CN105388413A - Chip failure analysis instrument - Google Patents
Chip failure analysis instrument Download PDFInfo
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- CN105388413A CN105388413A CN201510916674.0A CN201510916674A CN105388413A CN 105388413 A CN105388413 A CN 105388413A CN 201510916674 A CN201510916674 A CN 201510916674A CN 105388413 A CN105388413 A CN 105388413A
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- chip
- metal
- under test
- sheet metal
- hole
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a chip failure analysis instrument. The test fixture of the chip failure analysis instrument comprises a bottom board, a carrying board and a clamping board; metal protrusions are evenly arranged at the center of the bottom board; evenly-distributed through holes which are corresponding to the metal protrusions pass through the upper surface and lower surface of the carrying board; connecting pieces connected with the pins of a tested chip are arranged in the through holes; each connecting piece comprises a metal thin sheet arranged at the upper surface of the carrying plate and a metal probe connected with the lower part of the metal thin sheet; the metal probe is sleeved with an elastic component; the elastic component is fixed to the inner wall of a corresponding through hole; when the tested chip is arranged at the upper surface of the carrying board, the clamping board is slightly pressed on the tested chip, the pins of the tested chip are pressed on the metal thin sheets, and the elastic components are compressed at the same time, and the metal probes are electrically connected with the metal protrusions; and the test machine of the chip failure analysis instrument is used for outputting test signals to the tested chip and is electrically connected with the metal protrusions selectively. The chip failure analysis instrument of the invention is a test apparatus which can be widely applied to the failure analysis of chips of various kinds of packaging structures.
Description
Technical field
The present invention relates to chip failure analysis technical field, particularly relate to the testing apparatus that a kind of chip that can be widely used in various encapsulating structure carries out failure analysis.
Background technology
In general, integrated circuit lost efficacy inevitable in development, production and use procedure, along with people's improving constantly product quality and reliability requirement, failure analysis work also seems more and more important, analyzed by chip failure, Integrated circuit designers can be helped to find not mating of the defect in design, technological parameter or the problem such as improper in designing and operating.Specifically, the meaning of failure analysis is mainly manifested in the following aspects to the meaning main manifestations of failure analysis: failure analysis is the necessary means determining chip failure mechanism.Failure analysis is that effective fault diagnosis provides necessary information.Failure analysis is the design that design engineer updated or repaired chip, and making it coincide more with design specifications provides necessary feedback information.Failure analysis can assess the validity of different test vector, for production test provides necessary supplementing, for validation test process optimization is submitted necessary information basis.Failure analysis key step and content chip Kaifeng: remove IC sealing, keep the intact of chip functions simultaneously, keep die, bondpads, bondwires and even lead-frame injury-free, for next step chip failure analysis design mothod is prepared.SEM scanning electron microscope/EDX constituent analysis: comprise material structure analysis/Observation of Defects, element forms conventional micro-zone analysis, accurately measure component size etc.Probe test: obtain IC internal electrical signal efficiently and easily with microprobe.Radium-shine cutting: with micro laser beam line disconnection or specific region, chip upper strata.
In the process improving product yield, Production Engineer needs to carry out electrically and physical failure analysis defective product, thus diagnoses product.Analyzed by electrical property failure, often can find out the position of defect on domain, for the concrete condition of clear and definite defect, need to carry out physical failure analysis, mainly comprise delamination, focused ion beam, scanning electron microscope (TEM), VC location technology and defect chemistry constituent analysis.Electrical property failure analysis is the prerequisite of physical failure analysis, and physical failure analysis result is object and the evidence of electrical property failure analysis.In failure analysis, each step work fit applications is indispensable.
In order to determine physical failure analysis and electrical property failure analysis, need to carry out connecting test to each pin of chip, and in detection industry, often run into the chip of various sizes and encapsulated type, often kind of chip needs to make fixture before test, this is a quite loaded down with trivial details job, is therefore necessary to develop the testing apparatus that a kind of chip that can be widely used in various encapsulating structure carries out failure analysis.
