CN104600433A - Metamaterial panel and manufacturing method thereof as well as antenna housing - Google Patents
Metamaterial panel and manufacturing method thereof as well as antenna housing Download PDFInfo
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- CN104600433A CN104600433A CN201310530124.6A CN201310530124A CN104600433A CN 104600433 A CN104600433 A CN 104600433A CN 201310530124 A CN201310530124 A CN 201310530124A CN 104600433 A CN104600433 A CN 104600433A
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Abstract
The invention discloses a metamaterial panel and a manufacturing method thereof as well as an antenna housing. The metamaterial panel comprises at least one functional layer which comprises an electrically conductive geometric structure and a dielectric layer for supporting the electrically conductive geometric structure; besides, holes are formed in the functional layer. According to the metamaterial panel, as the functional layer of the metamaterial panel is perforated, in the process of manufacturing products by use of the perforated metamaterial panel, the functional layer and the dielectric layer of the metamaterial panel are combined to form a three-dimensional network structure by use of the holes; as a result, the interlayer binding force and the shear force of the metamaterial panel are improved, and further, the mechanical strength of metamaterial products is improved to a large extent.
Description
Technical field
The present invention relates to Meta Materials field, and especially, relate to a kind of metamaterial panel and manufacture method thereof and radome.
Background technology
In traditional Meta Materials technology, metamaterial structure surface is metal covering, bonding with prepreg, solidification after, the bond strength of metal covering and prepreg directly determines the mechanical strength of final products (as radome), in actual application, also metal-prepreg interface often, the damage interface of product, therefore, for improving the mechanical strength of product, the adhesive strength at metal in product-prepreg interface first to be improved.
Such as, in the prior art, radome adopts the mode of successively layer paving in machine-shaping process.
Fig. 1 is the structure chart of metamaterial panel in correlation technique.As shown in Figure 1, metamaterial panel comprises functional layer 11 and composite layer 14a and 14b, wherein, functional layer 11 comprises multiple conduction geometry (such as, can be metal micro structure) 12, and for supporting the dielectric layer 13 of this conduction geometry 12, composite layer 14a and 14b is formed at the both sides of functional layer 11.In order to be clearly shown that composite layer, Fig. 1 shows the situation that composite layer 14a with 14b is separated with functional layer 13.
Under normal circumstances, the lifting of the bond strength of metal micro structure and prepreg, mainly reached by the alligatoring of metal covering, although this method can improve the adhesion of metal micro structure and prepreg to a certain extent, but not obvious to the lifting of adhesion, and effectively cannot improve the shearing force of interlayer.
For the inter-layer bonding force difference problem of metamaterial structure panel in correlation technique, at present effective solution is not yet proposed.
Summary of the invention
For the inter-layer bonding force difference problem of metamaterial structure panel in correlation technique, the present invention proposes manufacture method and the radome of a kind of metamaterial panel and metamaterial panel, the inter-layer bonding force of metamaterial structure can be improved, and then improve the mechanical strength of the product that application Meta Materials is made.
Technical scheme of the present invention is achieved in that
According to an aspect of the present invention, provide a kind of metamaterial panel, this metamaterial panel comprises at least one functional layer, and functional layer comprises conduction geometry and the dielectric layer for supporting conduction geometry, wherein, functional layer has hole.
Further, the position in hole comprise following one of at least:
The cabling of the dielectric layer outside conduction geometry, conduction geometry.
Further, when the position in hole is positioned at the cabling of conduction geometry, the edge in hole is conducted electricity the cabling of geometry and is surrounded, or the part edge in hole is conducted electricity the cabling of geometry and surrounds.
In addition, at least side of at least one functional layer is coated with composite layer, and the part of composite layer is positioned at hole.
In addition, composite layer has sandwich construction, and at least one deck inside in sandwich construction has empty structure.
Further, the hole in functional layer is through hole.
In addition, the both sides of at least one functional layer are coated with composite layer, and the composite layer being positioned at these functional layer both sides is contacted with each other by through hole and fixes.
Further, each conduction geometry has at least one hole.
According to a further aspect in the invention, provide a kind of radome, this radome is made up of above-mentioned metamaterial panel.
In accordance with a further aspect of the present invention, provide a kind of manufacture method of metamaterial panel, this manufacture method comprises:
There is provided pending functional layer, wherein, pending functional layer comprises dielectric layer and is covered in the conductive layer above dielectric layer;
Treat processing capacity layer and carry out patterning removal technique and drilling technology, obtain the functional layer with hole, the conduction geometry that functional layer comprises dielectric layer and supported by dielectric layer.
