CN104597389A - Quick evaluation method for plastic encapsulated integrated circuit reliability under marine environment condition - Google Patents
Quick evaluation method for plastic encapsulated integrated circuit reliability under marine environment condition Download PDFInfo
- Publication number
- CN104597389A CN104597389A CN201410812343.8A CN201410812343A CN104597389A CN 104597389 A CN104597389 A CN 104597389A CN 201410812343 A CN201410812343 A CN 201410812343A CN 104597389 A CN104597389 A CN 104597389A
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- packaged integrated
- plastic packaged
- reliability under
- described sample
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a quick evaluation method for plastic encapsulated integrated circuit reliability under a marine environment condition. The quick evaluation method for the plastic encapsulated integrated circuit reliability under the marine environment condition includes that exerting voltage stress, temperature stress, water vapor and atmosphere pressure to a sample, carrying out internal defect inspection on the sample through X-radiography, testing the sample, and judging whether the sample meets production performance and function index requirements. The quick evaluation method for the plastic encapsulated integrated circuit reliability under the marine environment condition fastens the plastic encapsulating material wetting rate and the organic material performance degradation through exerting the high temperature, high pressure and high humidity to simulate the marine environment, and the marine environment condition evaluation test finishing time is shortened to 1 to 2 days from the original 2 months. The quick evaluation method for the plastic encapsulated integrated circuit reliability under the marine environment condition considers the degradation effects of humidity, temperature, pressure, offset electric stress and the like comprehensive environment stress factors to the plastic encapsulated integrated circuit, uses the high-magnification X-ray fluoroscopy to detect the internal defects of the encapsulating material, and enables the evaluation test completeness and precision to be greatly improved.
Description
Technical field
The present invention relates to IC reliability field, particularly relate to plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions.
Background technology
Foreign study statistical report shows, and environmental stress causes in the ratio of integrated circuit (IC) products fault, salt fog accounts for 4%, sand and dust account for 6%, vibration accounts for 28%, humiture up to 60%, so humiture is remarkable especially for the impact of integrated circuit (IC) products.Marine environment is Gao Re and high humidity environment mainly, this environment is very harsh for plastic packaged integrated circuit, if plastic packaged integrated circuit encapsulation is bad, moisture can infiltrate in the chip encapsulated along the gap between person's capsulation material and wire, cause plastic packaged integrated circuit to occur polluting the short circuit etc. caused between popcorn effect, metallized area corrosion open circuit, pin, have a strong impact on service ability and the Long-Time Service reliability of ship's fitting.
At present, plastic packaged integrated circuit reliability assessment mainly adopts high temperature and humidity test, under sample is placed in various temperature, damp condition, tests plastic packaged integrated circuit temperature-resistant wet ability.Existing high temperature and humidity test (as: 40 DEG C/90%R.H., 85 DEG C/85%R.H., 60 DEG C/95%R.H.) for IC reliability Problems existing under evaluating marine environmental conditions is, the required time is longer, usually need more than 1000h to examine, and be difficult to some the specific inefficacy under the hot and humid condition of discovery plastic packaged integrated circuit.
Summary of the invention
For the above-mentioned problems in the prior art, the invention provides plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions.Described method improves by improving the temperature of experimental enviroment, humidity and atmospheric pressure, improves the hydroscopicity of sample closed material, thus accelerates its speed broken down, shorten evaluation time.
In order to achieve the above object, the present invention is by the following technical solutions:
Plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions, comprise the following steps: described sample is applied to voltage stress, applies temperature stress, applies steam, applies atmospheric pressure, by X-ray radiography, inherent vice inspection is carried out to described sample, described sample is tested, judges whether to meet properties of product, functional parameter requirement.
Further, also need to screen plastic packaged integrated circuit before testing, choose the qualified integrated circuit of performance function as plastic packaged integrated circuit sample to be evaluated by test.
Further, also need to clean described sample surfaces before testing, remove surface and oil contaminant, guarantee that described sample surfaces is without breakage, without crack, without distortion, lead-in wire not damaged.
