CN111989638A

CN111989638A - Electronic device including a plurality of fixing members for fixing a biosensor to a display and method of manufacturing the same

Info

Publication number: CN111989638A
Application number: CN201980026130.3A
Authority: CN
Inventors: 曹正圭; 金株汉; 金晋满; 沈宝璟; 李奉宰; 李龙源; 郑大光
Original assignee: Samsung Electronics Co Ltd
Current assignee: Samsung Electronics Co Ltd
Priority date: 2018-04-17
Filing date: 2019-04-17
Publication date: 2020-11-24
Anticipated expiration: 2039-04-17
Also published as: KR102495654B1; KR20190121155A; CN111989638B

Abstract

An electronic device includes: a display including a first surface facing a first direction and outputting display information and a second surface facing a second direction opposite to the first direction; a biosensor including a sensing surface disposed to face a partial area of a second surface of the display and a side surface formed in a lateral direction; a first fixing member interposed between a partial region of the second surface and the biosensor such that the sensing surface is attached to the partial region of the second surface, and hardened at a specified temperature; and a second fixing member attached to at least a portion of the side surface and at least a portion of the peripheral region adjacent to the partial region of the second surface, and hardened by light of a specified wavelength.

Description

Electronic device including a plurality of fixing members for fixing a biosensor to a display and method of manufacturing the same

Technical Field

The present disclosure generally relates to an electronic device including a biosensor for sensing fingerprint information of a user and a method of manufacturing the same.

Background

Recently, a biometric sensor that can be used to perform user authentication by using biometric information (e.g., a fingerprint, an iris, etc.) of a user has been developed. Different technologies such as optical, ultrasonic or capacitive may be used to implement the biosensor for fingerprint recognition.

The above information is provided merely as background information to aid in understanding the present disclosure. There is no determination as to whether any of the above is available as prior art to the present disclosure, nor is there any assertion.

Disclosure of Invention

Technical problem

The biosensor may be provided on a front surface of the electronic device, on which the display may also be arranged. Alternatively, in order to maximize the display area of the display, the biosensor may be disposed on the rear surface of the display. When the biosensor is fixed to the rear surface of the display, the display may be damaged.

In addition, when the biosensor is disposed on the rear surface of the display, the display area including the biosensor may be visually different from other portions of the display area not having the biosensor. For example, a display area including the biosensor may be visually different from a peripheral area of the display area.

Solution scheme

According to an aspect of the present disclosure, an electronic device may include: a display including a first surface facing a first direction and outputting display information (display data or display information) and a second surface facing a second direction opposite to the first direction; a biosensor including a sensing surface disposed to face a partial area of a second surface of the display and a side surface formed in a lateral direction; a first fixing member interposed between a partial region of the second surface and the biosensor such that the sensing surface is attached to the partial region of the second surface, and hardened at a specified temperature; and a second fixing member attached to at least a portion of the side surface and at least a portion of the peripheral region adjacent to the partial region of the second surface, and hardened by light of a specified wavelength.

According to an aspect of the present disclosure, a method for manufacturing an electronic device may include: providing a display and a biosensor; applying a first fixation member to a sensing surface of a biosensor; disposing a sensing surface of the biosensor to which the first fixing member is applied on a rear surface of the display; applying a second fixation member to at least a portion of the periphery of the biosensor; hardening the second fixing member by Ultraviolet (UV) light; and hardening the first fixing member by heat.

Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure.

Advantageous effects

Certain aspects of the present disclosure are to address at least the above problems and/or disadvantages and to provide at least the advantages described below.

Drawings

The foregoing and other aspects, features and advantages of particular embodiments of the present disclosure will become more apparent from the following description when taken in conjunction with the accompanying drawings, wherein:

FIG. 1 is a block diagram illustrating an electronic device in a network environment in accordance with certain embodiments;

fig. 2 is a view showing an appearance of an electronic apparatus according to the embodiment;

fig. 3 is an exploded perspective view of an electronic device according to an embodiment;

fig. 4a is a view illustrating a state when a biosensor module and a display of an electronic device are separated from each other according to an embodiment of the present disclosure;

fig. 4b is a view illustrating a state when a biosensor module and a display of an electronic device are combined with each other according to an embodiment of the present disclosure;

3 FIG. 3 5 3 is 3 a 3 cross 3- 3 sectional 3 view 3 taken 3 along 3 line 3 A 3- 3 A 3' 3 of 3 FIG. 3 4 3 b 3; 3

FIG. 6 is various views of a sensor placement area according to embodiments of the present disclosure;

Fig. 7 is a view illustrating fixing of a biosensor to a display panel layer according to an embodiment of the present disclosure;

fig. 8 is a view illustrating fixing of a biosensor to a display panel layer according to another embodiment of the present disclosure;

fig. 9 is a view showing a peripheral structure of a biosensor according to an embodiment of the present disclosure;

FIG. 10 is a diagram illustrating sensor placement areas according to two embodiments of the present disclosure;

FIG. 11 is a view showing another embodiment of a lamina layer of a biosensor according to an embodiment of the present disclosure;

FIG. 12 is a flow chart illustrating a method of manufacturing a display having a biosensor disposed therein according to an embodiment of the present disclosure;

fig. 13 is a view illustrating a sensor disposition area according to another embodiment of the present disclosure;

FIG. 14 shows a sensor placement area according to yet another embodiment of the present disclosure;

fig. 15 is a view showing one surface of the sensor disposition region of fig. 14; and

fig. 16 is a view showing another surface of the sensor disposition region of fig. 14.

Detailed Description

Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it will be understood by those of ordinary skill in the art that the present disclosure is not limited to the particular embodiments, and that various modifications, equivalents, and/or substitutions may be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. In the following description with respect to the drawings, like components will be assigned like reference numerals.

The biosensor may be disposed on a front surface of the electronic device, and the display may also be disposed on the front surface. Alternatively, in order to maximize the display area of the display, the biosensor may be disposed on the rear surface of the display. When the biosensor is fixed to the rear surface of the display, the display may be damaged.

Aspects of the present disclosure are to address at least the above problems and/or disadvantages and to provide at least the advantages described below.

Fig. 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to an embodiment. Referring to fig. 1, an electronic device 101 in a network environment 100 may communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or with an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a Subscriber Identity Module (SIM)196, or an antenna module 197. In some embodiments, at least one of the components (e.g., display device 160 or camera module 180) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented to be embedded in the display device 160 (e.g., a display).

The processor 120 may run, for example, software (e.g., the program 140) to control at least one other component (e.g., a hardware component or a software component) of the electronic device 101 connected to the processor 120 and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may load instructions or data received from another component (e.g., sensor module 176 or communication module 190) into volatile memory 132, process the instructions or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a Central Processing Unit (CPU) or an Application Processor (AP)) and an auxiliary processor 123 (e.g., a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a sensor hub processor, or a Communication Processor (CP)) that is operatively independent of or in conjunction with the main processor 121. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or be adapted specifically for a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

The secondary processor 123 may control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display device 160, the sensor module 176, or the communication module 190) when the primary processor 121 is in an inactive (e.g., sleep) state, or the secondary processor 123 may control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display device 160, the sensor module 176, or the communication module 190) with the primary processor 121 when the primary processor 121 is in an active state (e.g., running an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) that is functionally related to the auxiliary processor 123.

The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., program 140) and input data or output data for at least one instruction associated therewith. The memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored in the memory 130 as software, and the program 140 may include, for example, an Operating System (OS)142, middleware 144, or an application 146.

The input device 150 may receive instructions (or commands) or data from outside of the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). Input 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).

The sound output device 155 may output the sound signal to the outside of the electronic apparatus 101. The sound output 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing a record and the receiver may be used for incoming calls. Depending on the embodiment, the receiver may be implemented separate from the speaker, or as part of the speaker.

Display device 160 may visually provide information to an exterior (e.g., user) of electronic device 101. The display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to embodiments, the display device 160 may include touch circuitry adapted to detect a touch or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of a force caused by a touch.

The audio module 170 may convert sound into electrical signals and vice versa. According to embodiments, the audio module 170 may obtain sound via the input device 150 or output sound via the sound output device 155 or a headset of an external electronic device (e.g., the electronic device 102) connected directly (e.g., wired) or wirelessly with the electronic device 101.

The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., state of a user) external to the electronic device 101 and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an Infrared (IR) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

Interface 177 may support one or more particular protocols that will be used to directly (e.g., wired) or wirelessly connect electronic device 101 with an external electronic device (e.g., electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

The connection end 178 may include a connector via which the electronic device 101 may be physically connected with an external electronic device (e.g., the electronic device 102). According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module 179 may convert the electrical signal into a mechanical stimulus (e.g., vibration or motion) or an electrical stimulus that may be recognized by the user via his sense of touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

The power management module 188 may manage power to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of a Power Management Integrated Circuit (PMIC), for example.

The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108), and performing communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently of the processor 120 (e.g., an Application Processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a Global Navigation Satellite System (GNSS) communication module) or a wired communication module 194 (e.g., a Local Area Network (LAN) communication module or a Power Line Communication (PLC) module). A respective one of these communication modules may communicate with external electronic devices via a first network 198 (e.g., a short-range communication network such as bluetooth, wireless fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the internet, or a computer network (e.g., a LAN or Wide Area Network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) that are separate from one another. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., International Mobile Subscriber Identity (IMSI)) stored in the subscriber identity module 196.

The antenna module 197 may transmit signals or power to or receive signals or power from outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element composed of a conductive material or conductive pattern formed in a board (e.g., PCB) or formed on a substrate. According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network, such as the first network 198 or the second network 199, may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). Signals or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components other than the radiating element, such as a Radio Frequency Integrated Circuit (RFIC), may be additionally formed as part of the antenna module 197.

