CN104742261A - A processing device - Google Patents
A processing device Download PDFInfo
- Publication number
- CN104742261A CN104742261A CN201410766785.3A CN201410766785A CN104742261A CN 104742261 A CN104742261 A CN 104742261A CN 201410766785 A CN201410766785 A CN 201410766785A CN 104742261 A CN104742261 A CN 104742261A
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- CN
- China
- Prior art keywords
- carrying
- frame unit
- pair
- chuck table
- unit
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Machine Tool Units (AREA)
Abstract
A processing device is provided. The processing device comprises a conveying component (48). The conveying component (48) is provided with: a pair of guide rails (52, 54) which respectively pass a conveying-in and conveying-out zone from a position near a conveying-in and conveying-out opening in a box (8) on a box carrying part (6), traverse a cleaning zone, and are used for guiding movement of a frame unit (11); and a sliding component (50) for allowing the frame unit to move along the guide rails, wherein the guide rails are broken in the way to respectively form a pair of break guide rail parts (52b, 54b, 52d, 54d) in the conveying-in and conveying-out zone and the cleaning zone. The processing device is also provided with vertical movement components (62) for allowing the break guide rail parts to move between a continuous base position with other guide rails and a disassembling position of a disassembling frame unit of a chunk disc (14) or a cleaning platform (44); and gap changing components (64) for changing a gap of a pair of break guide rail parts at the disassembling position into a supporting distance of a supporting frame unit and a departure distance through which the frame unit can pass.
Description
Technical field
The present invention relates to the processing unit (plant) that the machined object of tabular is processed.
Background technology
The semiconductor wafer defining the device of IC etc. in front is such as cut device and laser processing device is processed, and is split into the multiple chips corresponding to each device.Man-hour is being added to the machined object of the such tabular of semiconductor wafer, is attaching cutting belt at the back side of machined object, and be fixed with the framework (for example, referring to patent document 1) of ring-type at the outer peripheral portion of cutting belt.
As above, form the frame unit supporting machined object by means of the cutting belt be fixed on the framework of ring-type, thus the dispersion splitting rear chip etc. can be prevented, can operability be maintained.
In addition, said frame unit is moved to processing unit (plant) being contained under the state in box.Therefore, processing unit (plant) is provided with the slide mechanism pulled out from box by frame unit.Frame unit in box is drawn out to by this slide mechanism on the guide rail that is configured near box.
The frame unit being drawn out to guide rail is carried on chuck table and turntable (rinsing table) after targeted by center.When being carried on chuck table and turntable by frame unit, use the carrying mechanism (for example, referring to patent document 2) independent of slide mechanism.
Patent document 1 Japanese Unexamined Patent Publication 2003-243483 publication
Patent document 2 Japanese Unexamined Patent Publication 2011-159823 publication
In addition, above-mentioned processing unit (plant) needs at least 2 group carrying mechanisms of carrying frame unit, is therefore unsuitable for miniaturization.In addition, also exist due to these 2 groups of carrying mechanisms, hinder the problem of the low price of processing unit (plant).
Summary of the invention
The present invention completes in view of this problem points, its object is to provide one to be suitable for miniaturization, and can realize the processing unit (plant) of low price.
The invention provides a kind of processing unit (plant), it is processed the machined object on frame unit, this frame unit is at the opening of the framework of ring-type this machined object accommodating plate-shaped by means of adhesive tape, it is characterized in that, have: box mounting portion, it is placed with box, and multiple frame unit accommodated by this box, and has carrying-in/carrying-out opening at side surface, chuck table, it keeps the machined object on frame unit, tool member, it is processed the machined object be held on the framing component of this chuck table, carrying-in/carrying-out region, in this carrying-in/carrying-out region, carries out carrying-in/carrying-out by frame unit for this chuck table, and this carrying-in/carrying-out region is adjacent with this box mounting portion, machining area, in this machining area, processes the machined object be held on the frame unit of this chuck table, cleaning area, in this cleaning area, has arranged the rinsing table of the machined object of cleaning framework unit in the position relative with this box mounting portion across this carrying-in/carrying-out region, carrying component, its this box mounting portion in linearly configuration, carrying frame unit between this carrying-in/carrying-out region and this cleaning area, this carrying component has: pair of guide rails, they cross this cleaning area by this carrying-in/carrying-out region respectively near this carrying-in/carrying-out opening of this box be placed in this box mounting portion, guide the movement of this frame unit, and sliding component, it makes this frame unit move along this guide rail, this guide rail is broken on the way, this carrying-in/carrying-out region and this cleaning area form a pair disjunction rail portion respectively, this disjunction rail portion changes component carry out moving and to this chuck table or this rinsing table dismounting frame unit by moving up and down component and interval, wherein, this move up and down component make this disjunction rail portion other guide rail continuous print reference positions and to the removal position of this chuck table or this rinsing table dismounting frame unit between move, this interval change component the interval of a pair this disjunction rail portion being positioned this removal position place is changed to support that the support distances of this frame unit and this frame unit can pass leave distance.