Further, also need to carry out following preliminary work before testing: the organic plates making aluminium oxide ceramic substrate or high-temp resisting high-humidity resisting, conducting wiring live width is greater than 3mm; Be fixed in substrate or organic plates by plastic packaged integrated circuit by socket, by applying bias voltage stress, test the leakage current of plastic packaged integrated circuit, leakage current must not be greater than 10mA; Described substrate or organic plates are placed in test unit cavity.
Further, the method described sample being applied to voltage stress is: to power end, the I/O end applying 5v voltage stress of described sample, by other lead leg ground connection of described sample, then drawn by two end lines and carry out leakage current monitoring, testing tool precision is higher than 1mA.
Further, the temperature applied described sample is 100 DEG C ~ 135 DEG C.
Further, the method described sample being applied to steam is: by evaporation deionized water adjusting ambient temperature, humidity range is adjusted to 50% ~ 100%.
Further, the scope applying atmospheric pressure to described sample is 1 ~ 3 atmospheric pressure.
Further, described sample is applied to every 10 DEG C of raisings 1 times of temperature, the speedup factor described sample being applied to steam is every 10% raising 1 times, and the speedup factor described sample being applied to atmospheric pressure is that every 0.5 atmospheric pressure improves 1 times.
Further, the content adopting X-ray radiography to carry out inherent vice inspection to described sample for whether there is burn into Ion transfer, crack, layering, chip lead come off.
Compared with prior art, invent and have the following advantages:
(1) the present invention is by applying high temperature, high pressure, the high humidity test condition of simulating ocean environment, accelerate the drenched rate of capsulation material, accelerate the degeneration of organic material performance, the marine environmental conditions evaluation test of 2 months need be spent to foreshorten to only need within 1 ~ 2 day, can complete by former;
(2) contemplated by the invention the deterioration impact of the synthetic chemistry laboratory factor pair plastic packaged integrated circuits such as humidity, temperature, pressure, biased electrical stress, and adopt the defect of powerful cryptoscopy encapsulating material inside, increase substantially the integrality of evaluation test, accuracy.Early stage, multiple authentication result of implementation showed, the product defects pattern found in test evaluation and fault test coverage rate reach more than 98%.
Accompanying drawing explanation
Fig. 1 is the process flow diagram of the method for the invention.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
The method flow diagram that embodiment adopts as shown in Figure 1, comprises the following steps:
Step 1, preparation of samples before test.
Choose the sample that performance function is qualified.Clean plastic packaged integrated circuit sample surfaces and removal surface and oil contaminant, guarantee that the sample surfaces chosen is without breakage, without crack, without distortion, lead-in wire not damaged.
Step 2, before test, test prepares.
Make the organic plates of aluminium oxide ceramic substrate or high-temp resisting high-humidity resisting, conducting wiring live width needs to be greater than 3mm, plastic packaged integrated circuit is fixed on substrate by socket, by applying bias voltage stress, the leakage current of plastic packaged integrated circuit is tested, leakage current must not be greater than 10mA, can carry out follow-up test.
Step 3, applies voltage stress to sample.
5v voltage stress is applied, other lead leg ground connection to plastic packaged integrated circuit power end, I/O end.Drawn by two end lines and carry out leakage current monitoring, testing tool choice accuracy needs higher than 1mA.
Applying bias voltage more easily finds the problem because outer ion pollution chip surface causes, as: cause corrosion and the leakage current etc. such as sheath pin hole, lacerated wound, coating bad place.
Step 4, applies temperature stress to sample.
Plastic packaged integrated circuit and substrate are placed in test unit cavity, apply temperature 100 DEG C to 135 DEG C, utilize rising environment temperature to accelerate failure phenomenon and occur, adopt [θ 10 DEG C] rule, every 10 DEG C of speedup factor improves 1 times.
Step 5, applies steam to sample.
By evaporation deionized water, intend marine environment moist conditions at test cavity internal mold, humidity range regulates selects 50%-100%, and speedup factor every 10% improves 1 times.
