CN1047460C - 银基电接点材料 - Google Patents
银基电接点材料 Download PDFInfo
- Publication number
- CN1047460C CN1047460C CN95116848A CN95116848A CN1047460C CN 1047460 C CN1047460 C CN 1047460C CN 95116848 A CN95116848 A CN 95116848A CN 95116848 A CN95116848 A CN 95116848A CN 1047460 C CN1047460 C CN 1047460C
- Authority
- CN
- China
- Prior art keywords
- nickel
- silver
- weight
- contact material
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
- C22C1/059—Making alloys comprising less than 5% by weight of dispersed reinforcing phases
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
- C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
- C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
- H01H1/0233—Composite material having a noble metal as the basic material and containing carbides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
- H01H1/0237—Composite material having a noble metal as the basic material and containing oxides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Composite Materials (AREA)
- Contacts (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
- Manufacture Of Switches (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6232950A JPH0896643A (ja) | 1994-09-28 | 1994-09-28 | 電気接点材料 |
| JPP6-232950 | 1994-09-28 | ||
| JP232950/1994 | 1994-09-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1127926A CN1127926A (zh) | 1996-07-31 |
| CN1047460C true CN1047460C (zh) | 1999-12-15 |
Family
ID=16947406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN95116848A Expired - Fee Related CN1047460C (zh) | 1994-09-28 | 1995-09-28 | 银基电接点材料 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5591926A (enExample) |
| JP (1) | JPH0896643A (enExample) |
| KR (1) | KR0170798B1 (enExample) |
| CN (1) | CN1047460C (enExample) |
| DE (1) | DE19535814C2 (enExample) |
| TW (1) | TW302487B (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2113671T3 (es) * | 1993-08-23 | 1998-05-01 | Siemens Ag | Material de contacto a base de plata, empleo de tal material de contacto en un dispositivo de conmutacion de la tecnica energetica, y procedimiento para la obtencion del material de contacto. |
| DE19602812C1 (de) * | 1996-01-26 | 1997-07-31 | Siemens Ag | Verfahren zur Herstellung eines Formstücks aus einem Kontaktwerkstoff auf Silberbasis und Formstück |
| DE19608490C1 (de) * | 1996-03-05 | 1997-09-04 | Siemens Ag | Kontaktwerkstoff aus Silber und Wirkkomponenten, daraus gefertigtes Formstück sowie Verfahren zur Herstellung des Formstücks |
| WO2004069452A2 (en) * | 2003-02-10 | 2004-08-19 | Koninklijke Philips Electronics N.V. | Composition comprising silver metal particles and a metal salt |
| DE10318890B4 (de) * | 2003-04-17 | 2014-05-08 | Ami Doduco Gmbh | Elektrische Steckkontakte und ein Halbzeug für deren Herstellung |
| TW200710905A (en) * | 2005-07-07 | 2007-03-16 | Hitachi Ltd | Electrical contacts for vacuum circuit breakers and methods of manufacturing the same |
| JP5002398B2 (ja) * | 2007-09-28 | 2012-08-15 | 株式会社東芝 | 真空遮断器用接点材料 |
| US9193853B2 (en) | 2010-06-08 | 2015-11-24 | Appia, Llc | Method of microbial and/or enzymatic devulcanization of rubber |
| TWI478191B (zh) * | 2011-11-04 | 2015-03-21 | 品元企業股份有限公司 | 銀不鏽鋼鎳電氣接點材料 |
| US9018552B2 (en) * | 2011-11-04 | 2015-04-28 | Taiwan Electric Contacts Corp. | Electrical contact including stainless steel material |
