CN108629234A - A kind of ceramic base strain fingerprint sensor arrangement - Google Patents
A kind of ceramic base strain fingerprint sensor arrangement Download PDFInfo
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- CN108629234A CN108629234A CN201710168726.XA CN201710168726A CN108629234A CN 108629234 A CN108629234 A CN 108629234A CN 201710168726 A CN201710168726 A CN 201710168726A CN 108629234 A CN108629234 A CN 108629234A
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- ceramic base
- ceramic
- strain transducer
- fpc
- fingerprint
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
Abstract
The present invention relates to a kind of ceramic bases to strain fingerprint sensor arrangement, belongs to sensor field.A kind of ceramic base strain fingerprint sensor arrangement, including ceramic base strain transducer, fingerprint chip, FPC and structural support；The ceramic base strain transducer is equipped with strain transducer using ceramic substrate made of structural ceramic material on ceramic substrate；The structural support gluing is in the upper surface of fingerprint chip；The lower surface of the fingerprint chip, which is set up directly on ceramic base strain transducer, forms electrical connection, while ceramic base strain transducer is also electrically connected with FPC；Or the lower surface of the fingerprint chip is set up directly on the positive of FPC and forms electrical connection, then formation electrical connection is arranged on ceramic base strain transducer by the reverse side of FPC；The fingerprint signal and strain signal are exported by FPC.The structure of the present invention is thinner, it is easier to be installed in the narrow machine product in the inner spaces such as mobile phone, tablet.
Description
Technical field
The present invention relates to a kind of senser element, more particularly to ceramic base strains fingerprint sensor arrangement.
Background technology
Currently, the pressure sensor structure below existing fingerprint sensor is connect based on capacitive detecting structure or resistance
The structure for touching resistance variations needs complicated opposing compression deformation structure, poor reliability, mounting structure complexity；In addition, also having makes
The structure for not needing opposing compression made of strain sheet material, structure is mounted on the stiffening plate at the fingerprint sensor back side
Foil gauge causes total thickness to increase, and it is PET, the plastic materials such as PI, the machinery of plastics itself in addition to strain sheet material
Performance can cause sensor performance bad.
Invention content
It is an object of the invention in view of the above-mentioned problems, providing a kind of ceramic base strain fingerprint sensor arrangement, reliably
Property it is high.
The object of the present invention is achieved like this：
A kind of ceramic base strain fingerprint sensor arrangement, which is characterized in that including ceramic base strain transducer, fingerprint core
Piece, FPC and structural support；The ceramic base strain transducer is using ceramic substrate made of structural ceramic material, in ceramics
Substrate is equipped with strain transducer；The structural support gluing is in the upper surface of fingerprint chip；The following table of the fingerprint chip
Face, which is set up directly on ceramic base strain transducer, forms electrical connection, while ceramic base strain transducer is also electrically connected with FPC；Or
The front that the lower surface of fingerprint chip described in person is set up directly on FPC forms electrical connection, then is arranged in ceramics by the reverse side of FPC
Electrical connection is formed on base strain transducer；The fingerprint signal and strain signal are exported by FPC.
Wherein, the ceramic substrate in the ceramic base strain transducer replaces the package substrate in fingerprint chip original structure,
Make the bare chip part in fingerprint chip be set up directly on the ceramic substrate to form electrical connection and encapsulate, then by FPC and makes pottery
Communication terminal electrical connection on porcelain substrate.
Wherein, the fingerprint chip, which is arranged on the ceramic substrate, forms electrical connection, on the FPC and ceramic substrate
Communication terminal is electrically connected.
Wherein, the fingerprint chip is arranged forms electrical connection in the front of FPC, and the reverse side of the FPC is set to ceramic base
The front of plate forms electrical connection.
Wherein, the strain transducer is resistor-type strain transducer.
Wherein, the ceramic substrate has positive and negative turning circuit；The resistor-type strain transducer is positive and negative four bridge legs
Structure or positive and negative two bridge arm structure.
Wherein, the resistor-type strain transducer is single bridge arm structure.
Wherein, supporting structure can be glass, metal, plastics, OLED display screen, the materials such as ceramics.