Summary of the invention
The object of this invention is to provide the testing apparatus that a kind of chip that can be widely used in various encapsulating structure carries out failure analysis.
To achieve these goals, technical scheme provided by the invention is: provide a kind of chip failure analytical instrument, comprising:
Test fixture, described test fixture comprises base plate, support plate and clamping plate, described base plate central authorities are provided with the metal bump be evenly arranged, run through described support plate upper surface, lower surface is provided with the through hole that be evenly arranged corresponding with described metal bump, the web member for being connected with the pin of chip under test is provided with in described through hole, described web member comprises the sheet metal of being located at described support plate upper surface and the metal probe under being connected to described sheet metal, described metal probe is arranged with elastomeric element, and described elastomeric element is fixed on described through-hole wall, when chip under test is placed in described support plate upper surface, described clamping plate are gently pressed on described chip under test, the pin of chip under test is pressed on described sheet metal, described elastomeric element is compressed together, and described metal probe and described metal bump are electrically connected,
Pressure transducer, described pressure transducer is located at immediately below described metal bump and is located, and when described clamping plate are gently pressed on described chip under test, described pressure transducer outwardly exports on-state signal.
Tester table, described tester table is used for exporting test signal to chip under test, and is electrically connected with described metal bump according to described on-state signal behavior.
Be located at described support plate upper surface described golden thin slice dimpling.
Described base plate is also provided with P.e.c. and some metal columns, described P.e.c. one end and described metal bump are electrically connected, and the other end and described metal column are electrically connected, and described tester table is selectively with arbitrary, and described metal column is electrically connected.
Described sheet metal and described metal probe are structure as a whole, and described elastomeric element is lower end has boss to described through-hole wall direction projection, and described elastomeric element is spring, and described spring upper end contacts at the lower surface of described sheet metal, described lower spring end is sticked in described through-hole wall place by described boss.
Be provided with electro-magnetic screen layer in described through hole, and be coated with coarse insulation layer structure at described through-hole wall place.
Described through hole is divided into upper and lower two sections, and the epimere internal diameter of described through hole is a bit larger tham hypomere internal diameter, and forming station stage structure between hypomere and epimere, and described spring upper end contacts at the lower surface of described sheet metal, described lower spring end is sticked on described ledge structure.
Described through hole is up big and down small round table-like structure, and described spring upper end contacts at the lower surface of described sheet metal, and described lower spring end is sticked in described through-hole wall place.
Described clamping plate comprise cleat body and can be connected to the fixed head of described cleat body bottom, described fixed head offers pickup groove according to the profile of chip under test, and chip under test is embedded in described pickup groove, described fixed head is threaded fixing with described cleat body.
Also comprise high power camera, described high power camera is located at above described clamping plate, and described cleat body and fixed head are highly transparent structure, when described clamping plate are gently pressed on described chip under test and are pressed on described sheet metal by the pin of chip under test, whether the contact observing the pin of chip under test and described sheet metal by described high power camera is good.
Described sheet metal is brushed with for the tin paste layer or conductive silver slurry layer with chip under test pin good contact.
Compared with prior art, chip failure analytical instrument of the present invention, due in described support plate, run through described support plate upper surface and lower surface is provided with the through hole be evenly arranged, therefore, when chip under test is positioned on described support plate, it is no matter the chip of which kind of encapsulated type, all pin can be placed on the described sheet metal on described through hole, described sheet metal is owing to being electrically connected with described metal probe, therefore during described sheet metal pressurized, described metal probe is connected with described metal bump, and the described metal bump of correspondence only need be electrically connected by described tester table, then can to chip under test input test signal.Therefore, the present invention is the testing apparatus that a kind of scope of application can tested different chips is extremely wide, highly shortened the research and development time of testing apparatus and reduces the development cost of equipment.
By following description also by reference to the accompanying drawings, the present invention will become more clear, and these accompanying drawings are for explaining embodiments of the invention.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of a chip failure analytical instrument of the present invention embodiment.
