KR102495654B1 - Electronic device including a fingerprint sensor and manufactureing method thereof - Google Patents

Abstract

According to an embodiment of the present invention, a display including a first surface capable of outputting display information and a second surface disposed in a direction opposite to the first surface, and a part of the second surface of the display A biosensor including a sensing surface disposed facing the area and a side surface formed in a direction different from the sensing surface, the sensing surface disposed between the partial area and the biosensor so that the sensing surface can be attached to the partial area, and designated An electronic device including a first fixing member curable at a temperature and a second fixing member attached to at least a portion of the side surface and at least a portion of a peripheral area adjacent to the partial area, and curable by light having a designated wavelength. Initiate. Also, other embodiments are possible.

Description

Electronic device including a plurality of fixing members for fixing a biosensor to a display and method for manufacturing the same

The present invention relates to an electronic device including a biosensor for detecting user's fingerprint information and a manufacturing method thereof.

Recently, a technique for performing user authentication using biometric information (eg, fingerprint, iris, etc.) of a user acquired by a biometric sensor has been developed. In the case of a biosensor for fingerprint recognition, it may be classified into an optical method, an ultrasonic method, and an electrostatic method according to a method of acquiring fingerprint information.

In order to expand the display area, a biometric sensor capable of acquiring fingerprint information may be disposed on the rear surface of the display. When the biosensor is placed on the back of the display, it is necessary to fix the biosensor. In the process of fixing the biometric sensor, there may be a problem that damage occurs to the display.

Also, when the biosensor is disposed on the rear surface of the display, the rear area of the display where the biosensor is disposed may be different from the rear area of the display where the biosensor is not disposed. For this reason, when looking at the display from the outside, there may be a problem in that the biosensor arrangement area looks different from the surrounding area.

Various embodiments of the present disclosure provide an electronic device having a structure capable of stably fixing a biosensor to the rear surface of a display without damage or deformation of the rear surface of the display, and a manufacturing method thereof.

In addition, various embodiments of the present disclosure provide an electronic device capable of improving display quality and a manufacturing method thereof.

An electronic device according to various embodiments of the present disclosure includes a display including a first surface capable of outputting display information and a second surface disposed in an opposite direction to the first surface, and a partial area of the second surface of the display. A biosensor including a sensing surface disposed facing the sensing surface and a side surface formed in a direction different from the sensing surface, disposed between the partial area and the biosensor so that the sensing surface can be attached to the partial area, and having a specified temperature It may include a first fixing member that can be cured and a second fixing member that is attached to at least a portion of the side surface and at least a portion of a peripheral area adjacent to the partial area and can be cured by light of a specified wavelength.

An electronic device manufacturing method according to various embodiments of the present disclosure includes providing a display and a biosensor, applying a first fixing member to a sensing surface of the biosensor, and applying a first fixing member to the biosensor. Disposing a sensing surface on the rear surface of the display, applying a second fixing member to at least a part of the periphery of the biosensor, UV-curing the second fixing member, and thermally curing the first fixing member. can include

According to various embodiments of the present disclosure, the biosensor can be stably fixed without damage or deformation of the rear surface of the display.

In addition, according to various embodiments of the present disclosure, the viewing quality of a display may be improved by providing a similar environment to a region in which a biosensor is disposed and a surrounding region.

Various other effects may be provided through each embodiment or a combination of embodiments.

1 is a block diagram of an electronic device in a network environment according to various embodiments.
2 is a diagram illustrating an appearance of an electronic device according to an exemplary embodiment.
3 is an exploded perspective view of an electronic device according to an exemplary embodiment;
4A is a diagram showing a form in which a biosensor module and a display are separated among some components of an electronic device according to an embodiment of the present invention.
4B is a diagram illustrating a combination of a biosensor module and a display among some components of an electronic device according to an embodiment of the present invention.
5 is a view showing an example of a cross section obtained by cutting the cutting line AA′ of FIG. 4B.
6 is a diagram showing an example of a sensor arrangement area according to an embodiment of the present invention.
7 is a diagram showing an example of a fixed form of a biosensor according to an embodiment of the present invention.
8 is a diagram showing another example of a fixed form of a biometric sensor according to an embodiment of the present invention.
9 is a diagram illustrating an example of a structure around a biosensor according to an embodiment of the present invention.
10 is a diagram showing an example of a sensor arrangement area according to an embodiment of the present invention.
11 is a view showing another form of a substrate layer of a biosensor according to an embodiment of the present invention.
12 is a diagram illustrating a method of manufacturing a display in which a biosensor is disposed according to an embodiment of the present invention.
13 is a diagram showing another example of a sensor arrangement area according to an embodiment of the present invention.
14 is a diagram showing another example of a sensor arrangement area according to an embodiment of the present invention.
FIG. 15 is a view showing one side of a part of the configuration of the sensor arrangement area of FIG. 14 .
FIG. 16 is a view showing another side of a part of the configuration of the sensor arrangement area of FIG. 14 .

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be understood that this is not intended to limit the present invention to the specific embodiments, and includes various modifications, equivalents, and/or alternatives of the embodiments of the present invention. In connection with the description of the drawings, like reference numerals may be used for like elements.

1 is a block diagram of an electronic device 101 within a network environment 100, according to various embodiments. Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input device 150, an audio output device 155, a display 160, an audio module 170, and a sensor module 176. ), interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197 can include In some embodiments, in the electronic device 101, at least one of these components (eg, the display 160 or the camera module 180) may be omitted or one or more other components may be added. In some embodiments, some of these components may be implemented as a single integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display 160 (or display device).

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , process commands or data stored in the volatile memory 132 , and store resultant data in the non-volatile memory 134 . According to one embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg, a graphics processing unit, an image signal processor) that may operate independently of or in conjunction therewith. , sensor hub processor, or communication processor). Additionally or alternatively, the secondary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display 160, the sensor module 176, or the communication module 190) It may control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as part of other functionally related components (eg, camera module 180 or communication module 190). there is.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input device 150 may receive a command or data to be used for a component (eg, the processor 120) of the electronic device 101 from an outside of the electronic device 101 (eg, a user). The input device 150 may include, for example, a microphone, mouse, or keyboard.

The sound output device 155 may output sound signals to the outside of the electronic device 101 . The audio output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback, and the receiver can be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to one embodiment, the display 160 may include a touch circuitry set to detect a touch or a sensor circuit (eg, a pressure sensor) set to measure the intensity of force generated by the touch. .

The audio module 170 may convert sound into an electrical signal or vice versa. According to one embodiment, the audio module 170 acquires sound through the input device 150, the sound output device 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 388 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module). Among these communication modules, the corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, WiFi direct, or IrDA (infrared data association)) or a second network 199 (eg, a cellular network, the Internet, or It may communicate with an external electronic device via a computer network (eg, a telecommunications network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified and authenticated.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include one or more antennas, from which at least one antenna suitable for a communication scheme used in a communication network such as the first network 198 or the second network 199 is, For example, it may be selected by the communication module 190. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the electronic devices 102 and 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external devices among the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, or client-server computing technology may be used.

The sensor module 176 of the electronic device 101 described above may include a biometric sensor disposed under the display 160 . The biometric sensor may include, for example, a sensor driven by an ultrasonic method. The biosensor irradiates ultrasonic waves from the lower part of the display 160 (eg, the rear surface of the display 160) to the upper part (eg, the top of the cover glass or outer cover), and transmits a response signal of the irradiated ultrasonic waves to information related to fingerprint recognition. can be collected with The biosensor may be fixed to the rear surface of the display 160 .

2 is a diagram illustrating an appearance of an electronic device according to an exemplary embodiment.

Referring to FIG. 2 , according to an embodiment, a display (or display device, or display panel (hereinafter referred to as “display”)) 210 and a housing 220 (or frame) are provided on the front of the electronic device 201 at least. Some may be exposed. According to various embodiments, the housing 220 may be provided so as to be observed from at least a part of a side surface or rear surface of the electronic device 201 and not from the front surface.

According to an embodiment, the electronic device 201 may include various hardware modules not shown. For example, a biometric sensor (or fingerprint sensor) for detecting a user's fingerprint may be disposed on the rear surface of the display 210 .

According to an embodiment, the electronic device 201 may detect the user's fingerprint through the fingerprint sensing area 212 of the display 210 . In this regard, a biosensor for detecting the fingerprint may be disposed on the rear surface (or lower part) of the fingerprint sensing area 212 of the display 210 .

According to various embodiments of the present disclosure, the biosensor may be fixed to the rear surface of the display 210 using a polymer or resin.

In FIG. 2 , the electronic device 201 is not limited to the example described above as an example. For example, a receiver, a camera module, an iris sensor, and other biometric sensors may be disposed on at least one side of the front, side, or rear surface of the electronic device 210 .

3 is an exploded perspective view of an electronic device according to an exemplary embodiment;

Referring to FIG. 3 , an electronic device 301 (eg, the electronic device 201 of FIG. 2 ) according to an embodiment includes a cover glass 310 and a display (or display panel) 320 (eg, FIG. 2 ). of the display 210), a biosensor module 340 (or a biosensor, or a biosensor device, etc.) (eg, a fingerprint sensor), a housing 350 (eg, the housing 220 of FIG. 2), a circuit board ( 360), a battery 370, and a back cover or rear cover 380. According to various embodiments, the electronic device 301 may not include some components shown in FIG. 3 or may additionally include components not shown in FIG. 3 .

The cover glass 310 may transmit at least a portion of the light generated by the display 320 . Also, on the cover glass 310, the user may perform a touch (including a contact using an electronic pen) by contacting a part of the body (eg, a finger). In this regard, the touch panel may be disposed on at least one layer of the inside or bottom of the cover glass 310 . The touch panel may be disposed on the display 320 (eg, above or below the display 320 or inside the display 320). The cover glass 310 is formed of, for example, tempered glass, reinforced plastic, or a flexible polymeric material, so that each component included in the display 320 and the electronic device 301 is protected from external impact. can protect According to various embodiments, the cover glass 310 may also be referred to as a glass window.

The display 320 may include a first surface 471 capable of outputting display information and a second surface 472 disposed in an opposite direction to the first surface. The display 320 may be disposed under or combined with the cover glass 310 and exposed through at least a portion of the cover glass 310 . The display 320 may output content (eg, text, image, video, icon, widget, or symbol) or may receive a touch input or an electronic pen input from a user. In relation to receiving an input of an electronic pen, a pen panel associated with operating an electronic pen may be disposed below the display 320 . Alternatively, the electronic pen input may be input through a touch panel disposed above or below the display 320 and on one side of the cover glass 310 .

According to one embodiment, the display 320 may include a display panel and a touch sensor. Alternatively, the display 320 may further include an electronic pen sensor in relation to an electronic pen input. The display panel may include, for example, a liquid crystal display (LCD) panel, a light emitting diode (LED) display panel, an organic light emitting diode (OLED) display panel, a microelectromechanical system (MEMS) display panel, or an electronic paper display panel. can include The touch sensor may include a capacitive touch panel, a resistive touch panel, a resistive touch panel, an infrared type touch panel, or an ultrasonic type touch panel. The touch sensor may be inserted between display panels (add-on touch panel), formed directly on the display panel (on-cell touch panel), or included inside the display panel ( in-cell touch panel). The electronic pen sensor (eg, digitizer) may detect a touch, gesture, or hovering from the electronic pen.

According to an embodiment, the display 320 includes a planar area 321 and one side (eg, an upper side, a lower side, a left side) of the planar area 321. ), and a bending area 322 extending from the right side. At least a part of the bending area 322 may include a non-display area. Alternatively, the bending area ( 322) The entirety may include a non-display area, and wirings for supplying signals to pixels disposed in the flat area 321 may be disposed in at least a part of the non-display area. According to this, the display 320 may further include an edge region bent while extending to the left and right sides of the flat region 321. Accordingly, at least a portion of the front surface of the display 320 may be provided in a convex shape.

Pixels (eg, OLED, etc.) of a display panel, a conductive pattern of a touch sensor, and/or a conductive pattern of an electronic pen sensor may be disposed on the flat area 321 . The bending area 322 may be electrically connected to a flexible printed circuit board (FPCB) 323 located on the rear surface of the display 320 through various conductive patterns (wiring).

According to an embodiment, a portion of the bending area 322 may be folded toward the rear surface of the flat area 321 . According to various embodiments, the wiring of the FPCB 323 may be electrically connected to the circuit board 360 through a designated connector. According to various embodiments, similarly to the flat area 321, pixels for displaying various types of information may be disposed in at least a portion of the bending area 322.

The biometric sensor module 340 includes, for example, a sensing surface 348 disposed to face a portion of the second surface 472 of the display 320 and a side surface 349 formed in a direction different from the sensing surface 348. It may include a biosensor including a. The biometric sensor module 340 (eg, a fingerprint sensor) may be disposed under or combined with the display 320 . For example, the biosensor module 340 may be attached to the rear surface of the flat area 321 of the display 320 .

The biometric sensor module 340 may sense user's biometric information (eg, fingerprint information). The biosensor module 340 may include, for example, an ultrasonic biosensor. For example, the biosensor module 340 may transmit and receive ultrasonic waves using at least one piezoelectric layer and an electrode layer. The transmitted/received ultrasound waves are transferred to an image collection layer (eg, a thin film transistor layer, CMOS (complementary metal oxide semiconductor image sensor), or CCD (complementary metal oxide semiconductor image sensor) layer) to capture a user's fingerprint image. can be used A unique fingerprint minutiae of the fingerprint may be extracted from the fingerprint image, and the fingerprint minutiae may be compared with pre-registered fingerprint minutiae to be used for user authentication.

The housing 350 may form at least a part of an inner tube or an exterior of the electronic device 301 and accommodate each component included in the electronic device 301 . For example, the housing 350 may form a side surface (eg, an upper side, a lower side, a left side, and/or a right side) of the electronic device 301 . According to various embodiments, the housing 350 may include a combination of a plurality of sub-housings. The housing 350 may also be referred to as a rear case or a rear plate. According to one embodiment, at least a part of the side surface of the housing 350 may be formed of a metal material and used as an antenna structure.

According to one embodiment, the housing 350 may include a bracket. The bracket is made of, for example, a magnesium alloy and may be disposed below the display 320 and above the circuit board 360 . The bracket may be combined with the display 320 and the circuit board 360 to physically support them.

According to one embodiment, the circuit board 360 may be disposed below the housing 350 (or above the housing 350). The circuit board 360 may mount or arrange various electronic components, devices, printed circuits, etc. (eg, a processor, memory, communication circuit, etc.) of the electronic device 301 . According to various embodiments, the circuit board 360 may be referred to as a main board, a printed board assembly (PBA), or simply a printed circuit board (PCB). The circuit board 360 may include, for example, a main circuit board and a sub circuit board. According to an embodiment, the main circuit board and the sub circuit board may be electrically connected to each other through a designated connector or a designated wire. The circuit board 360 may be implemented as, for example, a rigid printed circuit board (rigid PCB) and/or FPCB.

The battery 370 can convert chemical energy and electrical energy in both directions. For example, the battery 370 may convert chemical energy into electrical energy and supply the electrical energy to various components or modules connected to the display 320, the biosensor module 340, and the circuit board 360. According to an embodiment, the circuit board 360 may include a power management module (eg, a power management integrated circuit (PMIC)) for managing charging and discharging of the battery 370 .

The rear cover 380 may be coupled to the rear surface of the electronic device 301 . The rear cover 380 may be formed of tempered glass, plastic injection molding, and/or metal. According to various embodiments, the rear cover 380 may be integrally implemented with the housing 350 or be detachable by a user.

Among the biosensor modules 340 described above, the biosensor is fixed to one side of the second surface 472 of the display 320 through the first fixing member and the second fixing member (or the first adhesive member and the second adhesive member). can The first fixing member is disposed between the partial area and the biosensor so that the sensing surface 348 can be attached to the partial area of the second surface 472 of the display 320, and can be cured at a designated temperature. there is. The second fixing member is attached to at least a portion of a peripheral area adjacent to at least a portion of the side surface 348 of the biosensor and a portion of the second surface 472 of the display 320, and is cured by light having a designated wavelength. It can be.

4A is a view showing a form in which a biosensor module and a display are separated from among some components of an electronic device according to an embodiment of the present invention, and FIG. It is a drawing showing the form in which the display is combined.

Referring to FIGS. 4A and 4B , at least a portion of an electronic device 401 (eg, the electronic device 301 of FIG. 3 ) is a display (or display panel) 420 (eg, the display 320 of FIG. 3 ). ), a first circuit board 423 (M-FPCB, multi-layered-FPCB), and a biosensor module 440 (eg, the biosensor module 340 of FIG. 3).

According to an embodiment, the display 420 may include a first panel layer 421 and a second panel layer 425 (or an auxiliary layer, or a back panel layer). According to an embodiment, the first panel layer 421 may include at least one light emitting device. According to an embodiment, the first panel layer 421 may include at least one layer through which signals (eg, ultrasonic signals) of a specific wavelength range may be transmitted. For example, the first panel layer 421 may include at least one organic material layer (eg, at least one insulating layer or poly-imides (PI) layer). Alternatively, the first panel layer 421 may include at least one organic material layer and at least one metal layer (eg, a wiring layer). In the ultrasonic transmission process, medium characteristics between the at least one organic material layer described above may be similar to each other or the same within a certain error range for effective ultrasonic transmission. According to various embodiments, a difference in medium properties between the organic material layer and the metal layer may be within a predetermined error range. A signal (eg, an ultrasonic signal) of a designated wavelength range is output from the lower biosensor module 440 of the first panel layer 421, and the vibration of the material layer of the first panel layer 421 causes the vibration of the first panel layer 421. It can be transferred to the top (eg, cover glass 310). The signal of the designated wavelength band is a signal reflected from the user's finger (or at least a part of the surface of the finger print) contacting the upper portion of the first panel layer 421 (eg, a signal from which the irradiated ultrasonic signal is reflected) Vibration may be transmitted through at least one material layer included in 421 and reach the biosensor module 440 . In this regard, the ultrasonic signal is absorbed or absorbed due to an impedance difference between a material layer (eg, the cover glass 310) and an air layer (eg, an air layer above the cover glass 310) or an impedance difference between the material layer and the user's fingerprint. reflections may vary. For example, an ultrasonic signal may be absorbed by a finger at a ridge of a fingerprint contacting the cover glass 310 and reflected at a valley of the fingerprint to be transmitted to the biosensor module 440 .

According to one embodiment, the second panel layer 425 may be disposed on the rear surface of the first panel layer 421 . According to an embodiment, the second panel layer 425 may include a sensor placement area 409 (or a sensor placement hole) for accommodating a biosensor module (eg, the biosensor module 340 of FIG. 3 ). there is. The sensor placement area 409 is the front and back sides of the second panel layer 425 so as to face a partial area of the first panel layer 421 in a state where the biosensor module 440 is disposed on the rear surface of the first panel layer 421. The face may be perforated.