Beneficial effects of the present invention are：The new construction pattern that the present invention is combined using fingerprint sensor and strain transducer,
While identification fingerprint may be implemented, the big of the finger pressure on fingerprint surface is applied to by the dependent variable identification of strain transducer
It is small, and the structure is thinner, it is easier to it is installed in the narrow machine product in the inner spaces such as mobile phone, tablet.
Description of the drawings
Fig. 1 is the structural schematic diagram of the ceramic base strain transducer of positive and negative four bridge legs structure.
Fig. 2 is the structural schematic diagram of front strain transducer material resistance bridge arm on ceramic substrate.
Fig. 3 is the structural schematic diagram of reverse side strain transducer material resistance bridge arm on ceramic substrate
Wherein：29- ceramic substrates；The fronts 30- strain transducer material resistance bridge arm；The fronts 31- strain transducer material
The connecting wire of resistance bridge arm；Conductive hole is connected in 32-；The connecting wire of 33- reverse side strain transducer material resistance bridge arms；34-
Reverse side strain transducer material resistance bridge arm；35- electric connection terminals.
Fig. 4 is the structure diagram of embodiment one.
Fig. 5 is the internal structure schematic diagram of embodiment one.
Wherein：43- structural supports；44- bare chips；45-Gold Wire；46- plastic packaging materials；The positive sensors of 47- are answered
Become material resistance bridge arm；The connecting wire of the upper positive strain transducer material resistance bridge arms of 48-；49- ceramic substrates；50- is anti-
The strain transducer material resistance bridge arm in face；The connecting wire of the strain transducer material resistance bridge arm of 51- reverse side；Under 52- absolutely
Edge layer；Conductive hole is connected in 53-；26- conducting resinls；27-FPC；The outlet terminal of 28-FPC.
Fig. 6 is the operation mode figure of embodiment one.
Fig. 7 is the structure diagram of embodiment two.
Fig. 8 is the internal structure schematic diagram of embodiment two.
Wherein：15- fingerprint chips；16- insulation colloids；17- conducting resinls；18- electric connection terminals；The positive sensors of 19-
The connecting wire of strain gauge material resistance bridge arm；The positive strain transducer material resistance bridge arms of 20-；21- ceramic substrates；22- is anti-
The connecting wire of the strain transducer material resistance bridge arm in face；The strain transducer material resistance bridge arm of 23- reverse side；Under 24- absolutely
Edge layer；Conductive hole is connected in 25-；26- conducting resinls；27-FPC；The outlet terminal of 28-FPC.
Fig. 9 is the operation mode figure of embodiment two.
Figure 10 is the structure diagram of embodiment three.
Figure 11 is the internal structure schematic diagram of embodiment three.
Wherein：1- structural supports；2- fingerprint chips；3-FPC；4- colloid layers；5- electric connection terminals；The upper insulating layers of 6-；
7- conductive adhesive layers；8- electric connection terminals；The connecting wire of the positive strain transducer material resistance bridge arms of 9-；The positive biographies of 10-
Sensor strain gauge material resistance bridge arm；11- ceramic substrates；The strain transducer material resistance bridge arm of 12- reverse side；Insulating layer under 13-；
Conductive hole is connected in 14-.
Figure 12 is the operation mode figure of embodiment three.
Specific implementation mode
With reference to specific embodiments and the drawings, the present invention is further explained.
A kind of ceramic base strain fingerprint sensor arrangement, including ceramic base strain transducer, fingerprint chip, FPC and structure
Support element.
Wherein, ceramic base strain transducer is equipped with using ceramic substrate made of structural ceramic material on ceramic substrate
Strain transducer.
The preferred ZrO ceramics of structural ceramic material, can also be aluminium oxide, aluminium nitride, silicon carbide, the potteries such as silica
Porcelain.The structural ceramics is using the tape casting forming and sintering or using being sintered after isostatic pressing method molding, by grinding or cutting after sintering
Piece flakiness, sheet thickness 0.05mm~1.5mm, elasticity modulus>200GPa, bending strength>800MPa, 2~3W/ of thermal coefficient
m.K.If thermal conductivity requires high, when such as needing the faster application environment of positive and negative heat conduction, aluminium nitride ceramics material can be selected,
180~220W/m.K of thermal coefficient.The sensor prepared using above-mentioned ceramic material, extraordinary can eliminate conventional sensing
Strain residual, lag and material creep of the device base material (PET, PI, rubber, PC, PMMA etc.) in deformation process.Meanwhile it controlling
The surface roughness of structural ceramics base material uses ceramic substrate made of structural ceramic material and answers in this way in 0.1um~100um
The associativity for becoming sensor material is significantly improved compared to conventional substrate (PET, PI etc.) and the associativity of strain transducer material, is made
Strain transducer can effectively reduce noise, improve sensitivity, and the response time increase substantially for<20ms.Meanwhile it controlling
8~12*10-6/ degrees Celsius of the coefficient of thermal expansion range of above structure ceramic base material thermally expands caused strain to effectively reduce
The strain error of sensor.
