CN104600009B - Chip measuring sorting system and method - Google Patents
Chip measuring sorting system and method Download PDFInfo
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- CN104600009B CN104600009B CN201510023987.3A CN201510023987A CN104600009B CN 104600009 B CN104600009 B CN 104600009B CN 201510023987 A CN201510023987 A CN 201510023987A CN 104600009 B CN104600009 B CN 104600009B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides chip measuring sorting system and method. The system comprises a sorting device, a measuring device and a carrying device, wherein the sorting device and the measuring device are adjacent to each other; a first storing seat is arranged in the measuring device, and while a second sorting seat is arranged in the sorting device; the carrying device is adjacent to a positioning access device; a first carrying platform is arranged on the carrying device, and while a second carrying platform is arranged on the positioning access device to carry and position a standard device; the carrying device is adjacent to the storing device; a picking rotating arm is arranged between the carrying device and the sorting device; the positioning access device is arranged adjacent to a tool frame assembly, and a second mechanical arm is arranged between the positioning access device and the device frame assembly; a standard device and a central control system which is connected with all the devices above are stored in the device frame assembly. With the adoption of the system, the problems of low production efficiency and relatively high production cost due to repeated setting of a cabinet and wafer scanning during measuring and sorting chips in the prior art can be solved.
Description
Technical field
The present invention relates to semiconductor fabrication, more particularly to a kind of chip measurement separation system and method.
Background technology
Semiconductor crystal wafer is by after thinning back side and cutting, forming thousands of chips independent of each other, it usually needs
Characteristic according to each chip in wafer is sorted to it, for example, being typically based on the light of the LED chip to LED chip sorting
Electrical characteristics, that is, need to carry out different grades of classification according to different photoelectric characteristics to upper thousands of chips in wafer, with
And cast out the abnormal chip of damage or photoelectric parameter, this process is referred to as sorting.
Before being sorted to LED chip at present, all LED chips in wafer are measured one by one first every to obtain
The photoelectric characteristic of individual chip；Specifically, wafer is measured and sorting generally includes following steps：On first in measurement wafer
The photoelectric characteristic of each chip simultaneously scans the coordinate information for generating the wafer；Produced according to measured photoelectric characteristic and coordinate information
Raw wafer correspondence wafer archives；Wafer archives are sent to sorting unit, the wafer archives for having obtained are read in sorting unit
Afterwards, the operation for picking and rearranging is performed according to default sort regular, the LED chip for rearranging for being obtained has consistent
Photoelectric characteristic so that complete sorting.In actual production process, Fig. 1 is refer to, be the measurement point of chip of the prior art
The schematic diagram of choosing method, wafer is required to carry out board setting and wafer-scanning when measuring and sorting operation, and many
Number operation is all needed by the manually operated of operating personnel.
However, in the prior art to the measurement and sorting of chip, due to needing to repeat board setting and wafer-scanning
Operation, and cause production efficiency low and production cost is higher.
The content of the invention
The present invention provides the measurement separation system and method for a kind of chip, with solve measurement in the prior art to chip and
Sorting, due to needing to repeat board setting and the operation of wafer-scanning, and cause production efficiency low and production cost compared with
Problem high.
The present invention provides a kind of measurement separation system of chip, measurement apparatus, sorting unit, bogey, positioning access
Device, fixture frame component, the first mechanical arm, the second mechanical arm, feeding spiral arm and central control system；
The first thing-putting holder is provided with the measurement apparatus, the second thing-putting holder is provided with sorting unit, described first puts
Diameter identical center ring is offered in thing seat and second thing-putting holder, for specification identical wafer fixation kit to be fixed
In the center ring, the measurement apparatus are used to scan and obtain the coordinate letter of the wafer fixed in the wafer fixation kit
Breath, and measure and record the photoelectric characteristic for being arranged at each chip wafer Nei；The sorting unit and the measurement apparatus
It is disposed adjacent, the chip for the measurement apparatus to have been measured is sorted out according to preset rules classification；
The bogey is disposed adjacent with the positioning access device, wherein, it is provided with first on the bogey
Carrying platform, is provided with the second carrying platform on the positioning access device, first carrying platform and described second carry
Platform is used to carry and localization criteria fixture, and second carrying platform is additionally operable to deposit the wafer fixation kit temporarily；
The bogey is also disposed adjacent with the sorting unit, is set between the bogey and the sorting unit
The feeding spiral arm is equipped with, for when the sorting unit is sorted to the chip in the wafer, by the feeding
The chip that spiral arm is sorted out the sorting unit is according to the preset regularly arranged standard system onto first carrying platform
In tool；
First mechanical arm is arranged at the measurement apparatus, the sorting unit, the bogey and described fixed
The center of position access device, for capturing and movement first thing-putting holder, second thing-putting holder or second carry flat
Wafer fixation kit on platform, and capture and move first carrying platform or second carrying platform on standard system
Tool；
The positioning access device is also disposed adjacent with the fixture frame component, is stored with the fixture frame component described
Standard fixture, second mechanical arm is arranged between the positioning access device and the fixture frame component, for from institute
State and standard fixture is captured in fixture frame component and is placed on the second carrying platform of the positioning access device；
The central control system is accessed with the measurement apparatus, the sorting unit, the bogey, the positioning respectively
Device, first mechanical arm, second mechanical arm and the feeding spiral arm connection, for connected described
Each device and component are controlled and are correspondingly operated with execution, are additionally operable to divide the data measured by the measurement apparatus
Analysis, treatment and access.
The present invention also provides a kind of measurement method for separating of chip, is measured using the measurement separation system of said chip
And analysis, methods described includes：
The coordinate information of position scanning generation first wafer is carried out to first wafer, and by the measurement mould
Block carries out the measurement of photoelectric properties to first wafer, generates the first metrical information, wherein, the coordinate information includes described
The coordinate information of each chip in first wafer；
First wafer is moved and is fixed on second thing-putting holder by first mechanical arm, by institute
State sorting unit and the feeding spiral arm carries out sorting operation to first wafer, according to preset sort regular by described
In die grading to different standard fixture in one wafer.
As shown from the above technical solution, the measurement separation system and method for chip provided by the present invention, by measurement
The rational deployment of device, sorting unit, bogey, positioning access device and fixture frame component, and by measurement apparatus and
Being provided with sorting unit can be with the first thing-putting holder of the wafer fixation kit of compatible same size and the second thing-putting holder, in cooperation
The programme-control of control system, realizes and board setting and scan operation is only performed once to the sorting of chip in wafer, by this
The measurement separation system of the chip that embodiment is provided carries out die grading, solves measurement in the prior art to chip and divides
Choosing, due to needing to repeat board setting and the operation of wafer-scanning, and causes that production efficiency is low and production cost is higher
Problem, correspondingly reduce processing step, largely improve operating efficiency, and reduce processing procedure
Hardware cost and human cost.