The second panel layer 425 is disposed below the first panel layer 421 and has a heat dissipation function of radiating heat generated by the first panel layer 421 and reducing pressure applied to the first panel layer 421. At least one of a function to reduce breakage, a function to shield electromagnetic waves, and a function to increase visibility of the first panel layer 421 may be performed. The second panel layer 425 may include one or a plurality of sub-layers to support the above-described functions singly or in combination. When the second panel layer 425 includes a plurality of sub-layers, in the sensor arrangement area 409, at least some of the plurality of sub-layers are removed to form a hole or recess or groove) can be formed. Accordingly, the biosensor module 440 disposed in the sensor arrangement area 409 is disposed while directly facing the lower surface of the first panel layer 421, or is disposed through at least some sub-layers of the first panel layer ( 421) may be disposed below.

The first circuit board 423 (eg, FPCB 323 of FIG. 3 ) extends from one side (eg, lower side) of the first panel layer 421 and is electrically connected to the first panel layer 421 . can A display IC and/or a touch sensor IC may be disposed on the first circuit board 423 . According to an embodiment, the first circuit board 423 may be functionally or electrically connected to the circuit board 360 described in FIG. 3 . A sensor placement area 409 may be provided on one side of the first circuit board 423 .

According to an embodiment, the sensor placement area 409 may be provided with a predetermined size penetrating the front and rear surfaces of the first circuit board 423 . The size of the sensor arrangement area 409 may be the same as that of the biosensor module 440 or larger than the biosensor module 440 by a designated size. The sensor arrangement area 409 may be formed penetrating the first circuit board 423 and the second panel layer 425 . Alternatively, the sensor placement area 423 may be provided by penetrating the first circuit board 423 and removing a portion of at least one sublayer of the second panel layer 425 .

The biometric sensor module 440 (eg, the biometric sensor module 340 of FIG. 3 ) may be used to obtain user's biometric information, for example, fingerprint information. The biosensor module 440 may include a biosensor 441, a second circuit board 442, and a sensor circuit 443 (or sensor integrated chips (IC)).

The biosensor 441 may be attached to the rear surface of the display 420 . For example, one surface of the biosensor 441 may pass through at least a portion of the first circuit board 423 and be attached to the rear surface of the first panel layer 421 . Alternatively, the biosensor 441 passes through at least a portion (eg, through hole or groove) of the first circuit board 423 and at least a portion of the second panel layer 425 and is attached to the rear surface of the first panel layer 421 . It can be. Alternatively, when some sub-layers of the second panel layer 425 are configured to be disposed on the entire rear surface of the first panel layer 421, the biosensor 441 is configured to include at least a portion of the first circuit board 423 and the second panel. A portion of the layer 425 may be penetrated and fixed to some sub-layers. The biosensor 441 irradiates a signal of a designated wavelength range (eg, a signal of an ultrasonic band), collects the reflected signal when the irradiated signal is reflected on an object in contact with the cover glass 310, and transmits the collected signal. It can be transmitted to the sensor circuit 443 through the second circuit board 442 .

According to one embodiment, one side of the second circuit board 442 is electrically connected to signal lines disposed on one side of the biosensor 441 and the other side is electrically connected to the sensor circuit 443. can At least a portion of the second circuit board 442 may be made of an anisotropic conductive film (ACF). Alternatively, at least a portion of the second circuit board 442 may be made of a flexible PCB (FPCB). A connector may be disposed on a portion of the second circuit board 442 connected to the sensor circuit 443 .

The sensor circuit 443 may extract fingerprint information by processing a signal transmitted through the second circuit board 442 . Alternatively, the sensor circuit 443 may extract image information corresponding to a fingerprint according to signal processing and transmit it to a processor (eg, the processor 120 of FIG. 1 ) of the electronic device 401 .

FIG. 5 is a view showing an example of a cross section obtained by cutting along the cutting line AA′ of FIG. 4B.

Referring to FIG. 5 , an electronic device 501 (eg, the electronic device 301 of FIG. 3 ) includes a first panel layer 421 and a second panel layer 425 (eg, the electronic device 301 of FIG. 3 ). It may include a display 320), a first circuit board 423, and a biosensor module 440. The electronic device 501 includes a first fixing member 510 (or first adhesive member) and a second fixing member 520 (or second adhesive member) for fixing the biosensor 441 of the biosensor module 440. absent) may be included. Based on the drawing, a cover glass may be further disposed on one surface of the first first panel layer 421 .

The second panel layer 425 may include a first sub-layer 425a, a second sub-layer 425b, a third sub-layer 425c, and a fourth sub-layer 425d. In the drawings, the second panel layer 425 includes first to fourth sub-layers 425a, 425b, 425c, or 425d, but the present invention is not limited thereto. For example, the second panel layer 425 may include some components of the first to fourth sub-layers 425a, 425b, 425c, or 425d (eg, the first sub-layer 425a and the second sub-layer ( 425b) or only the first sub-layer 425a and the fourth sub-layer 425d). The first sub-layer 425a may include, for example, an embossing layer. The second sub-layer 425b may include, for example, a cushion layer that absorbs impact. The third sub-layer 425c may include, for example, an EMI shielding sheet (eg, Cu sheet) to shield electro-magnetic interference (EMI). The fourth sub-layer 425d may include, for example, a heat dissipation sheet (eg, graphite sheet) that dissipates heat generated from the first panel layer 421 .

The biosensor module 440 may include, for example, a biosensor 441 , a second circuit board 442 , and a sensor circuit 443 .

The biosensor 441 may irradiate a signal (eg, an ultrasonic signal) of a designated wavelength range and collect a reflection signal obtained by reflecting the corresponding signal. In this regard, the biosensor 441 may include a substrate layer 441a, a circuit layer 441b, a piezo material layer 441c, and an electrode layer 441d. The substrate layer 441a may include, for example, a silicon layer, an insulated silicon layer, a thin film transistor (TFT) layer, a glass layer, a plastic layer, a ceramic layer, or a layer in which at least some of the above layers are combined. The circuit layer 441b may include, for example, a TFT circuit formed on a TFT layer. Alternatively, the circuit layer 441b may include a CMOS or CCD layer formed on a silicon layer. The circuit layer 441b, the piezo material layer 441c, and the electrode layer 441d may serve as a signal transmission/reception layer that outputs or receives a signal of a designated wavelength range.

For example, the piezo material layer 441c may include a piezoelectric layer, and the electrode layer 441d may include an electrode layer corresponding to the circuit layer 441b. In the signal transmission/reception layer of this structure, when power is supplied to the circuit layer 441b and the electrode layer 441d, in the piezo material layer 441c disposed between the circuit layer 441b and the electrode layer 441d, the piezo material layer ( A signal (eg, an ultrasonic signal) of a designated wavelength band corresponding to the material characteristics of 441c) may be irradiated, or a half-time signal of the irradiated signal may be received. In this regard, while at least a portion of the signal transmission/reception layer including the circuit layer 441b, the piezo material layer 441c, and the electrode layer 441d irradiates a signal, the other portion receives a signal reflected from the irradiated signal. can fulfill its role. Alternatively, the signal transmission/reception layer may perform an operation of irradiating a signal of a designated wavelength band during a first period according to divided time periods, and an operation of receiving a signal reflected from the irradiated signal during a second period thereafter. there is.

The second circuit board 442 is an FPCB, and one side may be electrically connected to the biosensor 441 and the other side may be connected to the sensor circuit 443 . The second circuit board 442 may be disposed at a height spaced apart from the first panel layer 421 by a predetermined distance. According to one embodiment, one side of the second circuit board 442 is provided in an ACF type and is electrically connected to signal wires (or electrode pads formed at the ends of the signal wires) provided on one side of the biosensor 441. can The other side of the second circuit board 442 may be electrically connected to the connector, and may be electrically connected to the sensor circuit 443 based on the connector.

The sensor circuit 443 may generate and transmit a control signal related to driving the biosensor 441 . The sensor circuit 443 controls the biosensor 441 to irradiate an ultrasonic signal in response to control of a processor (eg, the processor 120 of FIG. 1 ), and receives a signal reflected by the ultrasonic signal. Thus, fingerprint information can be obtained. The sensor circuit 443 may transmit acquired fingerprint information to the processor. The fingerprint information may include, for example, at least one of image information constructed based on an ultrasonic half-vision signal or feature point information of an acquired image.

The first fixing member 510 may be disposed between the biosensor 441 and the first panel layer 421 . Alternatively, the first fixing member 510 may be disposed between the substrate layer 441a of the biosensor 441 and the first panel layer 421 . The first fixing member 510 may include a thermosetting resin that is cured when a designated amount of heat is applied for a designated period of time. For example, the first fixing member 510 may include an epoxy resin-based adhesive member. The first fixing member 510 is applied to one side of the biosensor 441 (eg, on the substrate layer 441a) or applied to the sensor arrangement area 409 of the first panel layer 421 through an injection method or the like. It can be. The biosensor 441 to which the first fixing member 510 is applied to the substrate layer 441a may be placed on the first panel layer 421 of the sensor arrangement area 409 through a jig. A designated chamber may be provided for curing the first fixing member 510 (attachment of the first panel layer 421 and the biosensor 441). In a state in which the biosensor 441 is fixed to the rear surface of the first panel layer 421 by using the second fixing member 520, the first fixing member 510 is attached to the designated time and temperature environment (eg, about It can be cured in the chamber having about 5 to 60 minutes at 50 to 100 degrees, or about 10 minutes at about 70 degrees).