The strain transducer is preferably resistor-type strain transducer, and the resistor-type strain transducer is preferably positive and negative four
Bridge arm structure correspondingly makes positive and negative turning circuit on ceramic substrate using ceramet circuit chemical industry skill.Its principle
For：By four strain transducer material resistance bridge arm settings to the positive and negative of potsherd, Wheatstone bridge, front sensor are formed
Sensor is compressed when strain gauge material resistance bridge arm compression deformation, and resistance becomes smaller, reverse side strain transducer material resistance bridge arm by
Sensor is stretched when swaging becomes, and resistance becomes larger；Four strain transducer material resistance bridge arms pass through resistance trimming balancing, can be mutual
Resistance is elegant caused by mutually eliminating temperature.For this structure due to being bridge circuit, four strain transducer material resistance bridge arms can
So that Signal averaging is four times of single-sensor strain gauge material resistance bridge arm.
Resistor-type strain transducer can also select positive and negative two bridge arm structure in addition to using above-mentioned positive and negative four bridge legs structure
With single bridge arm structure.Wherein, positive and negative two bridge arm structure also has certain temperature compensation characteristic, but single bridge arm does not have the temperature
Supplementary characteristic；In addition, the sensitivity of the resistor-type strain transducer of positive and negative two bridge arm structure is for the resistor-type of single bridge arm structure
Twice of strain transducer.
Below by taking positive and negative four bridge legs structure as an example, the structure of ceramic base strain transducer is illustrated.As shown in Figs. 1-3,
In four strain transducer material resistance bridge arms adjacent two respectively in the tow sides of ceramic substrate, and two neighboring sensing
Connecting wire (the i.e. connecting wire of front strain transducer material resistance bridge arm and reverse side sensing of device strain gauge material resistance bridge arm
The connecting wire of device strain gauge material resistance bridge arm) by conducting conductive hole on ceramic substrate realize after connection on ceramic substrate
Electric connection terminal is connected, due to being positive and negative four bridge legs structure, electric connection terminal here altogether there are four, a pair of opposite electrical connection
Terminal is respectively Input voltage terminal VCC and ground terminal GND, and the opposite electric connection terminal of another pair is respectively then signal output end S1
With signal output end S2.
The fingerprint chip is set on ceramic base strain transducer, and fingerprint chip and ceramic base strain transducer are equal
It realizes and is electrically connected between FPC, the fingerprint signal and strain signal are exported by FPC, and the structural support gluing exists
The upper surface of fingerprint chip.The concrete structure of several ceramic base strain fingerprint sensor arrangements is given below:
Embodiment one
In the present embodiment, package substrate of the ceramic substrate as fingerprint chip, ceramic base strains fingerprint sensor arrangement,
In the case of structural support, device thickness can be as thin as between 0.6mm~0.8mm.