Brief description of the drawings
Fig. 1 is the schematic diagram of the measurement method for separating of chip of the prior art；
A kind of structural representation of the measurement separation system of chip that Fig. 2 is provided by the embodiment of the present invention；
The vertical view of the first fixed eyelid retractor in the measurement separation system of the chip that Fig. 3 is provided by embodiment illustrated in fig. 2
Figure；
The part-structure of measurement apparatus is illustrated in the measurement separation system of the chip that Fig. 4 is provided by embodiment illustrated in fig. 2
Figure；
The second fixed eyelid retractor 230 bows in the measurement separation system of the chip that Fig. 5 is provided by embodiment illustrated in fig. 2
View；
Fig. 6 is a kind of layout of crystal circle structure in the embodiment of the present invention；
The front view of fixture frame component in the measurement separation system of the chip that Fig. 7 is provided by embodiment illustrated in fig. 2；
Fig. 8 is the top view of fixture frame component in embodiment illustrated in fig. 7；
A kind of flow chart of the measurement method for separating of chip that Fig. 9 is provided by the embodiment of the present invention；
The flow chart of the measurement method for separating of another chip that Figure 10 is provided by the embodiment of the present invention；
A kind of schematic diagram of the measurement method for separating of chip that Figure 11 is provided by the embodiment of the present invention.
Specific embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
A part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
In specific embodiment once of the invention, core proposed by the invention is illustrated by more detailed implementation
Joining relation and work side under the concrete structure of measurement separation system and each device busy state of the system of piece
Formula, the accompanying drawing in embodiment is also only schematic diagram, is intended to for expressing invention of the invention, and implementation of the invention is not
The concrete structure in the following drawings is only limitted to, and the embodiment of the present invention is specifically given by taking the measurement method for separating of LED chip as an example
To illustrate, the object that the measurement separation system of the chip provided using following embodiment of the invention is sorted can also be it
Its semiconductor chip.By to chip provided in an embodiment of the present invention measurement separation system structure and working method it is specific
Description, to those skilled in the art, can easily understand difference and the advantage place of the present invention and prior art.
A kind of structural representation of the measurement separation system of chip that Fig. 2 is provided by the embodiment of the present invention.Such as Fig. 2 institutes
Show, the measurement separation system of the chip that the present embodiment is provided, for being measured to semiconductor crystal wafer and being sorted, the present invention is each
Embodiment is specifically explained as a example by LED chip is measured and sorted, and the measurement separation system of the chip includes：Measurement
Device 100, sorting unit 200, bogey 300, positioning access device 400, fixture frame component 500, the first mechanical arm
600th, the second mechanical arm 700, feeding spiral arm 800 and central control system (not shown), below to each device in the system and
The structure of component is described in detail.
In the present embodiment, the first thing-putting holder 110 is provided with measurement apparatus 100, second is provided with sorting unit 200
Diameter identical center ring is offered in thing-putting holder 210, the first thing-putting holder 110 and the second thing-putting holder 210, for specification is identical
Wafer fixation kit be fixed in center ring, the wafer fixation kit is specifically arranged on a wafer tensioner ring 001, the measurement
Device 100 is used to scan and obtain the coordinate information of each chip in the wafer fixed in wafer fixation kit, and measures and remember
Record the photoelectric characteristic of each chip wafer Nei；Sorting unit 200 is disposed adjacent with measurement apparatus 100, for by measurement apparatus
100 chips for having measured are sorted out according to preset rules classification；Bogey 300 is disposed adjacent with positioning access device 400, its
In, the first carrying platform 310 is provided with bogey 300, the second carrying platform 410 is provided with positioning access device 400,
First carrying platform 310 and the second carrying platform 410 are used to carry and localization criteria fixture, and the second carrying platform 410 is additionally operable to
Interim storing wafer fixation kit.It should be noted that first, in the system that provides of the present embodiment, the first thing-putting holder 110 and the
The set-up mode of two thing-putting holders 210, the wafer fixation kit that can be used with compatible measurement device 100 and sorting unit 200, because
This, when the coordinate information of wafer is obtained, coordinates the program of central control system to set, it is only necessary to carry out a board setting and wafer is swept
Retouch, without repeating this operation, i.e. perform when sorting is operated using the scanning result before measurement, reduce sorting
Processing step, largely improves operating efficiency；Second, when multiple wafers are carried out with batch sorting, to wafer A
While carrying out sorting operation, wafer B can be measured, at this point it is possible to one of wafer is determined in interim depositing in
On second carrying platform 410 of position access device 400, to exchange the job position of wafer.
Bogey 300 is also disposed adjacent with sorting unit 200, is provided between bogey 300 and sorting unit 200
Feeding spiral arm 800, for when sorting unit 200 is sorted to the chip in wafer, will be sorted by feeding spiral arm 800 and filled
200 chips sorted out are put according in the preset regularly arranged standard fixture onto the first carrying platform 310.First carrying
Standard fixture on platform 310 is selected by positioning access device 400 from fixture frame component 500 first, in each standard fixture
The photoelectric characteristic of the chip of arrangement is identical, finally through the arrangements of chips of different qualities in different standard fixtures.
In implementing, the first mechanical arm 600 can be arranged at measurement apparatus 100, sorting unit 200, carried
The center of device 300 and positioning access device 400, for capturing and mobile first thing-putting holder 110, the second thing-putting holder 210
Or the second wafer fixation kit on carrying platform 410, and capture and move the first carrying platform 310 or the second carrying platform
Standard fixture on 410.As shown in Fig. 2 above-mentioned each device is located at the first area of system, the first area is drawn with quadrant
Point, bogey 300, positioning access device 400, measurement apparatus 100 and sorting unit 200 are located at first, second, third respectively
And fourth quadrant, to meet the position relationship of above-mentioned each device；It should be noted that various embodiments of the present invention are not restricted to figure
The particular location of each device in 2, as long as the position relationship of above-mentioned each device can be met, and realizes identical processing mode,
The position set-up mode of each device in the measurement separation system of the chip that can be provided as the present invention.