In the second fixing member 520, the biosensor 441 to which the first fixing member 510 in the first state (non-curing state) is applied is the first panel layer 421 corresponding to the sensor arrangement area 409. After being placed on the back of the body, it can be used to fix the biosensor 441. In this regard, the second fixing member 520 may be disposed on at least a part of the periphery of the biosensor 441 . For example, a predetermined amount of the second fixing member 520 may be applied to the corner of the biosensor 441 . Alternatively, while the second fixing member 520 is applied to at least a part of the edge circumference of the biosensor 441, the biosensor 441 is on the rear surface of the first panel layer 421 corresponding to the sensor arrangement area 409. can be fixed The second fixing member 520 may be an adhesive member having a different property from that of the first fixing member 510 . For example, the second fixing member 520 may be a UV curable resin, urethane or acrylic resin. According to various embodiments, the second fixing member 520 does not generate a chemical reaction with the first fixing member 510 or higher than a specified exothermic condition in order to suppress a decrease in adhesive force due to a chemical reaction with the first fixing member 510. Any material that does not may be used.

In the electronic device 501 having the above structure, while the biosensor 441 is disposed on the first panel layer 421 of the sensor arrangement area 409, the first fixing member in a first state (eg, non-curing state) ( 510) is disposed between the substrate layer 441a and the first panel layer 421, the second fixing member 520 in a first state (eg, non-curing state) to fix the biosensor 441 may be applied to a contact portion between the biosensor 441 and the first panel layer 421 (eg, at least a portion of an edge of the biosensor 441). Thereafter, the second fixing member 520 may be cured (eg, cured by UV) and transformed into a second state (eg, cured state). As the hardening of the second fixing member 520 is completed within a few seconds to a few minutes, the biosensor 441 can be quickly fixed to the sensor arrangement area without damage or deformation of surrounding structures. Thereafter, the biosensor module 440 and the display 420 provided with the first fixing member 510 in the first state and the second fixing member 520 in the second state may be disposed in the chamber. Thereafter, when the first fixing member 510 is heated in the chamber for a specified temperature and time (eg, a temperature within a range in which the biosensor module 440 and the display 420 are not damaged by heat and a curing time), the first fixing member 510 is heated. The fixing member 510 may be deformed into a second state (eg, a hardened state). As described above, in the process of attaching the biosensor 441 to the first panel layer 421, heat is not applied to the first fixing member through the jig holding the biosensor 441, so that the biosensor ( 441) is damaged or flawed by heat of the display 420 in contact (or a ringing phenomenon, a phenomenon in which polyethylene terephthalate (PET), which forms part of the first panel layer 421, is deformed, and the adhesive layer of the adhesive surface is deformed from the outside. visible phenomenon, wrinkle generation phenomenon, discoloration phenomenon, etc.) may not occur.

6 is a diagram showing an example of a sensor arrangement area according to an embodiment of the present invention.

Referring to FIG. 6 , referring to states 601 and 603 , the sensor placement area 409 in which the biosensor 441 according to an embodiment of the present invention is disposed is located on the rear surface of a display (eg, the display 420 of FIG. 5 ). 4A, 4B, and 5, etc., at least a portion of the second panel layer 425 is removed, so that at least a portion of the first panel layer 421 contacts the biosensor 441. can include In state 601, after the biosensor 441 is disposed on the rear surface of the first panel layer 421 in the sensor arrangement area 409, the first fixing member 510_1 in a first state (eg, non-curing state) and the first The shape to which the second fixing member 520_1 in a state (eg, non-curing state) is applied is illustrated. State 603 illustrates a shape in which the spacer 530 provided in the biometric sensor 441, the first fixing member 510_1 in the first state, and the second fixing member 520_1 in the first state are disposed.

The first fixing member 510_1 in the first state applied between the first panel layer 421 and the biosensor 441 may be pressed with a predetermined pressure by a jig. Accordingly, the first fixing member 510_1 in the first state having fluidity decreases the space between the first panel layer 421 and the biosensor 441, and the biosensor 441 and the first panel layer 421 ), and the remaining portion may partially protrude outside the edge of the biosensor 441. Accordingly, at least a part of the first fixing member 510_1 may protrude to the periphery of the biosensor 441 to form a fillet structure.

According to various embodiments, the biosensor 441 may have a predetermined thickness and include at least one spacer 530 disposed at a corner of the biosensor 441 . For example, the spacer 530 may be disposed at each corner portion (or four corner portions) of the biosensor 441 with a predetermined thickness. The spacer 530 is disposed between the biosensor 441 and the first panel layer 421 so that the biosensor 441 and the first panel layer 421 maintain a constant distance, and the spacer 530 forms a corner portion of the first panel layer 421. It may serve to prevent the first fixing member 510_1 from protruding. The second fixing member 520_1 in the first state may be applied in a predetermined amount to each corner region of the biosensor 441 where the first fixing member 510_1 in the first state does not protrude. In this process, the second fixing member 520_1 in the first state is introduced into the gap between the spacer 530, the biometric sensor 441, and the first panel layer 421, and the second fixing member in the first state ( While 520_1 is undergoing a UV curing process, the biosensor 441 can be more firmly fixed to the sensor arrangement area (or on the first panel layer 421).

As shown in state 605, the shape of the biosensor 441 is different from the spacer 530 described in state 603, in which grooves 532 are formed. The grooves 532 are provided at the corners of the biosensor 441, and the fixing member 510_1 in the first state may be applied on the substrate layer (eg, the upper surface based on the drawing) of the biosensor 441. there is. While the biosensor 441 to which the fixing member 510_1 in the first state is applied is placed in the sensor arrangement area 409, as described in state 601, at least a part of the fixing member 510_1 in the first state is a biosensor ( 441) may protrude outward through the edge. In this process, the fixing member 510_1 in the first state may protrude relatively less or may not protrude in the corner region where the groove 532 is formed. The second fixing member 520_1 in the first state is applied between one surface of the sensor arrangement area 409 (eg, the rear surface of the first panel layer 421) and the groove 532 of the biological sensor 441, It may have a larger contact area with the sensor 441 . Accordingly, while the second fixing member 520_1 in the first state (eg, non-curing state) is curing (eg, UV curing), the biosensor 441 may be more firmly fixed. The aforementioned spacer 530 or groove 542 may be disposed to space the first fixing member 510 and the second fixing member 520 apart at appropriate intervals. Alternatively, the spacer 530 or the groove 542 may be disposed to maintain a constant distance between the first fixing member 510 and the second fixing member 520 . For example, when the resin corresponding to the first fixing member 510 spreads widely in the space between the biosensor 441 and the first panel layer 421 while the display 420 and the biosensor 441 are bonded, the spacer 530 ) or the resin may spread to a region where the groove 542 does not exist. Accordingly, the surface where the second fixing member 520 applied later comes into contact with the biosensor 441 or the first panel layer 421 (or at least one sub-layer existing on the first panel layer 421). can be sufficiently secured, and the distance between the first fixing member 510 and the second fixing member 520 can be maintained at a specified size or more.

State 607 shows the biosensor 441 in more detail. The biosensor 441 includes an active area 441_1 that irradiates an ultrasonic signal related to fingerprint sensing, and a circuit (eg, circuit layer 441b) disposed in the active area. , TFT substrates) may include a wiring region 441_2 in which signal wires (or electrode pads connected to the signal wires) are formed to supply power. The wiring area 441_2 may be electrically connected to the ACF type second circuit board 442 . The spacer 530 may be disposed at a corner region of the biosensor 441 . For example, spacers 530 may be disposed at two locations in the active area 441_1 and at two locations in the wiring area 441_2 of the biosensor 441 .

State 609 indicates the application shape 510_2 of the first fixing member applied on the biosensor 441 through the injector. As shown, the application shape 510_2 of the first fixing member may be applied so that at least one side may be a “Y” (or “T” character, “t” character) shape. While the first fixing member having the above-described application shape 510_2 is attached to the sensor arrangement area 409, the first fixing member 510_1 in the first state is spread evenly by the pressure applied thereto, or the first fixing member 510_1 in the first state or In the form shown in state 607, a certain portion protrudes from the edge area and can be evenly positioned between the biosensor 441 and the first panel layer 421.

7 is a diagram showing an example of a fixed form of a biosensor according to an embodiment of the present invention. 7 is an example of another shape of the cut surface of the cut line A-A' of FIG. 4B.

Referring to FIG. 7 , some components of an electronic device 701 (eg, the electronic device 301 of FIG. 3) according to an embodiment include, for example, a display 420 (eg, a first panel layer 421 and a second panel layer 421). 2 panel layer 425), a first circuit board 423, and a biosensor module 440. The biosensor module 440 may include a biosensor 441 , a second circuit board 442 and a sensor circuit 443 . The first panel layer 421, the first circuit board 423, and the biosensor module 440 may have the same configurations as the panel layer, the first circuit board, and the biosensor module described above with reference to FIG. 5 .

The second panel layer 425 may include a first sub-layer 425a, a second sub-layer 425b, a third sub-layer 425c, and a fourth sub-layer 425d. Here, the second panel layer 425 may include fewer layers. The first sub-layer 425a may remain on the sensor arrangement area 709 without being removed. The second sub-layer 425b, the third sub-layer 425c, and the fourth sub-layer 425d may be removed from the sensor placement area 709 .

