CN109708810A - A kind of apparatus and system for film tactile sensing chip testing - Google Patents
A kind of apparatus and system for film tactile sensing chip testing Download PDFInfo
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Abstract
The present invention discloses a kind of device for film tactile sensing chip testing, it include: the air bag pressure unit for the sealing ventilation chamber for being used to form airbag structure with one, pressure control portion including air intake control valve and pressure-detecting device, the sensor supporting part of loading plate with multiple load bearing units, it and include the test circuit portion of the multi channel signals conditioning circuit for being handled the signal of the sensing chip test lead output to be measured, the device, which is able to achieve, makes testing pressure equably by way of air bag pressure, it is applied on film tactile sensing chip to be measured in large area, and sensor supporting part and multiple channel test circuit is combined to realize batch testing to film tactile sensing chip to be measured.Further, invention additionally discloses a kind of systems for film tactile sensing chip testing, are based on above-mentioned apparatus, and the automatic test of film tactile sensing chip multiple performance is realized by the inclusion of the test software of multiple pressure models.
Description
Technical field
The invention belongs to sensor testing techniques fields, and in particular to the measuring technology of softness haptic perception sensing chip.
Background technique
Since film tactile sensing chip is in wearable health monitoring equipment, electronic skin, biomedical diagnostic, medical treatment
The huge applications potentiality in the fields such as instrument and robot make it be increasingly becoming the heat in current thin film tactile sensing chip research field
One of point.Film tactile sensing chip needs to carry out it before factory the test of various performance parameters, and mainly items refer to
It marks the variation for ambient pressure to respond, such as sensing chip measurement range, sensitivity, repeatability, signal hysteresis loop line, signal drift
Move etc..
Since film tactile sensing chip majority is in development phase, test equipment majority is simply to build, Huo Zhezhi
Connect using silicon piezoresistive pressure sensor of the test conventional pressure sensor such as based on MEMS technology, silicon strain gauge pressure sensor,
The test equipments of the hard substrate devices such as piezo-ceramic pressure sensor is tested, and test method usually utilizes pressure gauge or again
Object carries out pressure test to sensor, but the application of this mode pressure is uneven, also unstable, and testing efficiency is low, testability
It can quality control that is single and being not readily used for volume production.
Summary of the invention
To solve the above problems, the present invention proposes a kind of device for film tactile sensing chip testing, pass through air bag
Pressure mode is applied to testing pressure equably, in large area on film tactile sensing chip to be measured, and holds in conjunction with sensor
Load portion and multiple channel test circuit realize batch testing to film tactile sensing chip to be measured.Further, it is also proposed that Yi Zhongji
In the device for film tactile sensing chip testing, film tactile can be realized by the inclusion of the test software of multiple pressure models
The automatic test of sensing chip multiple performance.
Technical scheme is as follows:
Scheme one: the present invention discloses a kind of device for film tactile sensing chip testing, comprising:
Air bag pressure unit, the sealing ventilation chamber for being used to form airbag structure with one, the air bag is in test for side
The sensing unit of sensing chip provides the pressure uniformly directly contacted；
Pressure control portion comprising air intake control valve and pressure-detecting device, the sealing ventilation chamber are controlled by air inlet
Valve is connect with gas source, and the pressure-detecting device is for detecting the intracavitary air pressure of sealing ventilation；
Sensor supporting part comprising the loading plate with multiple load bearing units, the load bearing unit is configured with one group of gold
Belong to probe, described metal probe one end is configured to connect with the test lead of sensing chip to be measured, and the other end is configured to and surveys
Try circuit portion connection；
Test circuit portion comprising the multi-pass for being handled the signal of the sensing chip test lead output to be measured
Road signal conditioning circuit；
When sensing chip to be measured is placed on the load bearing unit and does not start test, the air bag pressure unit is to biography to be measured
Sense chip does not generate pressure；When test, after gas enters sealing ventilation chamber, the air bag pressure unit forms airbag structure, and right
The sensing unit of sensing chip to be measured presses.
As a preferred embodiment, the air bag pressure unit include a hard lid with top surface and side wall and with it is described
The elastic film of hard lid bottom surface connection；The sealing ventilation chamber is configured to caping and side wall and bullet by hard lid
Property film enclose, the hard lid be equipped with ventilation interface.