When humidity is at 50%-100%, steam just can be infiltrated by epoxy resin, when absorb moisture content higher than 0.17% time, aluminum metal wire can be caused to produce galvanic corrosion and then produce open circuit and migration growth phenomenon, meanwhile, steam initiated polymerization thing material depolymerization, polymkeric substance binding ability decline, burn into cavity, wire bonding point are thrown off, electric leakage between lead-in wire, chip and chip bonding die pull-up is opened, pad burn into metallizes or draws short-circuit between conductors.
Step 6, applies atmospheric pressure to sample.
The substrate of fixed sample is placed in test unit cavity, applies high-pressure 1 atmospheric pressure to 3 atmospheric pressures.
Under high pressure plastic packaged integrated circuit surface be in condensation, in high humidity environment, to make steam enter in packaging body, expose the weakness in encapsulation, as the corrosion of layering and metal layer.Water vapor permeable can be accelerated to enter in plastic packaged integrated circuit shell by pressurization.Every 0.5 atmospheric pressure of speedup factor improves 1 times.
Step 7, X ray inherent vice checks: adopt the structure of X ray to plastic packaged integrated circuit inside to take a picture, and checks whether physical imperfections such as there is burn into Ion transfer, crack, layering, chip lead come off.
Step 8, to properties of sample functional test.
Plastic packaged integrated circuit on substrate is tested, judges whether to meet properties of product, functional parameter requirement.
Adopt the method for the invention to carry out evaluation test, speedup factor can reach more than 100 times: the present invention's evaluation test of 12 ~ 96 hours, is equivalent to conventional wet heat test 1000 ~ 4000 hours.And the result of test of many times shows, the product defects pattern found in test evaluation and fault test coverage rate reach more than 98%.
The those of ordinary skill in field is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of the claims in the present invention.
Claims (10)
1. plastic packaged integrated circuit method for quickly evaluating reliability under a marine environmental conditions, it is characterized in that, improve the hydroscopicity of plastic packaged integrated circuit sample encapsulating material to be evaluated by improving the temperature of experimental enviroment, humidity, atmospheric pressure and bias voltage, thus improve evaluation speed; Described method comprises: described sample is applied to voltage stress, applies temperature stress, applies steam, applies atmospheric pressure; By X-ray radiography, inherent vice inspection is carried out to described sample, described sample is tested, judge whether to meet properties of product, functional parameter requirement.
2. plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions according to claim 1, it is characterized in that, also need to screen plastic packaged integrated circuit before testing, choose the qualified integrated circuit of performance function as plastic packaged integrated circuit sample to be evaluated by test.
3. plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions according to claim 1, it is characterized in that, also need to clean described sample surfaces before testing, remove surface and oil contaminant, guarantee that described sample surfaces is without breakage, without crack, without distortion, lead-in wire not damaged.
4. plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions according to claim 1, is characterized in that, also needs to carry out following steps before testing:
Make the organic plates of aluminium oxide ceramic substrate or high-temp resisting high-humidity resisting, conducting wiring live width is greater than 3mm; Be fixed in substrate or organic plates by plastic packaged integrated circuit by socket, by applying bias voltage stress, test the leakage current of plastic packaged integrated circuit, leakage current must not be greater than 10mA; Described substrate or organic plates are placed in test unit cavity.
5. plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions according to claim 1, it is characterized in that, the method described sample being applied to voltage stress is: to power end, the I/O end applying 5v voltage stress of described sample, by other lead leg ground connection of described sample, then 5V voltage line and ground wire are drawn and carry out leakage current monitoring, testing tool precision is higher than 1mA.
6. plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions according to claim 1, is characterized in that, the temperature applied described sample is 100 DEG C ~ 135 DEG C.
7. plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions according to claim 1, it is characterized in that, the method described sample being applied to steam is: by evaporation deionized water adjusting ambient temperature, humidity range is adjusted to 50% ~ 100%.
8. plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions according to claim 1, is characterized in that, the scope described sample being applied to atmospheric pressure is 1 ~ 3 atmospheric pressure.
9. according to plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions in claim 1,6,7,8 described in any one, it is characterized in that, the speedup factor described sample being applied to temperature is every 10 DEG C of raisings 1 times, the speedup factor described sample being applied to steam is every 10% raising 1 times, and the speedup factor described sample being applied to atmospheric pressure is that every 0.5 atmospheric pressure improves 1 times.