In addition, drilling technology is carrying out performing before patterning removes technique, or drilling technology performs after patterning.
Further, the position that drilling technology carries out punching comprise following one of at least:
The cabling of the dielectric layer outside conduction geometry, conduction geometry.
In addition, when the position in hole is positioned at the cabling of conduction geometry, the edge in hole is conducted electricity the cabling of geometry and is surrounded, or the part edge in hole is conducted electricity the cabling of geometry and surrounds.
In addition, form composite layer at least side of functional layer, composite layer covering function layer, and the part of composite material is positioned at hole.
In addition, composite layer has sandwich construction, and at least one deck inside in sandwich construction has empty structure.
Further, the hole in this functional layer is through hole.
In addition, when the both sides of functional layer all form composite layer, the composite layer being positioned at functional layer both sides is contacted with each other by through hole and fixes.
Wherein, drilling technology comprise following one of at least:
Machine drilling, laser drill, plasma etching.
Further, drilling technology forms at least one hole on each conduction geometry.
Alternatively, the method may further include: carry out alligatoring to conduction geometry.
In addition, this manufacture method comprises further: multiple functional layer be connected in the plane.
Wherein, multiple functional layer is connected in the plane comprises: the conduction geometry of multiple functional layer is connected in the plane.
Further, the mode that the conduction geometry of multiple functional layer carries out being electrically connected in the plane is comprised following one of at least:
Undertaken connecting, being undertaken connecting, being undertaken connecting, being connected by conducting polymer composite by silver slurry by copper slurry by tin.
The present invention by punching in the functional layer of metamaterial panel, make in the product process of this metamaterial panel of application, the portion of material being arranged in this functional layer at least other structures of side can be filled to hole, thus improve the inter-layer bonding force of metamaterial panel, and then improve the quality of the product applying this metamaterial panel.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structure chart of metamaterial panel in correlation technique;
Fig. 2 is the structural representation of functional layer in the metamaterial panel according to the embodiment of the present invention;
Fig. 3 forms composite layer structural representation in the both sides of functional layer in metamaterial panel according to an embodiment of the invention;
Fig. 4 forms composite layer structural representation in the both sides of functional layer in metamaterial panel according to another embodiment of the present invention;
Fig. 5 is the structural representation with the metamaterial panel of multiple functional layer according to the embodiment of the present invention;
Fig. 6 is the manufacture method flow chart of the metamaterial panel according to the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain, all belongs to the scope of protection of the invention.
According to embodiments of the invention, provide a kind of metamaterial panel.
As shown in Figure 2, comprising at least one functional layer according to the metamaterial panel of the embodiment of the present invention, in order to be clearly shown that improvement of the present invention, in Fig. 2, illustrate only a functional layer 11.Wherein, functional layer 11 comprises conduction geometry 12 and conducts electricity geometry (such as supporting, conduction geometry can be the metal micro structure that cabling has certain pattern or certain space stereochemical structure, the metal making conduction geometry can comprise copper, silver, iron etc. or its alloy) dielectric layer 13 of 12, functional layer 11 has hole 15.
In the embodiment shown in fig. 2, hole 15 is positioned on the cabling of conduction geometry 12, and that is, the edge in hole 15 is conducted electricity the cabling of geometry 12 and surrounds.In another embodiment, the position in hole 15 can on the dielectric layer 13 outside conduction geometry, and that is, hole through conduction geometry 13, and can not extend only through dielectric layer 13, hole 15 as shown in Figure 4.In other embodiments, the track edge place at conduction geometry can be beaten in hole, and that is, the part edge in hole is conducted electricity the cabling of geometry and surrounds.In a metamaterial panel, the position in hole can comprise above three one of at least.
According to embodiments of the invention, the at least side of functional layer 11 can be coated with prepreg (such as, can be composite layer), like this, after formation composite layer, in the portion of material meeting access aperture of composite layer, make to form three-dimensional net structure between composite layer and functional layer, thus effectively improve the inter-layer bonding force (comprising shearing strength between layers) of metamaterial panel.
Fig. 3 and Fig. 4 shows and form composite layer 14a above functional layer 11, and forms the embodiment of composite layer 14b in the below of functional layer 11.In order to be clearly shown that its structure, Fig. 3 with Fig. 4 shows composite layer and functional layer in the mode be separated.