In the present embodiment, positioning access device 400 is also disposed adjacent with fixture frame component 500, in fixture frame component 500
The standard that is stored with fixture, the second mechanical arm 700 be arranged at positioning access device 400 and fixture frame component 500 between, for from
Standard fixture is captured in fixture frame component 500 and is placed on the second carrying platform 410 of positioning access device 400；And then by
The standard fixture is moved to the first carrying platform 310 by the first mechanical arm 600, so as to subsequent execution sorting work.In addition, this reality
Apply central control system in example respectively with above-mentioned measurement apparatus 100, sorting unit 200, bogey 300, positioning access device
400th, the first mechanical arm 600, the second mechanical arm 700 and feeding spiral arm 800 are connected, for connected each device and
Component is controlled and is correspondingly operated with execution, is additionally operable to that the data measured by measurement apparatus 100 are analyzed, processed and deposited
Take.It is understood that each device and moveable component in the present embodiment, including first the 600, second machinery of mechanical arm
Arm 700 and feeding spiral arm 800 control to perform corresponding operation by central control system, and the central control system can be arranged at above-mentioned
The vicinity of each device, it is also possible under conditions of above-mentioned annexation is met, is arranged in another workspace, for example, one
Control computer, is controlled by the manually operated or set in advance program of operating personnel to each device.
The measurement separation system of the chip that the present embodiment is provided, by measurement apparatus, sorting unit, bogey,
The rational deployment of positioning access device and fixture frame component, and can be with compatibility by being provided with measurement apparatus and sorting unit
First thing-putting holder and the second thing-putting holder of the wafer fixation kit of same size, coordinate the programme-control of central control system, realize
Sorting to chip in wafer is only performed once board setting and scan operation, the measurement point of the chip provided by the present embodiment
Selecting system carries out die grading, solves measurement and sorting in the prior art to chip, is set due to needing to repeat board
The operation of fixed and wafer-scanning, and cause production efficiency low and production cost problem higher, correspondingly reduce technique step
Suddenly, operating efficiency is largely improve, and reduces hardware cost and human cost in processing procedure.Further
Ground, the present embodiment reduce scan operation number of times while, reduce the acquisition number of times of wafer coordinate information, wafer it is more,
In the case that data volume is larger, the relative risk of batch mixing, loss of data and read error is reduced, be conducive to improving measurement sorting
Accuracy.
Below by way of the specific knot of each device in the measurement separation system of the chip shown in some instantiation explanatory diagrams 2
Structure, to explain that each device performs the specific implementation of corresponding operating.The survey of the chip that Fig. 3 is provided by embodiment illustrated in fig. 2
The top view of the first fixed eyelid retractor in amount separation system, the measurement sorting of the chip that Fig. 4 is provided by embodiment illustrated in fig. 2
The part-structure schematic diagram of measurement apparatus in system, refer to Fig. 2 to Fig. 4, and the first driving mould is additionally provided with measurement apparatus 100
Block 120, chip measurement module 130, light source acquisition module 140 (not shown in Fig. 2) and the first image receiver module (do not show in figure
Go out).First drive module 120 is connected to the bottom of the first thing-putting holder 110, to cause that the first thing-putting holder 110 drives by first
The driving of module 120 carries out transverse direction, longitudinal direction and rotary motion；The first fixed eyelid retractor 150 is installed with measurement apparatus 100,
The bottom of the center ring of the first thing-putting holder 110 is specifically arranged at, wherein, the top of the first fixed eyelid retractor 150 is provided with multiple
Enclose and be located at the edge of the first fixed eyelid retractor 150 and symmetrical vacuum sucking holes 151.Specifically, the first drive module
120 for example can include the first horizontal slide rail, first longitudinal direction slide rail and the first driver, first driver can have cause
The function that first thing-putting holder 110 is rotated around central shaft；It should be noted that the first fixed eyelid retractor 150 is fixation
Set, that is to say, that while the first thing-putting holder 110 is moved, the position of the first fixed eyelid retractor 150 keeps not
Become, i.e. the chip positioned at the top of the first fixed eyelid retractor 150 is changed by the motion of the first thing-putting holder 110, successively to wafer
In each chip measure.
As shown in Fig. 2 chip measurement module 130 includes at least two probe spiral arms 131 and is arranged at each probe spiral arm
The probe 132 (only figure 4 illustrates) of 131 front ends, probe spiral arm 131 is used to become in the working condition of chip measurement module 130
During change, moved horizontally, moved up and down or rotated around the bottom of probe spiral arm 131；It will be many that chip measurement module 130 is used for
When individual probe 132 is moved to the top of the first fixed eyelid retractor 150, to the chip of the top of the first fixed eyelid retractor 150
Measure；Specifically metering system can be：When operation of feeding and discharging or holding state is carried out, probe spiral arm 131 is moved
To the position away from the first thing-putting holder 110, the movement of first thing-putting holder 110 will not be caused to stop, when a measurement is taken, visited
Pin spiral arm 131 is moved to the top of the first fixed eyelid retractor 150 so that the end of probe 132 is located at the first fixed support
The top of device 150, as shown in figure 4, probe 132 and light source acquisition module 140 are respectively positioned on the top of wafer 002, now, has completed to survey
Measure the preparation of chip.Due to generally needing to measure its electrical characteristics in the state of chip energization, therefore, chip measurement module
Current source is additionally provided with 130, for chip to be measured provide electric current, there is provided size of current can be steady state value or change value,
To drive chip light emitting to be measured.As shown in figure 4, light source acquisition module 140 is arranged at the top of the first fixed eyelid retractor 150,
When being measured for the chip in the top of 130 pairs of first fixed eyelid retractors of chip measurement module 150, while obtaining the core
The optical information of piece.First image receiver module is arranged at the top of the first thing-putting holder 110, comprising microscope and image sensing
Device, microscope is used to be shown when the image of wafer is received the image of enhanced processing, and the imageing sensor for example can be electricity
Lotus coupled apparatus (Charge Coupled Device, referred to as：CCD) imageing sensor or complementary metal oxide semiconductors (CMOS)
(Complementary Metal-Oxide-Semiconductor, referred to as：CMOS) imageing sensor, for extracting wafer
Image information, i.e. the positional information specifically to wafer measures.
Structure with above-mentioned measurement apparatus 100 is similar, the measurement sorting of the chip that Fig. 5 is provided by embodiment illustrated in fig. 2
The top view of the second fixed eyelid retractor in system, is additionally provided with the second drive module 220 and the second image in sorting unit 200
Receiver module (not shown)；Second drive module 220 is connected to the bottom of the second thing-putting holder 210, to cause the second glove
Seat 210 carries out transverse direction, longitudinal direction and rotary motion by the driving of the second drive module 220；Second is installed with sorting unit 200
Fixed eyelid retractor 230, is specifically arranged at the bottom of the center ring of the second thing-putting holder 210, wherein, the second fixed eyelid retractor 230
Top be provided with multiple enclosing and be located at the edge of the second fixed eyelid retractor 230 and symmetrical vacuum sucking holes 231, second consolidates
The center of fixed pattern eyelid retractor 230 also sets up thimble through hole 232, under the driving of the second drive module 220, by its inside
Thimble ejects predeterminable range.Specifically, the second drive module 220 can for example include the second horizontal slide rail, second longitudinal direction slide rail
With the second driver, second driver can be with the function of the second thing-putting holder 210 is rotated around central shaft.
