CN109492497A - Ultrasonic fingerprint identifies mould group and electric equipment manufacturing method - Google Patents
Ultrasonic fingerprint identifies mould group and electric equipment manufacturing method Download PDFInfo
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- CN109492497A CN109492497A CN201710819517.7A CN201710819517A CN109492497A CN 109492497 A CN109492497 A CN 109492497A CN 201710819517 A CN201710819517 A CN 201710819517A CN 109492497 A CN109492497 A CN 109492497A
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- ultrasonic sensor
- adhesive
- matching layer
- ultrasonic
- cover board
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
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- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The present invention relates to a kind of ultrasonic fingerprint identification mould group and electric equipment manufacturing methods, comprising: provides ultrasonic sensor, and forms matching layer at the top of the ultrasonic sensor；And cover board is provided, and the cover board is fitted on the surface far from the ultrasonic sensor of the matching layer.Matching layer is formed at the top of ultrasonic sensor in the above method, advantage based on ultrasonic sensor small volume, therefore the mode easy to accomplish that matching layer is formed simultaneously on multiple ultrasonic sensors in technique, to shorten the manufacturing time of matching layer when producing ultrasonic fingerprint identification mould group in batches, the production efficiency of ultrasonic fingerprint identification mould group is improved.
Description
Technical field
The present invention relates to fingerprint identification technology fields, identify mould group and electronic equipment more particularly to a kind of ultrasonic fingerprint
Manufacturing method.
Background technique
Ultrasonic fingerprint identification technology is the ability for having penetrable material using ultrasonic wave, and is generated greatly with the different of material
Small different echo (when i.e. ultrasonic wave reaches unlike material surface, the ultrasonic energy that is reflected back toward and after distance it is different)
And carry out fingerprint recognition.Therefore, using skin and air for the difference of sound impedance, so that it may distinguish fingerprint ridge and valley institute
Position.Ultrasonic fingerprint identification technology fingerprint can be carried out deeper into analytical sampling, or even the table that can penetrate to the skin
The unique three-dimensional feature of fingerprint is identified under face.Moreover, because ultrasonic wave has certain penetrability, therefore have on a small quantity in finger
Work is remained in the case where dirt or humidity, the equipment such as glass, aluminium, stainless steel, sapphire can be penetrated and identified.Therefore,
Ultrasonic fingerprint identification technology is increasingly valued by people.
However, ultrasonic fingerprint identification technology is in initial stage of development, how to optimize the production work of fingerprint recognition mould group
Skill is a problem to be solved.
Summary of the invention
Based on this, it is necessary to aiming at the problem that how to optimize the production technology of fingerprint recognition mould group, provide a kind of ultrasonic wave
Fingerprint recognition mould group and electric equipment manufacturing method.
A kind of ultrasonic fingerprint identification module making method, comprising:
Ultrasonic sensor is provided, and forms matching layer at the top of the ultrasonic sensor；And
Cover board is provided, and the cover board is fitted on the surface far from the ultrasonic sensor of the matching layer.
The thickness of the matching layer is between 20 μm to 100 μm in one of the embodiments,.The thickness of matching layer is low
In 20 μm or higher than 100 μm, matching layer not can be effectively carried out acoustic resistance matching, i.e., cannot effectively reduce piezoelectric layer and connect
The acoustic resistance touched between object is poor, so that ultrasonic wave cannot be transmitted effectively.
Matching layer is formed at the top of the ultrasonic sensor in one of the embodiments, are as follows: is provided and the ultrasound
The circuit board of wave sensor electrical connection, and being located on the same floor with the circuit board is formed at the top of the ultrasonic sensor
With layer.The embodiment can make up existing ladder offset between ultrasonic sensor and circuit board.
The thickness of the matching layer is not less than the thickness of the circuit board in one of the embodiments,.It so could more
Existing ladder offset between ultrasonic sensor and circuit board is mended, offset could be effectively filled, to improve ultrasonic transmission
Validity.
It is formed at the top of the ultrasonic sensor and is located on the same floor with the circuit board in one of the embodiments,
Matching layer includes:
First adhesive is affixed at the top of the ultrasonic sensor, and makes first adhesive and the circuit board shape
At in same layer；And
The ultrasonic sensor for posting first adhesive, which is carried out baking, solidifies first adhesive, in institute
It states and forms the matching layer at the top of ultrasonic sensor.Specifically, first adhesive is hot pressing glue film.Due to can be direct
Membranaceous hot pressing glue (i.e. hot pressing glue film) is attached at the top of ultrasonic sensor, consequently facilitating processing.
