CN204613969U - Fingerprint identification device, touch-screen and electronic equipment - Google Patents
Fingerprint identification device, touch-screen and electronic equipment Download PDFInfo
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- CN204613969U CN204613969U CN201520130436.2U CN201520130436U CN204613969U CN 204613969 U CN204613969 U CN 204613969U CN 201520130436 U CN201520130436 U CN 201520130436U CN 204613969 U CN204613969 U CN 204613969U
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Abstract
The utility model provides a kind of fingerprint identification device, comprises a substrate, and is attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, described substrate be provided with arrange towards described cover plate first surface, with the opposing second surface of described first surface, the side being connected to described first surface and second surface; One flexible PCB; Described at least one fingerprint induction electrode is configured to the fingerprint of sensing user finger; Described at least one control element is configured to control described fingerprint induction electrode; Be provided with the flexible PCB of at least one fingerprint induction electrode from the second surface extending to described substrate between described substrate and described thin plate through the side of described substrate; Described fingerprint induction electrode is fixed between described thin plate and substrate.Fingerprint identification device of the present utility model by arranging cover plate on substrate, thus forms smooth astomous flat surface, makes the electronic equipment arranging this fingerprint identification device have complete, good outward appearance and intensity.
Description
Technical field
The utility model relates to fingerprint identification technology field, particularly relates to a kind of fingerprint identification device, touch-screen and electronic equipment.
Background technology
With development in science and technology, fingerprint identification device applies to all kinds of portable electric appts more and more widely.As an existing class is provided with the smart mobile phone of fingerprint identification device, user realizes the functions such as mobile phone unblock, fingerprint recognition payment by described fingerprint identification device.
Existing electronic product, if the electronic equipment such as mobile phone, panel computer is in order to realize fingerprint identification function, need to punch in its touch cover, and adopt LGA (Land Grid Array, Background Grid array packages) encapsulation technology electronic equipment cover plate punching place laminating fingerprint sensor, then through hole is offered to expose the touch-control sensing region of fingerprint sensor in the surface of the direct cover plate at electronic equipment, so that described fingerprint sensor can carry out fingerprint detection.But, through hole is offered to the surface of the cover plate of electronic equipment and easily causes through hole stress to increase, thus cause cover-plate glass intensity to decline.For ensureing the cover plate intensity of electronic equipment, drilling technology is complicated, and cost is higher.
If directly arrange at least one fingerprint Identification sensor module under the touch cover of electronic equipment (mobile phone, panel computer etc.).Because electronic equipment cover plate is as user's inputting interface, often accept the user behaviors such as user mobile phone touch-control pressing, therefore electronic equipment needs stronger rigid, and electronic equipment cover sheet thickness this kind of is at present greater than more than 300 microns, the coverage of current finger face and fingerprint Identification sensor is less than 100 microns.This distance is far beyond the finger face of user and the distance coverage of fingerprint Identification sensor, cause fingerprint Identification sensor inefficacy and None-identified user points line paddy ridge and forms fingerprint pattern, therefore there are two technical barriers of urgently capturing in this field: the distance one, reducing finger face and fingerprint Identification sensor; Two, the intensity strengthening the electromagnetic field of fingerprint sensor can make its intensity penetrate 300 microns with upper cover plate.
Utility model content
There is provided that a kind of intensity is better, fingerprint induction be sensitive, the fingerprint identification device of flat appearance, touch-screen and electronic equipment.
A kind of fingerprint identification device, comprising:
One cover component: comprise a substrate, and be attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, and described substrate is provided with the first surface arranged towards described cover plate, the second surface relative with described first surface, is connected to the side of described first surface and second surface,
Be connected with a flexible PCB of at least one control element and at least one fingerprint induction electrode;
Described at least one fingerprint induction electrode is configured to the fingerprint of sensing user finger; Described at least one control element is configured to control described fingerprint induction electrode;
Be provided with the flexible PCB of at least one fingerprint induction electrode from the second surface extending to described substrate between described substrate and described thin plate through the side of described substrate; Described fingerprint induction electrode is fixed between described thin plate and substrate, to make at least one fingerprint induction electrode described be positioned in the position pointed closer to described user than described substrate.
Further, described cover component is formed at least one deck color layers.
Further, described color layers comprises at least one deck color ink layer or BM layer, and described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described thin plate the 3rd surface or the 4th surface in one.
Further, described gauge of sheet is less than or equal to 150 μm.
Further, the fingerprint induction electrode of described fingerprint recognition module is positioned in the position pointed closer to described user than described flexible PCB.