It should be noted that the second horizontal slide rail in the present embodiment can be with the first horizontal slide rail in above-described embodiment
Overall structure is set to, the second fixed eyelid retractor 230 is similarly and is fixedly installed, that is to say, that the second thing-putting holder 210 is transported
While dynamic, the position of the second fixed eyelid retractor 230 keeps constant, i.e. change position by the motion of the second thing-putting holder 210
In the chip of the top of the second fixed eyelid retractor 230, each chip in wafer is sorted successively, the second fixed support
When thimble inside device 230 is ejected, the chip above it is sorted out.
In the present embodiment, the second image receiver module is arranged at the top of the second thing-putting holder 210 and includes microscope and figure
As sensor, microscope is used to be shown when the image of wafer is received the image of enhanced processing, and the imageing sensor for example may be used
Think ccd image sensor or cmos image sensor, the image information for extracting wafer.Second image receiver module
Function is similar with above-mentioned first image receiver module, and specifically the positional information to wafer is measured, alternatively, in the present embodiment
Sorting unit 200 be additionally operable to scan and obtain the coordinate information of fixed wafer in wafer fixation kit, central control system is also used
It is analyzed, processes and accesses in the data measured by sorting unit 200.In implementing, it usually needs brilliant to batch
Chip in circle performs sorting and operates, and the function of measurement coordinate position is equally set to sorting unit 200, is conducive to improving execution
The production capacity of sorting, further improves operating efficiency.
It should be noted that being scanned to wafer and obtaining the positional information of wafer, it is necessary first to scan the wafer
Mark point, as shown in fig. 6, being a kind of layout of crystal circle structure in the embodiment of the present invention, Fig. 6 only shows the one of wafer 002
Part, the unit repeated in figure is the chip 002a in wafer 002, is mark point with the visibly different special marking of chip form
003, such as "+" phenotypic marker or " ╔ " phenotypic marker, the mark point 003 is usually arranged as human eye, and above-mentioned first image connects
Receiving apparatus and the second image received device, the shape for all obviously easily recognizing；In implementing, any of which mark can be chosen
Point 003 is remembered as initial markers point, then by recording the image of the initial markers point and being scanned for coordinate pair wafer, with life
The relative co-ordinate information of each chip on into wafer 002.Normally, wafer leading portion processing in, if can all be reserved with thereon
Dry mark point, subsequently to carry out the measurement of correlation.
Further, the edge of the first thing-putting holder 110 and the second thing-putting holder 210 can be provided with vacuum sucking holes or solid lock
Mechanism, for fixing wafer fixation kit, wherein, it is provided with wafer fixation kit for fixing consolidating for wafer tensioner ring 001
Lock button, is stained with the adhesive membrane for fixing wafer on wafer tensioner ring 001；The wafer being fixed on wafer fixation kit
Be by chip separated from one another after cutting splitting, these adhesive die attachments are not allowed on adhesive membrane it is easy to fall off, and each other
There is a certain distance, adhesive membrane is easy to processing by tight on wafer tensioner ring 001.Similarly, first carrying platform 310
Edge is provided with vacuum sucking holes or solid lock mechanism, for fixed standard fixture, wherein, it is stained with for depositing on standard fixture
The adhesive membrane of chip, is finally needed in the die grading with different photoelectric characteristics to different standard fixtures, and sorting is picked
Equally can be easy to preserve the chip for having sorted by adhesive die attachment on the adhesive membrane of standard fixture when going out；Second carrying platform
410 edge is provided with positioning claw, for fixed and storing wafer fixation kit or standard fixture.
Specifically, the front end of feeding spiral arm 800 is provided with vacuum slot, for being moved to sorting dress in feeding spiral arm 800
When putting 200, coordinate thimble ejection in the thimble through hole at the center of the second fixed eyelid retractor 230, pierce through on wafer fixation kit
Adhesive membrane ejects chip to be sorted so that vacuum slot is contacted and adsorbs the chip of ejection, and first is put so as to chip be moved to
On the standard fixture of carrying platform 310；Wherein, the first carrying platform 310, is additionally operable to often be performed in feeding spiral arm 800 and once takes
After material operation, the cell of predeterminable range is moved with laterally or longitudinally direction so that the chip that feeding spiral arm 800 is chosen every time is equal
Adhere on the adhesive membrane of standard fixture.Feeding spiral arm 800 needs also exist for being configured with driver, the feeding rotation shown in Fig. 2
The moving range of arm 800 is 90 degree.
With above-mentioned measurement apparatus 100 and sorting unit 200 similarly, bogey 300 is additionally provided with the 3rd drive module
320 and the 3rd image receiver module；3rd drive module 320 is connected to the bottom of the first carrying platform 310, to cause that first holds
Carrying platform 310 carries out transverse direction, longitudinal direction and rotary motion by the driving of the 3rd drive module 320；Wherein, the first carrying platform
310 edge is provided with latching device, for fixed standard fixture.Specifically, the 3rd drive module 320 can for example include the
Three horizontal slide rails, the 3rd longitudinal slide rail and the 3rd driver, the 3rd driver can have so that the 3rd thing-putting holder is in
The function that heart axle is rotated.The 3rd image receiver module in the present embodiment is arranged at the top of the first carrying platform 310, the
Three image receiver modules include microscope and imageing sensor, and microscope is used to be shown at amplification when the image of wafer is received
The image of reason, the imageing sensor equally can be ccd image sensor or cmos image sensor, the figure for extracting wafer
As information, when be positioned over for chip on the standard fixture on the first carrying platform 310 by feeding spiral arm 800, the 3rd image connects
Receiving apparatus can display chip in real time arranging situation, so as to avoid wrong arranging, the phenomenon such as omit in printing.
As shown in Fig. 2 various embodiments of the present invention provide chip measurement separation system in, measurement apparatus 100 and point
Shade 900 is also provided between screening device 200, the shade 900 includes shading baffle and barrier driving module,
The top of shading baffle is located under the horizontal plane of the first thing-putting holder 110 and the second thing-putting holder 210, barrier driving module and middle control
System is connected, in measurement apparatus 100 and/or in running order sorting unit 200, raising shading baffle to isolate survey
Amount device 100 and sorting unit 200.Specifically, the barrier driving module is specifically included and carries out oscilaltion for shading baffle
Slide rail and driver, when shading baffle lands, its top is located at the thing-putting holder water of measurement apparatus 100 and sorting unit 200
Under plane, and the operation such as pick and place of the movement of thing-putting holder in measurement apparatus 100 and sorting unit 200, wafer will not be caused
Influence；When shading baffle rises, can be mutually isolated by measurement apparatus 100 and sorting unit 200 so that light can not be mutually saturating
Cross, during so as to avoiding measurement apparatus 100 and sorting unit 200 from working at the same time, because light source interferes the adverse effect brought.