At least some of the above components may be interconnected and communicate signals (e.g., instructions or data) communicatively between them via an inter-peripheral communication scheme (e.g., bus, General Purpose Input Output (GPIO), Serial Peripheral Interface (SPI), or Mobile Industry Processor Interface (MIPI)).

According to an embodiment, instructions or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be the same type of device as the electronic device 101 or a different type of device from the electronic device 101. According to embodiments, all or some of the operations to be performed at the electronic device 101 may be performed at one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service instead of or in addition to performing the function or service. The one or more external electronic devices that receive the request may perform the requested at least part of the functions or services or perform another function or another service related to the request and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing of the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

The sensor module 176 of the electronic device 101 described above may include a biosensor disposed below the display 160. The biosensor may comprise a sensor that is driven, for example, ultrasonically. The biosensor may radiate ultrasonic waves from a lower portion of the display 160 (e.g., a rear surface of the display 160) toward an upper portion of the display 160 (e.g., an upper portion of a cover glass or a housing), and may collect a response signal to the radiated ultrasonic waves as information associated with fingerprint recognition. The biosensor may be fixed on the rear surface of the display 160.

Fig. 2 is a view showing an appearance of an electronic apparatus according to the embodiment.

Referring to fig. 2, according to an embodiment, a display (or display device or display panel) 210 and at least a portion of a housing 220 (or frame) may be included in (or exposed through) a front surface of an electronic device 201. According to an embodiment, the housing 220 may provide only a side or back surface of the electronic device 201. That is, the front surface of the electronic device 201 may be entirely composed of the display surface.

According to an embodiment, the electronic device 201 may include various hardware modules that are not shown. For example, a biometric sensor (or fingerprint sensor) for detecting a fingerprint of a user may be disposed on a rear surface of the display 210, i.e., on a surface of the display 210 that does not face the user. As shown, in an embodiment, the biosensor may be disposed at a lower portion of the display 210.

According to an embodiment, the electronic device 201 may detect a fingerprint of a user through the fingerprint sensing area 212 of the display 210. Accordingly, the biosensor may be disposed on the rear surface of the display 210 at a position corresponding to the fingerprint sensing area 212.

According to an embodiment of the present disclosure, the biosensor may be fixed to the rear surface of the display 210 by using a polymer or resin (or at least one adhesive member).

Accordingly, aspects of the present disclosure are to provide an electronic device including a structure capable of stably fixing a biosensor on a rear surface of a display without damaging or changing the rear surface of the display, and a method of manufacturing the same.

Other aspects of the present disclosure are to provide an electronic device having a display with improved visual quality and a method of manufacturing the same.

In fig. 2, the electronic device 201 is provided by way of example, and the present disclosure is not limited to the above example. For example, a receiver, camera module, iris sensor, or other biometric sensor may be disposed on various surfaces of the electronic device 201.

Fig. 3 is an exploded perspective view of an electronic device according to an embodiment.

Referring to fig. 3, according to an embodiment, an electronic device 301 (e.g., electronic device 201 of fig. 2) may include a cover glass 310, a display (or display panel) 320 (e.g., display 210 of fig. 2), a biosensor module 340 (or biosensor, or biosensor device) (e.g., fingerprint sensor), a housing 350 (e.g., housing 220 of fig. 2), a circuit board 360, a battery 370, a back cover 380 (or back cover). According to other embodiments, the electronic device 301 may not include some of the components shown in fig. 3, and may additionally include components not shown in fig. 3.

The cover glass 310 may be transparent to allow transmission of at least a portion of the light generated from the display 320. In addition, the user may place a part of his/her body (e.g., a finger) on the cover glass 310 to perform a touch operation. Alternatively, the user may perform a touch operation using the electronic pen. To implement the touch operation, a touch panel may be disposed under the cover glass 310. For example, the touch panel may be disposed above or below the display 320 or integrated with the display 320. The cover glass 310 may be made of, for example, tempered glass, reinforced plastic, flexible polymer material, or the like, to protect components included in the electronic device 301 from external impact. The cover glass 310 may be referred to as a glazing.

The display 320 may include a first surface 471 for outputting display information and a second surface 472 disposed in a direction opposite to that of the first surface 471. The display 320 may be disposed under the cover glass 310 or may be coupled to the cover glass 310. Accordingly, at least a portion of the display 320 may be exposed through at least a portion of the cover glass 310. The display 320 may output content (e.g., text, images, videos, icons, widgets, symbols, etc.) and may receive touch input or electronic pen input from a user. For electronic pen input, a pen panel associated with operation of the electronic pen may be provided with the display 320. When the touch panel is disposed between the cover glass 310 and the pen panel, an electronic pen input may be detected by the pen panel.

As described above, the display 320 may include a display panel and a touch panel or sensor. Alternatively, the display 320 may also include an electronic pen panel or sensor associated with electronic pen input. For example, the display panel may include, for example, a Liquid Crystal Display (LCD) panel, a Light Emitting Diode (LED) display panel, an Organic LED (OLED) display panel, a Micro Electro Mechanical System (MEMS) display panel, or an electronic paper display panel. The touch sensor may include a capacitive touch panel, a pressure-sensitive touch panel, a resistive touch panel, an infrared touch panel, or an ultrasonic touch panel. The touch sensor may be interposed between the display panels (additional touch panels), may be directly formed on the display panels (touch panels on the unit), or may be included in the display panels (touch panels within the unit). An electronic pen sensor (e.g., digitizer) may detect contact, gesture or hover input from the electronic pen.

According to an embodiment, the display 320 may include a planar region 321 and a curved region 322 extending from one side (e.g., upper, lower, left, or right) of the planar region 321. At least a portion of the curved region 322 may include a non-display region. Alternatively, the entire portion of the bending region 322 may include the non-display region. A wire for supplying a signal to the pixel disposed in the plane area 321 may be disposed in at least a portion of the non-display area. According to an embodiment, the display 320 may further include an edge region that is bent while extending from the left or right side of the planar region 321. Accordingly, at least a portion of the front surface of the display 320 may be provided in a convex shape.

Planar area 321 may have pixels of a display panel (e.g., OLED pixels), conductive patterns of a touch sensor, and/or conductive patterns of an electronic pen sensor all disposed in planar area 321. The bending region 322 may be electrically connected with a flexible printed circuit board 323 located on the rear surface of the display 320 through various conductive patterns (wires).

According to an embodiment, a portion of the curved region 322 may be curved toward the rear surface of the planar region 321. According to an embodiment, the electric wire of the FPCB 323 may be electrically connected with the circuit board 360 through a specific connector. According to an embodiment, pixels for displaying various contents may be disposed in at least a portion of the curved region 322, similar to the planar region 321.

The biosensor module 340 may include: for example, a biosensor including a sensing surface 348 disposed to face a portion of the area of the second surface 472 of the display 320, and a side surface 349 facing a direction different from that of the sensing surface 348. Sensing surface 348 may be a surface in which signals for acquiring fingerprint information are transceived. The bio-sensor module 340 (e.g., a fingerprint sensor) may be disposed under the display 320 or may be connected to a rear surface of the display 320. For example, the biosensor module 340 may be attached to the rear surface of the planar area 321 of the display 320.

The biometric sensor module 340 may sense biometric information (e.g., fingerprint information) of the user. The biosensor module 340 may include, for example, an ultrasonic biosensor. For example, the biosensor module 340 may transmit and receive ultrasonic waves by using at least one piezoelectric layer and an electrode layer. Ultrasonic waves reflected from a user's finger may be transmitted to an image collection layer (e.g., a thin film transistor layer or a complementary metal oxide semiconductor image sensor (CMOS) layer or a Charge Coupled Device (CCD) layer) and may be used to capture or obtain a fingerprint image. Unique fingerprint information may be extracted from the fingerprint image and used for user authentication when compared to previously stored fingerprint information for the user.

The housing 350 may form at least a portion of the exterior of the electronic device 301 and may house components included in the electronic device 301. For example, the housing 350 may form various side surfaces (e.g., an upper surface, a lower surface, a left side surface, and/or a right side surface) of the electronic device 301. According to an embodiment, the housing 350 may include a plurality of sub-housings assembled together. Housing 350 may be referred to as a "rear housing" or "backplate". According to an embodiment, at least a portion of the side surface of the housing 350 may be metallic for use in an antenna structure.

According to an embodiment, the housing 350 may include a bracket (not shown). The bracket may be made of, for example, a magnesium alloy, and may be disposed below the display 320 and above the circuit board 360. The bracket may be connected to the display 320 and the circuit board 360 to physically support the display 320 and the circuit board 360.

According to an embodiment, the circuit board 360 may be disposed below the housing 350 (or above the housing 350). Various components, devices, other printed or daughter circuit boards, and/or other components (e.g., processors, memory, communication circuitry, etc.) of the electronic device 301 may be mounted or disposed on the circuit board 360, according to an embodiment. According to embodiments, the circuit board 360 may be referred to as a "motherboard," a "Printed Board Assembly (PBA), or simply a" PCB. The circuit board 360 may include, for example, a main circuit board and a sub circuit board. According to an embodiment, the main circuit board and the sub circuit board may be electrically connected to each other through a specific connector. The circuit board 360 may be implemented, for example, as a rigid PCB.

Battery 370 may convert chemical energy to electrical energy and/or electrical energy to chemical energy. For example, the battery 370 may convert chemical energy into electrical energy and may provide the electrical energy to various components or modules mounted in the display 320, the biosensor module 340, and the circuit board 360. According to an embodiment, a power management module (e.g., a Power Management Integrated Circuit (PMIC)) for managing charging/discharging of the battery 370 may be provided in the circuit board 360.