Further, the fingerprint induction electrode of described fingerprint recognition module directly fits in the 4th surface of described thin plate.
Further, described fingerprint identification device is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
Further, described bonding coat also covers the fingerprint induction electrode of described fingerprint recognition module and at least part of flexible PCB.
Further, described bonding coat is also covered in described flexible PCB described fingerprint induction electrode side dorsad.
Further, described bonding coat adopts Optical transparent adhesive.
Further, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
Comprise a touch-screen for fingerprint identification device, described touch-screen is provided with visible area and non-visible area, comprising:
One cover component; Comprise a substrate, and be attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, and described substrate is provided with the first surface arranged towards described cover plate, the second surface relative with described first surface, is connected to the side of described first surface and second surface,
Be connected with a flexible PCB of at least one control element and at least one fingerprint induction electrode;
Described at least one fingerprint induction electrode be arranged at touch-screen visible area and be configured to sensing user finger fingerprint; At least one control element is configured to control described fingerprint induction electrode;
Be provided with the flexible PCB of at least one fingerprint induction electrode from the second surface extending to described substrate between described substrate and described thin plate through the side of described substrate; Described fingerprint induction electrode is fixed between described thin plate and substrate, to make at least one fingerprint induction electrode described be positioned in the position pointed closer to described user than described substrate;
Wherein said substrate is formed touch-control sensing layer.
Further, described control element is arranged at the second surface of described substrate.
Further, at least one fingerprint induction electrode described comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.
Further, described base component is formed at least one deck color layers.
Further, described color layers comprises at least one deck color ink layer or BM layer, and described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described thin plate the 3rd surface or the 4th surface in one.
Further, described gauge of sheet is less than or equal to 150 μm.
Further, the fingerprint induction electrode of described fingerprint recognition module is positioned in the position pointed closer to described user than described flexible PCB.
Further, the fingerprint induction electrode of described fingerprint recognition module directly fits in the 4th surface of described thin plate.
Further, described touch-screen is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
Further, described bonding coat also covers the fingerprint induction electrode of described fingerprint recognition module and at least part of flexible PCB.
Further, described bonding coat is also covered in described flexible PCB described fingerprint induction electrode side dorsad.
Further, described bonding coat adopts Optical transparent adhesive.
Further, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
For an electronic equipment for fingerprint recognition sensing, described electronic equipment is provided with visible area and non-visible area, and described electronic equipment comprises:
Be arranged at a display element of visible area at least partly;
Cover component; Fit with described at least one display element;
Described cover component subregion is transparent, comprises a substrate further, and is attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, and described substrate is provided with the first surface arranged towards described cover plate, the second surface relative with described first surface, is connected to the side of described first surface and second surface,
Be connected with a flexible PCB of at least one control element and at least one fingerprint induction electrode, described at least one fingerprint induction electrode be arranged at described electronic equipment visible area and be configured to sensing user finger fingerprint; At least one control element is configured to control described fingerprint induction electrode;
Be provided with the flexible PCB of at least one fingerprint induction electrode from the second surface extending to described substrate between described substrate and described thin plate through the side of described substrate; Described fingerprint induction electrode is fixed between described thin plate and substrate, to make at least one fingerprint induction electrode described be positioned in the position pointed closer to described user than described substrate.
Further, described fingerprint induction electrode comprises one group of capacitive element of the user fingerprints that can be coupled to user's finger in a capacitive manner.
Further, at least one fingerprint induction electrode described comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.
Further, the substrate of described cover component directly fits in described display element, and described control element is arranged between described cover component and described display element.
Further, described base component is formed at least one deck color layers.
Further, described color layers comprises at least one deck color ink layer or BM layer, and described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described thin plate the 3rd surface or the 4th surface in one.
Further, described gauge of sheet is less than or equal to 150 μm.
Further, the fingerprint induction electrode of described fingerprint recognition module is positioned in the position pointed closer to described user than described flexible PCB.
Further, the fingerprint induction electrode of described fingerprint recognition module directly fits in the 4th surface of described thin plate.
Further, described electronic equipment is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
Further, described bonding coat also covers the fingerprint induction electrode of described fingerprint recognition module and at least part of flexible PCB.
Further, described bonding coat is also covered in described flexible PCB described fingerprint induction electrode side dorsad.
