CN103674966A - Apparatus and method for detecting wafer surface flaws - Google Patents
Apparatus and method for detecting wafer surface flaws Download PDFInfo
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- CN103674966A CN103674966A CN201310656750.XA CN201310656750A CN103674966A CN 103674966 A CN103674966 A CN 103674966A CN 201310656750 A CN201310656750 A CN 201310656750A CN 103674966 A CN103674966 A CN 103674966A
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Abstract
The invention relates to the field of semiconductor device manufacture equipment, and especially relates to an apparatus and a method for detecting wafer surface flaws. The apparatus comprises a main part and a control unit for controlling the main part; and the main part comprises a motion platform provided with a X shaft and a Y shaft which definite a motion plane, a first Z shaft installed on the X shaft and can have perpendicular motion relative to the motion plane, a linear array camera installed on the first Z shaft and focused through the first Z shaft for detecting the wafer surface flaws, a first light source used for assisting the linear array camera for image acquisition, a second Z shaft installed on the X shaft and can have perpendicular motion relative to the motion plane, an area array camera arranged on the second Z shaft and focused through the second Z shaft for reexamining the wafer surface flaws, and a second light source used for assisting the area array camera for image acquisition, wherein the Y shaft can be used to carry wafers. The apparatus and the method provided by the invention are capable of improving the efficiency and the quality of surface flaw detection.
Description
Technical field
The present invention relates to semiconductor fabrication, refer more particularly to a kind of device of realizing crystal column surface Defect Detection.
Background technology
In semiconductor machining and manufacturing industry, the detection of crystal column surface flaw occupies very important role, and it has influence on the working (machining) efficiency of wafer.In order to improve the working (machining) efficiency of wafer, can obtain by the result data of Defect Detection the attributes such as quantity, size, shape and the residing position of flaw of flaw in wafer, according to the residing position of flaw, it is taked to corresponding treatment measures simultaneously.In addition, if wanting the flaw of the wafer to detecting observes, observations can be subject to the impact of wafer size size, the size of wafer is different, comes the effect of the flaw that observation post detects just different, for the larger wafer of size by human eye, can observe by the wafer image of taking out, but for the little wafer of size, the resolution of human eye is limited, cannot observe.
Summary of the invention
The technical problem to be solved in the present invention is, for the above-mentioned defect of prior art, provides a kind of apparatus and method for crystal column surface Defect Detection, the efficiency and the quality that to improve surface blemish, detect.
The technical solution adopted for the present invention to solve the technical problems is: a kind of device for crystal column surface Defect Detection is provided, comprises main part and in order to control the control module of described main part, described main part comprises:
Motion platform, it has the Y-axis of an X-axis and can be relative described X-axis vertical movement, and described X-axis and Y-axis define a plane of movement, and described Y-axis can be in order to carry wafer;
The first Z axis, being installed in also can be with respect to described plane of movement vertical movement in described X-axis;
Line-scan digital camera, is installed on the first described Z axis and focuses by the first Z axis, for crystal column surface Defect Detection;
The first light source, is used for assisting described line-scan digital camera to carry out image acquisition;
The second Z axis, being installed in also can be with respect to described plane of movement vertical movement in described X-axis;
Area array cameras, is installed on the second described Z axis and focuses by the second Z axis, for crystal column surface flaw, checks;
Secondary light source, is used for assisting described area array cameras to carry out image acquisition.
Further preferred version of the present invention is: the first described light source is line source, and it is fixed on the camera lens of described line-scan digital camera; Described secondary light source is pointolite, and it is fixed on the camera lens of described area array cameras.
Further preferred version of the present invention is: described control module comprise department of computer science unify be controlled by described computer system in order to controlling the X-axis motion controller of described X-axis motion, in order to controlling the Y-axis motion controller of described Y-axis motion, in order to control the first Z axis motion controller of described the first Z axis motion and in order to control the second Z axis motion controller of described the second Z axis motion.
Further preferred version of the present invention is: described line-scan digital camera, the first light source, area array cameras and secondary light source are controlled by described computer system; Described line-scan digital camera and area array cameras are that the wafer image that can be collected is sent to described computer system.