The rear cover 380 may be connected to a rear surface of the electronic device 301. The rear cover 380 may be made of tempered glass, injection molded products, and/or metal. According to alternative embodiments, the rear cover 380 may be integrally implemented with the housing 350, or may be removably implemented from the housing 350 by a user.

The biosensor of the biosensor module 340 may be fixed to one side of the second surface 472 of the display 320 by the first and second fixing members (or the first and second adhesive members). The first fixing member may be interposed between a partial region of the second surface 472 of the display 320 and the biosensor (such that the sensing surface 348 is attached to a partial region of the second surface 472 of the display 320), and may be hardened at a designated temperature. The second fixing member may be attached to at least a portion of the side surface 349 of the biosensor and at least a portion of the peripheral region adjacent to a partial region of the second surface 472 of the display 320, and may be hardened by light having a specified wavelength.

Fig. 4a is a view illustrating a state when a biosensor module and a display of an electronic device are separated from each other according to an embodiment of the present disclosure. Fig. 4b is a view illustrating a state when a biosensor module and a display of an electronic device are combined with each other according to an embodiment of the present disclosure.

Referring to fig. 4a and 4b, an electronic device 401 (e.g., electronic device 301 of fig. 3) may include: a display (or a display panel, a display module, a display panel module) 420 (e.g., the display 320 of fig. 3), a first circuit board 423 (e.g., a multi-layer FPCB (M-FPCB)), and a biosensor module 440 (e.g., the bio module 340 of fig. 3).

According to an embodiment, the display 420 may include a first panel layer 421 and a second panel layer 425 (or an auxiliary layer, a panel back surface layer). According to an embodiment, the first panel layer 421 may include at least one light emitting device. According to an embodiment, the first panel layer 421 may include at least one layer allowing transmission of a signal having a specific wavelength band (e.g., a signal having an ultrasonic wavelength band (ultrasonic signal)). For example, the first panel layer 421 may include at least one organic material layer (e.g., at least one insulating layer or Polyimide (PI) layer). In addition, the first panel layer 421 may include at least one organic material layer and at least one metal layer (e.g., a wire layer). When transmitting the ultrasonic wave, dielectric properties of the at least one organic material layer and the at least one metal layer may be similar or identical to each other within a certain tolerance, thereby effectively transmitting the ultrasonic wave. For example, the difference in dielectric properties between the organic material layer and the metal layer may be within a specified tolerance.

A signal (e.g., an ultrasonic signal) having a specified wavelength band may be output from the biosensor module 440, the biosensor module 440 being disposed at a lower portion of the first panel layer 421. Then, the signal may be transmitted to an upper portion of the first panel layer 421 (e.g., a portion in contact with the cover glass 310) via vibration of the first panel layer 421. The signal may be reflected from a finger (or a surface of at least a portion of a fingerprint) of the user contacting the cover glass, and the reflected signal may be transmitted to the biosensor module 440 in the form of vibration through the first panel layer 421. The degree of absorption or reflection of the ultrasonic signal may vary due to an impedance difference between the first panel layer 521 and air (e.g., an air layer between the user's finger and the cover glass 310) or an impedance difference between the first panel layer 521 and the user's fingerprint. For example, the ultrasonic signal may be absorbed into the fingerprint at the ridge portion of the fingerprint touching the cover glass 310, and may be reflected from the valley portion of the fingerprint and transmitted to the biosensor module 440.

According to an embodiment, the second panel layer 425 may be disposed on the rear surface of the first panel layer 421. According to an embodiment, the second panel layer 425 may include a sensor arrangement region 409 (or sensor placement hole) to accommodate a biosensor module (e.g., the biosensor module 340 of fig. 3). The sensor disposition region 409 may have holes passing through the front and rear surfaces of the second panel layer 425 such that the biosensor module 440 faces a partial region of the first panel layer 421 when mounted in the second panel layer 425.

The second panel layer 425 may be disposed below the first panel layer 421 to perform one or more functions. These functions include: the heat emitted from the first panel layer 421 is radiated, the breakage is reduced to reduce the pressure applied to the first panel layer 421, the electromagnetic waves are suppressed, and the visual appearance of the first panel layer 421 is improved. The second panel layer 425 may include one or more sub-layers, each of which performs one of the functions described above. Alternatively, two or more sub-layers may collectively perform one of the functions. When the second panel layer 425 includes a plurality of sub-layers, the above-described holes or recesses or grooves may be formed by removing at least a portion of the sub-layers from the sensor arrangement region 409. Accordingly, the biosensor module 440 disposed in the sensor disposition region 409 may be disposed to directly face the bottom surface of the first panel layer 421, or may be disposed below the first panel layer 421 through at least some sub-layers.

The first circuit board 423 (e.g., the FPCB 323 of fig. 3) may extend from one side (e.g., a bottom surface) of the first panel layer 421 and may be electrically connected with the first panel layer 421. A display Integrated Circuit (IC) and/or a touch sensor IC may be disposed on the first circuit board 423. According to an embodiment, the first circuit board 423 may be operable or electrically connected to the circuit board 360 described in connection with fig. 3. The sensor disposition region 409 may be disposed at one side of the first circuit board 423.

According to the embodiment, the size of the sensor disposition region 409 may be set to be equal to the size of the biosensor module 440 or to be larger than the size of the biosensor module 440 by a specified margin. The sensor disposition region 409 may be formed through the first circuit board 423 and the second panel layer 425. Alternatively, the sensor placement region 409 may be provided by removing some of at least one sub-layer of the second panel layer 425 while passing through the first circuit board 423.

The biosensor module 440 (e.g., biosensor module 340 of fig. 3) may be used to obtain biometric information of a user, such as fingerprint information. The biosensor module 440 may include a biosensor 441, a second circuit board 442, and a sensor circuit 443 (or sensor IC).

At least a portion of biosensor 441 may be attached to the back surface of display 420. For example, one surface of the biosensor 441 may be attached to the rear surface of the first panel layer 421 through at least a portion of the first circuit board 423. Alternatively, the biosensor 441 may be attached to the back surface of the first panel layer 421 through at least a portion (e.g., a through hole or a groove) of the first circuit board 423 and at least a portion of the second panel layer 425. Still alternatively, when some sub-layers of the second panel layer 425 are disposed in the entire portion of the back surface of the first panel layer 421, the biosensor 441 may be secured to at least a portion of the first circuit board 423 and other sub-layers of the second panel layer 425. The biosensor 441 may radiate a signal (e.g., an ultrasonic signal) having a specific wavelength band, may collect the signal after the signal has been reflected from an object in contact with the cover glass 310, and may transmit the collected signal to the sensor circuit 443 through the second circuit board 442.

According to an embodiment, the second circuit board 442 may electrically connect the biosensor 441 and the sensor circuit 443 via signal lines. At least a portion of the second circuit board 442 may be provided in the form of an Anisotropic Conductive Film (ACF). Alternatively, at least a portion of the second circuit board 442 may be provided in the form of a flexible pcb (fpcb). The connector may be disposed at a portion of the second circuit board 442 connected with the sensor circuit 443.

The sensor circuit 443 may extract fingerprint information by processing signals received via the second circuit board 442. Alternatively, the sensor circuit 443 may extract image information corresponding to a fingerprint and may send the image information to a processor of the electronic device 401 (e.g., the processor 120 of fig. 1).

Fig. 5 is a cross-sectional view taken along line a-a' of fig. 4 b.

Referring to fig. 5, an electronic device 501 (e.g., electronic device 301 of fig. 3) may include a display (e.g., display 320 of fig. 3) including a first panel layer 421 and a second panel layer 425, a first circuit board 423, and a biosensor module 440. The electronic device 501 may include a first fixing member 510 (or a first adhesive member) and a second fixing member 520 (or a second adhesive member) for fixing the biosensor 441 of the biosensor module 440. The cover glass may be further disposed on one surface of the first panel layer 421, which is not shown in fig. 5.

The second faceplate layer 425 may include at least one of a first sub-layer 425a, a second sub-layer 425b, a third sub-layer 425c, or a fourth sub-layer 425 d. Although the figure shows the second faceplate layer 425 to include the first, second, third, and fourth sub-layers 425a, 425b, 425c, 425d, the disclosure is not limited thereto. For example, the second faceplate layer 425 may include only some of the first sub-layers shown (e.g., the first and second sub-layers 425a, 425b, or the first and fourth sub-layers 425a, 425 d). The first sub-layer 425a may comprise, for example, an embossed layer. The second sub-layer 425b may include, for example, a buffer layer for absorbing impact. The third sub-layer 425c may include, for example, an electromagnetic interference (EMI) shielding sheet (e.g., a copper (Cu) sheet) for shielding EMI. The fourth sub-layer 425d may comprise, for example, a heat sink (e.g., a graphite sheet) for dissipating heat emitted from the first panel layer 421.

The biosensor module 440 may include, for example, a biosensor 441, a second circuit board 442, and a sensor circuit 443.

The biosensor 441 may radiate a signal (e.g., an ultrasonic signal) having a specific wavelength band, and then may collect the signal as it is reflected. In this regard, the biosensor 441 may include a plate layer 441a, a circuit layer 441b, a piezoelectric material layer 441c, and an electrode layer 441 d. The plate layer 441a may include, for example, a silicon layer, an insulating silicon layer, a Thin Film Transistor (TFT) layer, a glass layer, a plastic layer, a ceramic layer, or a combination thereof. The circuit layer 441b may include, for example, a Thin Film Transistor (TFT) circuit formed in a TFT layer. Alternatively, the circuit layer 441b may include a CMOS layer or a CCD layer formed on a silicon layer. The circuit layer 441b, the piezoelectric material layer 441c, and the electrode layer 441d may function as a signal transceiving layer to output a signal having a specified wavelength band or receive a reflected signal.