Further, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
Fingerprint identification device of the present utility model by arranging cover plate on substrate, thus form smooth astomous flat surface, the electronic equipment that this fingerprint identification device is set is made to have complete, good outward appearance and intensity, not only can avoid the perforate of electronic equipment appearance and cause stress concentrate, intensity decline, be also convenient to user simultaneously and carry out touch-control and viewing.And fingerprint identification device of the present utility model is by arranging fingerprint induction electrode in visible area, is convenient to user and carries out fingerprint recognition sense operation in visible area, there is good operating experience.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of a kind of fingerprint identification device that the first embodiment provides;
Fig. 2 is the close-up schematic view of the fingerprint identification device described in Fig. 1;
Fig. 3 is the diagrammatic cross-section of a kind of fingerprint identification device that the first embodiment provides;
Fig. 4 is the diagrammatic cross-section of a kind of fingerprint identification device that the second embodiment provides;
Fig. 5 is the diagrammatic cross-section of a kind of fingerprint identification device that the 3rd embodiment provides.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
The utility model provides a kind of fingerprint identification device and electronic equipment.Fingerprint identification device according to the utility model embodiment can be applied to the electronic equipments such as mobile phone, panel computer, notebook computer, media player, also the financial terminal equipments such as ATM (Automatic Teller Machine) (Automated Teller Machine, ATM) can be applied to.
Refer to Fig. 1 to Fig. 3, this utility model first embodiment provides a kind of fingerprint identification device 10 and is provided with the electronic equipment of this fingerprint identification device 10, and described electronic equipment comprises fingerprint identification device 10 and display element 100.The fingerprint recognition module 15 that described fingerprint identification device 10 comprises cover component 12 and depends on described cover component 12.Described cover component 12 is covered on display element 100.
Described cover component 12 comprises substrate 122 and is attached at the thin plate 123 on described substrate 122, and the thickness of described thin plate 123 is less than the thickness of substrate 122.
Described substrate 122 comprises first surface 1220 and the second surface 1222 relative with first surface 1220, and described thin plate 123 comprises the 3rd surface 1230 and four surface 1232 relative with the 3rd surface.Described substrate 122 by glue laminating in the mutual stacked setting of described thin plate 123, the first surface 1220 of described substrate 122 is oppositely arranged with the 4th surface 1232 of described thin plate 123, the second surface 1222 of described substrate 122 and the 3rd surface 1230 opposing settings of described thin plate 123.Described fingerprint recognition module 15 is arranged at described substrate 122, and described thin plate 123 covers described fingerprint recognition assembly and at least substrate 122 described in cover part.Described substrate 122 is also provided with the side 1223 being connected to described first surface 1220 and second surface 1222.
In the present embodiment, described substrate 122 and described thin plate 123 cover component 12 forming electronic equipment bonded to each other, thus the types of functionality for coordinating the miscellaneous part of electronic equipment to realize electronic equipment.Described substrate 122 and described thin plate 123 can be used as the operation interface that the display interface protective device of electronic equipment or user input.As described in thin plate 123 with as described in substrate 122 user that can be used as electronic equipment carry out the display screen watched; Meanwhile, the user that described thin plate 123 and described substrate 122 also can be used as electronic equipment carries out the touch screen of touch control operation.Be understandable that, described fingerprint identification device 10 can arrange the back side being formed at electronic equipment, and substrate 122 and the thin plate 123 of described fingerprint identification device 10 can form the backboard of electronic equipment jointly.
Substrate 122 in the utility model can adopt in transparent glass, sapphire, transparent resin any one make, described thin plate 123 can adopt in glass, sapphire, transparent resin any one make.Preferably, described substrate 122 can adopt sapphire material to make.Secondary choosing, described substrate 122 also can adopt the tempered glass of Corning Incorporated to make.The thickness of described substrate can be less than or equal to 400 μm, and preferably, the thickness of described substrate 122 can be 300 μm to 400 μm.
Preferably, described thin plate 123 can adopt sapphire material to make.Secondary choosing, described thin plate 123 also can adopt the tempered glass of Corning Incorporated to make.The thickness of described substrate can be less than or equal to 150 μm, and preferably, the thickness of described substrate 122 is less than or equal to 100 μm.
Be understandable that, described substrate 122 can adopt identical or different material to make with thin plate 123, as substrate 122 and thin plate 123 can all adopt sapphire material or glass material to make, also can adopt sapphire and glass combination etc.
When described substrate 122 all adopts glass to make with thin plate 123, described substrate 122 can adopt tempered glass to make, and thin plate 123 can adopt simple glass to make.