The present invention is preferably configured to, described sliding component has 2 handle parts of the described framework holding frame unit in back-to-back mode, by other frame unit of another this handle part tractive, 2 framing unit are moved by this handle part pressing frame unit simultaneously along described guide rail.
In processing unit (plant) of the present invention, carrying component has the pair of guide rails of the movement of guiding frame unit and makes frame unit along the sliding component of pair of guide rails movement.
In addition, this pair of guide rails has a pair disjunction rail portion, this a pair disjunction rail portion moves to the removal position of chuck table or rinsing table dismounting frame unit, and interval can be enable to change to, and the support distances of supporting framework unit or frame unit pass leaves distance.
Thus, according to processing unit (plant) of the present invention, only the suitable carrying frame unit of this carrying component can be relied on.That is, the processing unit (plant) of the handling unit carrying frame unit of use more than 2 groups compared by processing unit (plant) of the present invention, is suitable for miniaturization, and can realizes low price.
Accompanying drawing explanation
Fig. 1 is the stereogram of the structure example of the processing unit (plant) schematically showing present embodiment.
Fig. 2 is the top view of the situation schematically showing carrying frame unit.
Fig. 3 is the top view of the situation schematically showing carrying frame unit.
Fig. 4 is the top view of the situation schematically showing carrying frame unit.
Fig. 5 is the top view of the situation schematically showing carrying frame unit.
Fig. 6 is the top view of the situation schematically showing carrying frame unit.
Fig. 7 is partial cross section's side view of the situation being schematically illustrated in installation frame unit in chuck table.
Fig. 8 is partial cross section's side view of the situation being schematically illustrated in installation frame unit in chuck table.
Symbol description
2 processing unit (plant)s
4 base stations
4a, 4b, 4c opening
6 box mounting tables (box mounting portion)
8 boxes
10 X-axis travelling carriages
12 buckers
14 chuck table
16 clamps
18 cutting units (tool member)
20 support portions
22 cutting unit travel mechanisms
24 Y-axis guide rails
26 Y-axis travelling carriages
28 Y-axis ball-screws
30 Y-axis pulse motors
32 Z axis guide rails
34 Z axis travelling carriages
36 Z axis ball-screws
38 Z axis pulse motors
40 bites
42 wiper mechanisms (cleaning element)
44 turntables (rinsing table)
46 clamps
48 carrying mechanisms (carrying component)
50 slide mechanisms (sliding component)
52 guide rails
52a fixed guide
52b movable guiding rail (disjunction rail portion)
52c fixed guide
52d movable guiding rail (disjunction rail portion)
54 guide rails
54a fixed guide
54b movable guiding rail (disjunction rail portion)
54c fixed guide
54d movable guiding rail (disjunction rail portion)
56 guides
58 ball-screws
60 pulse motors
62 elevating mechanisms (moving up and down component)
64 interval set mechanisms (interval change component)
11 frame units
13 machined objects
15 cutting belt
17 frameworks
Detailed description of the invention
Below, with reference to accompanying drawing, embodiments of the present invention are described.Fig. 1 is the stereogram of the structure example of the processing unit (plant) schematically showing present embodiment.In addition, in the present embodiment, the processing unit (plant) (topping machanism, cutter) of the machined object cutting tabular is described, and processing unit (plant) of the present invention also can be grinding attachment (grinder), lapping device, laser processing device etc.
As shown in Figure 1, processing unit (plant) 2 has the base station 4 supporting each structure.Be provided with rectangular-shaped opening 4a in a bight of the front side of the upper surface of base station 4, in this opening 4a, the mode that can be elevated be provided with box mounting table (box mounting portion) 6.