For example, the piezoelectric material layer 441c and the electrode layer 441d may correspond to the circuit layer 441 b. When power is supplied to the circuit layer 441b and the electrode layer 441d, the piezoelectric material layer 441c interposed between the circuit layer 441b and the electrode layer 441d may radiate a signal (e.g., an ultrasonic signal) having a specific wavelength band, wherein the signal corresponds to a material property of the piezoelectric material layer 441 c. The piezoelectric material layer 441c may also receive a reflected signal. Accordingly, the signal transceiving layer including the circuit layer 441b, the piezoelectric material layer 441c, and the electrode layer 441d may radiate a signal through at least a portion thereof, and receive a reflected signal of the radiated signal through the remaining portion thereof. Alternatively, based on a particular time interval, the signal transceiving layer may radiate the signal for a first period of time and may receive the reflected signal for a second period of time after the first period of time.

The second circuit board 442, which may be an FPCB, may be electrically connected to the biosensor 441 at one side thereof, and may be connected to the sensor circuit 443 at the other side thereof. The second circuit board 442 may be separated from the first panel layer 421 by a certain distance. According to an embodiment, one side of the second circuit board 442 may include an Anisotropic Conductive Film (ACF), and may be electrically connected with a signal line (or an electrode pad formed at an end of the signal line) disposed at one side of the biosensor 441. The other side of the second circuit board 442 may be electrically connected with the connector and may be electrically connected to the sensor circuit 443.

Sensor circuit 443 can generate and transmit control signals associated with the driving of biosensor 441. The sensor circuit 443 may control the biosensor 441 to radiate an ultrasonic signal under the control of a processor (e.g., the processor 120 of fig. 1), and may obtain fingerprint information by receiving a reflected signal of the ultrasonic signal. The sensor circuit 443 can send the obtained fingerprint information to the processor. The fingerprint information may include, for example, image information generated based on a reflection signal of the ultrasonic signal or feature information of the obtained image.

First fixation member 510 may be interposed between biosensor 441 and first panel layer 421. Specifically, the first fixing member 510 may be interposed between the plate layer 441a and the first panel layer 421 of the biosensor 441. The first fixing member 510 may include a thermosetting resin that is hardened after heat of a certain temperature is applied to the thermosetting resin for a certain time. For example, the first fixing member 510 may include epoxy resin. The first fixing member 510 may be applied to one surface of the biosensor 441 (e.g., on the sheet layer 441 a), or injected onto the sensor-disposing region 409 of the first panel layer 421. The biosensor 441 having the first fixing member 510 applied on the plate layer 441a may be placed on a portion of the first panel layer 421 corresponding to the sensor disposition region 409 using a jig. A specific heating chamber may be provided to harden the first fixing member 510 in order to bond the first panel layer 421 to the biosensor 441. When the biosensor 441 is fixed to the rear surface of the first panel layer 421 by using the second fixing member 520, the first fixing member 510 may be hardened in a chamber having a designated ambient temperature for a designated time (e.g., about 5 minutes to 60 minutes at about 50 ℃ to 100 ℃, or about 10 minutes at about 70 ℃).

After the biosensor 441 to which the first fixing member 510 of the first state (non-hardened state) is applied is placed on the rear surface of the first panel layer 421 corresponding to the sensor arrangement region 409, the second fixing member 520 may be used to fix the biosensor 441. In this regard, the second fixing member 520 may be disposed in at least a portion of the peripheral portion of the biosensor 441. For example, the second fixing member 520 may be applied to a corner portion of the biosensor 441. Alternatively, since the second fixing member 520 may be applied to at least a portion of the circumference of the biosensor 441. The second fixing member 520 may be an adhesive member having different properties from the first fixing member 510. For example, the second fixing member 520 may include at least one of an ultraviolet curing resin, a polyurethane-based resin, or an acrylic-based resin. According to an embodiment, the second fixing member 520 may include a material that does not chemically react with the first fixing member 510, or a material that chemically reacts but releases heat only between the second fixing member 520 and the first fixing member 510 to a certain extent, thereby preventing the adhesive force from being reduced due to the chemical reaction.

In the above-described electronic apparatus 501, when the first fixing member 510 is also in the first state (e.g., non-hardened state) and interposed between the sheet layer 441a and the first sheet layer 421, and the biosensor 441 is disposed on a portion of the first sheet layer 421 corresponding to the sensor disposition region 409, the second fixing member 520 in the first state (e.g., non-hardened state) may be applied to a contact portion (e.g., at least a portion of an edge of the biosensor 441) between the biosensor 441 and the first sheet layer 421 to fix the biosensor 441. Thereafter, the second fixing member 520 may be hardened (e.g., hardened by UV light) and thus deformed to be in a second state (e.g., hardened state). When the hardening of the second fixing member 520 is completed within several seconds to several minutes, the biosensor 441 can be quickly fixed to the sensor-disposing region 409 without damaging or deforming the peripheral structure of the first panel layer 421. When the first stationary member 510 is in the first state and the second stationary member 520 is in the second state, the display 420 may be placed in a curing chamber for the first stationary member 510. Thereafter, when the first fixing member 510 is heated in the chamber at a specified temperature for a specified time (e.g., within a specified temperature and a specified time range that do not damage the biosensor module 440 and the display 420), the first fixing member 510 may be deformed to be in a second state (e.g., a hardened state). As described above, when the biosensor 441 is bonded to the first panel layer 421, the biosensor 441 is gripped using a jig without applying heat to the first fixing member 510, thereby preventing the display 420 in contact with the biosensor 441 from being damaged or broken (or, preventing the display 420 from being crushed, dented, or wrinkled, preventing the polyethylene terephthalate (PET) constituting a portion of the first panel layer 421 from being deformed, preventing the bonding layer on the bonding surface from being viewed from the outside without being deformed, or preventing the rear surface or the bonding surface of the first panel layer 421 from being wrinkled or discolored).

Fig. 6 is various views of a sensor placement area according to embodiments of the present disclosure.

Referring to

states

601 and 603 in fig. 6, according to an embodiment of the present disclosure, the sensor-disposing region 409 in which the biosensor 441 is disposed may include a region in which at least a portion of the first panel layer 421 contacts the biosensor 441 when at least a portion of the second panel layer 425 described with reference to fig. 4a, 4b, and 5 is removed. State 601 shows the following states: the first fixing member 510_1 is in a first state (e.g., non-hardened state) and the second fixing member 520_1 is in a first state (e.g., non-hardened state), and after the biosensor 441 is disposed on the rear surface of the first panel layer 421 corresponding to the sensor disposition region 409, the first fixing member 510_1 and the second fixing member 520_1 are applied. State 603 shows a state in which the first fixing member 510_1 is set in the first state and the second fixing member 520_1 is set in the first state, and the spacer 530 is set.

When the first fixing member 510_1 in the first state is between the first panel layer 421 and the biosensor 441, the first fixing member 510_1 may be pressed by a jig under a certain pressure. Further, since the first fixing member 510_1 in the first state is not yet hardened, a portion of the first fixing member 510_1 may protrude outside the edge of the biosensor 441 since the space between the first panel layer 421 and the biosensor 441 is reduced by the jig. The portion of the first fixing member 510_1 protruding from the outer peripheral portion of the biosensor 441 may be referred to as a rounded corner structure.

According to an embodiment, the biosensor 441 having a specific thickness may include at least one spacer 530 disposed in a corner portion thereof. For example, at least one spacer 530 having a certain thickness may be disposed in corner portions (e.g., all four corner portions) of the biosensor 441. At least one spacer 530 is interposed between the biosensor 441 and the first panel layer 421 so as to maintain a certain distance between the biosensor 441 and the first panel layer 421. By preventing the jig from reducing the space between the first panel layer 421 and the biosensor 441 to less than a certain distance (e.g., the height of the spacer 530), the first fixing member 510_1 in the first state may be prevented from protruding from the corner portion. The second fixing member 520_1 of the first state may then be applied to each corner region of the biosensor 441. For example, the second fixing member 520_1 of the first state may be introduced into the gap between the spacer 530 and the first panel layer 421. When the second fixing member 520_1 in the first state is subjected to UV hardening, the biosensor 441 may be more firmly fixed on the sensor-disposing region (or the first panel layer 421).

As shown in state 605, biosensor 441 has grooves 532 instead of spacers 530. The groove 532 may be disposed at a corner portion of the biosensor 441, and the first fixing member 510_1 of the first state may be applied to a plate layer of the biosensor 441 (e.g., a top surface of the biosensor 441 shown in the drawing). When the biosensor 441 to which the first fixing member 510_1 in the first state is applied is placed in the sensor-disposing region 409, at least a portion of the first fixing member 510_1 in the first state may protrude outside the edge of the biosensor 441, as described in state 601. According to various embodiments, the first fixing member 510_1 of the first state may protrude less or may not protrude through the corner region having the groove 532. When the second fixing member 520_1 in the first state is applied between one surface (e.g., the rear surface of the first panel layer 421) of the sensor arrangement region 409 and the groove 532 of the biosensor 441, the second fixing member 520_1 in the first state may have a larger contact area with the biosensor 441. Accordingly, when the second fixing member 520_1 in the first state (e.g., non-hardened state) is hardened, the biosensor 441 may be more firmly fixed. The spacer 530 or the groove 542 may be used to space the first and second fixing

members

510 and 520 apart from each other by a certain distance. According to various embodiments, the spacer 530 or the groove 542 may be used to uniformly maintain the distance between the first and second fixing

members

510 and 520. For example, when the display 420 is coupled to the biosensor 441, the first fixing members 510 (or resin corresponding to the first fixing members 510) are widely dispersed in the space between the biosensor 441 and the first panel layer 421. According to various embodiments, the resin may be spread to areas where the spacers 530 or the grooves 542 are not disposed. Accordingly, contact between the first panel layer 421, the second fixing member 520, and the biosensor 441 may be sufficiently ensured, and a distance between the first fixing member 510 and the second fixing member 520 may be maintained.

