CN1047043C - 表面安装型电子元件 - Google Patents

表面安装型电子元件 Download PDF

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Publication number
CN1047043C
CN1047043C CN94119054A CN94119054A CN1047043C CN 1047043 C CN1047043 C CN 1047043C CN 94119054 A CN94119054 A CN 94119054A CN 94119054 A CN94119054 A CN 94119054A CN 1047043 C CN1047043 C CN 1047043C
Authority
CN
China
Prior art keywords
dummy metal
shell
welding
housing
metal parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN94119054A
Other languages
English (en)
Chinese (zh)
Other versions
CN1111043A (zh
Inventor
尾山祐诚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN1111043A publication Critical patent/CN1111043A/zh
Application granted granted Critical
Publication of CN1047043C publication Critical patent/CN1047043C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1028—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being held between spring terminals
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/58—Multiple crystal filters
    • H03H9/60—Electric coupling means therefor
    • H03H9/605—Electric coupling means therefor consisting of a ladder configuration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CN94119054A 1993-12-15 1994-12-15 表面安装型电子元件 Expired - Fee Related CN1047043C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP314613/93 1993-12-15
JP5314613A JPH07170144A (ja) 1993-12-15 1993-12-15 表面実装型電子部品

Publications (2)

Publication Number Publication Date
CN1111043A CN1111043A (zh) 1995-11-01
CN1047043C true CN1047043C (zh) 1999-12-01

Family

ID=18055413

Family Applications (1)

Application Number Title Priority Date Filing Date
CN94119054A Expired - Fee Related CN1047043C (zh) 1993-12-15 1994-12-15 表面安装型电子元件

Country Status (5)

Country Link
US (1) US5821672A (enExample)
JP (1) JPH07170144A (enExample)
KR (1) KR0146389B1 (enExample)
CN (1) CN1047043C (enExample)
TW (1) TW256986B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5872493A (en) * 1997-03-13 1999-02-16 Nokia Mobile Phones, Ltd. Bulk acoustic wave (BAW) filter having a top portion that includes a protective acoustic mirror
US6233133B1 (en) * 1999-05-05 2001-05-15 Shui-Te Weng Capacitor
DE102016003866A1 (de) * 2015-04-10 2016-10-13 Marquardt Gmbh Baugruppe

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4223177A (en) * 1977-08-11 1980-09-16 Murata Manufacturing Co., Ltd. Structure and method for sealing electronic parts
US5265316A (en) * 1987-02-27 1993-11-30 Seiko Epson Corporation Method of manufacturing a pressure seal type piezoelectric oscillator

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2416876A (en) * 1945-01-04 1947-03-04 Walter E Kuenstler Casing for piezoelectric crystals
US2577576A (en) * 1950-11-30 1951-12-04 Mannes N Glickman Hermetic crystal holder
US3697789A (en) * 1970-06-23 1972-10-10 Citizen Watch Co Ltd Mechanical oscillator
US5274529A (en) * 1990-03-05 1993-12-28 Murata Manufacturing Co., Ltd. Electronic device with molded case

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4223177A (en) * 1977-08-11 1980-09-16 Murata Manufacturing Co., Ltd. Structure and method for sealing electronic parts
US5265316A (en) * 1987-02-27 1993-11-30 Seiko Epson Corporation Method of manufacturing a pressure seal type piezoelectric oscillator

Also Published As

Publication number Publication date
CN1111043A (zh) 1995-11-01
US5821672A (en) 1998-10-13
JPH07170144A (ja) 1995-07-04
TW256986B (enExample) 1995-09-11
KR950023248A (ko) 1995-07-28
KR0146389B1 (ko) 1998-10-01

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee