CN104617116A - 用于图像传感器的大-小像素方案及其使用 - Google Patents
用于图像传感器的大-小像素方案及其使用 Download PDFInfo
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- CN104617116A CN104617116A CN201410074543.8A CN201410074543A CN104617116A CN 104617116 A CN104617116 A CN 104617116A CN 201410074543 A CN201410074543 A CN 201410074543A CN 104617116 A CN104617116 A CN 104617116A
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- 238000009792 diffusion process Methods 0.000 claims abstract description 44
- 238000007667 floating Methods 0.000 claims abstract description 42
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 238000003384 imaging method Methods 0.000 claims description 18
- 230000008878 coupling Effects 0.000 claims description 8
- 238000010168 coupling process Methods 0.000 claims description 8
- 238000005859 coupling reaction Methods 0.000 claims description 8
- 238000001914 filtration Methods 0.000 claims description 4
- 230000000644 propagated effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 101100248200 Arabidopsis thaliana RGGB gene Proteins 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 208000024754 bloodshot eye Diseases 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 201000005111 ocular hyperemia Diseases 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
- H01L27/14614—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor having a special gate structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14641—Electronic components shared by two or more pixel-elements, e.g. one amplifier shared by two pixel elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
Claims (21)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/070,286 US9305949B2 (en) | 2013-11-01 | 2013-11-01 | Big-small pixel scheme for image sensors |
US14/070,286 | 2013-11-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104617116A true CN104617116A (zh) | 2015-05-13 |
CN104617116B CN104617116B (zh) | 2017-10-03 |
Family
ID=53006392
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410074543.8A Active CN104617116B (zh) | 2013-11-01 | 2014-03-03 | 用于图像传感器的大‑小像素方案及其使用 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9305949B2 (zh) |
CN (1) | CN104617116B (zh) |
HK (1) | HK1209901A1 (zh) |
TW (1) | TWI502737B (zh) |
Cited By (14)
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CN105681690A (zh) * | 2016-03-10 | 2016-06-15 | 长春长光辰芯光电技术有限公司 | 双转移栅高动态范围图像传感器像素的全局快门控制方法 |
CN106972035A (zh) * | 2016-01-14 | 2017-07-21 | 豪威科技股份有限公司 | 图像传感器及图像传感器制作方法 |
CN107426472A (zh) * | 2017-06-01 | 2017-12-01 | 深圳市矽旺半导体有限公司 | 宽动态范围图像传感器系统及其实现方法 |
CN109076179A (zh) * | 2016-04-06 | 2018-12-21 | 科磊股份有限公司 | 双列并行ccd传感器及使用传感器的检验系统 |
CN109216385A (zh) * | 2017-07-05 | 2019-01-15 | 豪威科技股份有限公司 | 具有增强近红外量子效率的cmos图像传感器 |
CN109786403A (zh) * | 2017-11-13 | 2019-05-21 | 爱思开海力士有限公司 | 图像传感器 |
CN110809823A (zh) * | 2019-09-30 | 2020-02-18 | 深圳市汇顶科技股份有限公司 | 图像传感器的半导体结构、芯片及电子装置 |
CN110993630A (zh) * | 2018-10-02 | 2020-04-10 | 豪威科技股份有限公司 | 多厚度栅极电介质 |
CN112188123A (zh) * | 2019-07-02 | 2021-01-05 | 爱思开海力士有限公司 | 图像感测装置 |
CN112382641A (zh) * | 2020-11-11 | 2021-02-19 | 上海韦尔半导体股份有限公司 | 高动态范围图像传感器的环形像素阵列 |
CN112788258A (zh) * | 2019-11-05 | 2021-05-11 | 豪威科技股份有限公司 | 用于高动态范围图像传感器的多单元像素阵列 |
CN113540137A (zh) * | 2020-04-22 | 2021-10-22 | 豪威科技股份有限公司 | 具有经移位彩色滤光片阵列图案及位线对的图像传感器 |
CN114078895A (zh) * | 2020-08-20 | 2022-02-22 | 豪威科技股份有限公司 | 具有穿硅鳍片转移门的图像传感器 |
CN115460365A (zh) * | 2021-06-08 | 2022-12-09 | 豪威科技股份有限公司 | 使用用于相位检测自动聚焦及图像感测光电二极管的三次读出方法的图像传感器 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US9324759B2 (en) | 2013-12-19 | 2016-04-26 | Omnivision Technologies, Inc. | Image sensor pixel for high dynamic range image sensor |
JP6334203B2 (ja) * | 2014-02-28 | 2018-05-30 | ソニー株式会社 | 固体撮像装置、および電子機器 |
JP6617428B2 (ja) * | 2015-03-30 | 2019-12-11 | 株式会社ニコン | 電子機器 |
KR102541701B1 (ko) * | 2016-01-15 | 2023-06-13 | 삼성전자주식회사 | 씨모스 이미지 센서 |
US10778925B2 (en) | 2016-04-06 | 2020-09-15 | Kla-Tencor Corporation | Multiple column per channel CCD sensor architecture for inspection and metrology |
US9848148B1 (en) * | 2016-06-17 | 2017-12-19 | Semiconductor Components Industries, Llc | Methods and apparatus for a multiple storage pixel imaging system |
JP2018152696A (ja) * | 2017-03-13 | 2018-09-27 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置、その駆動方法および電子機器 |
US10181490B2 (en) * | 2017-04-03 | 2019-01-15 | Omnivision Technologies, Inc. | Cross talk reduction for high dynamic range image sensors |
US11114489B2 (en) | 2018-06-18 | 2021-09-07 | Kla-Tencor Corporation | Back-illuminated sensor and a method of manufacturing a sensor |
US11114491B2 (en) | 2018-12-12 | 2021-09-07 | Kla Corporation | Back-illuminated sensor and a method of manufacturing a sensor |
RU2709461C1 (ru) * | 2019-02-04 | 2019-12-18 | Вячеслав Михайлович Смелков | Способ формирования видеосигнала на кристалле сенсора, изготовленном по технологии КМОП |
KR20230098578A (ko) * | 2020-11-12 | 2023-07-04 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 촬상 소자 및 촬상 장치 |
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US20070040922A1 (en) * | 2005-08-22 | 2007-02-22 | Micron Technology, Inc. | HDR/AB on multi-way shared pixels |
US20070257280A1 (en) * | 2006-05-04 | 2007-11-08 | Magnachip Semiconductor Ltd. | Complementary metal oxide semiconductor (CMOS) image sensor with extended pixel dynamic range incorporating transfer gate with potential well |
US7525077B2 (en) * | 2005-02-07 | 2009-04-28 | Samsung Electronics Co., Ltd. | CMOS active pixel sensor and active pixel sensor array using fingered type source follower transistor |
CN101800861A (zh) * | 2009-02-09 | 2010-08-11 | 索尼公司 | 固态图像摄取器件和相机系统 |
CN103227897A (zh) * | 2012-01-31 | 2013-07-31 | 索尼公司 | 固态图像传感器和相机系统 |
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KR100761829B1 (ko) * | 2005-12-15 | 2007-09-28 | 삼성전자주식회사 | 반도체 소자, 시모스 이미지 센서, 반도체 소자의 제조방법및 시모스 이미지 센서의 제조방법 |
US7863647B1 (en) | 2007-03-19 | 2011-01-04 | Northrop Grumman Systems Corporation | SiC avalanche photodiode with improved edge termination |
KR100835894B1 (ko) | 2007-06-18 | 2008-06-09 | (주)실리콘화일 | 다이내믹 레인지가 넓고, 색재현성과 해상능력이 우수한픽셀어레이 및 이미지센서 |
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2013