Fig. 2 is the structural representation of an embodiment of the base plate of chip failure analytical instrument as shown in Figure 1.
Fig. 3 is the structural representation of an embodiment of the support plate of chip failure analytical instrument as shown in Figure 1.
Fig. 4 is the structural representation of an embodiment of the web member of chip failure analytical instrument as shown in Figure 1.
Fig. 5 is the schematic diagram of the cross section structure of an embodiment of the through hole of chip failure analytical instrument as shown in Figure 1.
Fig. 6 is the schematic diagram of the cross section structure of another embodiment of the through hole of chip failure analytical instrument as shown in Figure 1.
Embodiment
With reference now to accompanying drawing, describe embodiments of the invention, element numbers similar in accompanying drawing represents similar element.As mentioned above, as shown in figures 1 to 6, the chip failure analytical instrument 100 that the embodiment of the present invention provides, comprising:
Test fixture 1, described test clip 1 tool comprises base plate 10, support plate 11 and clamping plate 12, described base plate 10 central authorities are provided with the metal bump 101 be evenly arranged, run through described support plate 11 upper surface, lower surface is provided with the through hole 110 that be evenly arranged corresponding with described metal bump 101, the web member 111 for being connected with the pin of chip under test is provided with in described through hole 110, described web member 111 comprises the sheet metal 1110 of being located at described support plate 11 upper surface and the metal probe 1111 under being connected to described sheet metal 1110, described metal probe 1111 is arranged with elastomeric element, and described elastomeric element is fixed on described through hole 110 inwall, when chip under test 2 is placed in described support plate 11 upper surface, described clamping plate 12 are gently pressed on described chip under test 2, the pin of chip under test 2 is pressed on described sheet metal 1110, described elastomeric element is compressed together, and described metal probe 1111 is electrically connected with described metal bump 101, in the present embodiment, the metal bump 101 that described base plate 10 central authorities lay and the described through hole 110 that described support plate 11 is arranged are all arrays, projection in this array and the quantity of through hole and protrudingly also can to pre-set with the size of through hole, according to the spacing setting between the structure of the pin of chip common at present and pin.It should be noted that, due to the chip of currently available technology encapsulating structure normally: dual-in-line package (DIP), little outline packages (SOP), small-sized package (SOJ), go between flat package (QFP) on four sides, ball grid array (BGA) structure, various encapsulating structure above, no matter which kind of encapsulates, substantially can be divided into and pin is arranged to common pin shape, or ball grid array shape, only need guarantee pin and described sheet metal 1110 good contact, if and when chip under test 2 is placed in described sheet metal 1110, if when the area of the too thick and described sheet metal of pin is less than pin surface of contact, one of this chip under test 2 pin can be contacted simultaneously two adjacent described sheet metals 1110, now, usually only one of them and described tester table 3 in two adjacent described sheet metals 1110 need be electrically connected, described tester table 3 pairs of chip under test 2 are not hindered to export test signal.In addition, described metal bump 101 is corresponding with the size of described through hole 110, and can need prefabricated described base plate 10 and described support plate 11 according to test.
Pressure transducer (figure does not show), described pressure transducer is located at immediately below described metal bump 101 and is located, and when described clamping plate 12 are gently pressed on described chip under test 2, described pressure transducer outwardly exports on-state signal.
Tester table 3, described tester table 3 for exporting test signal to chip under test 2, and is electrically connected with described metal bump 101 according to described on-state signal behavior.The quantity of the described metal bump 101 on described base plate 10 can be huger, so conveniently can test the chip under test 2 of different pin number, therefore in test process, only need by the described metal bump 101 that touches by the pin of described test chip 2 carry out being electrically connected.Which kind of test signal described tester table 3 exports, and the chip testing normally sent out out by hardware description language verilog is encouraged.
