JPS6459930A - Ultraviolet-ray irradiation device for wafer mounting frame - Google Patents
Ultraviolet-ray irradiation device for wafer mounting frameInfo
- Publication number
- JPS6459930A JPS6459930A JP21832087A JP21832087A JPS6459930A JP S6459930 A JPS6459930 A JP S6459930A JP 21832087 A JP21832087 A JP 21832087A JP 21832087 A JP21832087 A JP 21832087A JP S6459930 A JPS6459930 A JP S6459930A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- ultraviolet
- ray irradiation
- mounting frame
- nozzles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
PURPOSE:To improve the workability and effectiveness of ultraviolet-ray irradiation, to reduce the usage of inert gas and to contrive an economization by a method wherein a mounting frame is attracted by attracting nozzles and is moved to an ultraviolet-ray irradiation place by a traverse mechanism and after ultraviolet-rays are irradiated on an adhesive tape by the vertical motion of the attracting nozzles, which are actuated by an elevating mechanism, the mounting frame is taken out. CONSTITUTION:Attracting holes 7a are abutted on a mounting frame MF by the descent of attracting nozzles 7, the frame MF is attracted to the nozzles 7 by vacuum suction and the frame MF is transferred to an ultraviolet-ray irradiation place P2. Then, the frame MF is made to descent and is placed on a frame supporting plate 14 in an ultraviolet-ray irradiation machine 10. Inert gas G is jetted in the internal space through inert gas jet nozzles 16 and ultraviolet-rays are irradiated on an adhesive tape B to reduce the adhesive force of exposed tape parts B1. Then, the frame MF is made to ascend to a traverse height and a first air cylinder 1 is stretched to transfer the frame MF to a mounting frame separating place P3. Like the above way, the charge and the extraction of the frame MF are automatized. Thereby, an operating efficiency is improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21832087A JPS6459930A (en) | 1987-08-31 | 1987-08-31 | Ultraviolet-ray irradiation device for wafer mounting frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21832087A JPS6459930A (en) | 1987-08-31 | 1987-08-31 | Ultraviolet-ray irradiation device for wafer mounting frame |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6459930A true JPS6459930A (en) | 1989-03-07 |
Family
ID=16718002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21832087A Pending JPS6459930A (en) | 1987-08-31 | 1987-08-31 | Ultraviolet-ray irradiation device for wafer mounting frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6459930A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008147468A (en) * | 2006-12-12 | 2008-06-26 | Lintec Corp | Apparatus and method for energy ray irradiation |
JP2015126076A (en) * | 2013-12-26 | 2015-07-06 | 株式会社ディスコ | Processing device |
-
1987
- 1987-08-31 JP JP21832087A patent/JPS6459930A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008147468A (en) * | 2006-12-12 | 2008-06-26 | Lintec Corp | Apparatus and method for energy ray irradiation |
JP2015126076A (en) * | 2013-12-26 | 2015-07-06 | 株式会社ディスコ | Processing device |
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