The biosensor 441 may be disposed on the first sub-layer 425a provided in the sensor arrangement area 709 . A first fixing member 510 may be disposed between the biosensor 441 and the first sub-layer 425a. A second fixing member 520 may be disposed in a corner area of the biosensor 441 and an area adjacent to the first sub-layer 425a.

Even if the first sub-layer 425a is maintained, the electronic device 701 described in the foregoing structure may acquire fingerprint information in an appropriate form as the ultrasonic signal passes through the first sub-layer 425a. As the first sub-layer 425a is maintained, the sensor arrangement area 709 under the first panel layer 421 and the area other than the sensor arrangement area 709 can create a visually similar environment. there is. Accordingly, even when a user observes from the top of the first panel layer 421 in the direction in which the biometric sensor 441 is disposed, the sensor arrangement area 709 and the surrounding area are in the same form by the first sub-layer 425a. can be observed Accordingly, the electronic device according to an embodiment may improve the viewing quality of the display. In addition, by fixing the biosensor 441 on the first sub-layer 425a without directly disposing the biosensor 441 on the first panel layer 421, the manufacturing method of the electronic device 701 is Deformation or discoloration of the first panel layer 421 may be suppressed or display quality may be improved. The deformation phenomenon includes a wrinkle phenomenon in which at least a portion of the first panel layer 421 is wrinkled, a phenomenon in which at least a portion of the first panel layer 421 is damaged or stretched, and a peripheral structure in which at least a portion of the first panel layer 421 is damaged. (For example, it may include mixing with the biological sensor 441 or the first adhesive layer.

8 is a diagram showing another example of a fixed form of a biometric sensor according to an embodiment of the present invention. 8 illustrates another form of the cut surface of the cut line A-A' of FIG. 4B.

Referring to FIG. 8 , some components of an electronic device 801 (eg, the electronic device 301 of FIG. 3) according to an embodiment include, for example, a display 420 (eg, a first panel layer 421 and a second panel layer 421). 2 panel layer 425), an auxiliary layer 810, a first circuit board 423, and a biological sensor module 440 may be included. The biosensor module 440 may include a biosensor 441 , a second circuit board 442 and a sensor circuit 443 . The first panel layer 421, the second panel layer 425, the first circuit board 423, and the biosensor module 440 are the panel layer, layer, first circuit board, and biosensor module described in FIG. 5 above. It may include the same configuration as For example, the second panel layer 425 may include first to fourth sub-layers 425a, 425b, 425c, or 425d.

An auxiliary layer 810 may be disposed on the first panel layer 421 of the sensor arrangement area 809 where the biosensor 441 is disposed (eg, a partial rear surface area of the first panel layer 421). . The auxiliary layer 810 may be provided by, for example, applying ink having a designated color using an inkjet or spray method. For example, the auxiliary layer 810 may include a layer coated with black ink. Alternatively, the auxiliary layer 810 may include a layer coated with ink of the same color as that of the second panel layer 425 . The auxiliary layer 810 may be prepared by applying black ink several times to a certain thickness (repetition of applying black ink, drying the applied ink, and then applying black ink to the upper surface of the dried ink). there is. The auxiliary layer 810 may have a certain thickness and color density so that the ultrasound signal irradiated from the biosensor 441 is reflected to obtain fingerprint information having a certain resolution or higher. The auxiliary layer 810 may be placed on the same surface as the first sub-layer 425a (eg, the rear surface of the first panel layer 421). The auxiliary layer 810 may be formed to a thickness thinner than, for example, the first sub-layer 425a.

The biosensor 441 may be disposed on the auxiliary layer 810 provided in the sensor arrangement area 809 . A first fixing member 510 may be disposed between the biosensor 441 and the auxiliary layer 810 . A second fixing member 520 may be disposed at a corner area of the biosensor 441 and an area adjacent to the auxiliary layer 810 .

In the electronic device 801 having the above-described structure, since the biosensor 441 passes through the auxiliary layer 810 and is provided to transmit and receive ultrasonic waves, it is possible to obtain fingerprint information in an appropriate form, and the sensor arrangement area 809 and An environment other than the sensor arrangement area 809 may be visually similar. Accordingly, even when observed from the top of the first panel layer 421 in the direction in which the biosensor 441 is disposed, the sensor arrangement area 809 and the surrounding area can be observed in the same form by the auxiliary layer 810. , The electronic device 801 according to an embodiment may improve viewing quality of a display. In addition, by fixing the biosensor 441 on the auxiliary layer 810 using the first fixing member 510 instead of directly disposing the biosensor 441 on the first panel layer 421, the first fixation is performed. Since the resistance of the first panel layer 421 to the hardening of the member 510 (eg, thermal curing by heat) can be increased, the manufacturing method of the electronic device 801 can harden the first fixing member 510. It is possible to suppress the occurrence of deformation or discoloration according to.

9 is a diagram illustrating an example of a structure around a biosensor according to an embodiment of the present invention. The cross section shown in FIG. 9 may be one example of various shapes of the cross section AA′ of FIG. 4B described above.

Referring to FIG. 9 , some components of an electronic device 901 (eg, the electronic device 301 of FIG. 3 ) according to an embodiment include, for example, a display 420 (eg, a first panel layer 421 and a second panel layer 421). 2 panel layer 425), a first circuit board 423, a biosensor module 440, and a sealing layer 910 (sealing layer). The biosensor module 440 may include a biosensor 441 , a second circuit board 442 and a sensor circuit 443 . The first panel layer 421, the second panel layer 425, the first circuit board 423, and the biosensor module 440 are the panel layer, layer, first circuit board, and biosensor module described in FIG. 5 above. It may include the same configuration as

A portion of the sensor arrangement area 909 where the biosensor 441 is disposed on the first panel layer 421 (eg, a portion of the rear surface of the first panel layer 421) and the biosensor 441 are separated from each other. 1 fixing member 510 may be disposed. A second fixing member 520 may be disposed on at least a part of an edge (or corner) of the biosensor 441 disposed on the first panel layer 421 . The second fixing member 520 may be hardened. For example, the second fixing member 520 may be UV cured by a UV wavelength signal, and the biosensor 441 may be fixed to the rear surface of the first panel layer 421 .

A sealing layer 910 may be provided in a space between the biosensor 441 and a peripheral portion (eg, the first circuit board) of the sensor arrangement area 909 . The sealing layer 910 may be disposed to surround the periphery of the biosensor 441 and fill the sensor disposition area 909 in the form of a groove or a hole. Accordingly, the sealing layer 910 is disposed on the rear surface of the first panel layer 421 other than the area where the first fixing member 510 and the second fixing member 520 disposed on the biosensor 441 are disposed. can The sealing layer 910 may include, for example, a material (eg, resin) capable of producing a color similar to that of the second panel layer 425 or a color similar to that of the first fixing member 510 . A material constituting the sealing layer 910 may be different from a material constituting the first fixing member 510 . The material constituting the sealing layer 910 is the first fixing member 510 in order to prevent a decrease in adhesive strength due to a chemical reaction between the first fixing member 510, the second fixing member 520, and the sealing layer 910. ) and a material that does not cause a chemical reaction with the second fixing member 520 may be employed.

The sealing layer 910 may be a black-based liquid resin. The sealing layer 910 may be prepared by applying the liquid resin using an inkjet method. Due to the presence of an air layer between the biosensor 441 and the sensor placement area 909, the corresponding air layer can be recognized when viewing the sensor placement area 909 from the outside (eg, the front of the display 420). . The sealing layer 910 may improve the visibility of the display by removing the air layer from the sensor arrangement area 909 .

When the sealing layer 910 is provided after the biosensor 441 is fixed with the second fixing member 520 on the top of the first panel layer 421 to which the first fixing member 510 is applied, the display 420 may be placed in a chamber and heated to a designated temperature for a certain period of time. Accordingly, the first fixing member 510 and the sealing layer 910 are simultaneously cured by the heat applied in the chamber, so that the biosensor 441 can be more firmly fixed on the upper portion of the first panel layer 421 . As the cured sealing layer 910 has a color similar to that of the surrounding second panel layer 425 and the first fixing member 510, the sensor placement area 909 is viewed from the outside of the display 420. There is no significant difference between the color environment of the panel layer 909 and the panel layer of the peripheral area, and thus the viewing quality of the display 420 can be improved.

10 is a diagram showing an example of a sensor arrangement area according to an embodiment of the present invention.

Referring to FIG. 10 , as described above with reference to FIG. 9 , a first circuit board 423 is disposed on the rear surface of the display 420, and as in state 1001, the first circuit board ( A first type sensor disposition area 1009a (eg, a groove or a hole) may be formed in 423 . When observing the rear side of the display from the top, at least a part of the first type sensor placement area 1009a where the biosensor 441 is placed may be provided in a concavo-convex shape, for example, a castle shape (or zigzag shape). Alternatively, the inner wall of the first type sensor disposition area 1009a may be provided in a repeated concave-convex shape. The first-type sensor disposition area 1009a has a shape of at least one of the sub-layers 425a, 425b, 425c, or 425d included in the second panel layer 425 described with reference to FIG. It can be provided in shape. For example, the fourth sub-layer 425d may be provided in a concave-convex shape, or the third sub-layer 425c and the fourth sub-layer 425d may be provided in a concave-convex shape. Alternatively, the second sub-layer 425b, the third sub-layer 425c, and the fourth sub-layer 425d may be provided in concavo-convex shapes. Alternatively, the first to fourth sub-layers 425a, 425b, 425c, or 425d may be provided in a concavo-convex shape.