At the rectangular-shaped box 8 of the multiple frame unit 11 of upper surface mounting collecting of box mounting table 6.The carrying-in/carrying-out opening (not shown) for taking out of or move into frame unit 11 is formed at the side surface of box 8.In addition, in FIG for convenience of explanation, illustrate only the profile of box 8.
Frame unit 11 has the machined object 13 of tabular.This machined object 13 is such as discoid semiconductor wafer, and face side is divided into the device area of central authorities and surrounds the periphery remaining area of device area.Device area is multiple region by Cutting Road (segmentation preset lines) Further Division of the arrangement in clathrate, and each region defines the device of IC etc.
The cutting belt 15 that diameter is greater than machined object 13 is attached in the rear side of machined object 13.The outer peripheral portion of cutting belt 15 is fixed on the framework 17 of the ring-type with circular opening.Thus, constitute frame unit 11, this frame unit 11 supports machined object 13 by means of the cutting belt 15 be fixed on the framework 17 of ring-type.
Rectangular-shaped opening 4b longer on fore-and-aft direction (X-direction) is defined in the position close to box mounting table 6.In this opening 4b, be provided with X-axis travelling carriage 10, make X-axis travelling carriage 10 at the X-axis travel mechanism (not shown) of X-direction (fore-and-aft direction, processing direction of feed) upper movement and the bucker 12 covering X-axis travel mechanism.
X-axis travel mechanism has a pair X-axis guide rail (not shown) being parallel to X-direction, and X-axis guide rail is provided with X-axis travelling carriage 10 in the mode that can slide.Be provided with nut portions (not shown) in the lower face side of X-axis travelling carriage 10, this nut portions is screwed with the X-axis ball-screw (not shown) being parallel to X-axis guide rail.
X-axis pulse motor (not shown) has been linked in an end of X-axis ball-screw.By X-axis pulse motor, X-axis ball-screw is rotated, thus X-axis travelling carriage 10 move in the X-axis direction along X-axis guide rail.
The chuck table 14 that absorption keeps the machined object 13 of frame unit 11 is provided with above X-axis travelling carriage 10.Around chuck table 14, be provided with 4 clamps 16, these 4 clamps grip the framework 17 of the ring-type for supporting machined object 13 from four directions.
Chuck table 14 links with the rotating mechanism (not shown) of motor etc., rotates around the upper rotating shaft extended of vertical direction (Z-direction).In addition, chuck table 14 is moved in the X-axis direction by above-mentioned X-axis travel mechanism, on the carrying-in/carrying-out region being located in the front of carrying-in/carrying-out frame unit 11 and machining area to the central authorities of machined object 13 machining.
The upper surface of chuck table 14 is the holding surface that absorption keeps machined object 13.This holding surface is connected with attraction source (not shown) by the stream (not shown) being formed at the inside of chuck table 14.
Above base station 4, be configured with the support portion 20 of the gate for supporting 2 groups of cutting units (tool member) 18 in the mode of crossing over opening 4b.The 2 groups of cutting unit travel mechanisms 22 making the movement in Y direction (index feed direction) and Z-direction (short transverse, vertical direction) of each cutting unit 18 are provided with on the front surface top of support portion 20.
Cutting unit travel mechanism 22 have be configured at support portion 20 front surface on and be parallel to a pair Y-axis guide rail 24 of Y direction.Y-axis guide rail 24 is provided with in the mode that can slide the Y-axis travelling carriage 26 being formed each cutting unit travel mechanism 22.
Be provided with nut portions (not shown) in the rear side (below side) of each Y-axis travelling carriage 26, this nut portions is screwed with Y-axis ball-screw 28 respectively that be parallel to Y-axis guide rail 24.An end of each Y-axis ball-screw 28 has linked Y-axis pulse motor 30.When making Y-axis ball-screw 28 rotate by Y-axis pulse motor 30, Y-axis travelling carriage 26 moves in the Y-axis direction along Y-axis guide rail 24.
The a pair Z axis guide rail 32 being parallel to Z-direction is provided with in the front (front surface) of each Y-axis travelling carriage 26.Z axis guide rail 32 is provided with Z axis travelling carriage 34 in the mode that can slide.
Be provided with nut portions (not shown) in the rear side (below side) of each Z axis travelling carriage 34, this nut portions is screwed with Z axis ball-screw 36 respectively that be parallel to Z axis guide rail 32.An end of each Z axis ball-screw 36 is linked with Z axis pulse motor 38.When making Z axis ball-screw 36 rotate by Z axis pulse motor 38, Z axis travelling carriage 34 moves in the Z-axis direction along Z axis guide rail 32.