In the present embodiment, described fingerprint recognition module 15 comprises flexible PCB 152, fingerprint induction electrode 153, control element 155.Fingerprint induction electrode 153 is located between thin plate 123 and substrate 122 at least partly, when user carries out fingerprint recognition authentication operations at described electronic equipment, the finger print face of user and the distance of fingerprint induction electrode 153 are about d, and the thickness of described thin plate 123 is approximately described distance d, therefore at the thin plate 123 adopting same material, its thickness is thinner, then the accuracy of its fingerprint recognition, discrimination are higher.
By arranging thinner thin plate 123 thickness, making the distance in fingerprint induction electrode and user's finger print face shorter, thus ensureing the fingerprint sensing effect of described fingerprint induction electrode 154.Further, the utility model is by arranging the thickness of substrate 122 and thin plate 123, make the integral thickness of the cover component 12 of electronic equipment below 500 μm, and then make the cover component 12 of electronic equipment can meet its demand as the rigid of touch-control inputting interface, electronic equipment thickness can not be increased again.Make electronic equipment cover component not in borehole situation, also dexterously fingerprint induction electrode 153 can be embedded among cover component 12 and solve technical matters of the present utility model.
Described fingerprint induction electrode 153 for carrying fingerprint induction electrode 153 and control element 155, and is electrically connected with control element 155 by flexible PCB 152.The base material of described flexible PCB 152 can adopt Kapton (Polyimide film, PI film) to make; Further, the base material of described flexible PCB 152 can adopt two layers of polyimide resin (Polyimide resin, PI resin) to form, and it also can be made up of the protective seam resin of one deck polyimide base material in conjunction with other materials of one deck.The utility model is not as limit.
Described fingerprint induction electrode 153 is formed between described substrate 122 and thin plate 123, and described fingerprint induction electrode 153 is arranged at the visible area of described fingerprint identification device 10.Fingerprint induction electrode 153 for finger sensing to the pressing of described thin plate 123 and gather finger fingerprint to generate simulating signal.
In the present embodiment, fingerprint induction electrode 153 adopts metal grill (metal mesh) technology to make, and it is provided with metal grill.Concrete, the lattice structure that described fingerprint induction electrode 153 can adopt nano level metal to make, described fingerprint induction electrode 153 can be formed at the first surface 1220 of described substrate 122.Concrete processing procedure and the principle of described fingerprint induction electrode 153 are prior art, do not repeat them here.
In the present embodiment, fingerprint identification device 10 is by arranging fingerprint induction electrode 153 in visible area, and edge user carries out fingerprint recognition sense operation in visible area, makes user have good operating experience.
Described control element 155 is electrically connected with flexible PCB 152.Described control element 155 can adopt control chip maybe can realize the control circuit of controlling functions, as application-specific IC (ApplicationSpecific Integrated Circuits, ASIC).
Described control element 155 can adopt any suitable prior art with the electric connection mode of described flexible PCB 152.As the control element 155 in the utility model can adopt bonding wire, through-silicon via structure or upside-down mounting mode to be electrically connected on flexible PCB 152, the utility model is not as limit.
Described fingerprint recognition module 15 identifies for carrying out induction to fingerprint.One end of the flexible PCB 152 of described fingerprint recognition module 15 is arranged between the first surface 1220 of described substrate 122 and the 4th surface 1232 of described thin plate 123, and between the first surface 1220 and the 4th surface 1232 of described thin plate 123 of described substrate 122, the side 1223 through described substrate 122 extends to the second surface 112 of described substrate 122.The flexible PCB 152 of described fingerprint recognition module 15, being arranged in the process of described cover component 12 around folding, can keep fitting in described substrate 122.Further, described flexible PCB 152 is bonded in described substrate 122 by optical cement.
When described fingerprint identification device 10 is assembled in described electronic equipment, the center (not shown) of electronic equipment can be set outside substrate 122, described center can pressure holding fix described substrate 122 side 1223 and around the flexible PCB 152 rolled in side 1223.
Described fingerprint induction electrode 153 is electrically connected on one end of described flexible PCB 152, and described fingerprint induction electrode is arranged between the first surface 1220 of described substrate 122 and the 4th surface 1232 of described thin plate 123; Described control element 155 is electrically connected on the other end of described flexible PCB 152, and second surface 112 side of substrate 122 described in described control element 155.