The solidification temperature of first adhesive is lower than 120 DEG C in one of the embodiments,.It is highly preferred that described
The solidification temperature of one adhesive is between 80 DEG C to 120 DEG C.When baking temperature be lower than 80 DEG C, cause the first adhesive solidification not
Completely, the adhesive strength for showing as the first adhesive is extremely low, to cannot fit closely with ultrasonic sensor.Work as baking temperature
Higher than 120 DEG C, due to material of main part (such as piezoelectric material) non-refractory of ultrasonic sensor, by the height for being higher than 120 DEG C
It will affect the performance of ultrasonic sensor after temperature baking.
The cover board is fitted in the separate ultrasonic sensor of the matching layer in one of the embodiments,
Include: on surface
The second adhesive is coated in the cover board bottom；And
The cover board is affixed on to the table far from the ultrasonic sensor of the matching layer by second adhesive
On face, and toasted.
Specifically, second adhesive is glue, can effectively fill the binding face micro interface of ultrasonic sensor
On it is uneven.
In one of the embodiments, to the temperature of second adhesive baking between 60 DEG C to 120 DEG C.Work as baking
Roasting temperature is lower than 60 DEG C, causes the solidification of the second adhesive not exclusively, the adhesive strength for showing as the second adhesive is extremely low, thus not
It can be fitted closely with ultrasonic sensor.When baking temperature be higher than 120 DEG C, due to ultrasonic sensor material of main part (such as
Piezoelectric material) non-refractory, it will affect the performance of ultrasonic sensor after the high-temperature baking higher than 120 DEG C.
The thickness summation of the thickness of the matching layer and second adhesive is not less than institute in one of the embodiments,
State the thickness of circuit board.It so just can overcome the disadvantages that existing ladder offset between ultrasonic sensor and circuit board, could effectively fill out
Offset is filled, to improve the validity of ultrasonic transmission.
The ultrasonic sensor includes the electrode layer, piezoelectric layer and film set gradually in one of the embodiments,
Transistor pixels array layer.
The cover board is that the shell of electronic equipment or the cover board are embedded in electronics and set in one of the embodiments,
In standby shell or the cover board is installed below the shell of electronic equipment.
The circuit board is flexible circuit board in one of the embodiments,.
A kind of electronic equipment manufacturing method identifies module making method including the ultrasonic fingerprint.
In above-mentioned ultrasonic fingerprint identification mould group and electric equipment manufacturing method, the first formation at the top of ultrasonic sensor
With layer, cover board is then provided, and cover board is fitted on the surface of separate ultrasonic sensor of matching layer.Due to the above method
Middle matching layer is formed at the top of ultrasonic sensor, based on the advantage of ultrasonic sensor small volume, therefore in technique
The upper mode easy to accomplish that matching layer is formed simultaneously on multiple ultrasonic sensors, to know in batch production ultrasonic fingerprint
The manufacturing time that matching layer is shortened when other mould group improves the production efficiency of ultrasonic fingerprint identification mould group.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The attached drawing of other embodiments is obtained according to these attached drawings.
Fig. 1 is the flow chart that the ultrasonic fingerprint that an embodiment provides identifies module making method；
Fig. 2 is that the ultrasonic fingerprint of Fig. 1 illustrated embodiment identifies ultrasonic sensor and circuit in module making method
The schematic diagram of plate；
Fig. 3 is that the ultrasonic fingerprint of Fig. 1 illustrated embodiment identifies that step S110 is executed into module making method
Result schematic diagram afterwards；
Fig. 4 is that the ultrasonic fingerprint of Fig. 1 illustrated embodiment identifies that step S120 is executed into module making method
Result schematic diagram afterwards；
Fig. 5 be Fig. 1 illustrated embodiment ultrasonic fingerprint identify module making method in step S110 one of them
The specific flow chart of embodiment；
Fig. 6 be Fig. 1 illustrated embodiment ultrasonic fingerprint identify module making method in step S120 one of them
The specific flow chart of embodiment；
Fig. 7 is after the completion of the ultrasonic fingerprint of embodiment illustrated in fig. 6 identifies that step S121 is performed in module making method
Result schematic diagram.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give presently preferred embodiments of the present invention.But the invention can be realized in many different forms, however it is not limited to this paper institute
The embodiment of description.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more thorough
Comprehensively.