In one embodiment, be located at described support plate 11 upper surface described golden thin slice 1110 dimpling.The object arranged by described sheet metal 1110 dimpling to make the pin of chip under test 2 contact with described sheet metal 1110 better, and it is bad to distinguish which part contact better, such as whether there is the situation that a pin does not push down corresponding described sheet metal 1110 just over the ground.
In one embodiment, as shown in Figure 2, described base plate 10 is also provided with P.e.c. and metal column 102, Figure 2 shows that the described metal column 102 just exemplifying part, described P.e.c. one end and described metal bump 101 are electrically connected, the other end and described metal column 102 are electrically connected, and described tester table 3 is selectively with arbitrary, and described metal column 102 is electrically connected.Described metal column 102, by being threadedly connected on described base plate 10, can being unloaded down, be loaded onto again, be convenient for carrying and preserve when needs use by described metal column 102 at ordinary times.
In one embodiment, described sheet metal 1110 is structure as a whole with described metal probe 1111, and described elastomeric element is lower end has boss 1113 to described through hole 110 inwall direction projection, and described elastomeric element is spring 1112, and described spring 1112 upper end contacts at the lower surface of described sheet metal 1110, described spring 1112 lower end is sticked in described through hole 110 inwall place by described boss 1113.Owing to being provided with described boss 1113, therefore, it is possible to guarantee that the described web member 111 do not struck the beam does not contact with described metal bump 101.
In an embodiment, in described through hole 110, be provided with electro-magnetic screen layer, and be coated with coarse insulation layer structure at described through hole 110 inwall place.By arranging described electro-magnetic screen layer, mutually can shield the electromagnetic interference (EMI) between adjacent described metal probe 1111, and described insulation layer structure can be guaranteed to keep insulating between described metal probe 1111 and described support plate 11, coarse interior wall construction then can guarantee that described boss 1113 can be sticked in described through hole 110 inwall place well.
In an embodiment, be illustrated in figure 5 the schematic diagram of the cross section structure of an embodiment of through hole 110.Described through hole 110 is divided into upper and lower two sections, and the epimere internal diameter of described through hole 110 is a bit larger tham hypomere internal diameter, and forming station stage structure 1101 between hypomere and epimere, and described spring 1112 upper end contacts at the lower surface of described sheet metal 1110, described spring 1112 lower end is sticked on described ledge structure 1101.Namely be the epimere described spring 1112 being limited in described through hole 110, in the present embodiment, described through hole 110 epimere and hypomere must ensure coaxial configuration, and due to described through hole 110 upper and lower two sections for die sinking can be separated, then by pasting fixing or being threaded fixing.
In an embodiment, be illustrated in figure 6 the cross section structure schematic diagram of another embodiment of through hole 110.Described through hole 110 is up big and down small round table-like structure, and described spring 1112 upper end contacts at the lower surface of described sheet metal 1110, and described spring 1112 lower end is sticked in described through hole 110 inwall place.The present embodiment is compared in embodiment as shown in Figure 5, and its processing and making process is simpler and easy, but higher to the mechanical property requirements of described support plate 11 material, needs more robust material.
In an embodiment, as shown in Figure 1, described clamping plate 12 comprise cleat body 121 and can be connected to the fixed head 122 of described cleat body 121 bottom, described fixed head 122 offers pickup groove according to the profile of chip under test 2, and chip under test 2 is embedded in described pickup groove, described fixed head 122 is threaded fixing with described cleat body 121.By described clamping plate 12 are divided into two-part structure, therefore, at every turn for the chip under test 2 of different model, size, only need transform described fixed head 122, effectively can reduce development difficulty and the cost of development of masterplate.