10. according to plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions in claim 1 ~ 8 described in any one, it is characterized in that, the content adopting X-ray radiography to carry out inherent vice inspection to described sample for whether there is burn into Ion transfer, crack, layering, chip lead come off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410812343.8A CN104597389B (en) | 2014-12-23 | 2014-12-23 | Plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410812343.8A CN104597389B (en) | 2014-12-23 | 2014-12-23 | Plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104597389A true CN104597389A (en) | 2015-05-06 |
| CN104597389B CN104597389B (en) | 2017-11-03 |
Family
ID=53123298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410812343.8A Expired - Fee Related CN104597389B (en) | 2014-12-23 | 2014-12-23 | Plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104597389B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107505525A (en) * | 2017-09-12 | 2017-12-22 | 浙江大学 | A kind of reliability on-line monitoring system |
| CN108169651A (en) * | 2017-11-22 | 2018-06-15 | 北京无线电计量测试研究所 | A kind of clock crystal oscillator detection method |
| CN110426570A (en) * | 2019-07-15 | 2019-11-08 | 北京遥感设备研究所 | A kind of fast mass consistency check method of plastic packaging SoC device |
| CN112858872A (en) * | 2020-12-31 | 2021-05-28 | 华中光电技术研究所（中国船舶重工集团公司第七一七研究所） | Circuit board health management circuit, device, control method and circuit board health manager |
| CN114323427A (en) * | 2021-12-24 | 2022-04-12 | 中国电子科技集团公司第四十九研究所 | Multi-stress accelerated storage test method based on pressure sensor |
| CN114441515A (en) * | 2021-12-15 | 2022-05-06 | 航天科工防御技术研究试验中心 | Device and method for detecting moisture of plastic packaged device |
| CN114459544A (en) * | 2022-02-17 | 2022-05-10 | 中国电子科技集团公司第五十八研究所 | Evaluation method for comprehensive stress sand dust test of electronic product |
| CN117491814A (en) * | 2023-10-31 | 2024-02-02 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Method for evaluating insulation reliability of plastic package interface |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05302949A (en) * | 1992-04-28 | 1993-11-16 | Hitachi Ltd | Evaluation apparatus of durable lift of electric component |
| CN1858604A (en) * | 2005-04-30 | 2006-11-08 | 中国科学院空间科学与应用研究中心 | Screening method for commercial plastic packaging device space application |
| CN101813954A (en) * | 2010-04-28 | 2010-08-25 | 中国人民解放军国防科学技术大学 | High-temperature variability temperature and humidity environmental test control method and device |
| CN102494695A (en) * | 2011-11-04 | 2012-06-13 | 中国船舶重工集团公司第七0七研究所 | High-efficiency MTBF (Mean Time Between Failures) proof test method applied to ship navigation product |
-
2014
- 2014-12-23 CN CN201410812343.8A patent/CN104597389B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05302949A (en) * | 1992-04-28 | 1993-11-16 | Hitachi Ltd | Evaluation apparatus of durable lift of electric component |
| CN1858604A (en) * | 2005-04-30 | 2006-11-08 | 中国科学院空间科学与应用研究中心 | Screening method for commercial plastic packaging device space application |
| CN101813954A (en) * | 2010-04-28 | 2010-08-25 | 中国人民解放军国防科学技术大学 | High-temperature variability temperature and humidity environmental test control method and device |
| CN102494695A (en) * | 2011-11-04 | 2012-06-13 | 中国船舶重工集团公司第七0七研究所 | High-efficiency MTBF (Mean Time Between Failures) proof test method applied to ship navigation product |
Non-Patent Citations (1)
| Title |
|---|
| 杜社会等: "大规模集成电路相关测试标准的剖析", 《半导体技术》 * |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107505525A (en) * | 2017-09-12 | 2017-12-22 | 浙江大学 | A kind of reliability on-line monitoring system |
| CN108169651A (en) * | 2017-11-22 | 2018-06-15 | 北京无线电计量测试研究所 | A kind of clock crystal oscillator detection method |
| CN108169651B (en) * | 2017-11-22 | 2021-05-11 | 北京无线电计量测试研究所 | Clock crystal oscillator detection method |