Alternatively, when observing the rear surface of the display from the top, the second type sensor arrangement area 1009b where the biometric sensor 441 is disposed may be formed in a wave-like concavo-convex shape as in the state 1003. Additionally, one corner of the second type sensor disposition area 1009b may be provided with a groove 1011 larger than the peripheral portion. The groove 1011 may serve as an inlet for liquid resin used to form the sealing layer 910 described in FIG. 9 , for example. In the sensor disposition area 1009, while liquid resin forming the sealing layer 910 is injected into the first type sensor disposition area or the second type sensor disposition area 1009a or 1009b, the concave-convex structure prevents capillary action. , so that a separate space (eg, air layer) is not formed on the bottom surface of the first-type sensor disposition area or the second-type sensor disposition area 1009a or 1009b, and the liquid resin spreads well. .

11 is a view showing another form of a substrate layer of a biosensor according to an embodiment of the present invention.

Referring to FIG. 11, a biosensor 1141 (eg, the biosensor module 340 of FIG. 3) includes a substrate layer 1141a, a circuit layer 1141b, a first electrode layer 1141c, and a second electrode layer 1141d. can include As shown, the width of the substrate layer 1141a gradually increases from the upper side (eg, the surface facing the first panel layer 421) to the lower side (eg, the surface facing the circuit layer 114b). It may be provided in a shrinking shape. A first fixing member 1110 may be disposed between the substrate layer 1141a and the first panel layer 421 .

As described above, the substrate layer 1141a is provided in a shape having a certain inclination, or the substrate layer 1141a faces the lower portion of the substrate layer 1141a (eg, the first panel layer 421). As it is provided in a hangover shape upward with reference to the surface), an escape area 1130 may be formed inside the substrate layer 1141a between the substrate layer 1141a and the panel layer. For example, the second fixing member 1120 or the sealing layer 910 described in FIG. 10 may be formed in the escape area 1130 by the injector 1109 . Accordingly, while the second fixing member 1120 or the sealing layer 910 does not cover the upper region of the biosensor 1141 or the peripheral portion (eg, the first circuit board), the second fixing member 1120 or The contact area of the sealing layer 910 may be kept wider than the previous state (eg, a state in which upper and lower portions of the substrate layer 1141a are straight).

According to the various embodiments described above, an electronic device according to an embodiment includes a display including a first surface capable of outputting display information and a second surface disposed in an opposite direction to the first surface, and the first surface of the display. A biometric sensor including sensing surfaces disposed to face partial areas of two surfaces and a side surface formed in a direction different from the sensing surfaces, and between the partial areas and the biosensor so that the sensing surfaces can be attached to the partial areas. Disposed and attached to a first fixing member that can be cured (eg, thermally cured) at a designated temperature and at least a portion of the side surface and at least a portion of a peripheral region adjacent to the partial region, and can be cured by light having a designated wavelength. A second fixing member may be included.

According to various embodiments, the biosensor may transmit or receive an ultrasonic band signal.

According to various embodiments of the present disclosure, the display includes a first panel layer and a second panel layer, and a portion of the rear surface of the first panel layer is obtained by removing at least a portion of the second panel layer. may include an exposed area, and the first fixing member may be disposed between an area where a part of the rear surface of the first panel layer is exposed and the biosensor.

According to various embodiments, the first panel layer may include a polyethylene terephthalate (PET) layer.

According to various embodiments, the display includes a first panel layer and a second panel layer, and a portion of the rear surface of the first panel layer is formed by removing at least a portion of the first panel layer. An auxiliary layer including an exposed region and a part of the rear surface of the first panel layer exposed, wherein the first fixing member may be disposed between the biosensor and the auxiliary layer. .

According to various embodiments, the auxiliary layer may include a black ink layer.

According to various embodiments, the display may include a first panel layer and a second panel layer, and the first fixing member may be disposed between at least one of the plurality of sub-layers and the biosensor. .

According to various embodiments, the at least one sub-layer may include an embossed layer.

According to various embodiments, the display includes a first panel layer and a second panel layer, and in a partial area of the second surface, at least a portion of the second panel layer is removed so that a portion of the rear surface of the first panel layer is formed. A sealing layer including an exposed area and covering the side surface of the biosensor and the second fixing member on the exposed area may be further included.

According to various embodiments, the display includes a first panel layer, a second panel layer, and a first circuit board that transmits a signal for driving the display, and a partial area of the second surface is formed by the second panel layer. and a sensor disposition area in which a portion of the rear surface of the first panel layer is exposed by removing at least a portion of the first circuit board.

According to various embodiments of the present disclosure, a sidewall of the sensor arrangement area may have a concave-convex shape.

According to various embodiments of the present disclosure, at least one groove larger than the concavo-convex shape is further formed on one side of the sensor arrangement area.

According to various embodiments, a sealing layer injection hole provided at one side of the sensor arrangement area and injecting a resin related to forming the sealing layer may be further included.

According to various embodiments, the method further includes at least one spacer disposed between at least one edge of the biosensor and a second surface, and the second fixing member covers the spacer and at least a portion of the biosensor. It can be.

According to various embodiments, the sensor may further include at least one groove formed on one side of at least one corner of the biosensor, and the second fixing member may be disposed between the groove and a partial region of the second surface.

According to various embodiments, a sensor circuit connected to the biosensor and a second circuit board electrically connecting the biosensor and the sensor circuit may be further included.

According to various embodiments, the biosensor includes a substrate layer facing the second surface and a transmission/reception layer for transmitting or receiving ultrasonic waves through the substrate layer, wherein the transmission/reception layer includes a piezo material layer, an electrode layer, and the piezoelectric sensor. A circuit layer disposed between the material layer and the electrode layer may be included.

According to various embodiments, the substrate layer may include thin film transistor (TFT) wiring.

The substrate layer may include at least one of a silicon layer, an insulated silicon layer, a TFT layer, a glass layer, a plastic layer, or a ceramic layer.

According to various embodiments of the present disclosure, an electronic device in which an edge of the first fixing member is smaller than an edge of the substrate layer of the biosensor and larger than an edge of an active area of the biosensor.

According to various embodiments of the present disclosure, the first fixing member may be disposed on at least a partial area of the substrate layer to cover an area of the transmission/reception layer that transmits or receives the ultrasonic waves.

12 is a diagram illustrating a method of manufacturing a display in which a biosensor is disposed according to an embodiment of the present invention.

Referring to FIG. 12 , in a display manufacturing method according to an embodiment, in step 1201, a display including a sensor arrangement area (eg, the sensor arrangement area 409 of FIG. 4A ) and a biosensor to be disposed in the sensor arrangement area are prepared. can do.

In step 1203, a first fixing member in a first state (non-curing state) may be applied to one surface (eg, the surface of the substrate layer) of the biosensor. Here, the first state of the first fixing member may include a state before being thermally cured.

In step 1205, the first fixing member in the first state may be placed with a biosensor in a sensor arrangement area. For example, the first fixing member may be applied to one surface of the biosensor by an inkjet method or the like. In this step, the biosensor is gripped using a jig, and the side to which the first fixing member is applied is placed on the bottom surface of the sensor arrangement area (eg, the rear surface of the panel layer, the top surface of the first sub-layer, or the panel layer). The biosensor may be disposed on an upper surface of the applied auxiliary layer, and while a predetermined pressure is applied to the biosensor, the first fixing member may spread between the biosensor and the panel layer with a predetermined thickness.

In step 1207, a second fixing member in a first state (uncured state) may be disposed on at least a part of the biometric sensor and the edge. For example, the second fixing member may be applied to four corners of the biosensor. Here, the first state of the second fixing member may include a state before UV curing.

In step 1209, the second fixing member may be changed to a second state (cured state) through a curing process. Here, the second state of the second fixing member may include a UV cured state by UV irradiation. Accordingly, the biosensor may be fixed to one surface of the panel layer. The curing process may include a process in which UV is irradiated for several seconds to several tens of seconds (eg, about 6 seconds). In order not to delay curing of the first fixing member, the curing process (eg, UV curing by UV) is kept short for a certain time or less, so that mixing occurs on the surface where the first fixing member and the second fixing member are in contact. can be minimized.

In step 1211, after disposing the display to which the biosensor is fixed in the chamber, the first fixing member in the first state may be deformed (eg, hardened) to the second state at a specified temperature and time. Here, the second state of the first fixing member may include a thermal curing state by heat. For example, the curing process may include heating the display at about 50 to 100 degrees (eg, about 70 degrees) for about 5 to 20 minutes (eg, about 10 minutes).

According to various embodiments, between steps 1209 and 1211, a sealing layer may be formed on the exposed portion of the panel layer or on the periphery of the biosensor. In this regard, liquid resin for forming the sealing layer may be injected into the edge of the biosensor in the sensor arrangement area. When the display to which the sealing layer is applied is disposed in the chamber, the first fixing member and the sealing layer may be simultaneously cured during a heating process. For example, heat of a predetermined temperature may be applied to the first fixing member and the sealing layer, and thus, the first fixing member and the sealing layer may be thermally cured.

According to the various embodiments described above, a method of manufacturing an electronic device according to an embodiment includes providing a display and a biosensor, applying a first fixing member to a sensing surface of the biosensor, and applying the first fixing member to the sensing surface of the biosensor. disposing the sensing surface of the biosensor on the rear surface of the display, applying a second fixing member to at least a part of the periphery of the biosensor, curing the second fixing member, and removing the first fixing member. A curing step may be included. For example, the second fixing member curing step may include UV curing, and the first fixing member curing step may include thermal curing.