In an embodiment, as shown in Figure 1, also comprise high power camera 4, described high power camera 4 is located at above described clamping plate 12, and described cleat body 121 and fixed head 122 are highly transparent structure, when being gently pressed on described chip under test 2 when described clamping plate 12 and being pressed on described sheet metal 1110 by the pin of chip under test 2, whether the contact observing the pin of chip under test 2 and described sheet metal 1110 by described high power camera 4 is good.Described high power camera 4 must combinationally use by the computing machine connected with display, in addition, in the present embodiment, if run into small-sized chip under test 2, it directly can fix with on described fixed head 122, and be placed on described sheet metal 1110, now described fixed head 122 does not connect described cleat body 121, so directly carry out observing and aiming at, its better effects if by described high power camera 4.
In an embodiment, described sheet metal 1110 is brushed with for the tin paste layer or conductive silver slurry layer with chip under test 2 pin good contact.By described tin paste layer or conductive silver slurry layer, the performance in electrical contact between chip under test 2 and described sheet metal 1110 greatly can be improved.Applicant, in long-term operating process, finds that the described tin paste layer of brush or conductive silver slurry layer are splendid to improve the effect of performance in electrical contact, is especially applicable to small size chip under test 2.
Composition graphs 1-6, compared with prior art, chip failure analytical instrument 100 of the present invention, due in described support plate 11, run through described support plate 11 upper surface and lower surface is provided with the through hole 110 be evenly arranged, therefore, when chip under test 2 is positioned on described support plate 11, it is no matter the chip of which kind of encapsulated type, all pin can be placed on the described sheet metal 1110 on described through hole 110, described sheet metal 1110 is owing to being electrically connected with described metal probe 1111, therefore during described sheet metal 1110 pressurized, described metal probe 1111 is connected with described metal bump 101, and the described metal bump 101 of correspondence only need be electrically connected by described tester table 3, then can to chip under test 2 input test signal.Therefore, the present invention is the testing apparatus that a kind of scope of application can tested different chips is extremely wide, highly shortened the research and development time of testing apparatus and reduces the development cost of equipment.
Above disclosedly be only the preferred embodiments of the present invention, certainly can not limit the interest field of the present invention with this, therefore according to the equivalent variations that the present patent application the scope of the claims is done, still belong to the scope that the present invention is contained.
Claims (10)
1. a chip failure analytical instrument, is characterized in that, comprising:
Test fixture, described test fixture comprises base plate, support plate and clamping plate, described base plate central authorities are provided with the metal bump be evenly arranged, run through described support plate upper surface, lower surface is provided with the through hole that be evenly arranged corresponding with described metal bump, the web member for being connected with the pin of chip under test is provided with in described through hole, described web member comprises the sheet metal of being located at described support plate upper surface and the metal probe under being connected to described sheet metal, described metal probe is arranged with elastomeric element, and described elastomeric element is fixed on described through-hole wall, when chip under test is placed in described support plate upper surface, described clamping plate are gently pressed on described chip under test, the pin of chip under test is pressed on described sheet metal, described elastomeric element is compressed together, and described metal probe and described metal bump are electrically connected,
Pressure transducer, described pressure transducer is located at immediately below described metal bump and is located, and when described clamping plate are gently pressed on described chip under test, described pressure transducer outwardly exports on-state signal.
Tester table, described tester table is used for exporting test signal to chip under test, and is electrically connected with described metal bump according to described on-state signal behavior.
2. chip failure analytical instrument as claimed in claim 1, is characterized in that, be located at described support plate upper surface described golden thin slice dimpling.
3. chip failure analytical instrument as claimed in claim 1, it is characterized in that, described base plate is also provided with P.e.c. and some metal columns, described P.e.c. one end and described metal bump are electrically connected, the other end and described metal column are electrically connected, and described tester table is selectively with arbitrary, and described metal column is electrically connected.
4. chip failure analytical instrument as claimed in claim 2, it is characterized in that, described sheet metal and described metal probe are structure as a whole, and described elastomeric element is lower end has boss to described through-hole wall direction projection, and described elastomeric element is spring, and described spring upper end contacts at the lower surface of described sheet metal, described lower spring end is sticked in described through-hole wall place by described boss.
5. chip failure analytical instrument as claimed in claim 4, is characterized in that, be provided with electro-magnetic screen layer in described through hole, and be coated with coarse insulation layer structure at described through-hole wall place.