Fingerprint identification device 10 in the present embodiment by arranging thin plate 123 on a substrate 122, thus is formed smooth astomous smooth.Make the electronic equipment that this fingerprint identification device 10 is set have complete, good outward appearance and intensity, not only can avoid the perforate of electronic equipment appearance and cause stress concentrate, intensity decline, be convenient to user simultaneously and carry out touch-control and viewing.And the fingerprint identification device 10 in the present embodiment is by arranging the side 1223 of flexible PCB 152 from substrate 122 around folding, the surface integrity destroying substrate 122 can be avoided also can be convenient to arrange fingerprint induction chip 153 and control element 155, ensure that fingerprint identification device 10 has thinner thickness, be beneficial to the fingerprint recognition precision promoting fingerprint identification device 10.
Further, fingerprint identification device 10 of the present utility model is also provided with bonding coat 17 between described substrate 122 and thin plate 123, for mutually being combined closely with thin plate 123 by described substrate 122.Described bonding coat 17 can adopt optical clear resin (Optical Clear Resin, OCR) or optical adhesive tape (Optical ClearAdhesive, OCA).
Further, described bonding coat 17 covers the fingerprint induction electrode 153 of described fingerprint recognition module 15 or is covered to small part flexible PCB 152.
In the present embodiment, described bonding coat 17 can be covered in the side that described flexible PCB 152 is provided with described fingerprint induction electrode 153.Namely, described fingerprint induction electrode 153 is arranged at the side of described flexible PCB 152 towards the 4th surface 1232 of described thin plate 123, described bonding coat 17 is covered in the side of described flexible PCB 152 towards the 4th surface 1232 of described thin plate 123, and covers described fingerprint induction electrode 153 and/or at least part of flexible PCB 152.
Described bonding coat 17 also can be covered in the side that described flexible PCB 152 does not arrange fingerprint induction electrode 153.That is, described fingerprint induction electrode 153 is arranged at the side of described flexible PCB 152 towards the 4th surface 1232 of described thin plate 123; Described bonding coat 17 is covered in the side of described flexible PCB 152 towards the first surface 1220 of described substrate 122, and described bonding coat 17 at least flexible PCB 152 described in cover part.
Described bonding coat 17 not only can strengthen the strength of joint between described substrate 122 and described thin plate 123, also can be convenient to described fingerprint recognition module 15 and stably be arranged between described substrate 122 and described thin plate 123.Further, described bonding coat 17 can be used for strengthening the strength of joint between described fingerprint induction electrode 153 and described flexible PCB 152.And, when described bonding coat 17 is arranged between flexible PCB 152 and described substrate 122, can not increase described fingerprint induction electrode 153 to described thin plate 123 the 3rd surface 1230 between thickness, and then the sensing accuracy of identification of described fingerprint induction electrode 153 can be ensured.
As shown in Figure 4, the second embodiment of the present utility model provides a kind of electronic equipment being provided with fingerprint identification device 20, and it is roughly the same with the first embodiment, and described electronic equipment is provided with visible area and non-visible area.Described fingerprint identification device 20 comprises cover component, fingerprint recognition module 25.Described cover component comprises substrate 222 and is attached at the thin plate 223 of substrate 222, and the thickness of described thin plate 223 is less than the thickness of substrate 222.Described substrate 222 be provided be oppositely arranged first surface 2220, second surface 2222, be connected to the side 2223 of first surface 2220 and second surface 2222.Described thin plate 223 is provided with the 3rd surface 2230 and the 4th surface 2232 be oppositely arranged.Described fingerprint recognition module 25 comprises flexible PCB 252, fingerprint induction electrode 253, control element 255.Fingerprint induction electrode 253 adopts metal grill (metal mesh) technology to make, and is arranged at the visible area of described fingerprint identification device 20.
Difference is, in the present embodiment, described fingerprint induction electrode 253 directly fits in the 4th surface 2232 of described thin plate 223.
In the present embodiment, by the 4th surface 2232 by direct for described fingerprint induction electrode 253 attaching sheet 223, thus reduce fingerprint induction electrode 253 and user point between air line distance, be convenient to user and carry out fingerprint induction, identification by the 3rd surface 2231 of the described thin plate 223 of touch to make described fingerprint recognition module 25.