Further preferred version of the present invention is: described computer system further comprises: Defect Detection module, in order to the demonstration to wafer image, result and testing result; Data statistics module, in order to adding up the testing result of wafer in batches; Flaw attribute module, in order to make corresponding analysis according to the size of flaw, position and categorical data to flaw; And face battle array check module, in order to flaw is checked, realize and the in the situation that of high-amplification-factor, observe flaw.
Further preferred version of the present invention is: described device also comprises that described delivery mechanism is controlled by described control module in order to wafer to be measured is placed into the delivery mechanism of described Y-axis.
The technical solution adopted for the present invention to solve the technical problems is: a kind of method that adopts said apparatus to carry out crystal column surface Defect Detection is provided, comprises the following steps:
S1, use line-scan digital camera scanning wafer;
S2, to wafer image splicing, and carry out surface blemish detection;
S3, generation wafer mapping graph;
The positional information of the flaw that S4, acquisition are checked;
S5, all-moving surface array camera carry out image acquisition and complete check.
Beneficial effect of the present invention is, by motion control line-scan digital camera, gather wafer image, obtain high-resolution image for carrying out surface blemish detection, after Defect Detection completes, can obtain a series of attribute about flaw, such as type, size and position etc.; These attributes that obtain are the data supportings that generate wafer mapping, wherein positional information is that area array cameras is used for locating use, the approach of area array cameras acquisition flaw location information is that the wafer by generating shines upon, by the flaw in click wafer mapping graph, obtain the position of this flaw, chain of command array camera moves the check of carrying out flaw afterwards, thereby can improve efficiency and quality that surface blemish detects.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the structural representation of the main part of apparatus of the present invention.
Fig. 2 is the block diagram of relation signal between control module and main part in apparatus of the present invention.
Fig. 3 is the schematic diagram that line-scan digital camera gathers wafer image.
Fig. 4 is the schematic diagram that area array cameras carries out flaw check.
Fig. 5 is the principle of work block diagram of apparatus of the present invention.
Fig. 6 is the interface signal of apparatus of the present invention Computer system.
Fig. 7 is the overall flow figure of the inventive method.
Embodiment
Now by reference to the accompanying drawings, preferred embodiment of the present invention is elaborated.
As shown in Figure 1, be the schematic diagram of the present invention for the main part 1 of the device of crystal column surface Defect Detection.Wherein, label 11 is the X-axis in XY motion platform, label 12 is the Y-axis in XY motion platform, label 13 is wafer to be measured, and label 14 is line-scan digital camera, label 15 first light sources, label 16 is area array cameras, label 17 is secondary light source, and label 18 is the first Z axis for line-scan digital camera 14 focusing, and label 19 is the second Z axis for area array cameras 16 focusing.Particularly, the first light source 15 is line source, and it is fixed on the camera lens of line-scan digital camera 14.Secondary light source 17 is pointolite, and it is fixed on the camera lens of area array cameras 16.X-axis 11 and Y-axis 12 definition one plane of movement (surface level).Y-axis 12 can that is to say in order to carry wafer, and Y-axis 12 itself is an objective table.The first Z axis 18 and the second Z axis 19 are installed in the X-axis 11 of XY motion platform in the lump, and preferably, the two is mutually contiguous to make as much as possible area array cameras 16 can aim at same wafer to be measured with line-scan digital camera 14 simultaneously.X-axis 11 can drive the first Z axis 18 and the second Z axis 19 horizontal (left and right) to move, and Y-axis 12 can move relative to X-axis 11 longitudinal (front and back).