6. chip failure analytical instrument as claimed in claim 4, it is characterized in that, described through hole is divided into upper and lower two sections, and the epimere internal diameter of described through hole is a bit larger tham hypomere internal diameter, and forming station stage structure between hypomere and epimere, and described spring upper end contacts at the lower surface of described sheet metal, described lower spring end is sticked on described ledge structure.
7. chip failure analytical instrument as claimed in claim 4, it is characterized in that, described through hole is up big and down small round table-like structure, and described spring upper end contacts at the lower surface of described sheet metal, and described lower spring end is sticked in described through-hole wall place.
8. chip failure analytical instrument as claimed in claim 1, it is characterized in that, described clamping plate comprise cleat body and can be connected to the fixed head of described cleat body bottom, described fixed head offers pickup groove according to the profile of chip under test, and chip under test is embedded in described pickup groove, described fixed head is threaded fixing with described cleat body.
9. chip failure analytical instrument as claimed in claim 7, it is characterized in that, also comprise high power camera, described high power camera is located at above described clamping plate, and described cleat body and fixed head are highly transparent structure, when described clamping plate are gently pressed on described chip under test and are pressed on described sheet metal by the pin of chip under test, whether the contact observing the pin of chip under test and described sheet metal by described high power camera is good.
10. chip failure analytical instrument as claimed in claim 1, it is characterized in that, described sheet metal is brushed with for the tin paste layer or conductive silver slurry layer with chip under test pin good contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510916674.0A CN105388413B (en) | 2015-12-10 | 2015-12-10 | Chip failure analysis instrument |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510916674.0A CN105388413B (en) | 2015-12-10 | 2015-12-10 | Chip failure analysis instrument |
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| CN105388413A true CN105388413A (en) | 2016-03-09 |
| CN105388413B CN105388413B (en) | 2023-06-09 |
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| CN201510916674.0A Active CN105388413B (en) | 2015-12-10 | 2015-12-10 | Chip failure analysis instrument |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106841848A (en) * | 2016-12-22 | 2017-06-13 | 深圳市广和通无线股份有限公司 | Wireless module test fixture and wireless module test system |
| CN109031102A (en) * | 2018-09-20 | 2018-12-18 | 北方电子研究院安徽有限公司 | A kind of apparatus for testing chip |
| CN109708810A (en) * | 2019-02-21 | 2019-05-03 | 钛深科技(深圳)有限公司 | A kind of apparatus and system for film tactile sensing chip testing |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204495961U (en) * | 2015-03-02 | 2015-07-22 | 山东盛品电子技术有限公司 | A kind of aging board chip testing plate |
| CN205484688U (en) * | 2015-12-10 | 2016-08-17 | 华测检测认证集团股份有限公司 | Chip failure analysis appearance |
-
2015
- 2015-12-10 CN CN201510916674.0A patent/CN105388413B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204495961U (en) * | 2015-03-02 | 2015-07-22 | 山东盛品电子技术有限公司 | A kind of aging board chip testing plate |
| CN205484688U (en) * | 2015-12-10 | 2016-08-17 | 华测检测认证集团股份有限公司 | Chip failure analysis appearance |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106841848A (en) * | 2016-12-22 | 2017-06-13 | 深圳市广和通无线股份有限公司 | Wireless module test fixture and wireless module test system |
| CN109031102A (en) * | 2018-09-20 | 2018-12-18 | 北方电子研究院安徽有限公司 | A kind of apparatus for testing chip |
| CN109031102B (en) * | 2018-09-20 | 2021-03-30 | 北方电子研究院安徽有限公司 | Chip testing device |
| CN109708810A (en) * | 2019-02-21 | 2019-05-03 | 钛深科技(深圳)有限公司 | A kind of apparatus and system for film tactile sensing chip testing |
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| Publication number | Publication date |
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| CN105388413B (en) | 2023-06-09 |
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