Unless otherwise defined, the skill of all technical and scientific terms used herein and the technical field for belonging to invention
The normally understood meaning of art personnel is identical.It is specific that description is intended merely in the term used in the description of invention herein
The purpose of embodiment, it is not intended that the limitation present invention.Term as used herein "and/or" includes one or more relevant institutes
Any and all combinations of list of items.
One embodiment provides a kind of ultrasonic fingerprint identification module making method, wherein ultrasonic fingerprint identifies mould
Group using ultrasonic scanning fingerprint and can identify fingerprint.Ultrasonic fingerprint identification mould group can be installed on electronics and set
It is standby interior.The ultrasonic fingerprint identifies that module making method includes the following contents.
Step S110 provides ultrasonic sensor 110, and matching layer 130 is formed at the top of ultrasonic sensor 110, asks
Referring to figs. 1 to Fig. 3.
Wherein, ultrasonic sensor 110 is for example including thin film transistor (TFT) pel array layer, piezoelectric layer and the electricity set gradually
Pole layer.Piezoelectric layer is made of piezoelectric material.Electrode layer is constructed from a material that be electrically conducting.Specifically, can also be provided in step S110 with
The circuit board 120 that ultrasonic sensor 110 is electrically connected.Please refer to Fig. 2.The height from circuit board 120 has been applied in electrode layer
Piezoelectric layer can produce ultrasonic wave after frequency electric signal, also, piezoelectric layer can also will reflect back into the ultrasonic wave come and be converted to telecommunications
Number, which is sent to circuit board 120 after corresponding processing (such as amplification) through thin film transistor (TFT) pel array layer again.
Circuit board 120 be used for ultrasonic sensor 110 provide control signal (such as to piezoelectric layer send high frequency telecommunications
Number), so that ultrasonic sensor 110 can emit ultrasonic wave.In addition, circuit board 120 may also receive from film crystal
The electric signal of pipe pel array layer, to be identified to fingerprint.Specifically, ultrasonic sensor 110 can be tied up with circuit board 120
Fixed connection.Further, circuit board 120 is flexible circuit board.
In addition, in ultrasonic fingerprint identification mould group, the 120 equal direction in top of 110 top of ultrasonic sensor and circuit board
Contact object (such as finger of user).Referring to FIG. 2,120 top of circuit board and formation at the top of ultrasonic sensor 110 are disconnected
Difference, in other words, circuit board 120 and ultrasonic sensor 110 are respectively at upper layer and lower layer, and circuit board 120 and ultrasonic wave pass
The junction of sensor 110 is step-like.
Matching layer 130 is for carrying out acoustic resistance matching, between the piezoelectric layer and contact object for reducing ultrasonic sensor 110
Acoustic resistance is poor, so that ultrasonic wave can be transmitted effectively.
Specifically, the thickness of matching layer 130 is between 20 μm to 100 μm.The thickness of matching layer 130 lower than 20 μm or
Higher than 100 μm, matching layer 130 not can be effectively carried out acoustic resistance matching, i.e., cannot effectively reduce piezoelectric layer and contact object
Between acoustic resistance it is poor so that ultrasonic wave cannot be transmitted effectively.
Specifically, the step of matching layer 130 are formed at the top of ultrasonic sensor 110 are as follows: pushed up in ultrasonic sensor 110
Portion forms the matching layer 130 being located on the same floor with circuit board 120.Wherein it is possible to not placed at the top of ultrasonic sensor 110
Matching layer 130 is formed at the position of circuit board 120, referring to FIG. 3, so that matching layer 130 is with circuit board 120 positioned at same
Layer, so as to make up existing offset between ultrasonic sensor 110 and circuit board 120.Therefore, matching layer 130 is in addition to tool
There is the matched effect of acoustic resistance, offset can also be filled, to improve the validity of ultrasonic transmission.
The thickness of matching layer 130 is not less than the thickness of circuit board 120 in one of the embodiments,.So just it can overcome the disadvantages that
Existing ladder offset, could effectively fill offset between ultrasonic sensor 110 and circuit board 120, to improve ultrasonic wave
The validity of transmission.
Step S120 provides cover board 140, and cover board 140 is fitted in the separate ultrasonic sensor 110 of matching layer 130
Surface on, please refer to Fig. 1, Fig. 4.