If with reference to the metamaterial panel shown in Fig. 3, the aperture in hole is less than the live width of conduction geometry cabling, and when not affecting conduction geometry electrical properties, the aperture in hole can be greater than the live width of cabling, like this, hole part edge by be positioned at conduction geometry cabling outside.If the metamaterial panel shown in Fig. 4, the aperture in hole can be less than the distance between conduction geometry cabling, also can be equal to, or greater than this distance.
In addition, the hole in a metamaterial panel, can have multiple different aperture, also can have unified aperture.
No matter whether the position in hole 15 is on conduction geometry 12, composite material in access aperture, thus can both improve inter-layer bonding force.
Further, according to one embodiment of present invention, the hole in functional layer can be all through hole, and in another embodiment, the hole in functional layer can be partly through hole, and another part is blind hole.
In the embodiment forming through hole, if all have composite layer in the both sides of functional layer 11, so the material of the composite layer of both sides to enter in through hole and to be fixed to one another, thus improves inter-layer bonding force further.
In fact, if metamaterial panel has multiple functional layer, so in the structure shown in Fig. 3 and Fig. 4, other functional layer can be formed further above composite layer 14a, and/or form other functional layer in the below of composite layer 14b further.
In addition, composite layer can have sandwich construction, and at least one deck inside in sandwich construction has empty structure, and the shape of empty structure comprises: quadrangle, triangle, hexagon, also can be other shapes.Such as, manufacture in the process of radome in this metamaterial panel of application, the some layers in multilayer materials can be honeycombs.
Fig. 5 shows the structure had with the metamaterial panel of two functional layers of overlapped way setting, in Fig. 5, in order to clear, wherein each composition is shown, eliminates the hole that functional layer is formed, in fact, the functional layer in Fig. 5 can have the hole shown in Fig. 3 or Fig. 4.Wherein, the functional layer 11-1 being positioned at below has multiple conduction geometry 12-1 and dielectric layer 13-1, the functional layer 11-2 being positioned at below has multiple conduction geometry 12-2 and dielectric layer 13-2, the below of functional layer 11-1 is formed with composite layer 14b-1, and the top of functional layer 11-2 is formed with composite layer 14a-2.In addition, between functional layer 11-1 and functional layer 11-2, be formed with composite layer, the composite material 14b-2 that this composite layer comprises composite material 14a-1, is positioned at the honeycomb layer 16 above composite material 14a-1 and is positioned at above honeycomb layer 16.
The layer with empty structure shown in Fig. 5 is honeycomb layer 16, and the empty structure of honeycomb layer 16 is penetrating up and down in vertical direction.In other embodiments, empty structure also can be inner cavity, or up or below be in communication with the outside.
By arranging the layer with empty structure, while mechanical strength is provided, the weight of metamaterial panel can be reduced.
In addition, in the solution of the present invention, the density in hole can be selected flexibly, and such as, the functional layer according to Fig. 2-Fig. 4, each conduction geometry can have a hole.In another embodiment, the density in hole can be lower.In other embodiments, a conduction geometry can there is multiple hole.
May be used for multiple field according to the metamaterial panel of the embodiment of the present invention, such as, may be used in radome, also may be used in other various communication equipments.
According to embodiments of the invention, additionally provide a kind of manufacture method of metamaterial panel.
As shown in Figure 6, this manufacture method comprises:
Step S601, provides pending functional layer, and wherein, pending functional layer comprises dielectric layer and is covered in the conductive layer above dielectric layer;
Step S603, treats processing capacity layer and carries out patterning removal technique and drilling technology, obtain the functional layer with hole, the conduction geometry that functional layer comprises dielectric layer, supported by dielectric layer.
Wherein, conductive layer preferably adopts metal to realize, and also can adopt other electric conducting materials.
Wherein, drilling technology can carry out performing before patterning removes technique, or drilling technology also can perform after patterning.In addition, after conduction geometry is formed, roughening process can be carried out to conduction geometry, roughening process can comprise following one of at least: brown technique, microetch technique, blackening craft, mechanical grinding technique.
Wherein, the position that drilling technology carries out punching comprise following one of at least: the cabling of the dielectric layer outside conduction geometry, conduction geometry.
Further, when the position in hole is positioned at the cabling of conduction geometry, the edge in hole is conducted electricity the cabling of geometry and is surrounded, or the part edge in hole is conducted electricity the cabling of geometry and surrounds.
In addition, form composite layer at least side of functional layer, composite layer covering function layer, and the part of composite material is positioned at hole.
Further, composite layer has sandwich construction, and at least one deck inside in sandwich construction has empty structure.
Wherein, the hole in functional layer can be through hole, may not be through hole, or partial hole is through hole.