As shown in Figure 2, for the block diagram of apparatus of the present invention is illustrated.Apparatus of the present invention 100 comprise above-mentioned main part 1 and the control module 2 being connected with described main part 1.Control module 2 in order to control subject part 1 with obtain wafer to be measured image and and then the image of wafer is processed.Particularly, control module 2 can comprise department of computer science unify be controlled by described computer system in order to controlling the X-axis motion controller of described X-axis motion, in order to controlling the Y-axis motion controller of described Y-axis motion, in order to control the first Z axis motion controller of described the first Z axis motion and in order to control the second Z axis motion controller (scheming not shown) of described the second Z axis motion.Wherein, the line-scan digital camera in main part 1 14, the first light source 15, area array cameras 16 and secondary light source 17 are controlled by described computer system.Described line-scan digital camera 14 and area array cameras 16 are that the wafer image that can be collected is sent to described computer system.Described device 100 also can comprise that wherein, described delivery mechanism is controlled by described control module 2 in order to wafer to be measured is placed into the delivery mechanism (scheming not shown) of described Y-axis.The principle of work of apparatus of the present invention 100 is:
1, calculate and carry out the initial some position of wafer-scanning and the line number that will scan;
2, control line array camera 14 moves to the reference position of scanning in X-axis 11, regulates the focal length of line-scan digital camera 14;
3, control Y-axis 12 and moved that line-scan digital camera 14 carries out wafer-scanning until meet the line number that will scan;
4, the image of resulting a few row wafers is carried out to Image Mosaics, obtain a complete wafer image, carry out surface blemish detection;
5, utilize the attribute of the flaw detecting to generate wafer mapping graph;
6, in wafer mapping graph, select the flaw that will check, thereby obtain the positional information of this flaw;
7, utilize the positional information chain of command array camera 16 obtaining, by the mobile collection image of Y-axis 12, check.
As shown in Figure 3, for line-scan digital camera, gather the schematic diagram of wafer image.Wherein, a few row images of label 26 for obtaining after scanning.The detailed process that line-scan digital camera gathers wafer image is as follows:
1, line-scan digital camera 14 moves to the reference position of scanning;
2, line-scan digital camera 14 is motionless, and the corresponding distance of Y-axis 12 motion (this distance can guarantee the complete of wafer-scanning) scans;
3, line-scan digital camera 14 moves after a live width, repeating step 2;
4, repeating step 3, until whole wafer-scanning completing place.
As shown in 4, the schematic diagram that carries out flaw check for area array cameras.Wherein, the check image of label 36 for collecting.The detailed process that area array cameras carries out flaw check is:
1, obtain flaw to be checked with respect to the positional information of XY motion platform;
2, utilizing positional information to control X-axis 11 moves on this some position with Y-axis 12;
3, gather check image, complete check.
As shown in Figure 5, be the principle of work block diagram of apparatus of the present invention, it describes the groundwork flow process of apparatus of the present invention in detail.In figure, illustrated altogether eight main processes:
P1, computing machine send motion control instruction;
P2, motor movement capture wafer to be detected and are placed on the objective table for surface sweeping image;
P3, computer control line scan camera and objective table cooperative motion are for clapping figure;
P4, line-scan digital camera scanning wafer grabgraf;
P5, by the image transmitting capturing in computing machine, by computing machine, image is carried out to a series of operation, thereby detects the flaw of crystal column surface;
P6, computing machine machine send the motion control instruction of area array cameras and objective table;
P7, area array cameras move to the position of appointment and carry out grabgraf;
P8, the image capturing by observation complete check operation.
As shown in Figure 6, for the interface of apparatus of the present invention Computer system is illustrated.The interface seeing through in figure shows the main modular that computer system comprises: Defect Detection module 21 is mainly the demonstration to wafer image, result and testing result; Data statistics module 22 is mainly a statistics to the testing result of wafer in batches; Flaw attribute module 23, mainly comprises the attributes such as size, position and type of flaw, by these data, can make corresponding analysis to flaw; And flaw check module 24, be mainly for flaw is checked to use, can realize and the in the situation that of high-amplification-factor, observe flaw.
As shown in Figure 7, be the overall flow figure of the inventive method, it comprises the following steps:
S1, line-scan digital camera scanning wafer;
S2, wafer image splicing and surface blemish are detected;
S3, generation wafer mapping graph;
The positional information of the flaw that S4, acquisition are checked;
S5, all-moving surface array camera carry out image acquisition and complete check.
The present invention gathers wafer image by motion control line-scan digital camera 14, obtain high-resolution image for carrying out surface blemish detection, obtain corresponding flaw attribute, according to attribute, generate wafer mapping graph, by wafer mapping graph, obtain the position of flaw to be checked, chain of command array camera 16 moves the check of carrying out flaw again, thereby can improve efficiency and quality that surface blemish detects.
Should be understood that, above embodiment only, in order to technical scheme of the present invention to be described, is not intended to limit, for a person skilled in the art, the technical scheme that can record above-described embodiment is modified, or part technical characterictic is wherein equal to replacement; And these modifications and replacement all should belong to the protection domain of claims of the present invention.