Wherein, cover board 140 shields.Cover board 140 can be the material that can be penetrated by ultrasonic wave, such as glass,
Ceramics, composite material etc..In addition, cover board 140 directly can be embedded in electricity for the shell of electronic equipment or cover board 140
In the shell of sub- equipment or cover board 140 is installed below the shell of electronic equipment.In the present embodiment, the top of cover board 140
Portion is towards contact object.The bottom of cover board 140 is opposite with the top of cover board 140, and the bottom of cover board 140 and matching layer 130 paste
It closes.Referring to FIG. 4, after the completion of step S130 is performed, ultrasonic fingerprint identifies the structure of mould group entirety from top to bottom successively are as follows:
Cover board 140, the matching layer 130 being located on the same floor and circuit board 120, ultrasonic sensor 110.
Therefore, in the ultrasonic fingerprint identification module making method that above embodiment provides, matching layer 130 is in ultrasound
It is formed at the top of wave sensor 110, based on 110 small volume of ultrasonic sensor, (such as 110 volume of ultrasonic sensor is less than
The volume of cover board 110) the characteristics of, therefore easy to accomplish in technique matching is formed simultaneously on multiple ultrasonic sensors 110
Layer 130 mode (such as: singulation is (i.e. for the entirety comprising multiple ultrasonic sensors 110 after can taking first big plate operation
Structure is formed simultaneously matching layer 130 at the top of all ultrasonic sensors 110, is then cut and is respectively formed with
Ultrasonic sensor 110 with layer 130) mode；Alternatively, take single operation, due to ultrasonic sensor 110 volume compared with
Small, the quantity for the ultrasonic sensor 110 that can be accommodated on single support plate is more, so as to simultaneously to the institute being located on support plate
There is single ultrasonic sensor 110 to form matching layer), to shorten matching when producing ultrasonic fingerprint identification mould group in batches
The manufacturing time of layer 130 improves the production efficiency of ultrasonic fingerprint identification mould group.
Above-mentioned formed at the top of ultrasonic sensor 110 is located on the same floor with circuit board 120 in one of the embodiments,
Matching layer 130 the step of include the following contents, please refer to Fig. 5.
First adhesive is affixed on 110 top of ultrasonic sensor, and makes the first adhesive and circuit board by step S111
120 are formed in same layer.
Specifically, in the step, by the first adhesive attachment without placing circuit board at the top of ultrasonic sensor 110
At 120 position, so that the first adhesive and circuit board 120 are formed in same layer.Wherein, the first adhesive needs to protect
It demonstrate,proves its acoustic impedance and piezoelectric layer acoustic impedance relatively, so that the acoustic resistance reduced between piezoelectric layer and contact object is poor, so makes
Obtaining ultrasonic wave can effectively transmit.First adhesive can be hot pressing glue film.Hot pressing glue film refers to membranaceous hot pressing glue.Hot pressing
Glue refers to a kind of glue material that hot-press solidifying is needed after being glued, the hot pressing glue for example including epoxy resin.In addition, due to hot pressing glue
Viscosity can be made very much membranaceous, i.e. referred to as hot pressing glue film without mobility by force.Therefore can the step can be direct
Membranaceous hot pressing glue (i.e. hot pressing glue film) is attached at 110 top of ultrasonic sensor, consequently facilitating processing.
Step S112, the ultrasonic sensor 110 for posting the first adhesive, which is carried out baking, solidifies the first adhesive, with
Matching layer 130 is formed at the top of ultrasonic sensor 110.
After the solidification of first adhesive, there is very strong viscosity, pushed up so as to fit closely in ultrasonic sensor 110
Portion.Specifically, the first adhesive can be lower than the hot pressing glue film of given threshold for solidification temperature.Wherein, given threshold is, for example,
120℃.When baking temperature is higher than 120 DEG C, since the material of main part (such as piezoelectric material) of ultrasonic sensor 110 is intolerant to height
Temperature will affect the performance of ultrasonic sensor 110 after the high-temperature baking higher than 120 DEG C.
It further, can also include: that will post the ultrasonic sensor 110 of the first adhesive before step S112
Deaeration processing is carried out, to promote the effect of subsequent cure.
The cover board is fitted in the separate described of the matching layer in above-mentioned steps S120 in one of the embodiments,
Include the following contents on the surface of ultrasonic sensor, please refers to Fig. 6, Fig. 7.
Step S121 coats the second adhesive 150 in 140 bottom of cover board.
Fig. 7 shows the cover board 140 coated with the second adhesive 150.It specifically, can when coating the second adhesive 150
To place cover board 140 in turn, in order to be coated.