The cutting unit 18 machined object 13 on frame unit 11 being carried out to machining is provided with in the bottom of each Z axis travelling carriage 34.In addition, the camera (not shown) that machined object 13 is made a video recording is provided with in the position adjacent with each cutting unit 18.By as above making Y-axis travelling carriage 26 and Z axis travelling carriage 34 move, each cutting unit 18 and each camera move in Y direction and Z-direction.
Each cutting unit 18 has circular bite 40, and this bite 40 is installed in the end side of the main shaft (not shown) rotated around Y-axis.Be linked with motor (not shown) in another side of each main shaft, the bite 40 be installed on main shaft is rotated.By making this bite 40 carry out rotating and be cut in machined object 13, machined object 13 is cut processing.
Rectangular-shaped opening 4c is formed in the position of the opposition side relative to opening 4b and opening 4a.The wiper mechanism (cleaning element) 42 in the front of the machined object 13 after cleaning cutting is provided with in opening 4c.
Wiper mechanism 42 has absorption in opening 4c and keeps the turntable (rinsing table) 44 of the machined object 13 of frame unit 11.Around turntable 44, be provided with 4 clamps 46, these 4 clamps 46 grip the framework 17 of the ring-type for supporting machined object 13 from four directions.
Linked the rotating mechanism (not shown) of motor etc. in the below of turntable 44, turntable 44 rotates by means of the revolving force transmitted from this rotating mechanism.Above turntable 44, be configured with nozzle (not shown), this nozzle is towards the fluid being held in machined object 13 jet cleaning on turntable 44.
The upper surface of turntable 44 is the holding surface that absorption keeps machined object 13.This holding surface is connected with attraction source (not shown) by the stream (not shown) being formed at the inside of turntable 44.
Such as, after the machined object 13 after cutting is held in turntable 44, if make this turntable 44 rotate and the fluid of jet cleaning from nozzle, then the foreign matter of the cutting swarf be attached on machined object 13 etc. can be removed.
Above opening 4b and opening 4c, be provided with carrying mechanism (carrying component) 48, this carrying mechanism 48 is at box 8 and carrying frame unit 11 between chuck table 14 and turntable 44.This carrying mechanism 48 has and holds frame unit 11 and the pair of guide rails 52,54 being parallel to Y direction that makes its slide mechanism (sliding component) 50 of movement and movement of guiding frame unit 11 in the Y-axis direction.
Slide mechanism 50 has and is configured at 2 handle parts 50a, 50b in the end side of arm (with reference to Fig. 2 etc.) in back-to-back mode, can carry 2 framing unit 11 simultaneously.Another side of arm is formed with opening (not shown) along Y direction, has inserted guide 56 in the openings, this guide 56 is configured at the front surface of base station 4 and extends along Y direction.
In addition, be provided with nut portions (not shown), this nut portions is screwed with ball-screw 58 in another side of arm, this ball-screw 58 and guide 56 are configured at the front surface of base station 4 abreast.An end of ball-screw 58 is linked with pulse motor 60.
If make ball-screw 58 rotate by pulse motor 60, then slide mechanism 50 moves in the Y-axis direction along guide 56.This slide mechanism 50 moves in the mode not occurring to disturb with base station 4, chuck table 14, turntable 44, pair of guide rails 52,54 etc.
Pair of guide rails 52,54 is formed as the length from box 8 to turntable 44.More specifically, be formed as, near the box mounting table 6 of the carrying-in/carrying-out opening corresponding to box 8, by the carrying-in/carrying-out region by frame unit 11 carrying-in/carrying-out chuck table 14, crossing the length of the cleaning area being provided with turntable 44.In addition, box mounting table 6, carrying-in/carrying-out region and the linearly configuration of cleaning area.
Guide rail 52 is broken is in the Y-axis direction multistage, has fixed guide 52a, 52c (with reference to Fig. 2 etc.) and movable guiding rail (disjunction rail portion) 52b, 52d of being fixed on the position of regulation by arbitrary supporting construction (not shown).
In addition, guide rail 54 is broken is in the Y-axis direction multistage, has fixed guide 54a, 54c and movable guiding rail (disjunction rail portion) 54b, 54d of being fixed on the position of regulation by arbitrary supporting construction (not shown).