Further, the first mechanical arm 600 is located at the center of aforementioned four device, it is necessary to the first thing-putting holder
110th, the part on the second thing-putting holder 210, the first carrying platform 310 and the second carrying platform 410 is captured and placement operation,
As shown in Fig. 2 the first mechanical arm 600 for meeting above-mentioned action can be configured with the first arm drive module, for causing the
One mechanical arm 600 carries out 360 degree of rotations and moves up and down, to move to measurement apparatus 100, sorting unit 200, bogey
300 or positioning access device 400 top, the front end of the first mechanical arm 600 is provided with vacuum cup, for being inhaled by vacuum
Attached firm grasping silicon wafer fixation kit or standard；Similarly, the second mechanical arm 700 can be configured with the second arm and drive mould
Block, for causing the second mechanical arm 700 to be rotated and being moved up and down, to move to inside and the positioning of fixture frame component 500
The top of access device 400, the front end of the second mechanical arm 700 is provided with vacuum cup, for what is consolidated by vacuum suction
Crawl standard fixture.It should be noted that the wafer fixation group of above-mentioned mechanical arm crawl be separable set-up mode, it is necessary to
Moved between the first thing-putting holder 110, the second thing-putting holder 210 and the second carrying platform 410, standard fixture is in fixture frame component
500th, moved between the second carrying platform 410 and the first carrying platform 310.
The front view of fixture frame component 500 in the measurement separation system of the chip that Fig. 7 is provided by embodiment illustrated in fig. 2,
Fig. 8 is the top view of fixture frame component 500 in embodiment illustrated in fig. 7.In implementing, the bottom of fixture frame component 500 can
To be provided with the 4th drive module, for causing that fixture frame component 500 is moved left and right and moved up and down, similarly, this
Four drive modules can equally include can be used for the slide rail for moving left and right and moving up and down and drive it, as shown in fig. 7, fixture
Multigroup " non-" font fixture storage position 510 is provided with frame component 500, the standard fixture 004 for being stained with adhesive membrane is arranged
It is placed in fixture storage position 510, the adhesive membrane adhered on standard fixture 004 can be blank, or be stained with
Not more than restricted number and the adhesive membrane for being stained with some chips of chip coordinate information is had by central control system record.
A kind of flow chart of the measurement method for separating of chip that Fig. 9 is provided by the embodiment of the present invention.Method makes shown in Fig. 9
For situation about being sorted to the chip in semiconductor crystal wafer, the measurement of the chip for specifically being provided by the above embodiment of the present invention
Separation system is performed, and the method that the present embodiment is provided is comprised the following steps：
S110, the coordinate information of position scanning the first wafer of generation is carried out to the first wafer, and by measurement module to the
One wafer carries out the measurement of photoelectric properties, generates the first metrical information, wherein, coordinate information includes each chip in the first wafer
Coordinate information.
In the present embodiment, equally it is explained by taking the measurement sorting of LED chip as an example, LED chip is sorted
Standard is the excellent summary of its photoelectric properties, and with reference to the system that above-mentioned Fig. 2 to embodiment illustrated in fig. 8 is provided, wafer splits by cutting
Core particles separated from one another are formed after piece, these core particles are adhered on adhesive membrane will not come off, and have a certain distance each other,
The adhesive membrane is easy to process by tight on the wafer tensioner ring 001 of a circle, and then, the fixing lock on wafer fixation kit
Be fixed thereon for wafer tensioner ring 001 by button, so as to the first thing-putting holder 110, second in the measurement separation system of follow-up chip
Can be fixed on wafer to be sorted in operating table surface by the wafer fixation kit by thing-putting holder 210.
It should be noted that the consideration based on lifting production capacity, generation coordinate information is scanned in S110 to the first wafer
Operation can be performed by measurement apparatus 100 or sorting unit 200, due to two devices configuration image receiver module,
The image information of first wafer can be obtained.Specifically, first wafer is placed on by measurement dress by wafer fixation kit
100 the first thing-putting holder 110 is put, or on the second thing-putting holder 210 of sorting unit 200, is performed and is inhaled vacuum action, it is firm to inhale
Attached wafer fixation kit, so as to by corresponding first image receiver module of the first thing-putting holder 110, or the second thing-putting holder 210
Corresponding second image receiver module imposes level correction and scanning to first wafer.
S120, the first wafer is moved and is fixed on the second thing-putting holder, by the first mechanical arm by sorting unit
Sorting operation is carried out to the first wafer with feeding spiral arm, according to preset sort regular by the die grading in the first wafer to not
In same standard fixture.
In the present embodiment, when the first wafer is positioned on the second thing-putting holder 210 of sorting unit 200, it is ready to carry out point
During selection operation, the coordinate information of wafer of the feeding spiral arm 800 according to acquired in central control system, according to the sort regular being manually set
Sorting operation is performed, when the chip that same sort regular is met in the first wafer is all picked, then by the first mechanical arm
600 are moved on the second carrying platform 410 the standard fixture on first carrying platform 310, then via after contraposition by the second machine
In the feeding fixture frame of tool arm 700 component 500, exchange another standard fixture for and continue operation, until completing institute on first wafer
There is the sorting of chip.
The chip that the measurement method for separating of the chip that the present embodiment is provided is provided by any of the above-described embodiment of the invention
Measurement separation system perform, therefore, implementation and beneficial effect are similar to the above embodiments, will not be repeated here.
Alternatively, in a kind of possible implementation of above-described embodiment, only single-wafer is carried out to sort operation
Concrete mode is that above-mentioned S110 could alternatively be：First wafer is fixed on the first thing-putting holder, by the measurement apparatus pair
First wafer carries out position scanning, obtains the initial markers point of the first wafer to generate the coordinate information of the first wafer, and to the
One wafer carries out the measurement of photoelectric properties, generates the first metrical information.
In the present embodiment, only the chip in first wafer is sorted, the problem of production capacity is not related to, can be direct
First wafer is positioned on the first thing-putting holder 110, acquisition positional information and the measurement letter of generation first are performed by measurement apparatus 100
The operation of breath, reduces the number of times that the first mechanical arm 600 moves first wafer as far as possible.