As a preferred embodiment, which further includes for the elastic film to be fixed on the thin of hard lid bottom surface
Film fixed frame, can accommodate the loading plate in the frame of the film fixed frame, and when test, the loading plate is placed in the film and consolidates
Determine in circle and adjacent with the elastic film.
As a preferred embodiment, the elastic film is TPU film, silica gel thin film or latex material film.
As a preferred embodiment, which further includes for accommodating pressure control portion and testing the cabinet of circuit portion.
As a preferred embodiment, which further includes the support plate for fixing the loading plate, and the support plate is solid
It is scheduled on the cabinet；The metal probe is electrical with the intracorporal signal conditioning circuit of case after the test board and support plate
Connection.
As a preferred embodiment, the load bearing unit is also configured with gas vent, for the biography to be measured with cavity structure
The exhaust of sense chip.
As a preferred embodiment, the signal conditioning circuit include sequentially connected amplifier sub-circuit, MCU processor and
First communication module, and the power module for powering for amplifier sub-circuit, MCU processor and first communication module.
As a preferred embodiment, the communication module is wireless communication module.
As a preferred embodiment, the amplifier sub-circuit selects LM324, and the MCU processor is selected
EFM8LB12F64, the first communication module are bluetooth module.
Scheme two: invention additionally discloses a kind of systems for film tactile sensing chip testing comprising user terminal
And the device for the chip testing of film tactile sensing as described in scheme one；The user terminal includes processor, storage
Device, second communication module and display module, the memory are stored with the film tactile sensing chip comprising multiple pressure models
Test software；The pressure model, which is used to react, applies pressure and the relationship for the time that presses to realize film tactile sensing chip not
With the test of performance；The film tactile sensing chip testing software is executed when being run by processor to give an order:
The pressure model selected of response user, in control pressure control unit when the switch degree and switch of air intake control valve
Between, corresponding pressure is applied to film tactile sensing chip to be measured in sensor supporting part with the air bag formed by sealing ventilation chamber
Power；
The electric signal exported after air bag by film tactile sensing chip stress to be measured for receiving test circuit portion output turns
The digital signal changed；
The output valve of film tactile sensing chip electric signal to be measured is drawn automatically according to the digital signal with application pressure
The relation curve of variation and variation；
It stores and shows the relation curve, complete film tactile sensing chip correlated performance test to be measured.
As a preferred embodiment, the pressure model includes measurement range to film tactile sensing chip to be measured, spirit
The test of sensitivity, repeatability, signal hysteresis loop line, signal drift performance.
The utility model has the advantages that
1) large area, the distribution of multi-product mean value pressure and engaged test are realized using ultra-thin super flexible resilient air bag,
And multiple channel test circuit is combined, it can be achieved that the test of batch tactile sensing chip parallel duplex and calibration, can be integrated in automation
Production line completes manufacturing side quality test.
2) by preset pressure model realization in test software to the consistency of tactile sensing chip, repeatability,
The multi-functional automatic test such as hysteresis.
3) air pressure that application is accurately controlled by pressure control portion, guarantees the accuracy of test.
4) by venthole design unique on loading plate, cavity structure tactile sensing chip exhaust requirements can be met, with
Realize the accurate test of this kind of sensor.
Figure of description
Fig. 1 is film tactile sensing apparatus for testing chip structural representation Fig. 1；
Fig. 2 is film tactile sensing apparatus for testing chip structural representation Fig. 2；
Fig. 3 is sensor supporting part structural representation Fig. 1；
Fig. 4 is sensor supporting part structural representation Fig. 2；
Fig. 5 is signal conditioning circuit block diagram；
Fig. 6 is film tactile sensing apparatus for testing chip test philosophy schematic diagram；
Fig. 7 (a) is repeated Load Test Model schematic diagram, and Fig. 7 (b) is sluggish Load Test Model schematic diagram,；
Attached drawing mark explanation: upper cover body 1, elastic film 2, film fixed frame 3, test fixture 4, support plate 5, test box 6
(not shown), sealing ventilation chamber 7, ventilation interface 8, program can air control valve 9, precision pressure gauge 10, metal probe 11, exhausts
Hole 12, air pump 13.