A pair fixed guide 52a, 54a are formed as equal length in the Y-axis direction, in addition, are fixed on position corresponding in the Y-axis direction.And then a pair fixed guide 52a, 54a configure in the mode separating the interval being equivalent to frame unit 11 in the X-axis direction, and are located in the At The Height roughly the same with handle part 50a, 50b of slide mechanism 50.
Similarly, a pair fixed guide 52c, 54c are formed as equal length in the Y-axis direction, in addition, are fixed in position corresponding in the Y-axis direction.And then a pair fixed guide 52c, 54c configure in the mode separating the interval being equivalent to frame unit 11 in the X-axis direction, and are located on the height roughly the same with handle part 50a, 50b of slide mechanism 50.
On the other hand, a pair movable guiding rail 52b, 54b are configured to interval and the height and position that can change X-direction.And then a pair movable guiding rail 52b, 54b are formed as equal length in the Y-axis direction, and are configured at frame unit 11 pairs of chuck table 14 are carried out on the carrying-in/carrying-out region of carrying-in/carrying-out.
Similarly, a pair movable guiding rail 52d, 54d are configured to interval and the height and position that can change X-direction.And then a pair movable guiding rail 52d, 54d are formed as equal length in the Y-axis direction, and be configured in the cleaning area of the turntable 44 being provided with cleaning machined object 13.
Each movable guiding rail 52b, 52d, 54b, 54d link with the elevating mechanism (moving up and down component) 62 and interval set mechanism (interval change component) 64 that are arranged at top respectively.In addition, Fig. 1 illustrate only the elevating mechanism 62 and interval set mechanism 64 that link with movable guiding rail 54b, 54d.
Elevating mechanism 62 is such as cylinder, each movable guiding rail 52b, 52d, 54b, 54d is positioned the removal position place with the below of the level reference position of fixed guide 52a, 52c, 54a, 54c phase or reference position.
When each movable guiding rail 52b, 52d, 54b, 54d are positioned reference position place, there is not difference of height at fixed guide 52a, 52c, 54a, 54c and between movable guiding rail 52b, 52d, 54b, 54d.
As above, by making fixed guide 52a, 52c, 54a, 54c and movable guiding rail 52b, 52d, 54b, 54d continuous, thus can the movement of suitably guiding frame unit 11.
On the other hand, if each movable guiding rail 52b, 52d, 54b, 54d are positioned removal position place, then as described later, frame unit 11 pairs of chuck table 14 or turntable 44 can be carried out dismounting.
Interval set mechanism 64 is such as cylinder, is set, changes the interval of a pair movable guiding rail 52b, 54b being positioned removal position place or the interval (hereinafter referred to as guide rail interval) of a pair movable guiding rail 52d, 54d by elevating mechanism 62.Specifically, by guide rail interval set, change to the diameter being equivalent to frame unit 11 support distances or be greater than frame unit 11 diameter leave distance.
After being set at guide rail interval, changing to support distances, a pair movable guiding rail 52b, 54b or a pair movable guiding rail 52d, 54d supporting framework unit 11 can be passed through.On the other hand, by guide rail interval set, change to leave distance time, frame unit 11 can through a pair movable guiding rail 52b, 54b or between a pair movable guiding rail 52d, 54d.That is, by guide rail interval set, change to leave distance time, the support of frame unit 11 is removed.
Therefore, if the guide rail interval of a pair movable guiding rail 52b, 54b or a pair movable guiding rail 52d, 54d of being located in removal position place is changed to from support distances and leaves distance, then frame unit 11 can be placed in below chuck table 14 or turntable 44 on.
In addition, changing to support distances by the interval of a pair movable guiding rail 52b, 54b by being located in removal position place or the interval of a pair movable guiding rail 52d, 54d from leaving distance, frame unit 11 can be unloaded from chuck table 14 or turntable 44.
Then, the carrying example of the frame unit 11 of above-mentioned processing unit (plant) 2 is described.Fig. 2 to Fig. 6 is the top view of the situation schematically showing carrying frame unit 11, Fig. 7 and Fig. 8 is partial cross section's side view of the situation being schematically illustrated in installation frame unit 11 in chuck table 14.
First, box mounting table 6 is elevated, the frame unit 11a be contained in box 8 is positioned the At The Height identical with handle part 50a, 50b of slide mechanism 50.In addition, guide rail interval is set as support distances, and each movable guiding rail 52b, 52d, 54b, 54d are positioned reference position place.
After this, as shown in (A) of Fig. 2, slide mechanism 50 is moved to box 8 side, held the framework 17a of the frame unit 11a be contained in box 8 by the handle part 50a of box 8 side.
If make slide mechanism 50 move to the direction leaving box 8 in this state, then as shown in (B) of Fig. 2, the frame unit 11a be contained in box 8 is pulled out by along pair of guide rails 52,54.
Here, as shown in (B) of Fig. 2 and (A) of Fig. 7, mobile slide mechanism 50 is until frame unit 11a is located on carrying-in/carrying-out region.After this, remove handle part 50a to the holding of framework 17a, slide mechanism 50 is moved slightly to the direction leaving box 8.Thus, frame unit 11a by a pair movable guiding rail 52b, 54b support.
Then, as shown in (B) of Fig. 7, a pair movable guiding rail 52b, 54b is made to decline and be positioned removal position place by elevating mechanism 62.If chuck table 16 is positioned carrying-in/carrying-out region, and a pair movable guiding rail 52b, 54b are positioned removal position place, then the cutting belt 15a of frame unit 11a touches the holding surface of chuck table 14.
After this, as shown in (A) of Fig. 3 and (A) of Fig. 8, by interval set mechanism 64 interval of a pair movable guiding rail 52b, 54b changed to from support distances and leave distance.Its result, relieve a pair movable guiding rail 52b, 54b to the support of frame unit 11a, frame unit 11a is placed in chuck table 14.
After frame unit 11a is placed in chuck table 14, keep machined object 13a by chuck table 14.In addition, as shown in (B) of Fig. 8, by clamp 16 fixed frame 17a.Thereby, it is possible to frame unit 11a is installed in chuck table 14.
After frame unit 11a is placed in chuck table 14, a pair movable guiding rail 52b, 54b is positioned reference position place, and guide rail interval is reverted to support distances.In addition, box mounting table 6 is elevated, other the frame unit 11b be contained in box 8 is positioned the At The Height identical with handle part 50a, 50b of slide mechanism 50.
Then, as shown in (B) of Fig. 3, slide mechanism 50 is moved to box 8 side, held the framework 17b of the frame unit 11b be contained in box 8 by handle part 50a.In addition, make chuck table 14 move to machining area, carry out machining by the machined object 13a of 2 groups of cutting units, 18 couples of frame unit 11a.
After the machining of machined object 13a completes, chuck table 14 is made to move to carrying-in/carrying-out region.Then, as shown in (A) of Fig. 4, guide rail interval is changed to from support distances and leaves distance, then make a pair movable guiding rail 52b, 54b decline and be positioned removal position place.
Then, remove the maintenance of chuck table 14 couples of machined object 13a and the fixing of clamp 16 couples of framework 17a, the guide rail interval of a pair movable guiding rail 52b, 54b is changed to support distances from leaving distance.After this, make a pair movable guiding rail 52b, 54b increase, and be positioned reference position place.Thus, frame unit 11a by a pair movable guiding rail 52b, 54b support.
Then, slide mechanism 50 is made to move on the direction leaving box 8.Here, as shown in (B) of Fig. 4, slide mechanism 50 is moved to can be held by the position of the framework 17a on the frame unit 11a of a pair movable guiding rail 52b, 54b support by the handle part 50b of the opposition side of handle part 50a.
Then, the framework 17a of frame unit 11a is held by handle part 50b.In this condition, by handle part 50a, 50b of back-to-back configuration, hold 2 framing unit 11a, 11b.
Then, as shown in (A) of Fig. 5, slide mechanism 50 is moved further on the direction leaving box 8.Specifically, mobile slide mechanism 50 is until frame unit 11b is located on carrying-in/carrying-out region.Then, remove handle part 50a to the holding of framework 17b, slide mechanism 50 is slightly moved on the direction leaving box 8.Thus, frame unit 11b by a pair movable guiding rail 52b, 54b support.
After this, as shown in (B) of Fig. 5, slide mechanism 50 is moved further on the direction leaving box 8.Specifically, mobile slide mechanism 50 is until frame unit 11a is located in cleaning area.Then, remove handle part 50b to the holding of framework 17a, slide mechanism 50 is slightly moved on the direction close to box 8.Thus, frame unit 11a by a pair movable guiding rail 52d, 54d support.