In actual production, it usually needs substantial amounts of wafer is sorted, its specific implementation is with above-mentioned to monolithic
The sorting of wafer is otherwise varied, as shown in Figure 10, by the measurement method for separating of another chip that the embodiment of the present invention is provided
Flow chart, on the basis of method shown in above-mentioned Fig. 9, S110 includes：
S111, the first wafer is fixed on the second thing-putting holder, and position scanning is carried out to the first wafer by sorting unit,
Obtain the initial markers point of the first wafer and generate the coordinate information, wherein of the first wafer, the coordinate information includes the first wafer
The coordinate information of interior each chip.
S112, the first wafer is moved and is fixed on the first thing-putting holder, by the first mechanical arm by measurement module
The measurement of photoelectric properties is carried out to the first wafer, the first metrical information is generated, and the second wafer is fixed on the second thing-putting holder,
Position scanning is carried out to the second wafer, the initial markers point of the second wafer is obtained and is generated the coordinate information of the second wafer, wherein,
The coordinate information includes the coordinate information of each chip in the second wafer.
In the present embodiment, after obtaining the coordinate information of the first wafer by sorting unit 200, the first mechanical arm 600
Rotated to sorting unit 200 by positioning access device 400, by vacuum suction grasping silicon wafer fixation kit and be moved to measurement dress
Put on 100 the first thing-putting holder 110, first thing-putting holder 110 starts vacuum sucking holes or solid lock mechanism to fix wafer fixation group
Part, now, the first image receiver module on the first thing-putting holder 110 can be scanned and find the initial mark in the first wafer
Note point, is shared in the coordinate information obtained in sorting unit 200.
It should be noted that measured to the first wafer, and during carrying out position scanning to the second wafer,
Probe spiral arm 131 rotated by initial position/measurement position is moved to, while movable shading baffle rises, according to parameter preset pair
Chip in first wafer is measured.It is noted that in the construction of traditional measurement apparatus, wafer is adhered to viscosity
In film, ring can't be expanded and tightened, the glove table top under this situation need to be designed to plane, to adsorb whole viscosity
Film.By contrast, it is equally simultaneous based on the flow scheme design measured with sorting in the system that the above embodiment of the present invention is provided
The compatibility to producing fixture of measurement apparatus 100 and sorting unit 200 is turned round and look at, by the first thing-putting holder 110 in measurement apparatus 100
It is designed as being constructed with the identical of the second thing-putting holder 210 in sorting unit 200, therefore, the second thing-putting holder 210 can be consolidated using second
Fixed pattern eyelid retractor 230 supports chip bottom, to match wafer tensioner ring 001 as production fixture, so as to reduce existing process
In, measured from wafer in sorting this link, the waste of manpower and material is brought because of the replacing of fixture.Refer to above-mentioned figure
3 and Fig. 5, the first fixed eyelid retractor 150 of measurement apparatus 100 only surround the vacuum sucking holes 151 of a circle, when probe spiral arm
When 131 pairs of certain chips are intended to perform measurement operation, vacuum sucking holes 151 are adsorbed and fix the subregion of chip position
Adhesive membrane is moved with preventing chip during measurement so that probe 132 can accurately touch chip surface.Meanwhile, by light
Source acquisition module 140 obtains the optical information of each chip, with reference to the coordinate information and the electricity letter of above-mentioned measurement of each chip
Breath, forms corresponding first metrical information of first wafer.
The method that the present embodiment is provided also included before S120：S113, by the first mechanical arm by the first wafer or
Second wafer is moved and is fixed on the second carrying platform, to cause that the second wafer is moved and is fixed on the first thing-putting holder.
, it is necessary to multiple wafers are measured and sorted simultaneously in the present embodiment, i.e., measured in 100 pairs of the first wafers of measurement apparatus
While, the second wafer can be added and placed and scanner uni acquisition positional information is completed on sorting unit 200.The side of implementing
Formula is, for example, that after the measurement operation that measurement apparatus 100 are completed to the first wafer, shading baffle falls, by the first manipulator
Arm 600 is captured and is moved to positioning access device 400 to be used to cache, then is captured the second wafer to measurement apparatus 100 and performed measurement
Action, so that the first wafer is crawled again delivers to sorting unit 200, is scanned by the way of same as described above and finds out initial mark
Waited after note point and perform sorting operation.
Correspondingly, the method that the present embodiment is provided also includes：S130, photo electric is carried out by measurement module to the second wafer
The measurement of energy, generates the second metrical information.It should be noted that the present embodiment does not limit the execution step of S120 and S130, figure
10 were specifically shown with S120 before S130, were typically what is performed simultaneously to improve production capacity in implementing.
S140, the second wafer is moved and is fixed on the second thing-putting holder, by the first mechanical arm by sorting unit
Sorting operation is carried out to the second wafer with feeding spiral arm, according to preset sort regular by the die grading in the second wafer to not
In same standard fixture.
The present embodiment also includes in implementing after S112：The coordinate information of first wafer and first are measured
Information is sent to central control system；Correspondingly, the concrete mode for operation being sorted in S140 is：Seat of the central control system according to the first wafer
Mark information and the first metrical information, control sorting unit and feeding spiral arm carry out sorting operation to first wafer.
In the present embodiment, either to the sorting of the first wafer, or the sorting to the second wafer, it is required to select in advance
Select standard fixture.In implementing, the internal memory of fixture frame component 500 is placed with multiple standard fixtures for being stained with adhesive membrane, often
There is absolute coding on individual standard fixture and recognize and record to be sorted device 200, so as to according to the survey of chip to be sorted
Amount result, fixture frame component 500 can be front and rear or be moved up and down so that the second mechanical arm 700 can extract required standard fixture
Second carrying platform 410 of feeding positioning access device 400, and then determined by 410 pairs of standard fixtures of the second carrying platform
Position, to ensure the accuracy of the position when the first carrying platform 310 is sent into, then by the first mechanical arm 600 by the standard fixture
Move on the first carrying platform 310 of bogey 300.With above steps similarly, sorting operation is terminated in the first wafer
When, the 3rd wafer can be added it is positioned on sorting unit 200 and scans to obtain positional information, executive mode afterwards and above-mentioned side
Method is similar to, therefore will not be repeated here.
It should be noted that because measurement process is typically more complicated, and measure the time required during different parameters
Also it is different, on the whole, to be slightly larger than the time required to performing sorting the time required to performing measurement for same wafer, because
And, in the measurement method for separating of the chip that embodiment is provided, by upper and lower of each wafer action, the scanning of wafer and
The cost of the times such as interface operation is carried out in being placed on sorting unit, for being gone up from the activity duration, realizes measurement apparatus with sorting
The matching of device, so that the production effect of the measurement method for separating that ensure that chip provided in an embodiment of the present invention of amplitude peak
Rate.