Specifically, the second adhesive 150 can be glue.Glue because have good mobility can preferably fill,
To be preferably bonded matching layer 130 and ultrasonic sensor 110.In addition, glue can also be filled into ultrasonic sensor 110
With the binding region of circuit board 120, enhance the bonding strength between ultrasonic sensor 110 and circuit board 120.
Cover board 140 is affixed on the separate ultrasonic sensor 110 of matching layer 130 by step S122 by the second adhesive 150
Surface on, and toasted.
Wherein, cover board 140 is affixed on matching layer 130 by the second adhesive 150, in other words, is coated with the second glue
The cover board 140 of stick 150 is sticked together with the ultrasonic sensor 110 for being formed with matching layer 130, and the second adhesive 150
It is in contact with matching layer 130.After being toasted, the second adhesive 150 solidification, to be coated with the lid of the second adhesive 150
Plate 140 fits together with the ultrasonic sensor 110 for being formed with matching layer 130, as shown in Figure 4.
Specifically, the temperature toasted in the step is for example between 60 DEG C to 120 DEG C.When baking temperature be lower than 60 DEG C,
Cause the second adhesive 150 solidify not exclusively show as the second adhesive 150 adhesive strength it is extremely low, thus cannot be by cover board
140 fit closely with ultrasonic sensor 110.When baking temperature is higher than 120 DEG C, due to the main body material of ultrasonic sensor 110
Expect (such as piezoelectric material) non-refractory, will affect the property of ultrasonic sensor 110 after the high-temperature baking higher than 120 DEG C
Energy.
Further, before being toasted in step S122, deaeration processing can also be carried out, to promote the second adhesive
150 cured effects.
The thickness summation of the thickness of matching layer 130 and the second adhesive 150 is not less than circuit in one of the embodiments,
The thickness of plate 120.It so just can overcome the disadvantages that existing ladder offset between ultrasonic sensor 110 and circuit board 120, it could effectively
Offset is filled, to improve the validity of ultrasonic transmission.
It should be noted that Fig. 1, Fig. 5 and Fig. 6 are the flow diagram of the method for the embodiment of the present invention.It should be understood that
It is, although each step in the flow chart of Fig. 1, Fig. 5 and Fig. 6 successively shows that these steps are simultaneously according to the instruction of arrow
It is not that the inevitable sequence according to arrow instruction successively executes.Unless expressly stating otherwise herein, the execution of these steps is not
There is stringent sequence limitation, can execute in the other order.Moreover, at least part step in Fig. 1, Fig. 5 and Fig. 6 can
To include that perhaps these sub-steps of multiple stages or stage are not necessarily to execute completion in synchronization to multiple sub-steps,
But can execute at different times, execution sequence is also not necessarily and successively carries out, but can with other steps or
The sub-step or at least part in stage of other steps execute in turn or alternately.
Another embodiment provides a kind of electronic equipment manufacturing method, and the ultrasonic fingerprint including above embodiment is known
Other module making method.
It should be noted that ultrasonic fingerprint identifies the system of mould group in the electric equipment manufacturing method that present embodiment provides
As soon as it is identical as the ultrasonic fingerprint identification principle of module making method that upper embodiment provides to make method, no longer superfluous here
It states.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (16)
1. a kind of ultrasonic fingerprint identifies module making method, comprising:
Ultrasonic sensor is provided, and forms matching layer at the top of the ultrasonic sensor；And
Cover board is provided, and the cover board is fitted on the surface far from the ultrasonic sensor of the matching layer.
2. the method according to claim 1, wherein the thickness of the matching layer is between 20 μm to 100 μm.
3. the method according to claim 1, wherein forming matching layer at the top of the ultrasonic sensor are as follows:
The circuit board being electrically connected with the ultrasonic sensor is provided, and is formed and the circuit board at the top of the ultrasonic sensor
The matching layer being located on the same floor.
4. according to the method described in claim 3, it is characterized in that, the thickness of the matching layer is not less than the thickness of the circuit board
Degree.
5. according to the method described in claim 3, it is characterized in that, being formed and the circuit at the top of the ultrasonic sensor
The matching layer that plate is located on the same floor includes:
First adhesive is affixed at the top of the ultrasonic sensor, and is formed in first adhesive with the circuit board
Same layer；And
The ultrasonic sensor for posting first adhesive, which is carried out baking, solidifies first adhesive, described super
The matching layer is formed at the top of sonic sensor.