Specific embodiment
Device proposed by the present invention for the chip testing of film tactile sensing mainly includes air bag pressure unit, air pressure control
Portion, sensor supporting part and test circuit portion processed, wherein air bag pressure unit, pressure control portion and sensor supporting part are mainly
Design and improvement to hardware configuration, test circuit portion is mainly to changing in terms of the acquisition of sensor output signal and processing
Into.Further, it is also proposed that for the system of film tactile sensing chip testing, including for film tactile sensing chip testing
Device and the user terminal that film tactile sensing chip testing software can be run.The test software can be according to preset anti-
The a variety of pressure models for answering any pressure and time relationship, to batch film tactile sensing chip measure range, sensitivity,
The performances such as repeatability, signal hysteresis loop line, signal drift are accurately tested.
Air bag pressure unit is used to form airbag structure, and the supply of gasbag pressure can be provided by the air intake pump of connection gas source, pressure
The control of power can be realized by the air intake control valve in pressure control portion.It further, can also be selected corresponding by user terminal
Press model, is accurately controlled gas flux and duration of ventilation, realizes the survey to film tactile sensing chip different performance
Examination.Large area, uniform pressure, and controllable pressure precision can be provided in such a way that air bag presses, in conjunction with achievable batch
The sensor supporting part and test circuit portion for measuring examination test film tactile sensing chip, and it is defeated to form input (pressure) VS
The related data of (capacitor or resistance) out, and relation curve drafting and storage are carried out by the test software of user terminal.Thus may be used
See, this system is easy to be integrated in automatic production line completion manufacturing side quality test.
In conjunction with shown in Fig. 1 to Fig. 4, embodiment 1 discloses a kind of film tactile sensing apparatus for testing chip (hereinafter referred to as dress
Set), it is mainly controllable including upper cover body 1, elastic film 2, film fixed frame 3, test fixture 4, support plate 5, test box 6, program
Air valve 9, precision pressure gauge 10.
The side wall that upper cover body 1 has a top surface and connect with top surface periphery, the top surface of upper cover body 1 have a ventilation interface
8.Elastic film 2 use very soft material, for example, TPU film, silica gel thin film or latex material film, this meeting so that
The pressure of application is more uniform.Top surface, side wall and the elastic film 2 of upper cover body 1 enclose a sealing ventilation chamber 7, are used to form
Airbag structure to provide the pressure uniformly directly contacted to sensor to be measured, and can be suitble to the pressure of large area.Entire bullet
Property film 2 plane it is bigger, the sensor of contact is more, and measurable sensor is also more, thus be applicable to batch
The detection of change.Film fixed frame 3 has certain thickness, is mainly used for for the periphery of elastic film 2 being fixed on the bottom of upper cover body 1
Face.Upper cover body 1 and film fixed frame 3 are hard material, for example, metal (aluminium, steel) or acrylic board.Specifically, can be upper
The lower frame of lid 1 and the upper side frame of film fixed frame 3 coat sealant, film 2 are pressed together on centre, and pass through using screw
Upper cover body 1, film 2 and film fixed frame 3 firmly tighten three, and sealant can be completed sealing and fix after drying out.Thus may be used
To see, upper cover body 1, elastic film 2 and film fixed frame 3 constitute the air bag pressure unit, form sealing ventilation chamber 7, and
It is pressed by airbag structure to sensor to be measured when test.
Ventilate interface 8 by program can air control valve 9 connect air pump, air pump connects gas source, and precision pressure gauge 10 and sealing are logical
It is connected inside air cavity 7, to show in sealing ventilation chamber 7 pressure value of (air bag).Program can air control valve 9 and precision pressure gauge 10
The pressure control portion is constituted, for controlling the precision of pressure, and the pressure that real-time display applies.
Test fixture 4 is plate structure, i.e., the loading plate in the described sensor supporting part, be mainly used for bearing with connect to
Survey sensor.There is multiple load bearing units (can also be test cell) on test fixture 4, each load bearing unit is each equipped with one
Group metal probe 11.The arrangement mode of each load bearing unit can be according to the shape size of test fixture 4, the size knot of sensor to be measured
Structure etc. is designed, as long as not interfering with each other in test.Sensor to be measured includes sensing unit and calibrating terminal, test
When, sensing unit stress is connect in air bag, calibrating terminal with metal probe 11.