The schematic diagram of the measurement method for separating of a kind of chip that Figure 11 is provided by the embodiment of the present invention, shown in comparison diagram 1
Operating process of the prior art, it is thus evident that after the measurement separation system of chip is provided using the embodiment of the present invention, greatly
Manually-operated step is reduced, and reduces the consumption of caused material in these redundancy steps simultaneously.
Finally it should be noted that：Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations；To the greatest extent
Pipe has been described in detail with reference to foregoing embodiments to the present invention, it will be understood by those within the art that：Its according to
The technical scheme described in foregoing embodiments can so be modified, or which part or all technical characteristic are entered
Row equivalent；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (14)
1. the measurement separation system of a kind of chip, it is characterised in that including：Measurement apparatus, sorting unit, bogey, positioning
Access device, fixture frame component, the first mechanical arm, the second mechanical arm, feeding spiral arm and central control system；
The first thing-putting holder is provided with the measurement apparatus, the second thing-putting holder, first thing-putting holder are provided with sorting unit
With diameter identical center ring is offered in second thing-putting holder, for specification identical wafer fixation kit to be fixed on into institute
State in center ring, the measurement apparatus are used to scan and obtain the coordinate information of the wafer fixed in the wafer fixation kit,
And measure and record the photoelectric characteristic for being arranged at each chip wafer Nei；The sorting unit is adjacent with the measurement apparatus
Set, the chip for the measurement apparatus to have been measured is sorted out according to preset rules classification；
The bogey is disposed adjacent with the positioning access device, wherein, the first carrying is provided with the bogey
Platform, is provided with the second carrying platform, first carrying platform and second carrying platform on the positioning access device
It is additionally operable to deposit the wafer fixation kit temporarily with localization criteria fixture, second carrying platform for carrying；
The bogey is also disposed adjacent with the sorting unit, is provided between the bogey and the sorting unit
The feeding spiral arm, for when the sorting unit is sorted to the chip in the wafer, by the feeding spiral arm
The chip that the sorting unit is sorted out is according in the preset regularly arranged standard fixture onto first carrying platform；
First mechanical arm is arranged at the measurement apparatus, the sorting unit, the bogey and the positioning and deposits
The center of device is taken, for capturing and movement first thing-putting holder, second thing-putting holder or the second carrying platform
Wafer fixation kit, and capture and move first carrying platform or second carrying platform on standard fixture；
The positioning access device is also disposed adjacent with the fixture frame component, and be stored with the standard in the fixture frame component
Fixture, second mechanical arm is arranged between the positioning access device and the fixture frame component, for from the system
Standard fixture is captured in tool frame component and is placed on the second carrying platform of the positioning access device；
The central control system is filled with the measurement apparatus, the sorting unit, the bogey, positioning access respectively
Put, first mechanical arm, second mechanical arm and the feeding spiral arm are connected, for connected described each
Device and component are controlled and correspondingly operated with performing, be additionally operable to be analyzed the data measured by the measurement apparatus,
Treatment and access.
2. the measurement separation system of chip according to claim 1, it is characterised in that be additionally provided with the measurement apparatus
First drive module, chip measurement module, light source acquisition module and the first image receiver module；
First drive module is connected to the bottom of first thing-putting holder, to cause first thing-putting holder by described the
The driving of one drive module carries out transverse direction, longitudinal direction and rotary motion；The first fixed eyelid retractor is installed with the measurement apparatus,
The bottom of the first thing-putting holder center ring is specifically arranged at, wherein, it is provided with the top of the first fixed eyelid retractor many
Individual enclosing is located at the described first fixed eyelid retractor edge and symmetrical vacuum sucking holes；
The chip measurement module includes at least two probe spiral arms and is arranged at the probe of each probe spiral arm front end, its
In, the probe spiral arm is used for when the working condition of the chip measurement module changes, around the bottom of the probe spiral arm
Moved horizontally, moved up and down or rotated；The chip measurement module is used to for multiple probes to be moved to described first
During the top of fixed eyelid retractor, the chip above the described first fixed eyelid retractor is measured；The chip measures mould
Current source is provided with block, for providing electric current to chip to be measured；
The light source acquisition module is arranged at the top of the described first fixed eyelid retractor, in the chip measurement module pair
When chip above the first fixed eyelid retractor is measured, the optical information of the chip is obtained；
Described first image receiver module is arranged at the top of first thing-putting holder, comprising microscope and imageing sensor, institute
Microscope is stated for showing the image of enhanced processing when the image of the wafer is received, described image sensor is used to extract
The image information of the wafer.
3. the measurement separation system of chip according to claim 1, it is characterised in that be additionally provided with the sorting unit
Second drive module and the second image receiver module；
Second drive module is connected to the bottom of second thing-putting holder, to cause second thing-putting holder by described the
The driving of two drive modules carries out transverse direction, longitudinal direction and rotary motion；The second fixed eyelid retractor is installed with the sorting unit,
The bottom of the second thing-putting holder center ring is specifically arranged at, wherein, it is provided with the top of the second fixed eyelid retractor many
Individual enclosing is located at the described second fixed eyelid retractor edge and symmetrical vacuum sucking holes, the second fixed eyelid retractor
Center also sets up thimble through hole, under the driving of second drive module, its internal thimble being ejected into predeterminable range；
The top that second image receiver module is arranged at second thing-putting holder includes microscope and imageing sensor, described
Microscope is used to be shown when the image of the wafer is received the image of enhanced processing, and described image sensor is used to extract institute
State the image information of wafer.
4. the measurement separation system of chip according to claim 3, it is characterised in that first thing-putting holder and described
The edge of two thing-putting holders is provided with vacuum sucking holes or solid lock mechanism, for fixing the wafer fixation kit, wherein, the crystalline substance
The fixed lock for fixing wafer tensioner ring is provided with circle fixation kit, is stained with for fixing on the wafer tensioner ring
The adhesive membrane of wafer；
The edge of first carrying platform is provided with vacuum sucking holes or solid lock mechanism, for fixing the standard fixture, its
In, the adhesive membrane for depositing chip is stained with the standard fixture；
The edge of second carrying platform is provided with positioning claw, for fixing and deposits the wafer fixation kit or institute
State standard fixture.