| TWI478190B (zh) * | 2011-11-04 | 2015-03-21 | 品元企業股份有限公司 | 銀不鏽鋼電氣接點材料 |
| CN102800513B (zh) * | 2012-08-10 | 2015-11-25 | 佛山通宝精密合金股份有限公司 | 一种电触头用银镍材料的制备方法 |
| CN103589898B (zh) * | 2013-11-22 | 2015-06-24 | 福达合金材料股份有限公司 | 银金属氧化物碳化钨复合电触头材料的制备方法及其产品 |
| KR102224011B1 (ko) * | 2017-01-23 | 2021-03-05 | 현대자동차 주식회사 | 전기 접점 소재 |
| CN112760513B (zh) * | 2020-12-30 | 2022-04-15 | 宁波东大神乐电工合金有限公司 | 一种银氧化锡电触头材料及其制备工艺 |
| CN115478188B (zh) * | 2022-08-24 | 2023-04-18 | 苏州银孚新材料有限公司 | 一种银碳化钨电触头材料的制备方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4834939A (en) * | 1988-05-02 | 1989-05-30 | Hamilton Standard Controls, Inc. | Composite silver base electrical contact material |
| US4874430A (en) * | 1988-05-02 | 1989-10-17 | Hamilton Standard Controls, Inc. | Composite silver base electrical contact material |
| US5198015A (en) * | 1990-06-21 | 1993-03-30 | Matsushita Electric Works, Ltd. | Silver base electrical contact material and method of making the same |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3799771A (en) * | 1971-12-06 | 1974-03-26 | Mallory & Co Inc P R | Electrical contact material containing silver,cadmium oxide,tin and nickel |
| JPS58126607A (ja) * | 1982-01-22 | 1983-07-28 | 田中貴金属工業株式会社 | 電気接点材料 |
| JPS596342A (ja) * | 1982-06-30 | 1984-01-13 | Matsushita Electric Works Ltd | 電気接点材料 |
| JPS59153852A (ja) * | 1983-02-21 | 1984-09-01 | Tanaka Kikinzoku Kogyo Kk | 電気接点材料 |
| JPS59159951A (ja) * | 1983-03-03 | 1984-09-10 | Tanaka Kikinzoku Kogyo Kk | 電気接点材料 |
| US4699763A (en) * | 1986-06-25 | 1987-10-13 | Westinghouse Electric Corp. | Circuit breaker contact containing silver and graphite fibers |
| JPH06104873B2 (ja) * | 1986-07-08 | 1994-12-21 | 富士電機株式会社 | 銀―金属酸化物系接点用材料及びその製造方法 |
| GB2203167B (en) * | 1987-03-25 | 1990-11-28 | Matsushita Electric Works Ltd | Composite conductive material and method for manufacturing same |
| JPH04107232A (ja) * | 1990-08-24 | 1992-04-08 | Matsushita Electric Works Ltd | 接点材料およびその製造方法 |
-
1994
- 1994-09-28 JP JP6232950A patent/JPH0896643A/ja active Pending
-
1995
- 1995-09-16 TW TW084109736A patent/TW302487B/zh not_active IP Right Cessation
- 1995-09-26 DE DE19535814A patent/DE19535814C2/de not_active Expired - Fee Related
- 1995-09-26 US US08/534,203 patent/US5591926A/en not_active Expired - Lifetime
- 1995-09-28 CN CN95116848A patent/CN1047460C/zh not_active Expired - Fee Related
- 1995-09-28 KR KR1019950033800A patent/KR0170798B1/ko not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4834939A (en) * | 1988-05-02 | 1989-05-30 | Hamilton Standard Controls, Inc. | Composite silver base electrical contact material |
| US4874430A (en) * | 1988-05-02 | 1989-10-17 | Hamilton Standard Controls, Inc. | Composite silver base electrical contact material |
| US5198015A (en) * | 1990-06-21 | 1993-03-30 | Matsushita Electric Works, Ltd. | Silver base electrical contact material and method of making the same |
Also Published As
| Publication number | Publication date |
|---|---|
| DE19535814A1 (de) | 1996-04-04 |
| TW302487B (enExample) | 1997-04-11 |
| DE19535814C2 (de) | 1998-07-23 |
| JPH0896643A (ja) | 1996-04-12 |
| US5591926A (en) | 1997-01-07 |
| CN1127926A (zh) | 1996-07-31 |
| KR0170798B1 (ko) | 1999-03-30 |
| KR960012067A (ko) | 1996-04-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 19991215 Termination date: 20120928 |