State 607 shows biosensor 441 in more detail. The biosensor 441 may include: active region 441_1, which radiates ultrasound signals associated with fingerprint sensing; and a wiring region 441_2 having a signal line (or an electrode pad connected to the signal line) for supplying power to a circuit (e.g., the circuit layer 441b, the TFT substrate) provided in the active region 441_ 1. The wiring region 441_2 may be electrically connected with the second circuit board 442 using an ACF. The spacers 530 may be disposed in the corner regions of the biosensor 441. For example, the spacers 530 may be disposed at two locations of the active region 441_1 and two locations of the wiring region 441_2 of the biosensor 441.

State 609 shows the specific shape 510_2 of the first fixation member when it is applied onto the biosensor 441 by the injector. As shown in state 609, a first fixation member may be applied such that at least one side of shape 510_2 has a shape of "Y" (or "T"). The first fixing member 510_1 in the first state partially protrudes from the edge region and is uniformly placed between the biosensor 441 and the first panel layer 421 as shown in state 601 or state 607 due to the pressure applied to the fixing member such that the first fixing member having the application shape 510_2 as described above is uniformly spread and the first fixing member is bonded to the sensor-disposing region 409. For example, after pressing, the application shape 510_2 may have an elliptical shape.

Fig. 7 is a view illustrating fixing of a biosensor to a display panel layer according to another embodiment of the present disclosure. Fig. 7 is another cross-sectional view taken along line a-a' of fig. 4 b.

Referring to fig. 7, some components of an electronic device 701 (e.g., electronic device 301 of fig. 3) may include a display 420 (e.g., a first panel layer 421 and a second panel layer 425), a first circuit board 423, and a biosensor module 440, according to an embodiment. The biosensor module 440 may include, for example, a biosensor 441, a second circuit board 442, and a sensor circuit 443. The first panel layer 421, the first circuit board 423, and the biosensor module 440 may be the same components as the panel layer, the first circuit board, and the biosensor module described in connection with fig. 5.

The second faceplate layer 425 may include a first sub-layer 425a, a second sub-layer 425b, a third sub-layer 425c, and a fourth sub-layer 425 d. In this case, the second fascia layer 425 may include a lesser number of layers than the second fascia layer disclosed in fig. 5. In contrast to fig. 5, the first sub-layer 425a may remain in the sensor arrangement region 709 without removing a portion. The second, third, and fourth sub-layers 425b, 425c, and 425d may be removed from the sensor placement area 709.

The biosensor 441 may be disposed on the first sub-layer 425a provided in the sensor disposition area 709. First fixation member 510 may be interposed between biosensor 441 and first sublayer 425 a. The second fixing member 520 may be interposed between the corner region of the biosensor 441 and the first sub-layer 425 a.

The electronic device 701 described in the above structure may obtain fingerprint information when the ultrasonic signal passes through the first sub-layer 425 a. Since the first sub-layer 425a is not removed in the sensor arrangement region 709, the sensor arrangement region 709 and regions other than the sensor arrangement region 709 can be viewed visually similar to each other. Therefore, even if the user gazes at the display 420 provided with the biosensor 441, the user may not visually notice any difference in the sensor setting area 709 due to the first sub-layer 425 a. Thus, according to an embodiment, the electronic device may improve the visual quality of the display. In addition, the manner for manufacturing the electronic device 701 may prevent the first panel layer 421 from being deformed or discolored, or may improve the visual quality of the display. This may be accomplished by affixing biosensor 441 to first sublayer 425a without disposing biosensor 441 directly on first panel layer 421. Here, the deformation of the first panel layer 421 may include wrinkling, sagging, breaking, or a combination of a portion of the first panel layer 421 and another structure (e.g., the biosensor 441 or the first adhesive layer).

Fig. 8 is a view illustrating fixing of a biosensor to a display panel layer according to another embodiment of the present disclosure. Fig. 8 shows another cross-sectional view taken along line a-a' of fig. 4 b.

Referring to fig. 8, some components of an electronic device 801 (e.g., electronic device 301 of fig. 3) may include a display 420 (e.g., a first panel layer 421 and a second panel layer 425), an auxiliary layer 810, a first circuit board 423, and a biosensor module 440, according to an embodiment. The biosensor module 440 may include, for example, a biosensor 441, a second circuit board 442, and a sensor circuit 443. The first panel layer 421, the second panel layer 425, the first circuit board 423, and the biosensor module 440 may be the same components as the panel layers, first circuit board, and biosensor module described in connection with fig. 5. The second faceplate layer 425 may include a first sub-layer 425a, a second sub-layer 425b, a third sub-layer 425c, and a fourth sub-layer 425 d.

The auxiliary layer 810 may be disposed on the first panel layer 421 (on a portion of the rear surface of the first panel layer 421) of the sensor disposition region 809 in which the biosensor 441 is disposed. The auxiliary layer 810 may be provided by applying ink in a designated color using an inkjet process or a spray process. For example, the auxiliary layer 810 may include a black ink layer. Alternatively, the auxiliary layer 810 may include a layer formed by applying ink in the same color as that of the second panel layer 425. The auxiliary layer 810 may be provided by applying the ink multiple times to achieve a particular thickness (i.e., repeatedly applying the ink, drying the ink, and then applying the ink on top of the dried black ink). The auxiliary layer 810 may have a certain thickness and color density so that fingerprint information having a certain resolution or higher is obtained as the ultrasonic signal emitted from the biosensor 441 is reflected. The auxiliary layer 810 may be placed on the same plane as the first sub-layer 425a (e.g., the rear surface of the first panel layer 421). The auxiliary layer 810 may be thinner than the first sub-layer 425 a.

The biosensor 441 may be disposed on the auxiliary layer 810 provided in the sensor disposition area 809. The first fixing member 510 may be interposed between the biosensor 441 and the auxiliary layer 810. The second fixing member 520 may be interposed between the corner region of the biosensor 441 and the auxiliary layer 810.

The electronic apparatus 801 shown in fig. 8 can appropriately obtain fingerprint information while making the sensor arrangement region 809 visually similar to other display regions. For example, even if the user views the display 420 in the direction in which the biosensor 441 is disposed, it can be viewed from the top of the first panel layer 421 that the sensor disposition region 809 and the peripheral region of the sensor disposition region 809 have the same form due to the auxiliary layer 810. Thus, according to embodiments, the electronic device 801 may improve the visual quality of the display. In addition, since the first fixing member 510 is not directly disposed on the first panel layer 421 and the biosensor 441 is disposed on the auxiliary layer 810, hardening of the first panel layer 421 may be slowed by the first fixing layer 510. Accordingly, the method for manufacturing the electronic apparatus 801 may prevent the first fixing member 510 from being deformed or discolored due to hardening of the first fixing member 510.

Fig. 9 is a view showing a peripheral structure of a biosensor according to an embodiment of the present disclosure. The cross-sectional view shown in fig. 9 may be one example of various cross-sectional views taken along line a-a' of fig. 4 b.

Referring to fig. 9, some components of an electronic device 901 (e.g., electronic device 301 of fig. 3) may include a display 420 (e.g., a first panel layer 421 and a second panel layer 425), a first circuit board 423, a biosensor module 440, and a sealing layer 910, according to an embodiment. The biosensor module 440 may include, for example, a biosensor 441, a second circuit board 442, and a sensor circuit 443. The first panel layer 421, the second panel layer 425, the first circuit board 423, and the biosensor module 440 may be the same components as the panel layer, the first circuit board, and the biosensor module described in connection with fig. 5.

The first fixing member 510 may be interposed between a portion of the first panel layer 421 of the sensor arrangement region 909 where the biosensor 441 is disposed (on a portion of the rear surface of the first panel layer) and the biosensor 441. The second fixing member 520 may be disposed in at least a portion of the edge of the biosensor 441. The second fixing member 520 may be hardened. For example, when the second fixing member 520 is UV-hardened by a UV wavelength signal, the biosensor 441 may be fixed onto the rear surface of the first panel layer 421.

A sealing layer 910 may be provided in sensor placement area 909 between biosensor 441 and second faceplate layer 425. The sealing layer 910 may be disposed to surround the periphery of the biosensor 441 while filling the sensor disposition region 909. Accordingly, the sealing layer 910 may be disposed on the rear surface of the first panel layer 421, which is outside the regions for the first and second fixing

members

510 and 520. The sealing layer 910 may include, for example, a material (e.g., resin) exhibiting a color similar to that of the second panel layer 425 or similar to that of the first fixing member 510. The material constituting the sealing layer 910 may be different from the material constituting the first fixing member 510. The material constituting the sealing layer 910 may include a material that does not chemically react with the first and second fixing

members

510 and 520 to prevent the adhesive force from being reduced due to the chemical reaction.

The sealing layer 910 may be a liquid resin having a black color (or a color similar to a display). The sealing layer 910 may be made by applying a liquid resin using an inkjet process. When there is an air layer around the biosensor 441 in the sensor arrangement region 909, the user can see or see the air layer when viewing the sensor arrangement region 909 from the outside (e.g., the front surface of the display 420). Since the sealing layer 910 replaces the air layer or may be formed around the sensor disposition region 909, the air layer around the sensor disposition region 909 may be removed to improve the visual appearance (or visibility) of the display 420.