According to various embodiments of the present disclosure, the method of manufacturing the electronic device may further include injecting a sealing layer covering the second fixing member after applying the second fixing member.

13 is a diagram showing another example of a sensor arrangement area according to an embodiment of the present invention.

Referring to FIG. 13 , an electronic device 1301 (eg, the electronic device 501 of FIG. 5 ) is a display 420 including a first panel layer 421 and a second panel layer 425 (eg, the electronic device 501 of FIG. 5 ). Display 320 of 3), the first circuit board 423 described in FIG. 4A or 5, etc., and a biosensor module (biological sensor 441, second circuit board 442, and sensor circuit 443). can do. The electronic device 1301 includes a first fixing member 1310 (or a first adhesive member) and a second fixing member 1320 (or a second adhesive member) for fixing the biosensor 441 of the biosensor module. can include Based on the drawing, a cover glass may be further disposed on one surface of the first panel layer 421 .

The second panel layer 425 may include a first sub-layer 425a, a second sub-layer 425b, a third sub-layer 425c, and a fourth sub-layer 425d. In the drawings, the second panel layer 425 includes first to fourth sub-layers 425a, 425b, 425c, or 425d, but the present invention is not limited thereto. For example, the second panel layer 425 may include some components of the first to fourth sub-layers 425a, 425b, 425c, or 425d (eg, the first sub-layer 425a and the second sub-layer ( 425b) or only the first sub-layer 425a and the fourth sub-layer 425d). The first sub-layer 425a may include, for example, an embossing layer. The second sub-layer 425b may include, for example, a cushion layer that absorbs impact. The third sub-layer 425c may include, for example, an EMI shielding sheet (eg, Cu sheet) to shield electro-magnetic interference (EMI). The fourth sub-layer 425d may include, for example, a heat dissipation sheet (eg, graphite sheet) that dissipates heat generated from the first panel layer 421 .

The biosensor module may include, for example, a biosensor 441 , a second circuit board 442 , and a sensor circuit 443 . The biosensor 441 may irradiate a signal (eg, an ultrasonic signal) of a designated wavelength range and collect a reflection signal obtained by reflecting the corresponding signal. The biosensor 441 may have substantially the same configuration as that of the biosensor described above with reference to FIG. 5 . Configurations related to other biosensor modules may also have substantially the same configurations as those of the biosensor described above with reference to FIG. 5 .

At least a portion of the first fixing member 1310 may be disposed between the biosensor 441 and the first panel layer 421 . Alternatively, the first fixing member 1310 may be disposed between the substrate layer 441a of the biosensor 441 and the first panel layer 421 . The first fixing member 1310 may include an epoxy resin-based adhesive member that is cured when a specified heat is applied for a specified time. The first fixing member 1310 is applied to one side of the biosensor 441 (eg, on the substrate layer 441a) or applied to the sensor arrangement area 409 of the first panel layer 421 through an injection method or the like. It can be.

The biosensor 441 to which the first fixing member 1310 is applied to the substrate layer 441a may be placed on the first panel layer 421 of the sensor arrangement area 409 through a jig. At this time, as the biosensor 441 is pressed toward the first panel layer 421 with the first fixing member 1310 in the middle, a part of the first fixing member 1310 moves toward the side of the biosensor 441. The fillet structure 1310a may be formed by protruding outward. The fillet structure 1310a may be provided to cover the entire edge of the biosensor 441 or may be provided on four sides of the biosensor 441 . Since the fillet structure 1310a protrudes in the lateral direction of the biosensor 441 when the biosensor 441 is pressed, at least a portion of the fillet structure 1310a may have an upwardly convex shape.

In the second fixing member 1320, the biosensor 441 to which the first fixing member 1310 in the first state (non-curing state) is applied is the first panel layer 421 corresponding to the sensor arrangement area 409. After being placed on the back of the body, it can be used to fix the biosensor 441. In this regard, the second fixing member 1320 may be disposed on at least a part of the periphery of the biosensor 441 . For example, a predetermined amount of the second fixing member 1320 may be applied to a corner (eg, a vertex where two edges meet) of the biosensor 441 . Alternatively, while the second fixing member 1320 is applied to at least a part of the edge circumference (side of each side) of the biosensor 441, the biosensor 441 is a first panel layer corresponding to the sensor arrangement area 409 ( 421) can be fixed to the rear surface.

If at least a portion of the second fixing member 1320 is applied on at least a portion of the first fixing member 1310, and the second fixing member 1320 and the first fixing member 1310 have the same properties, they may be mixed with each other. Therefore, the second fixing member 1320 may be an adhesive member having a different property from that of the first fixing member 1310 . For example, the second fixing member 1320 may be a UV curable resin, urethane or acrylic resin. According to various embodiments of the present disclosure, the second fixing member 1320 does not generate a chemical reaction with the first fixing member 1310 that exceeds a predetermined heating condition in order to suppress a decrease in adhesive force due to a chemical reaction with the first fixing member 1310. It may be a substance that does not

The biosensor module or the display structure to which the biosensor module is attached may further include a conductive tape 1350 attached to one side of the second circuit board 442 . One side of the conductive tape 1350 may contact the second circuit board 442 and the other side may contact one side of the first panel layer 421 . The conductive tape 1350 may serve as a ground for the second circuit board 442 . As various examples, as shown in FIGS. 5 and 6 described above, the biosensor module may not include the conductive tape 1350, and thus the conductive tape 1350 may be omitted.

14 is a diagram showing another example of a sensor arrangement area according to an embodiment of the present invention.

Referring to FIG. 14 , an electronic device 1401 (eg, the electronic device 301 of FIG. 3 ) is a display including a first panel layer 421 and a second panel layer 425 (eg, the display of FIG. 3 ). 320), the first circuit board 423 described in FIG. 4A or FIG. 5, and the biosensor module (the biosensor 441, the second circuit board 442, and the sensor circuit 443). . Among the components of the electronic device 1401, except for the first fixing member 1410 and the second fixing member 1420, the rest of the components may be substantially the same as those described above with reference to FIG. 13 .

The first fixing member 1410 may be disposed between the substrate layer 441a (or TFT layer) and the first panel layer 421 . In this case, the first fixing member 1410 may have a deformable state by external pressure (eg, pressing pressure of the biometric sensor). The amount of application of the first fixing member 1410 may be an amount in which the fillet structure 1310a previously described with reference to FIG. 13 is not formed after being pressed by the biometric sensor 441 . The application amount of the first fixing member 1410 may be experimentally obtained. As the first fixing member 1410 is disposed between the substrate layer 441a and the first panel layer 421 so as not to protrude outside the rim of the biometric sensor 441, the rim of the first fixing member 1410 is shown. As described above, the biosensor 441 may be positioned inside the substrate layer 441a.

The second fixing member 1420 is one side (eg, non-curing state) of the biosensor 441 to temporarily fix the biosensor 441 while the first fixing member 1410 is in a first state (eg, a non-curing state). : A certain amount may be applied to corners where the sides of the biosensor 441 meet. As the first fixing member 1410 is disposed so as not to protrude to the outside, the second fixing member 1420 may be disposed between a side surface of the biosensor 441 and a part of the bottom surface of the biosensor 441 . Accordingly, an air gap 1430 may be formed between the second fixing member 1420 and the first fixing member 1410 . Meanwhile, in the drawings, it is shown that all air gaps 1430 are formed between the first fixing member 1410 and the second fixing member 1420, but the present invention is not limited thereto. For example, even if the air gap 1430 is formed between the first fixing member 1410 and the second fixing member 1420 at a specific corner (the corner where the two sides of the substrate layer 441a meet), the air gap 1430 is formed at the other corner. ) may not be formed and the first fixing member 1410 and the second fixing member 1420 may have a contact state.

In the electronic device 1401 having the above structure, as the edge of the first fixing member 1410 is formed to stay inside the substrate layer 441a, even when the biosensor 441 is viewed from the outside, the first fixing member 1410 ) is disposed inside the substrate layer 441a, so that the first fixing member 1410 is not recognized from the outside. Accordingly, when the first fixing member 1410 is positioned inside the substrate layer 441a, visibility of the display 420 may be improved. Additionally, when observing from the front to the back of the display 420, the first fixing member 1410 covers an area in the transmission/reception layer of the biosensor 441 that transmits or receives ultrasonic waves. 1410 may be disposed on at least a portion of the substrate layer 441a (or disposed to cover the substrate layer 441a). For example, the first fixing member 1410 has a size larger than the width of the circuit layer 441b, a size larger than the width of the material layer 441c, or a size larger than the width of the electrode layer 441d, and has a lower portion of the substrate layer 441a (display ( 420) when looking at the front from the rear).

FIG. 15 is a view showing one side of a part of the configuration of the sensor arrangement area of FIG. 14 , and FIG. 16 is a view showing another side of the part of the configuration of the sensor arrangement area of FIG. 14 .