Then, a pair movable guiding rail 52d, 54d is made to decline and be positioned removal position place by elevating mechanism 62.Its result, the cutting belt 15a of frame unit 11a contacts the holding surface of turntable 44.
And, as shown in Figure 6, by interval set mechanism 64 interval of a pair movable guiding rail 52d, 54d changed to from support distances and leave distance.Thus, remove a pair movable guiding rail 52d, 54d to the support of frame unit 11a, frame unit 11a is placed on turntable 44.
After frame unit 11a is placed on turntable 44, keep machined object 13a by turntable 44.In addition, by clamp 46 fixed frame 17a.Thereby, it is possible to frame unit 11a is installed in chuck table 14, cleaning machined object 13a.In addition, frame unit 11a from turntable 44 take out of action etc. with from chuck table 14 to take out of action etc. identical.
As above, in the processing unit (plant) 2 of present embodiment, carrying mechanism (carrying component) 48 has the pair of guide rails 52,54 of the movement of guiding frame unit 11 and makes frame unit 11 along the slide mechanism (sliding component) 50 of pair of guide rails 52,54 movement.
In addition, this pair of guide rails 52,54 has a pair movable guiding rail (disjunction rail portion) 52b, 54b and a pair movable guiding rail (disjunction rail portion) 52d, 54d, they move to the removal position of chuck table 14 or turntable (rinsing table) 44 dismounting frame unit 11, and what interval can be changed to that the support distances of supporting framework unit 11 or frame unit can pass leaves distance.
Thus, in the processing unit (plant) 2 of present embodiment, can only with this carrying mechanism 48 suitably carrying frame unit 11.That is, the processing unit (plant) 2 of present embodiment is compared to the existing processing unit (plant) of use more than 2 groups carrying mechanism carrying frame unit 11, is suitable for miniaturization, and can realizes low price.
And then, in the processing unit (plant) 2 of present embodiment, slide mechanism 50 has 2 handle parts 50a, 50b of the framework 17 holding frame unit 11 in back-to-back mode, therefore, it is possible to press 1 framing unit 11 by the side in handle part 50a, 50b, and pull another 1 framing unit 11 by the opposing party of handle part 50a, 50b simultaneously and move it.
That is, 2 framing unit 11 can be made to move along pair of guide rails 52,54, and therefore compared to the processing unit (plant) with more than 2 groups carrying mechanisms, productivity can not reduce simultaneously.
In addition, the invention is not restricted to the description of above-mentioned embodiment, can various change be carried out and implement.Such as, in the processing unit (plant) 2 of above-mentioned embodiment, by changing guide rail interval, thus frame unit 11 is placed on chuck table 14 or turntable 44, or frame unit 11 is unloaded from chuck table 14 or turntable 44, but also can realize the mounting of turntable 44 by other actions and unload.
Such as, rotated around length direction (being Y direction here) by a pair movable guiding rail (disjunction rail portion) 52b, 54b or a pair movable guiding rail (disjunction rail portion) 52d, 54d of making to be positioned removal position place, thus the mounting of turntable 44 can be realized and unload.
In this case, replace interval set mechanism (interval change component) 64, arrange and make movable guiding rail 52b, 52d, 54b, 54d carry out the rotating mechanism rotated.Such as, in the mode liberated the support portion of framework 17, a pair movable guiding rail 52b, 54b or a pair movable guiding rail 52d, 54d are rotated downwards, thus turntable 44 can be placed on chuck table 14 or turntable 44.
In addition, by making a pair movable guiding rail 52b, 54b or a pair movable guiding rail 52d, 54d rotate in opposite direction, thus turntable 44 can be unloaded from chuck table 14 or turntable 44.
In addition, except the entirety of movable guiding rail 52b, 52d, 54b, 54d rotates, the bottom of movable guiding rail (part of supporting framework unit 11) can also be only made to rotate except making.
In addition, in the above-described embodiment, the slide mechanism 50 illustrated, it has 2 handle parts 50a, 50b of the framework 17 holding frame unit 11 in back-to-back mode, but the handle part that slide mechanism possesses also can be 1.In this case, need the mode frame unit can be carried to turntable, the moving range of slide mechanism is designed longer.In addition, pair of guide rails can also be formed as longer.