6. according to the method described in claim 5, it is characterized in that, first adhesive is hot pressing glue film.
7. according to the method described in claim 5, it is characterized in that, the solidification temperature of first adhesive is lower than 120 DEG C.
8. the method according to the description of claim 7 is characterized in that the solidification temperature of first adhesive between 80 DEG C extremely
Between 120 DEG C.
9. according to claim 1 to method described in any one of 8 claims, which is characterized in that the cover board to be fitted in
Include: on the surface far from the ultrasonic sensor of the matching layer
The second adhesive is coated in the cover board bottom；And
The cover board is affixed on the surface far from the ultrasonic sensor of the matching layer by second adhesive,
And it is toasted.
10. according to the method described in claim 9, it is characterized in that, second adhesive is glue.
11. according to the method described in claim 9, it is characterized in that, to second adhesive baking temperature between 60 DEG C
To between 120 DEG C.
12. according to the method described in claim 9, it is characterized in that, the thickness of the matching layer and second adhesive
Thickness summation is not less than the thickness of the circuit board.
13. according to claim 1 to method described in any one of 8,10 to 12 claims, which is characterized in that the ultrasound
Wave sensor includes the electrode layer set gradually, piezoelectric layer and thin film transistor (TFT) pel array layer.
14. according to claim 1 to method described in any one of 8,10 to 12 claims, which is characterized in that the cover board
For the shell of electronic equipment, perhaps the cover board is embedded in the shell of electronic equipment or the cover board is installed on electronics and sets
Below standby shell.
15. according to claim 1 to method described in any one of 8,10 to 12 claims, which is characterized in that the circuit
Plate is flexible circuit board.
16. a kind of electronic equipment manufacturing method, including ultrasonic fingerprint described in any one of claims 1 to 15 claim
Identify module making method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710819517.7A CN109492497A (en) | 2017-09-12 | 2017-09-12 | Ultrasonic fingerprint identifies mould group and electric equipment manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710819517.7A CN109492497A (en) | 2017-09-12 | 2017-09-12 | Ultrasonic fingerprint identifies mould group and electric equipment manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109492497A true CN109492497A (en) | 2019-03-19 |
Family
ID=65689101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710819517.7A Withdrawn CN109492497A (en) | 2017-09-12 | 2017-09-12 | Ultrasonic fingerprint identifies mould group and electric equipment manufacturing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN109492497A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021077269A1 (en) * | 2019-10-21 | 2021-04-29 | 南昌欧菲生物识别技术有限公司 | Ultrasonic detection module and electronic device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104677399A (en) * | 2014-11-24 | 2015-06-03 | 麦克思智慧资本股份有限公司 | Ultrasonic sensor |
| CN104751125A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
| CN105264543A (en) * | 2013-06-03 | 2016-01-20 | 高通Mems科技公司 | Ultrasonic sensor with bonded piezoelectric layer |
| CN105745669A (en) * | 2013-11-04 | 2016-07-06 | 高通股份有限公司 | User authentication biometrics in mobile devices |
| EP3108406A2 (en) * | 2014-02-23 | 2016-12-28 | Qualcomm Incorporated | Ultrasonic authenticating button |
| CN106709429A (en) * | 2016-11-30 | 2017-05-24 | 麦克思商务咨询(深圳)有限公司 | Ultrasonic sensing device and manufacturing method thereof |
-
2017
- 2017-09-12 CN CN201710819517.7A patent/CN109492497A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105264543A (en) * | 2013-06-03 | 2016-01-20 | 高通Mems科技公司 | Ultrasonic sensor with bonded piezoelectric layer |
| CN105745669A (en) * | 2013-11-04 | 2016-07-06 | 高通股份有限公司 | User authentication biometrics in mobile devices |
| EP3108406A2 (en) * | 2014-02-23 | 2016-12-28 | Qualcomm Incorporated | Ultrasonic authenticating button |
| CN104677399A (en) * | 2014-11-24 | 2015-06-03 | 麦克思智慧资本股份有限公司 | Ultrasonic sensor |
| CN104751125A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
| CN106709429A (en) * | 2016-11-30 | 2017-05-24 | 麦克思商务咨询(深圳)有限公司 | Ultrasonic sensing device and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021077269A1 (en) * | 2019-10-21 | 2021-04-29 | 南昌欧菲生物识别技术有限公司 | Ultrasonic detection module and electronic device |
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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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Application publication date: 20190319 |