Referring to FIGS. 15 and 16 , the electronic device may include a groove 409 area where a biosensor 441 is disposed. According to various embodiments, the height of the biosensor 441 may be smaller than the height of the groove 409 . For example, the groove 409 may have a height from the bottom of the rear surface of the first panel layer 421 of the display 420 to the top of the first circuit board 423 . Alternatively, the groove 409 may be formed by removing the embossed layer 425a to the first circuit board 423 among the layers disposed on the rear surface of the first panel layer 421 of the display 420 . Alternatively, as mentioned above, when a certain layer (eg, the embossed layer 425a) is maintained on the rear surface of the display 420 or a specific layer (eg, the auxiliary layer 810) is formed, the groove 409 is formed on the corresponding layer. (Except for the embossed layer 425a or the auxiliary layer 810), it may have a height from the rear surface of corresponding layers to the top of the first circuit board 423. Meanwhile, in the above description, the display 420 ) Various layers (eg, embossed layer 425a, cushion layer 425b, EMI shielding sheet 425c, heat dissipation sheet 425d, first circuit board 423) are formed on the rear surface, and the groove 409 Although the structure has been described, at least one of the various layers described above may be omitted if necessary For example, in the electronic device, only one of the embossed layer 425a or the cushion layer 425b among the various layers is used. or may have a structure in which only one layer of the EMI shielding sheet 425c or the heat dissipation sheet 425d is maintained Additionally, in the above description, the thickness of the biosensor 441 is considered considering the increase in the thickness of the electronic device. Although a case where is smaller than the height of the groove 409 is exemplified, the present invention is not limited thereto For example, the thickness of the biometric sensor 441 may be formed larger than the height of the groove 409, , In this case, at least a part of the biosensor 441 protruding above the height of the groove 409 may be seated in a bracket disposed on the rear surface of the display 420 (or a groove or hole of the housing 350 in FIG. 3 ). there is.

A first circuit board 443 may be disposed around the groove 409 . The first circuit board 443 may include a circuit board related to display driving. The groove 409 may be larger than the entire size of the biosensor 441 to the extent that the biosensor 441 can be disposed therein. The groove 409 may be formed by removing at least a portion of the second panel layer 425 . The bottom surface of the groove 409 may be the rear surface of the first panel layer 421 described above (when viewed from the direction in which the cover glass of the display is disposed toward the inside of the electronic device). Alternatively, the bottom surface of the groove 409 may be a partial surface (eg, an embossed layer) of the second panel layer 425 . Alternatively, the bottom surface of the groove 409 may be a black ink layer or a black matrix layer applied on the first panel layer 421 .

After the first fixing member 1410 described above is applied to the bottom surface of the groove 409 and the biosensor 441 is pressed, the shape of the first fixing member 1410 is elliptical, circular, or distorted circular. This can be. An edge of the first fixing member 1410 may not extend outside the substrate layer 441a of the biosensor 441 and may be disposed inside the substrate layer 441a. The second fixing member 1420 may be disposed on at least one side of the edge portion of the substrate layer 441a (or the edge portion of the biosensor). For example, a predetermined amount of the second fixing member 1420 may be applied to a corner region where two edges of the substrate layer 441a meet. While the second fixing member 1420 is applied, at least a portion permeates between the substrate layer 441a and the first panel layer 421, and the remaining portion permeates around the edge of the substrate layer 441a (eg, at least the sidewall of the corner). Some) may be arranged to cover. The biosensor 441 generates and outputs an ultrasonic signal on the substrate layer 441a, or an active area 441_1 (A/A: Active Area) (eg, a circuit layer 441b) for receiving an ultrasonic signal, a piezo material A region in which the layer 441c and the electrode layer 441d are stacked) may be included. The application area of the first fixing member 1410 may be larger than the border of the active area 441_1. Accordingly, the edge of the first fixing member 1410 may be smaller than the edge of the substrate layer 441a (or TFT layer) and larger than the edge of the active region 441_1. The active region 441_1 may be connected to the second circuit board 442 and may be connected to a separately provided sensor circuit 443 . A conductive tape 1450 may be disposed on one side of the second circuit board 442 , and one side of the conductive tape 1450 may contact the bottom surface of the groove 409 (or sensor arrangement area).

As described above, the biosensor module and the electronic device including the same according to an embodiment of the present invention improve external visibility as the rim of the first fixing member 1410 is provided inside the rim of the substrate layer 441a. In addition, the edge of the first fixing member 1410 is formed larger than the active area 441_1 of the biosensor 441, so that the quality of the ultrasonic signal can be maintained.

Meanwhile, the relationship structure between the edge of the first fixing member 1410 and the edge of the biosensor 441 described in FIGS. 14 to 16 is the example of other electronic devices described above, for example, the structures described in FIGS. 7 to 11 The same may be applied to at least one applied electronic device. For example, in the shape of the first fixing member 1410 having an edge smaller than that of the biosensor 441 described in FIG. 14, the embossing layer 425a described in FIG. ), a structure in which the auxiliary layer 810 forms the bottom surface of the biosensor seating groove, a structure in which the sealing layer 910 fills the empty space of the biosensor seating groove, and the inside of the biosensor seating groove. At least one of a structure in which the sidewall forms a repetitive concavo-convex shape and a structure in which the cross section of the edge of the substrate layer 441a gradually decreases toward the first panel layer 421 may be applied.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of the present document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numbers may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B," "A, B or C," "at least one of A, B and C," and "A Each of the phrases such as “at least one of , B, or C” may include all possible combinations of items listed together in the corresponding one of the phrases. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited. A (e.g., first) component is said to be "coupled" or "connected" to another (e.g., second) component, with or without the terms "functionally" or "communicatively." When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be an integral part or the smallest unit of a part or part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document provide one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, the program 140) including them. For example, a processor (eg, the processor 120 ) of a device (eg, the electronic device 101 ) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Device-readable storage media may be provided in the form of non-transitory storage media. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) online, directly between smartphones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the components described above may include a singular entity or a plurality of entities. According to various embodiments, one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.

Claims (20)

In electronic devices,
a display comprising a first surface capable of outputting display information and a second surface disposed opposite to the first surface;
a biometric sensor including a sensing surface disposed to face a partial area of the second surface of the display and a side surface formed in a direction different from that of the sensing surface;
a first fixing member disposed between the partial area and the biosensor so that the sensing surface can be attached to the partial area and cured at a designated temperature; and
a second fixing member attached to at least a portion of the side surface and at least a portion of a peripheral area adjacent to the partial area and curable by light having a designated wavelength;
and an air gap disposed between at least a portion of the second fixing member and at least a portion of the first fixing member. According to claim 1,
The biosensor
An electronic device that transmits or receives signals in the ultrasonic band. According to claim 1,
The display includes a first panel layer and a second panel layer,
A portion of the second surface is
At least a portion of the second panel layer is removed to include a region in which a portion of the rear surface of the first panel layer is exposed;
The first fixing member is
An electronic device disposed between an area where a part of the rear surface of the first panel layer is exposed and the biosensor. According to claim 3,
The first panel layer is
An electronic device comprising a polyethylene terephthalate (PET) layer. According to claim 1,
The display includes a first panel layer and a second panel layer,
A portion of the second surface is
At least a portion of the first panel layer is removed to include a region in which a portion of the rear surface of the first panel layer is exposed;
An auxiliary layer disposed in an area where a portion of the rear surface of the first panel layer is exposed,
The first fixing member is
An electronic device disposed between the biosensor and the auxiliary layer. According to claim 5,
The auxiliary layer is
An electronic device comprising a layer of black ink. According to claim 1,
The display includes a first panel layer and a second panel layer including a plurality of sub-layers,
The first fixing member is
An electronic device disposed between at least one of the plurality of sub-layers and the biosensor. According to claim 7,
The at least one sub-layer is
An electronic device comprising an embossed layer. According to claim 1,
The display includes a first panel layer and a second panel layer,
A portion of the second surface is
At least a portion of the second panel layer is removed to include a region in which a portion of the rear surface of the first panel layer is exposed;
The electronic device further includes a sealing layer covering the side surface of the biosensor and the second fixing member on the exposed area. According to claim 1,
The display includes a first panel layer, a second panel layer, and a first circuit board that transmits signals for driving the display;
A portion of the second surface is
and a sensor arrangement area in which a portion of a rear surface of the first panel layer is exposed by removing at least a portion of the second panel layer and the first circuit board. According to claim 10,
The sensor placement area is
An electronic device whose sidewall has a concave-convex shape. According to claim 11,
At least one groove larger than the concavo-convex shape is further formed on one side of the sensor arrangement area. According to claim 1,
It further includes; at least one spacer disposed between at least one corner of the biosensor and the second surface;
The second fixing member is
An electronic device disposed to cover at least a portion of the spacer and the biosensor. According to claim 1,
It further includes; at least one groove formed on one side of at least one corner of the biosensor;
The second fixing member is
An electronic device disposed between the groove and a partial area of the second surface. According to claim 1,
a sensor circuit connected to the biosensor;
The electronic device further comprising a second circuit board electrically connecting the biosensor and the sensor circuit. According to claim 1,
The biosensor
a substrate layer facing the second surface; and
An electronic device comprising a transmission/reception layer for transmitting or receiving ultrasonic waves through the substrate layer. According to claim 16,
The substrate layer is
An electronic device including at least one of a silicon layer, an insulated silicon layer, a thin film transistor (TFT) layer, a glass layer, a plastic layer, or a ceramic layer. According to claim 16,
The first fixing member is
An electronic device disposed in at least a partial area of the substrate layer to cover an area of the transmitting/receiving layer transmitting or receiving the ultrasonic waves. Preparing a display and bio-sensors;
applying a first fixing member to the sensing surface of the biosensor;
disposing the sensing surface of the biosensor to which the first fixing member is applied on the rear surface of the display;
applying a second fixing member to at least a part of the periphery of the biosensor;
curing the second fixing member using light of a designated wavelength;
and curing the first fixing member at a designated temperature after curing the second fixing member. According to claim 19,
and injecting a sealing layer covering the second fixing member after applying the second fixing member.

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