Further, when the both sides of functional layer all form composite layer, the composite layer being positioned at functional layer both sides is contacted with each other by through hole and fixes.
Wherein, drilling technology comprise following one of at least: machine drilling, laser drill, plasma etching.
Further, drilling technology forms at least one hole on each conduction geometry.
In addition, this manufacture method comprises further: multiple functional layer be connected in the plane.
Further, when multiple functional layer being connected in the plane, the conduction geometry of multiple functional layer can be connected in the plane, such as, when two functional layers are connected, the conduction geometry of Shi Liangge functional layer edge is connected to each other.
Wherein, the mode that the conduction geometry of multiple functional layer carries out being electrically connected in the plane is comprised following one of at least:
Undertaken connecting, being undertaken connecting, being undertaken connecting, being connected by conducting polymer composite by silver slurry by copper slurry by tin.
Below with reference to instantiation, describe the technical process that the present invention manufactures metamaterial panel in detail.
Example 1:
In this example, technical process is as follows:
Step 1, micro-structural is processed: according to design data, carry out etching and processing to the metal micro structure expanding into plane, wherein, the cell size of micro-structural is 6mm, and characteristic dimension of line width is 2mm, and bore diameter is 0.5mm;
Step 2, radome formed product: according to the folded structure of design, the microstructured layers of honeycomb and step (1) gained is successively laid on mould, wherein, as required, the microstructured layers tin of separation welds, after layer has spread, carry out vacuum bag or solidification of hot-press tank shaping, curing and demolding, to repair a die;
Step 3, test: the interlaminar shear strength testing sample with reference to GB GB3357-82 is 120MPa, and radome Insertion Loss is less than 1dB within the scope of 10 ~ 15GHz.
Example 2:
In this example, technical process is as follows:
Step 1, micro-structural is processed: according to design data, carry out etching and processing to the metal micro structure expanding into plane, wherein, the cell size of micro-structural is 7mm, and characteristic dimension of line width is 0.6mm, bore diameter is 0.01mm, and brown process is carried out on metal micro structure surface;
Step 2, radome formed product: according to the folded structure of design, the microstructured layers of dielectric layer and step (1) gained is successively laid on mould, wherein, as required, the microstructured layers of separation connects with copper slurry, molded curing; After the demoulding as required, repeat abovementioned steps, continue layer paving and be connected with slurry, until complete required laminated construction, after layer has spread, carry out vacuum bag or solidification of hot-press tank shaping, curing and demolding, to repair a die;
Step 3, test: the interlaminar shear strength testing sample with reference to GB GB3357-82 is 100MPa, and radome Insertion Loss is less than 0.8dB within the scope of 10 ~ 15GHz.
Example 3:
In this example, technical process is as follows:
Step 1, micro-structural is processed: according to design data, carry out etching and processing to the metal micro structure expanding into plane, wherein, the cell size of micro-structural is 8mm, and characteristic dimension of line width is 6mm, and bore diameter is 5mm, and microetch process is carried out on metal micro structure surface;
Step 2, radome formed product: according to the folded structure of design, the microstructured layers of dielectric layer and step (1) gained is successively laid on mould, wherein, as required, the microstructured layers of separation connects with silver slurry, and with laser sintered, after layer has spread, carry out vacuum bag or solidification of hot-press tank shaping, curing and demolding, to repair a die;
Step 3, test: the interlaminar shear strength testing sample with reference to GB GB3357-82 is 200MPa, and radome Insertion Loss is less than 0.5dB within the scope of 10 ~ 15GHz.
By above specific embodiment, be not difficult to find out, by technical scheme according to the present invention, the functional layer of metamaterial panel is holed, make metal micro structure-composite material interface form the network configuration of 3D, and then promote inter-layer bonding force and shearing force, make interlaminar shear strength bring up to more than 100MPa from former 30MPa, effectively improve the q&r of finished product, and the electric property of radome product can not be affected.
Further, technical scheme of the present invention, except being applied to radome product, also can be applicable to the product of similar multi-layer metamaterial micro-structural, under the process conditions such as uniform temperature, pressure, improves the interfacial bonding strength of metamaterial structure.
In sum, by means of technique scheme of the present invention, by punching in the functional layer of metamaterial panel, manufacture a product in process in this metamaterial panel with hole of application, the functional layer of this metamaterial panel and dielectric layer is made to form three-dimensional net structure by this hole, thus improve inter-layer bonding force and the shearing force of metamaterial panel, and then improve the mechanical strength of Meta Materials product to a great extent.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (23)
1. a metamaterial panel, is characterized in that, comprises at least one functional layer, and described functional layer comprises conduction geometry and the dielectric layer for supporting described conduction geometry, and described functional layer has hole.