In addition, the structure, method etc. of above-mentioned embodiment can suitably carry out changing and implementing in the scope not departing from object of the present invention.
Claims (2)
1. a processing unit (plant), it is processed the machined object of the tabular on frame unit, and wherein, this frame unit supports this machined object at the opening of the framework of ring-type by means of adhesive tape,
The feature of this processing unit (plant) is to have:
Box mounting portion, it is placed with box, and multiple frame unit accommodated by this box, and has carrying-in/carrying-out opening at side surface;
Chuck table, it keeps the machined object of frame unit;
Tool member, it is processed the machined object be held on the frame unit of this chuck table;
Carrying-in/carrying-out region, in this carrying-in/carrying-out region, carries out the carrying-in/carrying-out of frame unit to this chuck table, and this this carrying-in/carrying-out region is adjacent with this box mounting portion;
Machining area, in this machining area, processes the machined object be held on the frame unit of this chuck table;
Cleaning area, in this cleaning area, has arranged the rinsing table of the machined object on cleaning framework unit in the position relative with this box mounting portion across this carrying-in/carrying-out region; And
Carrying component, its this box mounting portion in linearly configuration, carrying frame unit between this carrying-in/carrying-out region and this cleaning area,
This carrying component has: pair of guide rails, and they cross this cleaning area by this carrying-in/carrying-out region respectively near this carrying-in/carrying-out opening of this box be placed in this box mounting portion, guide the movement of this frame unit; And
Sliding component, it makes this frame unit move along this guide rail,
This guide rail is broken on the way, and this carrying-in/carrying-out region and this cleaning area form a pair disjunction rail portion respectively,
This disjunction rail portion changes component carry out moving and to this chuck table or this rinsing table dismounting frame unit by moving up and down component and interval, wherein, this move up and down component make this disjunction rail portion other guide rail continuous print reference positions and to the removal position of this chuck table or this rinsing table dismounting frame unit between move, what this interval changed that the interval of a pair this disjunction rail portion being positioned this removal position place changes to that the support distances that supports this frame unit and this frame unit can pass by component leaves distance.
2. processing unit (plant) according to claim 1, is characterized in that,
Described sliding component has 2 handle parts of the described framework holding frame unit in back-to-back mode, by other frame unit of another this handle part tractive, 2 framing unit are side by side moved by this handle part pressing frame unit along described guide rail.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-269126 | 2013-12-26 | ||
| JP2013269126A JP6218600B2 (en) | 2013-12-26 | 2013-12-26 | Processing equipment |
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| Publication Number | Publication Date |
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| CN104742261A true CN104742261A (en) | 2015-07-01 |
| CN104742261B CN104742261B (en) | 2018-09-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410766785.3A Active CN104742261B (en) | 2013-12-26 | 2014-12-11 | Processing unit (plant) |
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| Country | Link |
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| JP (1) | JP6218600B2 (en) |
| CN (1) | CN104742261B (en) |
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| CN106141908A (en) * | 2016-08-25 | 2016-11-23 | 威海市银河光电设备有限公司 | Vehicle glass plate cutting edging positioner |
| CN107234477A (en) * | 2016-03-29 | 2017-10-10 | 株式会社迪思科 | Moving body feed mechanism and processing unit (plant) |
| CN108724010A (en) * | 2017-04-24 | 2018-11-02 | 株式会社迪思科 | water jet machining device |
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| JP6665041B2 (en) * | 2016-06-20 | 2020-03-13 | 株式会社ディスコ | Cutting equipment |
| JP6855130B2 (en) * | 2017-06-16 | 2021-04-07 | 株式会社ディスコ | Processing equipment |
| JP7023740B2 (en) * | 2018-02-22 | 2022-02-22 | 東レエンジニアリング株式会社 | Mounting device |
| JP7126906B2 (en) * | 2018-09-06 | 2022-08-29 | キヤノンマシナリー株式会社 | Transfer device, transfer method, die bonder, and bonding method |
| JP7162551B2 (en) * | 2019-02-18 | 2022-10-28 | 株式会社ディスコ | processing equipment |
| JP7440288B2 (en) | 2020-02-07 | 2024-02-28 | 株式会社ディスコ | processing equipment |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2015126076A (en) | 2015-07-06 |
| JP6218600B2 (en) | 2017-10-25 |
| CN104742261B (en) | 2018-09-11 |
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