As shown in Figure 5, the 3rd embodiment of the present utility model provides a kind of electronic equipment being provided with fingerprint identification device 30, and it is roughly the same with the first embodiment, and fingerprint identification device 30 comprises cover component 32, fingerprint recognition module 35.Described electronic equipment is also provided with display element 100.Described cover component 32 comprises substrate 322 and is attached at the thin plate 323 of substrate 322, and the thickness of described thin plate 323 is less than the thickness of substrate 322.Described substrate 322 be provided be oppositely arranged first surface 3220, second surface 3222, be connected to the side 2223 of first surface 2220 and second surface 2222.Described thin plate 323 is provided with the 3rd surface 3230 and the 4th surface 3232 be oppositely arranged.Described fingerprint recognition module 35 comprises flexible PCB 352, fingerprint induction electrode 353, control element 355.Bonding coat 37 is provided with between substrate 322 and thin plate 323.Fingerprint induction electrode 353 adopts metal grill (metal mesh) technology to make, and is arranged at the visible area of described fingerprint identification device 30.
Difference is, in the present embodiment, described fingerprint identification device 30 is also provided with at least one deck color layers 39, and described color layers 39 comprises at least one deck color ink layer or BM (Black Matrix, black matrix") layer be coated on described substrate 322 and/or described thin plate 323.Be understandable that, described color layers 39 can be formed at first surface 3220 and the second surface 3222 of described substrate 322, or is formed at the 3rd surface 3230 and the 4th surface 3232 of described thin plate 323.
Concrete, in the present embodiment, described color layers 39 is formed at the 4th surface 3232 of described thin plate 323, and the fingerprint induction electrode 353 of described fingerprint recognition module 35 directly can fit in described color layers 39, also can arrange bonding coat 37 between color layers 39 and fingerprint induction electrode 353.Described color layers 39 is for blocking all kinds of devices of described substrate 322 first surface 3220 side, thus the electronic equipment making fingerprint identification device 30 and be provided with this fingerprint identification device 30 has good appearance.
Further, described color layers 39 is identical with the color of the protective seam on described fingerprint induction electrode 353 surface.Described color of the present utility model is 39 can be formed at described cover component, further, what described color layers 39 can be arranged at cover component is non-visible area, thus block fingerprint identification device 30 or be provided with the touch screen of fingerprint identification device 30, the electronic component of electronic equipment, thus make fingerprint identification device 30 or be provided with the touch screen of fingerprint identification device 30, electronic equipment has good outward appearance.
The utility model also provides a kind of touch-screen comprising fingerprint identification device, adopts fingerprint identification device as above, and forms touch-control sensing layer (not shown) on the substrate, thus realizes the touch control operation of user.
The utility model also provides a kind of electronic equipment for fingerprint recognition sensing, comprises display element and fingerprint identification device as above, and the cover component subregion of described fingerprint identification device is transparent and fit in described display element.
Further, in another embodiment of the present utility model, described electronic equipment is provided with visible area and non-visible area, and described electronic equipment is provided with fingerprint identification device as above, and the fingerprint induction electrode of described fingerprint identification device is arranged in the non-visible area of described electronic equipment.Described substrate is visible area, cover part at least.
In description of the present utility model, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " axis ", " radial direction ", orientation or the position relationship of the instruction such as " circumference " are based on orientation shown in the drawings or position relationship, only the utility model and simplified characterization for convenience of description, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as restriction of the present utility model.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In description of the present utility model, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In the utility model, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or integral; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements.For the ordinary skill in the art, the concrete meaning of above-mentioned term in the utility model can be understood as the case may be.
In the utility model, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be that the first and second features directly contact, or the first and second features are by intermediary indirect contact.And, fisrt feature second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " can be fisrt feature immediately below second feature or tiltedly below, or only represent that fisrt feature level height is less than second feature.
In the description of this instructions, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present utility model or example.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in one or more embodiment in office or example in an appropriate manner.In addition, when not conflicting, the feature of the different embodiment described in this instructions or example and different embodiment or example can carry out combining and combining by those skilled in the art.
Above disclosedly be only a kind of preferred embodiment of the utility model, certainly the interest field of the utility model can not be limited with this, one of ordinary skill in the art will appreciate that all or part of flow process realizing above-described embodiment, and according to the equivalent variations that the utility model claim is done, still belong to the scope that utility model contains.
Claims (37)
1. a fingerprint identification device, is characterized in that, comprising:
One cover component: comprise a substrate, and be attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, and described substrate is provided with the first surface arranged towards described cover plate, the second surface relative with described first surface, is connected to the side of described first surface and second surface,
Be connected with a flexible PCB of at least one control element and at least one fingerprint induction electrode;
Described at least one fingerprint induction electrode is configured to the fingerprint of sensing user finger; Described at least one control element is configured to control described fingerprint induction electrode;
Be provided with the flexible PCB of at least one fingerprint induction electrode from the second surface extending to described substrate between described substrate and described thin plate through the side of described substrate; Described fingerprint induction electrode is fixed between described thin plate and substrate, to make at least one fingerprint induction electrode described be positioned in the position pointed closer to described user than described substrate.