2. metamaterial panel according to claim 1, is characterized in that, the position in described hole comprise following one of at least:
The cabling of the dielectric layer outside described conduction geometry, described conduction geometry.
3. metamaterial panel according to claim 2, it is characterized in that, when the position in described hole is positioned at the cabling of described conduction geometry, the edge in described hole is surrounded by the cabling of described conduction geometry, or the part edge in described hole is surrounded by the cabling of described conduction geometry.
4. metamaterial panel according to claim 1, is characterized in that, at least side of described at least one functional layer is coated with composite layer, and the part of described composite layer is positioned at described hole.
5. metamaterial panel according to claim 4, is characterized in that, described composite layer has sandwich construction, and at least one deck inside in described sandwich construction has empty structure.
6. metamaterial panel according to any one of claim 1 to 5, is characterized in that, described hole is through hole.
7. metamaterial panel according to claim 6, is characterized in that, the both sides of at least one functional layer are coated with composite layer, and the composite layer being positioned at these functional layer both sides is contacted with each other by described through hole and fixes.
8. metamaterial panel according to any one of claim 1 to 5, is characterized in that, each conduction geometry has at least one hole.
9. a radome, is characterized in that, is made up of metamaterial panel according to any one of claim 1 to 7.
10. a manufacture method for metamaterial panel, is characterized in that, comprising:
There is provided pending functional layer, wherein, described pending functional layer comprises dielectric layer and is covered in the conductive layer above described dielectric layer;
Patterning is carried out to described pending functional layer and removes technique and drilling technology, obtain the functional layer with hole, the conduction geometry that described functional layer comprises dielectric layer and supported by described dielectric layer.
11. manufacture methods according to claim 10, is characterized in that, described drilling technology is carrying out performing before described patterning removes technique, or described drilling technology performs after the patterning process.
12. manufacture methods according to claim 10, is characterized in that, the position that described drilling technology carries out punching comprise following one of at least:
The cabling of the dielectric layer outside described conduction geometry, described conduction geometry.
13. manufacture methods according to claim 12, it is characterized in that, when the position in described hole is positioned at the cabling of described conduction geometry, the edge in described hole is surrounded by the cabling of described conduction geometry, or the part edge in described hole is surrounded by the cabling of described conduction geometry.
14. manufacture methods according to claim 10, is characterized in that, comprise further:
Form composite layer at least side of described functional layer, described composite layer covers described functional layer, and the part of described composite material is positioned at described hole.
15. manufacture methods according to claim 14, is characterized in that, described composite layer has sandwich construction, and at least one deck inside in described sandwich construction has empty structure.
16., according to claim 10 to the manufacture method according to any one of 15, is characterized in that, described hole is through hole.
17. manufacture methods according to claim 16, is characterized in that, when the both sides of described functional layer all form composite layer, the composite layer being positioned at described functional layer both sides is contacted with each other by described through hole and fixes.
18., according to claim 10 to the manufacture method according to any one of 15, is characterized in that, described drilling technology comprise following one of at least:
Machine drilling, laser drill, plasma etching.
19., according to claim 10 to the manufacture method according to any one of 15, is characterized in that, described drilling technology forms at least one hole on each conduction geometry.
20., according to claim 10 to the manufacture method according to any one of 15, is characterized in that, comprise further:
Alligatoring is carried out to conduction geometry.
21., according to claim 10 to the manufacture method according to any one of 15, is characterized in that, comprise further:
Multiple functional layer is connected in the plane.
22. manufacture methods according to claim 21, is characterized in that, describedly the process that multiple functional layer is connected in the plane are comprised:
The conduction geometry of described multiple functional layer is connected in the plane.
23. manufacture methods according to claim 22, is characterized in that, the mode that the conduction geometry of described multiple functional layer carries out being electrically connected in the plane is comprised following one of at least:
Undertaken connecting, being undertaken connecting, being undertaken connecting, being connected by conducting polymer composite by silver slurry by copper slurry by tin.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310530124.6A CN104600433A (en) | 2013-10-30 | 2013-10-30 | Metamaterial panel and manufacturing method thereof as well as antenna housing |
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| CN201310530124.6A CN104600433A (en) | 2013-10-30 | 2013-10-30 | Metamaterial panel and manufacturing method thereof as well as antenna housing |
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