Claims (7)
1. for a device for crystal column surface Defect Detection, comprise main part and in order to control described main part
The control module dividing, is characterized in that, described main part comprises:
Motion platform, it has X-axis and Y-axis that can relative described X-axis vertical movement, described X-axis and Y-axis definition plane of movement, described Y-axis can be in order to carry wafer;
The first Z axis, being installed in also can be with respect to described plane of movement vertical movement in described X-axis;
Line-scan digital camera, is installed on described the first Z axis and by the first Z axis and focuses, for crystal column surface Defect Detection;
The first light source, is used for assisting described line-scan digital camera to carry out image acquisition;
The second Z axis, being installed in also can be with respect to described plane of movement vertical movement in described X-axis;
Area array cameras, is installed on described the second Z axis and by the second Z axis and focuses, and for crystal column surface flaw, checks;
Secondary light source, is used for assisting described area array cameras to carry out image acquisition.
2. device according to claim 1, is characterized in that: described the first light source is line source, and it is fixed on the camera lens of described line-scan digital camera; Described secondary light source is pointolite, and it is fixed on the camera lens of described area array cameras.
3. device according to claim 1, is characterized in that: described control module comprise department of computer science unify be controlled by described computer system in order to controlling the X-axis motion controller of described X-axis motion, in order to controlling the Y-axis motion controller of described Y-axis motion, in order to control the first Z axis motion controller of described the first Z axis motion and in order to control the second Z axis motion controller of described the second Z axis motion.
4. device according to claim 3, is characterized in that: described line-scan digital camera, the first light source, area array cameras and secondary light source are controlled by described computer system; Described line-scan digital camera and area array cameras are that the wafer image that can be collected is sent to described computer system.
5. device according to claim 4, is characterized in that: described computer system further comprises: Defect Detection module, in order to the demonstration of wafer image, result and testing result; Data statistics module, in order to adding up the testing result of wafer in batches; Flaw attribute module, in order to make corresponding analysis according to the size of flaw, position and categorical data to flaw; And face battle array check module, in order to flaw is checked, realize and the in the situation that of high-amplification-factor, observe flaw.
6. device according to claim 1, is characterized in that: described device also comprises that described delivery mechanism is controlled by described control module in order to wafer to be measured is placed into the delivery mechanism of described Y-axis.
7. adopt device described in claim 1 to 6 any one to carry out a method for crystal column surface Defect Detection, it is characterized in that, comprise the following steps:
S1, use line-scan digital camera scanning wafer;
S2, to wafer image splicing, and carry out surface blemish detection;
S3, generation wafer mapping graph;
The positional information of the flaw that S4, acquisition are checked;
S5, all-moving surface array camera carry out image acquisition and complete check.
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| CN104237249A (en) * | 2014-09-11 | 2014-12-24 | 苏州佳祺仕信息科技有限公司 | Tag appearance inspection and detection technological method |
| CN106596555A (en) * | 2015-10-19 | 2017-04-26 | 由田新技股份有限公司 | Optical inspection apparatus employing multi-axis robot arm |
| CN108732189A (en) * | 2018-08-03 | 2018-11-02 | 江苏阿瑞斯智能设备有限公司 | A kind of chip wafer detection device |
| CN112595729A (en) * | 2021-03-03 | 2021-04-02 | 惠州高视科技有限公司 | Mini-LED wafer rapid detection system and method |
| CN112893183A (en) * | 2021-03-02 | 2021-06-04 | 深圳鹏瑞智能科技有限公司 | Online continuous wafer flaw measurement method with abnormal data reminding function |
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| CN116878389A (en) * | 2023-09-07 | 2023-10-13 | 东莞市兆丰精密仪器有限公司 | Combined measurement method, device, system and storage medium |
| CN116878389B (en) * | 2023-09-07 | 2023-12-22 | 东莞市兆丰精密仪器有限公司 | Combined measurement method, device, system and storage medium |
| CN118570178A (en) * | 2024-06-11 | 2024-08-30 | 德车工坊(北京)科技有限公司 | Vehicle pre-inspection data processing method and platform |
| CN118817610A (en) * | 2024-09-19 | 2024-10-22 | 苏州高视半导体技术有限公司 | Wafer inspection method based on wafer inspection system and related products |
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Application publication date: 20140326 |