As illustrated in figures 4-5, the upper surface of structural support gluing bare chip in fingerprint chip, this structural support can
To be glass, ceramics, metal, plastics, OLED display screen or other materials；The direct gluing in lower surface of bare chip is in ceramic substrate
Front, the connecting wire that bare chip passes through gold wire and the positive strain transducer material resistance bridge arm of ceramic substrate connects
It connects, strain signal is accessed into fingerprint chip；Then the positive strain transducer material resistance bridge arm of ceramic substrate is passed through into print
The modes such as brush, coating, dispensing, spraying, vapor deposition or magnetron sputtering are fabricated into the front of ceramic substrate；By ceramic in this present embodiment
Substrate is used as the package substrate of fingerprint chip, it is therefore desirable to use plastic packaging material by bare chip, gold wire and ceramic base
Plate front-side circuit plastic packaging and passes through injection molding together；Then, the strain transducer material resistance bridge arm of ceramic substrate reverse side
It is fabricated into the reverse side of ceramic substrate by modes such as printing, coating, dispensing, spraying, vapor deposition or magnetron sputterings, and by the biography of reverse side
The connecting wire of sensor strain gauge material resistance bridge arm is connected to positive sensor by the conducting conductive hole on ceramic substrate and answers
Become material resistance bridge arm connecting wire on, ceramic substrate reverse side overall printing, vapor deposition or by physical vapour deposition (PVD) it is exhausted
Edge colloid forms lower insulating layer, to protect reverse side circuit.Further include the communication that signal is drawn out to periphery in ceramic substrate front
Terminal, the FPC are hot-pressed onto by being electrically connected conducting resinl in the communication terminal so that and the circuit of FPC is connected with communication terminal, then
It is connected to system host by the outlet terminal of FPC, fingerprint signal and strain signal can be transferred to system master by the FPC
Machine.
The operation mode of ceramic base strain fingerprint sensor arrangement is as shown in fig. 6, from sensor device in the present embodiment
Front apply pressure, (applying pressure on structural support) causes bare chip encapsulating compound deformation, simultaneously because bare chip with
The encapsulation of ceramic base strain transducer becames one, and ceramic base strain transducer also deforms upon so that is attached on ceramic substrate
Strain transducer material resistance bridge arm be squeezed and stretch so that generate resistance variations, by electrical connection be sent to fingerprint core
Piece.And the rear portion of ceramic base strain transducer is vacant state, does not need opposing compression ceramic base strain transducer.
Embodiment two
In the present embodiment, fingerprint chip is arranged on ceramic substrate, and FPC is electrically connected with the communication terminal on ceramic substrate,
Want thick compared to the ceramic base strain fingerprint sensor arrangement in embodiment one, without structural support, dress
Setting thickness can reach between 0.8~1.0mm.
As Figure 7-8, in the upper surface of fingerprint chip, (fingerprint chip here refers to packaged structural support gluing
Chip), this structural support can be glass, ceramics, metal, plastics, OLED display screen or other materials；The following table of chip
The direct gluing in face uses conducting resinl by fingerprint chip and the positive electric connection terminal shape of ceramic substrate in the front of ceramic substrate
At electrical connection, strain signal is accessed into fingerprint chip；By in this present embodiment using packaged fingerprint chip, therefore
There is no the injection molding packaging step in embodiment one；Rest part structure and operation mode are consistent with embodiment one, no longer superfluous herein
It states.
Embodiment three
As shown in figs. 10-11, in the present embodiment, fingerprint chip is welded to the fronts FPC by SMT techniques and forms electrical connection,
Bonding is strengthened in dispensing after welding, and the back sides FPC pass through colloid layer (can be with right and wrong conductive heat melten gel, anisotropic conductive adhesive paste etc.) and ceramics
Strain signal, is accessed the corresponding electrical connection endpoint of FPC by the positive and its positive electric connection terminal bonding connection of substrate, into
And fingerprint chip is accessed again；In ceramic substrate front overall printing, vapor deposition or formed by physical vapour deposition (PVD) insulating cement body
Insulating layer, to protect front-side circuit；Rest part structure and operation mode are consistent with embodiment two, and details are not described herein again.This dress
Setting thickness can reach without structural support between 0.9~1.1mm.
In aforementioned three embodiments, the control circuit of ceramic base strain transducer has all been built into fingerprint chip, therefore
Strain signal is accessed in fingerprint chip and is handled, and the control circuit of ceramic base strain transducer can also can be arranged and be arrived
The outside of the present apparatus, is connected by FPC.
Claims (10)
1. a kind of ceramic base strains fingerprint sensor arrangement, which is characterized in that including ceramic base strain transducer, fingerprint chip,
FPC and structural support；The ceramic base strain transducer is using ceramic substrate made of structural ceramic material, in ceramic substrate
It is equipped with strain transducer；The structural support gluing is in the upper surface of fingerprint chip；The lower surface of the fingerprint chip is straight
It connects to be arranged on ceramic base strain transducer and forms electrical connection, while ceramic base strain transducer is also electrically connected with FPC；Or institute
The lower surface for stating fingerprint chip is set up directly on the front formation electrical connection of FPC, then is answered in ceramic base by the reverse side setting of FPC
Become and forms electrical connection on sensor；The fingerprint signal and strain signal are exported by FPC.