2. fingerprint identification device as claimed in claim 1, is characterized in that, described cover component is formed at least one deck color layers.
3. fingerprint identification device as claimed in claim 2, it is characterized in that, described color layers comprises at least one deck color ink layer or BM layer, described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described thin plate the 3rd surface or the 4th surface in one.
4. fingerprint identification device as claimed in claim 1, it is characterized in that, described gauge of sheet is less than or equal to 150 μm.
5. the fingerprint identification device according to any one of Claims 1-4, is characterized in that, the fingerprint induction electrode of described fingerprint recognition module is positioned in the position pointed closer to described user than described flexible PCB.
6. the fingerprint identification device according to any one of Claims 1-4, is characterized in that, the fingerprint induction electrode of described fingerprint recognition module directly fits in the 4th surface of described thin plate.
7. the fingerprint identification device according to any one of Claims 1-4, it is characterized in that, described fingerprint identification device is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
8. fingerprint identification device as claimed in claim 7, is characterized in that, described bonding coat also covers the fingerprint induction electrode of described fingerprint recognition module and at least part of flexible PCB.
9. fingerprint identification device as claimed in claim 7, it is characterized in that, described bonding coat is also covered in described flexible PCB described fingerprint induction electrode side dorsad.
10. fingerprint identification device as claimed in claim 7, is characterized in that, described bonding coat adopts Optical transparent adhesive.
11. fingerprint identification devices as claimed in claim 1, is characterized in that, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
12. 1 kinds of touch-screens comprising fingerprint identification device, described touch-screen is provided with visible area and non-visible area, it is characterized in that, comprising:
One cover component; Comprise a substrate, and be attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, and described substrate is provided with the first surface arranged towards described cover plate, the second surface relative with described first surface, is connected to the side of described first surface and second surface,
Be connected with a flexible PCB of at least one control element and at least one fingerprint induction electrode;
Described at least one fingerprint induction electrode be arranged at touch-screen visible area and be configured to sensing user finger fingerprint; At least one control element is configured to control described fingerprint induction electrode;
Be provided with the flexible PCB of at least one fingerprint induction electrode from the second surface extending to described substrate between described substrate and described thin plate through the side of described substrate; Described fingerprint induction electrode is fixed between described thin plate and substrate, to make at least one fingerprint induction electrode described be positioned in the position pointed closer to described user than described substrate;
Wherein said substrate is formed touch-control sensing layer.
13. touch-screens as claimed in claim 12, it is characterized in that, described control element is arranged at the second surface of described substrate.
14. touch-screens as claimed in claim 12, is characterized in that, at least one fingerprint induction electrode described comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.
15. touch-screens as claimed in claim 12, is characterized in that, described base component is formed at least one deck color layers.
16. touch-screens as claimed in claim 15, it is characterized in that, described color layers comprises at least one deck color ink layer or BM layer, described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described thin plate the 3rd surface or the 4th surface in one.
17. touch-screens as claimed in claim 12, it is characterized in that, described gauge of sheet is less than or equal to 150 μm.
18. touch-screens according to any one of claim 12 to 17, it is characterized in that, the fingerprint induction electrode of described fingerprint recognition module is positioned in the position pointed closer to described user than described flexible PCB.
19. touch-screens according to any one of claim 12 to 17, is characterized in that, the fingerprint induction electrode of described fingerprint recognition module directly fits in the 4th surface of described thin plate.
20. touch-screens according to any one of claim 12 to 17, it is characterized in that, described touch-screen is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
21. touch-screens as claimed in claim 20, is characterized in that, described bonding coat also covers the fingerprint induction electrode of described fingerprint recognition module and at least part of flexible PCB.
22. touch-screens as claimed in claim 20, is characterized in that, described bonding coat is also covered in described flexible PCB described fingerprint induction electrode side dorsad.
23. touch-screens as claimed in claim 20, is characterized in that, described bonding coat adopts Optical transparent adhesive.