5. the measurement separation system of chip according to claim 4, it is characterised in that the front end of the feeding spiral arm is set
There is vacuum slot, for when the feeding spiral arm is moved to the sorting unit, in coordinating the second fixed eyelid retractor
Thimble ejection in the thimble through hole of the heart, the adhesive membrane pierced through on the wafer fixation kit ejects chip to be sorted so that institute
The chip that vacuum slot is contacted and adsorbs the ejection is stated, so as to the chip to be moved to the standard for putting first carrying platform
On fixture；
Wherein, first carrying platform, is additionally operable to after the feeding spiral arm often performs a feeding operation, with horizontal or vertical
The cell of predeterminable range is moved to direction so that the chip that the feeding spiral arm is chosen every time adheres to the standard fixture
Adhesive membrane on.
6. the measurement separation system of the chip according to any one of Claims 1 to 5, it is characterised in that the measurement dress
Put and shade is provided with and the sorting unit between, the shade includes shading baffle and barrier driving module, institute
The top for stating shading baffle is located under the horizontal plane of first thing-putting holder and second thing-putting holder, the barrier driving mould
Block is connected with the central control system, in the measurement apparatus and/or the in running order sorting unit, raising institute
Shading baffle is stated to isolate the measurement apparatus and the sorting unit.
7. the measurement separation system of the chip according to any one of Claims 1 to 5, it is characterised in that the carrying dress
The 3rd drive module and the 3rd image receiver module are additionally provided with putting；
3rd drive module is connected to the bottom of first carrying platform, to cause that first carrying platform passes through institute
The driving for stating the 3rd drive module carries out transverse direction, longitudinal direction and rotary motion；Wherein, the edge of first carrying platform is provided with
Latching device, for fixing the standard fixture；
3rd image receiver module is arranged at the top of first carrying platform, and the 3rd image receiver module is included
Microscope and imageing sensor, the microscope are used to be shown when the image of the wafer is received the image of enhanced processing,
Described image sensor is used to extract the image information of the wafer.
8. the measurement separation system of the chip according to any one of Claims 1 to 5, it is characterised in that first machine
Tool arm is configured with the first arm drive module, for causing first mechanical arm to carry out 360 degree of rotations and moving up and down,
To move to the measurement apparatus, the sorting unit, the bogey or the top of the positioning access device, described first
The front end of mechanical arm is provided with vacuum cup, for the crawl wafer fixation kit or described consolidated by vacuum suction
Standard；And/or,
Second mechanical arm is configured with the second arm drive module, for cause second mechanical arm carry out rotate and
Move up and down, to move to the inside of the fixture frame component and the top of the positioning access device, second mechanical arm
Front end be provided with vacuum cup, for by vacuum suction consolidate the crawl standard fixture.
9. the measurement separation system of the chip according to any one of Claims 1 to 5, it is characterised in that the sorting dress
The coordinate information for being additionally operable to scan and obtain the wafer fixed in the wafer fixation kit is put, it is right that the central control system is additionally operable to
Data measured by the sorting unit are analyzed, process and access.
10. the measurement separation system of the chip according to any one of Claims 1 to 5, it is characterised in that the fixture frame
The bottom of component is provided with the 4th drive module, for causing the fixture frame component to be moved left and right and being moved up and down, its
In, multigroup " non-" font fixture storage position is provided with the fixture frame component, the standard fixture is specifically stored in the system
In tool storage position.
The measurement method for separating of 11. a kind of chips, it is characterised in that using the core as any one of claim 1~10
The measurement separation system of piece is measured and analyzed, and methods described includes：
The coordinate information of position scanning generation first wafer is carried out to the first wafer, and by the measurement module to described
First wafer carries out the measurement of photoelectric properties, generates the first metrical information, wherein, the coordinate information includes first wafer
The coordinate information of interior each chip；
First wafer is moved and is fixed on second thing-putting holder by first mechanical arm, by described point
Screening device and the feeding spiral arm carry out sorting operation to first wafer, brilliant by described first according to preset sort regular
In die grading to different standard fixture in circle.
12. methods according to claim 11, it is characterised in that described that position scanning generation is carried out to first wafer
The coordinate information of each chip in first wafer, and photoelectric properties are carried out to first wafer by the measurement module
Measurement, generate the first metrical information, including：
First wafer is fixed on first thing-putting holder, carrying out position to first wafer by the measurement apparatus sweeps
Retouch, obtain the initial markers point of first wafer to generate the coordinate information of first wafer, and to first wafer
The measurement of photoelectric properties is carried out, the first metrical information is generated.
13. methods according to claim 11, it is characterised in that described that position scanning generation is carried out to first wafer
The coordinate information of first wafer, and the measurement of photoelectric properties is carried out to first wafer by the measurement module, it is raw
Into the first metrical information, including：
First wafer is fixed on second thing-putting holder, carrying out position to first wafer by the sorting unit sweeps
Retouch, obtain the initial markers point of first wafer and generate the coordinate information of first wafer；
First wafer is moved and is fixed on first thing-putting holder by first mechanical arm, by the survey
Amount module carries out the measurement of photoelectric properties to first wafer, generates the first metrical information, and the second wafer is fixed on into institute
State on the second thing-putting holder, position scanning is carried out to second wafer, obtain the initial markers point of second wafer and generate
The coordinate information of second wafer, wherein, the coordinate information includes the coordinate information of each chip in second wafer；
It is described first wafer is moved and is fixed on second thing-putting holder by first mechanical arm before, also
Including：
First wafer or second wafer are moved and be fixed on described second by first mechanical arm and is carried
On platform, to cause that second wafer is moved and is fixed on first thing-putting holder；
Then methods described also includes：
The measurement of photoelectric properties is carried out to second wafer by the measurement module, the second metrical information is generated；
Second wafer is moved and is fixed on second thing-putting holder by first mechanical arm, by described point
Screening device and the feeding spiral arm carry out sorting operation to second wafer, brilliant by described second according to preset sort regular
In die grading to different standard fixture in circle.
14. method according to any one of claim 11~13, it is characterised in that position is carried out to first wafer
The coordinate information of scanning generation first wafer, and photoelectric properties are carried out to first wafer by the measurement module
Measurement, after the first metrical information of generation, also includes：
The coordinate information of first wafer and first metrical information are sent to central control system；
It is then described that sorting operation is carried out to first wafer by the sorting unit and the feeding spiral arm, including：
The central control system controls the sorting unit according to the coordinate information and first metrical information of first wafer
Sorting operation is carried out to first wafer with the feeding spiral arm.
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Address after: 243000 Anhui Province Economic and Technological Development Zone Ma'anshan Baoqing Road 399 Building No. 1 Patentee after: Epitop Photoelectric Technology Co., Ltd. Address before: 243000 Anhui province Ma'anshan City West Road Economic Development Zone No. 259 South 1- layer Patentee before: EpiTop Optoelectronic Co., Ltd. |