | Shenzhen Goodix Technology Co., Ltd. | Fingerprint recognition device and manufacturing method therefor |
| US10380407B2 (en) | 2017-01-19 | 2019-08-13 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint identification apparatus and method for manufacturing the same |
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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Patentee before: OFilm Microelectronics Technology Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Patentee after: OFilm Microelectronics Technology Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: OFilm Tech Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 no.1189 Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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Effective date of registration: 20210705 Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: Jiangxi OMS Microelectronics Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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