2. a kind of ceramic base according to claim 1 strains fingerprint sensor arrangement, which is characterized in that the ceramic base is answered
Become the ceramic substrate in sensor instead of the package substrate in fingerprint chip original structure, keeps the bare chip part in fingerprint chip straight
It connects to be arranged on the ceramic substrate to be formed and is electrically connected and encapsulates, then FPC is electrically connected with the communication terminal on ceramic substrate.
3. a kind of ceramic base according to claim 1 strains fingerprint sensor arrangement, which is characterized in that the fingerprint chip
It is arranged on the ceramic substrate and forms electrical connection, the FPC is electrically connected with the communication terminal on ceramic substrate.
4. a kind of ceramic base according to claim 1 strains fingerprint sensor arrangement, which is characterized in that the fingerprint chip
It is arranged and forms electrical connection in the front of FPC, the reverse side of the FPC is set to the front formation electrical connection of ceramic substrate.
5. a kind of ceramic base according to any one of claims 1-4 strains fingerprint sensor arrangement, which is characterized in that described
Strain transducer is resistor-type strain transducer.
6. a kind of ceramic base according to claim 5 strains fingerprint sensor arrangement, which is characterized in that the ceramic substrate
With positive and negative turning circuit；The resistor-type strain transducer is positive and negative four bridge legs structure or positive and negative two bridge arm structure.
7. a kind of ceramic base according to claim 5 strains fingerprint sensor arrangement, which is characterized in that the resistor-type is answered
Become sensor as single bridge arm structure.
8. a kind of ceramic base according to any one of claims 1-4 strains fingerprint sensor arrangement, which is characterized in that described
The control circuit of ceramic base strain transducer is built into fingerprint chip or the setting of the control circuit of ceramic base strain transducer
It is connected to the outside of the present apparatus by FPC.
9. a kind of ceramic base according to claim 1 strains fingerprint sensor arrangement, which is characterized in that the structural support
Part is glass, ceramics, metal or plastic material.
10. a kind of ceramic base according to claim 1 strains fingerprint sensor arrangement, which is characterized in that the structure branch
Support member is OLED display screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710168726.XA CN108629234A (en) | 2017-03-21 | 2017-03-21 | A kind of ceramic base strain fingerprint sensor arrangement |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710168726.XA CN108629234A (en) | 2017-03-21 | 2017-03-21 | A kind of ceramic base strain fingerprint sensor arrangement |
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| CN108629234A true CN108629234A (en) | 2018-10-09 |
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| CN201710168726.XA Pending CN108629234A (en) | 2017-03-21 | 2017-03-21 | A kind of ceramic base strain fingerprint sensor arrangement |
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| CN103729617A (en) * | 2012-10-12 | 2014-04-16 | 周正三 | Fingerprint sensing device and manufacturing method thereof |
| CN104751125A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
| CN204480268U (en) * | 2015-03-06 | 2015-07-15 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition module and the touch screen based on fingerprint recognition |
| CN106415459A (en) * | 2016-09-17 | 2017-02-15 | 深圳市汇顶科技股份有限公司 | Touch pressure detection module and apparatus |
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2017
- 2017-03-21 CN CN201710168726.XA patent/CN108629234A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1638030A (en) * | 2003-10-28 | 2005-07-13 | 株式会社半导体能源研究所 | Method for manufacturing semiconductor device |
| CN103729617A (en) * | 2012-10-12 | 2014-04-16 | 周正三 | Fingerprint sensing device and manufacturing method thereof |
| CN103047927A (en) * | 2012-12-18 | 2013-04-17 | 无锡莱顿电子有限公司 | Piezoresistive strain gauge with ceramic substrate |
| CN103557989A (en) * | 2013-11-06 | 2014-02-05 | 济南大学 | Piezoelectric strain sensor, method for testing strain sensitivity of piezoelectric strain sensor and application of piezoelectric strain sensor |
| CN104751125A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
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Application publication date: 20181009 |