| CN110426570A (en) * | 2019-07-15 | 2019-11-08 | 北京遥感设备研究所 | A kind of fast mass consistency check method of plastic packaging SoC device |
| CN110426570B (en) * | 2019-07-15 | 2021-10-26 | 北京遥感设备研究所 | Rapid quality consistency inspection method for plastic package SoC device |
| CN112858872A (en) * | 2020-12-31 | 2021-05-28 | 华中光电技术研究所（中国船舶重工集团公司第七一七研究所） | Circuit board health management circuit, device, control method and circuit board health manager |
| CN114441515B (en) * | 2021-12-15 | 2023-12-05 | 航天科工防御技术研究试验中心 | Device and method for detecting moisture of plastic package device |
| CN114441515A (en) * | 2021-12-15 | 2022-05-06 | 航天科工防御技术研究试验中心 | Device and method for detecting moisture of plastic packaged device |
| CN114323427A (en) * | 2021-12-24 | 2022-04-12 | 中国电子科技集团公司第四十九研究所 | Multi-stress accelerated storage test method based on pressure sensor |
| CN114459544B (en) * | 2022-02-17 | 2023-09-12 | 中国电子科技集团公司第五十八研究所 | Comprehensive stress sand dust test evaluation method for electronic product |
| CN114459544A (en) * | 2022-02-17 | 2022-05-10 | 中国电子科技集团公司第五十八研究所 | Evaluation method for comprehensive stress sand dust test of electronic product |
| CN117491814A (en) * | 2023-10-31 | 2024-02-02 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Method for evaluating insulation reliability of plastic package interface |
| CN117491814B (en) * | 2023-10-31 | 2024-04-26 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Method for evaluating insulation reliability of plastic package interface |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104597389B (en) | 2017-11-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104597389A (en) | Quick evaluation method for plastic encapsulated integrated circuit reliability under marine environment condition | |
| CN111579972B (en) | Service life detection method for PCBA board-level component | |
| CN107797036B (en) | Method for evaluating composite insulator interface performance based on high voltage and salt solution | |
| Ueta et al. | Insulation characteristics of epoxy insulator with internal void-shaped micro-defects | |
| CN103077913A (en) | Lead-out device for aging bare chips and aging method | |
| CN105572561A (en) | Universal type test device for failure analysis of chip | |
| CN104345276A (en) | Method for testing attenuation of photovoltaic assembly | |
| US11166401B2 (en) | Dye and pry process for surface mount technology dual in-line memory module | |
| CN102445466B (en) | Method for determining heat resistance of circuit board and device thereof | |
| CN105388413A (en) | Chip failure analysis instrument | |
| Sood | Root-Cause Failure Analysis of Electronics | |
| CN113064001B (en) | Method for evaluating welding heat resistance of plastic package component | |
| JP2010038639A (en) | Reliability evaluation method of semiconductor device, and reliability evaluation device of semiconductor device | |
| CN105425139A (en) | Chip failure analysis test equipment | |
| KR101055593B1 (en) | Repair method of pattern part | |
| CN103364674A (en) | Method for judging glass fiber bundle anode leakage and failure | |
| Yong et al. | Reliability evaluation and selection of underfill adhesives | |
| Zhan et al. | Dendritic growth on the die under hermetic high temperature operation | |
| Shuai et al. | Destructive Physical Analysis Methods of Flip Chip Packaging Devices for High Reliability | |
| JPS59500288A (en) | electrical inspection | |
| Steiner et al. | Copper and silver sintered die-attach compared in HV-H3TRB and thermal shock cycling | |
| Koscielski et al. | The influence of corner bonding and underfilling techniques on the reliability of 3D TMV PoP structures in SMT assembly | |
| Preu et al. | A study on electrochemical effects in external capacitor packages | |
| CN106932706B (en) | A kind of ceramic package monolithic integrated circuit structure analysis method | |
| CN111397657A (en) | Method and device for testing shipment risk of board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171103 Termination date: 20201223 |