24. touch-screens as claimed in claim 12, is characterized in that, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
25. 1 kinds of electronic equipments for fingerprint recognition sensing, described electronic equipment is provided with visible area and non-visible area, it is characterized in that, described electronic equipment comprises:
Be arranged at a display element of visible area at least partly;
Cover component; Fit with described at least one display element;
Described cover component subregion is transparent, comprises a substrate further, and is attached at a thin plate on described substrate; Described gauge of sheet is less than the thickness of substrate, and described substrate is provided with the first surface arranged towards described cover plate, the second surface relative with described first surface, is connected to the side of described first surface and second surface,
Be connected with a flexible PCB of at least one control element and at least one fingerprint induction electrode, described at least one fingerprint induction electrode be arranged at described electronic equipment visible area and be configured to sensing user finger fingerprint; At least one control element is configured to control described fingerprint induction electrode;
Be provided with the flexible PCB of at least one fingerprint induction electrode from the second surface extending to described substrate between described substrate and described thin plate through the side of described substrate; Described fingerprint induction electrode is fixed between described thin plate and substrate, to make at least one fingerprint induction electrode described be positioned in the position pointed closer to described user than described substrate.
26. electronic equipments as claimed in claim 25, is characterized in that, described fingerprint induction electrode comprises one group of capacitive element of the user fingerprints that can be coupled to user's finger in a capacitive manner.
27. electronic equipments as claimed in claim 25, is characterized in that, at least one fingerprint induction electrode described comprises and is configured to be capacitively coupled to fingerprint ridge line on described user's finger to sense one group of capacitive element of described fingerprint.
28. electronic equipments as claimed in claim 25, it is characterized in that, the substrate of described cover component directly fits in described display element, and described control element is arranged between described cover component and described display element.
29. electronic equipments as claimed in claim 25, is characterized in that, described base component is formed at least one deck color layers.
30. electronic equipments as claimed in claim 29, it is characterized in that, described color layers comprises at least one deck color ink layer or BM layer, described color ink layer or BM layer are at least coated on first surface or the second surface of described substrate, or described thin plate the 3rd surface or the 4th surface in one.
31. electronic equipments as claimed in claim 25, it is characterized in that, described gauge of sheet is less than or equal to 150 μm.
32. electronic equipments as claimed in claim 25, it is characterized in that, the fingerprint induction electrode of described fingerprint recognition module is positioned in the position pointed closer to described user than described flexible PCB.
33. electronic equipments as claimed in claim 25, is characterized in that, the fingerprint induction electrode of described fingerprint recognition module directly fits in the 4th surface of described thin plate.
34. electronic equipments as claimed in claim 25, it is characterized in that, described electronic equipment is also provided with bonding coat, and described bonding coat is arranged between described substrate and described thin plate, and described bonding coat is used for described substrate and thin plate mutually to combine closely.
35. electronic equipments as claimed in claim 34, is characterized in that, described bonding coat also covers the fingerprint induction electrode of described fingerprint recognition module and at least part of flexible PCB.
36. electronic equipments as claimed in claim 34, is characterized in that, described bonding coat is also covered in described flexible PCB described fingerprint induction electrode side dorsad.
37. electronic equipments as claimed in claim 25, is characterized in that, any one in described substrate employing glass, sapphire, transparent resin is made; Any one in described thin plate employing glass, sapphire, transparent resin is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520130436.2U CN204613969U (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, touch-screen and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520130436.2U CN204613969U (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, touch-screen and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN204613969U true CN204613969U (en) | 2015-09-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520130436.2U Expired - Fee Related CN204613969U (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, touch-screen and electronic equipment |
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| CN (1) | CN204613969U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104751128A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
| CN105893934A (en) * | 2016-03-07 | 2016-08-24 | 北京集创北方科技股份有限公司 | Fingerprint identification method and device and mobile terminal |
| CN109886115A (en) * | 2019-01-18 | 2019-06-14 | 江西沃格光电股份有限公司 | Fingerprint recognition mould group, display module and display terminal |
-
2015
- 2015-03-06 CN CN201520130436.2U patent/CN204613969U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104751128A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
| CN105893934A (en) * | 2016-03-07 | 2016-08-24 | 北京集创北方科技股份有限公司 | Fingerprint identification method and device and mobile terminal |
| CN109886115A (en) * | 2019-01-18 | 2019-06-14 | 江西沃格光电股份有限公司 | Fingerprint recognition mould group, display module and display terminal |
| CN109886115B (en) * | 2019-01-18 | 2021-04-20 | 江西沃格光电股份有限公司 | Fingerprint identification module, display module and display terminal |
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Address after: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Patentee after: OFilm Microelectronics Technology Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: OFilm Tech Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Patentee before: OFilm Microelectronics Technology Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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Effective date of registration: 20210708 Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: Jiangxi OMS Microelectronics Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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