- 2013-11-01 US US14/070,286 patent/US9305949B2/en active Active
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2014
- 2014-03-03 CN CN201410074543.8A patent/CN104617116B/zh active Active
- 2014-03-21 TW TW103110752A patent/TWI502737B/zh active
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2015
- 2015-10-22 HK HK15110390.8A patent/HK1209901A1/zh unknown
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Cited By (26)
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---|---|---|---|---|
CN106972035B (zh) * | 2016-01-14 | 2020-08-18 | 豪威科技股份有限公司 | 图像传感器及图像传感器制作方法 |
CN106972035A (zh) * | 2016-01-14 | 2017-07-21 | 豪威科技股份有限公司 | 图像传感器及图像传感器制作方法 |
CN105681690B (zh) * | 2016-03-10 | 2018-05-25 | 长春长光辰芯光电技术有限公司 | 双转移栅高动态范围图像传感器像素的全局快门控制方法 |
CN105681690A (zh) * | 2016-03-10 | 2016-06-15 | 长春长光辰芯光电技术有限公司 | 双转移栅高动态范围图像传感器像素的全局快门控制方法 |
CN109076179A (zh) * | 2016-04-06 | 2018-12-21 | 科磊股份有限公司 | 双列并行ccd传感器及使用传感器的检验系统 |
CN107426472A (zh) * | 2017-06-01 | 2017-12-01 | 深圳市矽旺半导体有限公司 | 宽动态范围图像传感器系统及其实现方法 |
CN109216385A (zh) * | 2017-07-05 | 2019-01-15 | 豪威科技股份有限公司 | 具有增强近红外量子效率的cmos图像传感器 |
CN109786403B (zh) * | 2017-11-13 | 2023-09-29 | 爱思开海力士有限公司 | 图像传感器 |
CN109786403A (zh) * | 2017-11-13 | 2019-05-21 | 爱思开海力士有限公司 | 图像传感器 |
CN110993630A (zh) * | 2018-10-02 | 2020-04-10 | 豪威科技股份有限公司 | 多厚度栅极电介质 |
CN110993630B (zh) * | 2018-10-02 | 2023-09-05 | 豪威科技股份有限公司 | 多厚度栅极电介质 |
CN112188123B (zh) * | 2019-07-02 | 2023-06-27 | 爱思开海力士有限公司 | 图像感测装置 |
CN112188123A (zh) * | 2019-07-02 | 2021-01-05 | 爱思开海力士有限公司 | 图像感测装置 |
US11784200B2 (en) | 2019-07-02 | 2023-10-10 | SK Hynix Inc. | Image sensing device having multiple transfer gate structure |
WO2020011285A3 (zh) * | 2019-09-30 | 2020-08-13 | 深圳市汇顶科技股份有限公司 | 图像传感器的半导体结构、芯片及电子装置 |
CN110809823A (zh) * | 2019-09-30 | 2020-02-18 | 深圳市汇顶科技股份有限公司 | 图像传感器的半导体结构、芯片及电子装置 |
CN110809823B (zh) * | 2019-09-30 | 2021-10-29 | 深圳市汇顶科技股份有限公司 | 图像传感器的半导体结构、芯片及电子装置 |
US11233086B2 (en) | 2019-09-30 | 2022-01-25 | Shenzhen GOODIX Technology Co., Ltd. | Semiconductor structure of image sensor, chip and electronic apparatus |
CN112788258A (zh) * | 2019-11-05 | 2021-05-11 | 豪威科技股份有限公司 | 用于高动态范围图像传感器的多单元像素阵列 |
CN112788258B (zh) * | 2019-11-05 | 2024-01-09 | 豪威科技股份有限公司 | 用于高动态范围图像传感器的多单元像素阵列 |
US11716546B2 (en) | 2020-04-22 | 2023-08-01 | Omnivision Technologies, Inc. | Image sensor with shifted color filter array pattern and bit line pairs |
CN113540137A (zh) * | 2020-04-22 | 2021-10-22 | 豪威科技股份有限公司 | 具有经移位彩色滤光片阵列图案及位线对的图像传感器 |
CN114078895B (zh) * | 2020-08-20 | 2024-04-16 | 豪威科技股份有限公司 | 具有穿硅鳍片转移门的图像传感器 |
CN114078895A (zh) * | 2020-08-20 | 2022-02-22 | 豪威科技股份有限公司 | 具有穿硅鳍片转移门的图像传感器 |
CN112382641A (zh) * | 2020-11-11 | 2021-02-19 | 上海韦尔半导体股份有限公司 | 高动态范围图像传感器的环形像素阵列 |
CN115460365A (zh) * | 2021-06-08 | 2022-12-09 | 豪威科技股份有限公司 | 使用用于相位检测自动聚焦及图像感测光电二极管的三次读出方法的图像传感器 |
Also Published As
Publication number | Publication date |
---|---|
TWI502737B (zh) | 2015-10-01 |
CN104617116B (zh) | 2017-10-03 |
US9305949B2 (en) | 2016-04-05 |
TW201519421A (zh) | 2015-05-16 |
HK1209901A1 (zh) | 2016-04-08 |
US20150123172A1 (en) | 2015-05-07 |
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