When the sealing layer 910 is provided after the biosensor 441 is fixed to the first panel layer 421, the display 420 may be placed in a chamber and heated at a designated temperature for a specific time. Accordingly, since the first fixing member 510 and the sealing layer 910 are simultaneously hardened by heat applied in the chamber, the biosensor 441 may be more firmly fixed on the first panel layer 421. Since the color of the hardened sealing layer 910 is similar to the color of the second panel layer 425 and the first fixing member 510, the difference in color of the sensor arrangement area 909 and the portion of the display panel layer outside the sensor arrangement area 909 may not be visible. That is, no significant difference is generated between the panel layer of the sensor disposition area 909 and the panel layer of the peripheral area of the sensor disposition area 909, so that the visual quality of the display 420 can be improved.

Fig. 10 is a view showing a sensor arrangement region according to two embodiments of the present disclosure.

Referring to fig. 10, a first circuit board 423 is disposed on the rear surface of the display 420, as illustrated in fig. 9, and a first type sensor disposing region (e.g., a groove or hole) 1009a may be formed on the rear surface of the display 420 in association with the arrangement of the biosensor 441, as illustrated in state 1001. When the user views the rear surface of the display 420, at least a portion of the first type sensor arrangement region 1009a in which the biosensor 441 is arranged may be provided in a rough pattern, for example, a bastion pattern (or a zigzag pattern). Alternatively, this may be described as the inner side wall of the first type sensor disposition region 1009a having a rough pattern. In the first-type sensor disposition region 1009a, for example, at least one of the first sub-layer 425a, the second sub-layer 425b, the third sub-layer 425c, or the fourth sub-layer 425d included in the second panel layer 425 described with reference to fig. 9 may have a rough edge. For example, the fourth sub-layer 425d may be disposed in a rough pattern, or the third sub-layer 425c and the fourth sub-layer 425d may be disposed in a rough pattern. Alternatively, the second, third, and fourth sub-layers 425b, 425c, and 425d may be disposed in a rough pattern. Alternatively, the first, second, third, and fourth sub-layers 425a, 425b, 425c, 425d may be disposed in a rough pattern.

When the user views the display 420, a second type sensor arrangement region 1009b in which the biosensor 441 is arranged may be provided, wherein the second type sensor arrangement region 1009b has a wave-shaped edge. In addition, one corner of the second-type sensor arrangement region 1009b may be provided in the form of a groove 1011, which groove 1011 is larger than the other periphery of the second-type sensor arrangement region 1009 b. The recess 1011 may serve as an injection site for the sealing layer 910 described with reference to fig. 9. When the liquid resin of the sealing layer 910 is injected into the first-type sensor disposition region 1009a or the second-type sensor disposition region 1009b, the above-described rough edge or wavy edge causes a capillary effect, thereby enabling the liquid resin to be smoothly spread without forming an additional space (e.g., an air layer) on the bottom surface of the first-type sensor disposition region 1009a or the second-type sensor disposition region 1009b and also preventing the generation of bubbles.

Fig. 11 is a view illustrating another embodiment of a plate layer of a biosensor according to an embodiment of the present disclosure.

Referring to fig. 11, a biosensor 1141 (e.g., the biosensor module 340 of fig. 3) may include a plate layer 1141a, a circuit layer 1141b, a first electrode layer 1141c, and a second electrode layer 1141 d. The slab 1141a may have a shape that tapers from top to bottom as shown in fig. 11. The first fixing member 1110 may be interposed between the slab layer 1141a and the first panel layer 421.

As described above, since the slab layer 1141a has a certain inclination or is disposed to be suspended from a lower portion thereof (e.g., a portion facing the first panel layer 421), the escape area 1130 may be formed between the slab layer 1141a and the first panel layer 421. For example, the second fixing member 1120 or the sealing layer 910 described with reference to fig. 10 may be formed in the escape region 1130 by the injector 1109. Accordingly, the contact area of the second fixing member 1120 or the sealing layer 910 may be maintained wide, compared to the shape of the ply having the straight edges (e.g., the shape of the upper and lower portions of the ply of fig. 9 being straight) shown in the prior art drawings.

According to one embodiment, an electronic device may include: a display including a first surface facing a first direction and outputting display information and a second surface facing a second direction opposite to the first direction; a biosensor including a sensing surface disposed to face a partial area of a second surface of the display and a side surface formed in a lateral direction; a first fixing member interposed between the partial region and the biosensor such that the sensing surface is attached to the partial region, and hardened (e.g., hardened by heat) at a specified temperature; and a second fixing member attached to at least a portion of the side surface and at least a portion of the peripheral region adjacent to the partial region, and hardened by light of a specified wavelength.

According to an embodiment, the biosensor may transmit or receive a signal (or an ultrasonic signal) having an ultrasonic frequency band.

According to an embodiment, the display may be a first panel layer and a second panel layer, the partial region of the second surface may include a region exposing a portion of the rear surface of the first panel layer when at least a portion of the second panel layer is removed, and the first fixing member may be interposed between the rear surface of the first panel layer and the biosensor.

According to an embodiment, the first panel layer may include a polyethylene terephthalate (PET) layer.

According to an embodiment, the display may include a first panel layer and a second panel layer, the partial region of the second panel layer may include a region exposing a portion of the rear surface of the first panel layer when at least a portion of the second panel layer is removed, the electronic device may further include an auxiliary layer disposed in the region exposing the portion of the rear surface of the first panel layer, and the first fixing member may be interposed between the biosensor and the auxiliary layer.

According to an embodiment, the auxiliary layer may include a black ink layer.

According to an embodiment, the display may include a first panel layer and a second panel layer, and the first fixing member may be interposed between at least one of the plurality of sub-layers and the biosensor.

According to an embodiment, at least one of the plurality of sub-layers may comprise an embossed layer.

According to an embodiment, the display may include a first panel layer and a second panel layer, the partial region of the second panel layer may include a region exposing a portion of the rear surface of the first panel layer when at least a portion of the second panel layer is removed, and the electronic apparatus may further include a sealing layer covering the side surface of the biosensor and the second fixing member and disposed on a region exposing a portion of the rear surface of the first panel layer.

According to an embodiment, the display may include a first panel layer, a second panel layer, and a first circuit board for transmitting a signal for driving the display, and the partial region of the second surface may include a sensor arrangement region exposing a portion of the rear surface of the first panel layer when at least a portion of the second panel layer and the first circuit board are removed.

According to an embodiment, the sensor placement area may include one or more rough edges (e.g., the edges of the sensor placement area may form a plurality of valleys and a plurality of ridges).

According to an embodiment, the sensor arrangement region may comprise at least one groove formed on one side of the sensor arrangement region and having a size larger than a size of some of the one or more rough edges.

According to an embodiment, the electronic device may further include a sealing layer injection port provided at a side of the sensor-disposing region for injecting the resin in connection with forming the sealing layer.

According to an embodiment, the electronic device may further include at least one spacer interposed between at least one corner of the biosensor and the second surface, and the second fixing member may be disposed between the spacer and a partial region of the second surface.

According to an embodiment, the electronic device may further include at least one groove formed in at least one corner of the biosensor, and the second fixing member may be disposed between the groove and a partial region of the second surface.

According to an embodiment, the electronic device may further include a sensor circuit connected with the biosensor, and a second circuit board electrically connecting the biosensor and the sensor circuit.

According to an embodiment, the biosensor may include a plate layer facing the second surface, and a transceiving layer for transmitting or receiving ultrasonic waves through the plate layer. The transceiving layer may include a piezoelectric material layer, an electrode layer, and a circuit layer interposed between the piezoelectric material layer and the electrode layer.

According to an embodiment, the plate layer may include a TFT line.

According to an embodiment, the plate layer may include at least one of a silicon layer, an insulating silicon layer, a Thin Film Transistor (TFT) layer, a glass layer, a plastic layer, or a ceramic layer.

According to an embodiment, an edge of the first fixing member may be between an edge of a plate layer of the biosensor and an edge of an active area of the biosensor.

According to an embodiment, the area of the first fixing member may be smaller than the area of the board layer, but larger than the area of the transceiving layer.

Fig. 12 is a flowchart illustrating a method of manufacturing a display in which a biosensor is disposed according to an embodiment of the present disclosure.

Referring to fig. 12, in operation 1201 of a method for manufacturing the display, according to an embodiment, the display includes a sensor-disposing region (e.g., the sensor-disposing region of fig. 4 a), and a biosensor to be disposed in the sensor-disposing region may be provided.

In operation 1203, a first fixation member in a first state (e.g., a non-hardened state) may be applied to one surface of the biosensor (e.g., a surface of a lamina). The non-hardened state refers to a state before the first fixing member is heat-hardened. For example, the first fixing member may be applied to one surface of the biosensor using an inkjet process or the like.

In operation 1205, a biosensor may be set in the sensor setting area. In this operation, the biosensor may be grasped by using a jig, and may be disposed on the bottom surface of the sensor disposition region (for example, the rear surface of the panel layer, the top surface of the first sublayer, or the top surface of the auxiliary layer applied on the panel layer). In this case, when a specific pressure is applied to the biosensor, the first fixing member may be spread to a specific thickness between the biosensor and the panel layer.

In operation 1207, a second fixing member in a first state (non-hardened state) may be disposed in at least a portion of an edge of the biosensor. For example, the second fixing members may be applied to four corners of the biosensor. In this case, the non-cured state of the second fixing member means a state before the second fixing member is cured by ultraviolet rays.

In operation 1209, the second fixing member may be changed to be in a second state (hardened state) by a hardening process. In this case, the second fixing member may be hardened as the ultraviolet rays are irradiated. Therefore, the biosensor can be fixed on one surface of the display panel layer. The hardening treatment may include irradiating ultraviolet light for several seconds to several tens of seconds (e.g., about 6 seconds). The ultraviolet curing process may be kept brief to prevent the curing of the first fixing member from being delayed, thereby minimizing the possibility of mixing the first fixing member and the second fixing member.

In operation 1211, the first fixing member in the first state may be changed to be in a second state (e.g., a hardened state) at a specified temperature for a specified time. In this case, the fixing member may be hardened by heating. For example, the hardening process may include a process of heating the display at about 50 ℃ to 100 ℃ (e.g., about 70 ℃) for about 5 minutes to 20 minutes (e.g., about 10 minutes).

According to an embodiment, an encapsulation layer may be formed at the exposed portion of the panel layer or the peripheral portion of the biosensor by

operations

1209 and 1211. For this, a liquid resin for forming a sealing layer may be injected into the edge of the biosensor in the sensor-disposing region. When the display coated with the sealing layer is placed in the chamber, the first fixing member and the sealing layer may be simultaneously hardened during heating. For example, when heat having a specific temperature is applied to the first fixing member and the sealing layer, the first fixing member and the sealing layer may be hardened by heating.

According to an embodiment, a method for manufacturing an electronic device may include: providing a display and a biosensor; applying a first fixation member on a sensing surface of a biosensor; disposing a sensing surface of the biosensor to which the first fixing member is applied on a rear surface of the display; applying a second fixation member to at least a portion of the periphery of the biosensor; hardening the second fixing member; and hardening the first fixing member. For example, the hardening of the second fixing member may include hardening the second fixing member by ultraviolet light, and the hardening of the first fixing member may include hardening the first fixing member by heating.

According to an embodiment, the method for manufacturing an electronic device may further include injecting a sealing layer to cover the second fixing member after applying the second fixing member.

Fig. 13 is a view illustrating a sensor disposition area according to another embodiment of the present disclosure.

Referring to fig. 13, an electronic device 1301 (e.g., electronic device 501 of fig. 3) may include display (e.g., display 320 of fig. 3) 420 including first panel layer 421 and second panel layer 425, first circuit board 423, and a biosensor module (biosensor 441, second circuit board 442, and sensor circuit 443) described with reference to fig. 4a or 5. The electronic device 1301 may include a first fixing member 1310 (or a first adhesive member) and a second fixing member 1320 (or a second adhesive member) for fixing the biosensor 441 in the biosensor module. The cover glass may be further disposed on one surface of the first panel layer 421.

The second faceplate layer 425 may include a first sub-layer 425a, a second sub-layer 425b, a third sub-layer 425c, and a fourth sub-layer 425 d. Although the figure shows the second faceplate layer 425 to include the first, second, third, or fourth sub-layers 425a, 425b, 425c, 425d, the disclosure is not limited thereto. For example, the second panel layer 425 may include only some of the sub-layers. The first sub-layer 425a may comprise, for example, an embossed layer. The second sub-layer 425b may include, for example, a buffer layer for absorbing impact. The third sub-layer 425c may include, for example, an electromagnetic interference (EMI) shielding sheet (e.g., a copper (Cu) sheet) for shielding EMI. The fourth sub-layer 425d may comprise, for example, a heat sink (e.g., a graphite sheet) for dissipating heat emitted from the first panel layer 421.

The biosensor module may include, for example, a biosensor 441, a second circuit board 442, and a sensor circuit 443. The biosensor 441 may radiate a signal (e.g., an ultrasonic signal) having a specific wavelength band, and then may collect a reflected signal. The biosensor 441 may have substantially the same configuration as that of the biosensor described above with reference to fig. 5. In addition, other components associated with the biosensor module may have substantially the same configuration as the configuration of the biosensor described above with respect to fig. 5.

At least a portion of first fixation member 1310 may be interposed between biosensor 441 and first panel layer 421. That is, the first fixing member 1310 may be interposed between the plate layer 441a and the first panel layer 421 of the biosensor 441. The first fixing member 1310 may include an epoxy resin, which is hardened when heat is applied at a designated temperature for a specific time. The first fixing member 1310 may be applied to one surface of the biosensor 441 (e.g., on the plate layer 441 a) or the sensor disposition region 409 of the first panel layer 421 by injection.

The biosensor 441 in which the first fixing member 1310 is applied to the plate layer 441a may be placed on the first panel layer 421 of the sensor-disposing region 409 using a jig. In this case, since the first fixing member 1310 is interposed between the biosensor 441 and the first panel layer 421 and is pressed in the direction of the first panel layer 421, a portion of the first fixing member 1310 may protrude in the lateral direction of the biosensor 441, thereby forming a rounded corner structure 1310 a. Rounded corner structure 1310a may be present along the entire peripheral edge of biosensor 441, or may be present along four sides of biosensor 441. When the fillet structure 1310a is formed by pressing the biosensor 441, at least a portion of the fillet structure 1310a may have a convex shape.

The second fixing member 1320 may be used to fix the biosensor 441 after the biosensor 441 is placed on the rear surface of the first panel layer 421 corresponding to the sensor arrangement region 409 and after the first fixing member 1310 in the first state (non-hardened state) is applied. In this regard, the second fixing member 1320 may be disposed in at least a portion of the periphery of the biosensor 441. For example, the second fixing member 1320 may be applied to a corner portion (e.g., a vertex where both sides of an edge intersect with each other) of the biosensor 441. Alternatively, the second fixing member 1320 may be applied to at least a portion of the edge circumference (e.g., side surface) of the biometric sensor 441, and the biometric sensor 441 may be fixed to the rear surface of the first panel layer 421 corresponding to the sensor disposition region 409.

When at least a portion of the second fixing member 1320 is applied to at least a portion of the first fixing member 1310, and when the second fixing member 1320 and the first fixing member 1310 have the same property, the first fixing member 1310 and the second fixing member 1320 may be mixed with each other. Accordingly, the second fixing member 1320 may be an adhesive member having a property different from that of the first fixing member 1310. For example, the second fixing member 1320 may include at least one of an ultraviolet curing resin, a polyurethane-based resin, or an acrylic-based resin. Accordingly, the second fixing member 1320 may include a material that does not chemically react with the first fixing member 1310. For example, the second fixing member 1302 may include a material that chemically reacts only to a certain extent due to the release of heat generated by a chemical reaction between the material and the first fixing member 1310, thereby preventing a decrease in adhesion force due to the chemical reaction with the first fixing member 1310.

The biosensor module or the display structure to which the biosensor module is attached may further include a conductive strip 1350 attached on one side of the second circuit board 442. One side of the conductive tape 1350 may be in contact with the second circuit board 442, and the other side of the conductive tape 1350 may be adhered to one side of the first panel layer 421. The conductive strip 1350 may serve as a ground for the second circuit board 442. According to other embodiments, the biosensor module may not include the conductive strip 1350, as in the above description with reference to fig. 5 and 6. Thus, the conductive strip 1350 may be omitted.

Fig. 14 is a view illustrating a sensor disposition area according to still another embodiment of the present disclosure.

Referring to fig. 14, an electronic device 1401 (e.g., electronic device 301 of fig. 3) may include a display (e.g., display 320 of fig. 3) including a first panel layer 421 and a second panel layer 425, a first circuit board 423, and a biosensor module (biosensor 441, second circuit board 442, and sensor circuit 443) described with reference to fig. 4a or 5. The components of the electronic device 1401 may be substantially the same as those described with reference to fig. 13, except for the first fixing member 1410 and the second fixing member 1420.

The first fixing member 1410 may be interposed between the plate layer 441a (or the TFT layer) and the first panel layer 421. The shape of the first fixing member 1410 may be changed by external pressure (e.g., pressure applied to the biosensor). The amount of the first fixing member 1410 may prevent the rounded corner structure 1310a, which has been described with reference to fig. 13, from being formed after the first fixing member 1410 is pressed by the biosensor 441. Such an amount of the first fixing member 1410 may be determined through experiments. Since the first fixing member 1410 is disposed between the sheet layer 441a and the first panel layer 421 without protruding outside the edge of the biosensor 441, the edge of the first fixing member 1410 may be located inside the sheet layer 441a of the biosensor 441 as shown in fig. 14.

The second fixing member 1420 may be disposed at one side (e.g., a corner) of the biosensor 441 to temporarily fix the biosensor 441 when the first fixing member 1410 is in a first state (e.g., a non-hardened state). Since the first fixing member 1410 is disposed such that the first fixing member 1410 does not protrude, the second fixing member 1420 may be interposed between a side surface of the biosensor 441 and a portion of the bottom surface of the biosensor 441. Accordingly, an air gap 1430 may be formed between the second fixing member 1420 and the first fixing member 1410. Although the air gap 1430 is formed between the first fixing member 1410 and the second fixing member 1420 in the drawings, the present disclosure is not limited thereto. For example, although one corner has an air gap 1430 formed between the first fixing member 1410 and the second fixing member 1420, a different corner may have the first fixing member 1410 and the second fixing member 1420 contacting each other without the air gap 1430.

In the electronic apparatus 1401 having the above structure, since the edge of the first fixing member 1410 is kept inside the sheet layer 441a, the user cannot visually recognize the first fixing member 1410. Accordingly, when the first fixing member 1410 is positioned inside the sheet layer 441a, the visual appearance of the display 420 may be improved. In addition, when the user views the display 420, the first fixing member 1410 may be disposed such that the first fixing member 1410 covers that region which transmits and receives the ultrasonic waves. For example, the first fixing member 1410 may be provided in a size equal to or greater than the width of the circuit layer 441b, the width of the piezoelectric material layer 441c, or the width of the electrode layer 441 d.

Fig. 15 is a view showing one surface of the sensor disposition region of fig. 14, and fig. 16 is a view showing the other surface of the sensor disposition region of fig. 14.

Referring to fig. 15 and 16, the electronic device may include a groove 409 in which a biosensor 441 is disposed. According to an embodiment, the height of the biosensor 441 may be less than the height of the groove 409. For example, the groove 409 may have a height from the bottom of the rear surface of the first panel layer 421 of the display 420 to the top surface of the first circuit board 423. Alternatively, the groove 409 may be formed by removing a portion from between the embossed layer 425a of the layer provided on the rear surface of the first panel layer 421 and the first circuit board 423. Alternatively, as described above, when a specific layer (e.g., the embossed layer 425a) is maintained on the rear surface of the display 420 or a designated layer (e.g., the auxiliary layer 810) is formed on the rear surface of the display 420, the groove 409 may be formed from the rear surface of the relevant layer to the height of the top of the first circuit board 423 in addition to the relevant layer (e.g., the embossed layer 425a or the auxiliary layer 810). Although the structure of the groove 409 has been described in the above various examples in which various layers (e.g., the embossed layer 425a, the cushion layer 425b, the EMI shielding sheet 425c, the heat sink 425d, and the first circuit board 423) are formed on the rear surface of the display 420, at least one of the above various layers may be omitted if necessary. For example, the electronic device may include only the embossed layer 425a and/or the backing layer 425b, or only the EMI shield 425c and/or the heat sink 425 d. Further, the thickness of the biosensor 441 is described as being less than the height of the groove 409, to which the present disclosure is not limited. For example, the thickness of the biosensor 441 may be greater than the height of the groove 409, if necessary. In this case, at least a portion of the biosensor 441 protruding beyond the height of the groove 409 may be located in a groove or hole of a bracket (or the case 350 of fig. 3) mounted on the rear surface of the display 420.

The first circuit board 423 may be disposed at a peripheral portion of the groove 409. The first circuit board 423 may include a circuit board associated with a display driver. The groove 409 may be formed to be larger than the biosensor 441. The groove 409 may be provided by removing at least a portion of the second panel layer 425. The bottom surface of the groove 409 may be a rear surface (i.e., an inner surface) of the first panel layer 421. Alternatively, the bottom surface of the groove 409 may be a partial surface (e.g., an embossed layer) of the second panel layer 425. Alternatively, as described above, the bottom surface of the groove 409 may be a black ink layer or a black matrix layer applied on the first panel layer 421.

When the biosensor 441 is pressed after the first fixing member 1410 is applied onto the bottom surface of the groove 409, the shape of the first fixing member 1410 may be changed into an oval shape, a circular shape, or a twisted circular shape. The edge of the first fixing member 1410 may be disposed inside the slab 441a without protruding out of the slab 441 a. The second fixing member 1420 may be disposed in at least one side of the edge of the slab layer 441 a. For example, the second fixing member 1420 may be applied to the corner region. When the second fixing member 1420 is applied, at least a portion of the second fixing member 1420 may be introduced between the slab layer 441a and the first panel layer 421, and the remaining portion of the second fixing member 1420 may be disposed to surround a corner peripheral portion (e.g., at least a portion of a sidewall of the corner) of the slab layer 441 a. The biosensor 441 may include an active region (a/a)441_1 (e.g., a stacked layer of circuit layers 441b, a piezoelectric material layer 441c, and an electrode layer 441d) to generate and output an ultrasonic signal or receive an ultrasonic signal. The area to which the first fixing member 1410 is applied may be larger than the edge of the active area 441_ 1. Accordingly, the edge of the first fixing member 1410 may be between the edge of the plate layer 441a (or the TFT layer) and the edge of the active region 441_ 1. The active region 441_1 may be connected to the second circuit board 442 and may be connected to a separately provided sensor circuit 443. One side of the conductive strip 1450 may be disposed on one side of the second circuit board 442, and the other side of the conductive strip 1450 may be in contact with the bottom surface (or sensor disposition region) of the groove 409.

As described above, according to an embodiment of the present disclosure, in the biosensor module and the electronic device including the same, since the edge of the first fixing member 1410 is disposed within the edge of the sheet layer 441a, the electronic device may improve its appearance. First fixing member 1410 may further support to maintain the quality of the ultrasonic signal by an edge formed between an edge of first fixing member 1410 and an edge of active region 441_1 of biosensor 441.

The edge relationship of the first fixing member 1410 and the edge relationship of the biosensor 441, which have been described with reference to fig. 14 to 16, may be applied to other embodiments disclosed herein. For example, the shape of the first fixing member 1410 having an edge size smaller than that of the biosensor 441 described with reference to fig. 14 may be applied to the embodiment described in fig. 7, in which the embossed layer 425a forms the bottom surface of the mounting groove (e.g., the sensor disposing region) of the biosensor. This edge relationship can also be applied to the following embodiments: the auxiliary layer 810 forms the bottom surface of the mounting groove of the biosensor, the sealing layer 910 fills the empty space of the mounting groove of the biosensor, the edge of the mounting groove of the biosensor is rough, or the section of the edge of the plate layer 441a is tapered toward the first panel layer 421.

An electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may comprise, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to the embodiments of the present disclosure, the electronic apparatus is not limited to those described above.

It should be understood that the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalents, or alternatives to the respective embodiments. For the description of the figures, like reference numerals may be used to refer to like or related components. It will be understood that a noun in the singular corresponding to a term may include one or more things unless the relevant context clearly dictates otherwise. As used herein, each of the phrases such as "a or B," "at least one of a and B," "at least one of a or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B or C" may include any or all possible combinations of the items listed together with the respective one of the plurality of phrases. As used herein, terms such as "1 st" and "2 nd" or "first" and "second" may be used to distinguish one element from another element simply and not to limit the elements in other respects (e.g., importance or order). It will be understood that, if a component (e.g., a first component) is referred to as being "combined with," "coupled to," "connected to" or "connected to" another component (e.g., a second component), it can be directly (e.g., wired) connected to the other component, wirelessly connected to the other component, or connected to the other component via a third component, either when the terms "operable" or "communicatively coupled" are used or when the terms "operable" or "communicatively coupled" are not used.

As described above, according to some embodiments of the present disclosure, the biosensor may be stably fixed on the rear surface of the display without damaging or changing the rear surface of the display.

According to certain embodiments of the present disclosure, the visual quality of the display may be improved by making the region in which the biosensor is disposed similar to the peripheral region.

Various other effects can be provided by each embodiment or a combination thereof.

While the disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device, the electronic device comprising:

a display including a first surface facing a first direction and a second surface facing a second direction opposite the first direction;

a biosensor including a sensing surface disposed to face a partial region of the second surface of the display and a side surface formed in a lateral direction;

a first fixing member interposed between the partial region of the second surface and the biosensor such that the sensing surface is attached to the partial region of the second surface and the first fixing member is hardened at a specified temperature; and

A second fixing member attached to at least a portion of the side surface and at least a portion of a peripheral region adjacent to the partial region of the second surface, and hardened by light of a specified wavelength.

2. The electronic device of claim 1, wherein the biosensor transmits or receives an ultrasound signal.

3. The electronic device of claim 1, wherein the display comprises a first panel layer and a second panel layer,

wherein the partial region of the second surface comprises a region that exposes a portion of the back surface of the first panel layer when at least a portion of the second panel layer is removed, and

wherein the first fixation member is interposed between the back surface of the first panel layer and the biosensor,

wherein the first panel layer comprises:

a layer of polyethylene terephthalate (PET).

4. The electronic device of claim 1, wherein the display comprises a first panel layer and a second panel layer,

wherein the partial region of the second surface comprises a region that exposes a portion of a back surface of the first panel layer when at least a portion of the second panel layer is removed,

Wherein the electronic apparatus further comprises an auxiliary layer disposed in a region where a part of the rear surface of the first panel layer is exposed, and

wherein the first fixing member is interposed between the biosensor and the auxiliary layer,

wherein the auxiliary layer comprises a black ink layer.

5. The electronic device of claim 1, wherein the display comprises a first panel layer and a second panel layer comprising a plurality of sub-layers, and

wherein the first fixation member is interposed between at least one of the plurality of sub-layers and the biosensor,

wherein the at least one of the plurality of sub-layers comprises an embossed layer.

6. The electronic device of claim 1, wherein the display comprises a first panel layer and a second panel layer,

wherein the electronic apparatus further comprises a sealing layer covering a side surface of the biosensor and the second fixing member and disposed on the region exposing a portion of the rear surface of the first panel layer.

7. The electronic device of claim 1, wherein the display comprises a first panel layer, a second panel layer, and a first circuit board that transmits signals for driving the display, and

wherein the partial area of the second surface includes a sensor disposition area that exposes a portion of a rear surface of the first panel layer when at least a portion of the second panel layer and the first circuit board are removed.

8. The electronic device of claim 7, wherein the sensor placement area comprises one or more rough edges.

9. The electronic device of claim 8, wherein the sensor placement area further comprises at least one groove formed on one side of the sensor placement area and having a dimension that is greater than a dimension of some of the one or more rough edges.

10. The electronic device of claim 1, further comprising:

at least one spacer interposed between at least one corner of the biosensor and the second surface, and

Wherein the second fixing member is disposed between the spacer and the partial region of the second surface.

11. The electronic device of claim 1, further comprising:

at least one groove formed on at least one corner of the biosensor, and

wherein the second fixing member is disposed between the groove and the partial region of the second surface.

12. The electronic device of claim 1, further comprising:

a sensor circuit connected to the biosensor; and

a second circuit board electrically connecting the biosensor with the sensor circuit.

13. The electronic device of claim 1, wherein the biosensor comprises:

a ply facing the second surface; and

a transceiving layer that transmits or receives ultrasonic waves through the slab layer.

14. The electronic device of claim 13, wherein the board layer comprises:

at least one of a silicon layer, a silicon-on-insulator layer, a Thin Film Transistor (TFT) layer, a glass layer, a plastic layer, or a ceramic layer.

15. The electronic device of claim 13, wherein an area of the first securing member is smaller than an area of the board layer and larger than an area of the transceiving layer.