Support plate 5 is mainly used for supporting test fixture 4 and air bag pressure unit.It is in embodiment 1, metal probe 11 is equidistant
It is staggered and is arranged in the edge of 4 two long sides of test fixture, and be vertically arranged in after test fixture 4 and support plate 5 and test box 6
Interior test circuit connection.
Further, multiple gas vents 12 are additionally provided on test fixture 4, it is preferred that the quantity of gas vent 12 and carrying are single
The quantity of member is consistent, for the exhaust to the sensing chip to be measured with cavity structure.Correspondingly, the bottom surface of test fixture 4
It is spaced apart with the top surface of support plate 5, as used support leg to design in embodiment 1, in order to provide exhaust space.
It should be noted that 3 frame inner area of film fixed frame is greater than the area of test fixture 4, thickness in embodiment 1
It is adapted with the overall height (summation of the length of the thickness and support leg of plank) of test fixture 4, so that sensor to be measured is put
It sets in load bearing unit, contacts (i.e. elastic film 2 does not generate pressure to sensor to be measured), Huo Zheyu with elastic film 2 just
Elastic film 2 is (can generate pressure to sensor to be measured after applying certain pressure to elastic film 2) spaced apart.
Further, upper cover body 1, elastic film 2 and film fixed frame 3 can be designed to one similar " case lid " whole
Body structure, and the side of " case lid " is fixed in support plate 5 using modes such as hinge or hinges.When in use, sensing to be measured
When device is placed, " case lid " is opened, after placing, " case lid " is closed and is withheld, use is also more convenient.Certainly, may be used
To use separate structure completely, after sensor to be measured places, directly " case lid " is covered, it specifically can be as needed
It is designed.
Test box 6 is mainly used for placing test circuit portion, and there is test circuit portion multiple channel test circuit in parallel (to believe
Number conditioning circuit), test circuit is connected by metal probe 11 with film tactile sensing chip to be measured.As shown in connection with fig. 5, believe
Number conditioning circuit is mainly made of OpAmp amplifier sub-circuit, MCU processor, bluetooth module and power module, in which: OpAmp fortune
Putting sub-circuit can be selected LM324, be mainly used for low level signal amplification；EFM8LB12F64 can be selected in MCU processor, is mainly used for ADC
Data sampling；Bluetooth module can also be substituted using other wireless communication modules, for example, CC2640, it is of course also possible to use having
Line communication mode is communicated with user terminal, turns UAR scheme for example, by using CH340E USB；Power module is then used to
It states sub-circuit or module is powered.Test box 6 designs for body structure, it is preferred that support plate 5 can be fixed on test box 6
Top, by program can air control valve 9 and precision pressure gauge 10 be arranged in test box 6, do not influencing air inlet adjustment and pressure is shown
While, so that air bag pressure unit, pressure control portion, sensor supporting part and test circuit portion is formed an overall structure, so that
Overall volume is smaller, is moved easily.
It should be noted that the port number of multiple channel test circuit here can be consistent with the quantity of load bearing unit, one
One is correspondingly connected with, can also be inconsistent, i.e., test circuit is connect with multiple accommodation units all the way, by timing control design come real
The test of existing respective sensor, details are not described herein again.
The test philosophy of the device as shown in connection with fig. 6, the specific test method is as follows:
When test does not start, the sensor to be measured that is placed on test fixture 4 does not stress in elastic film 2 simultaneously.Start
When test, ventilation interface 8 is connected to air pump and is inflated to sealing ventilation chamber 7, so that elastic film 2, which gradually expands, forms air bag knot
Structure applies uniform pressure until contact and to sensor to be measured, which is equal to the air pressure in air bag.Sensor to be measured
By the pressure conversion of induction to pass to signal conditioning circuit connected to it by metal probe 11 after electric signal, through signal tune
After managing processing of circuit, output capacitance or resistance signal are changed into digital signal, then through Bluetooth wireless transmission to the end PC.It crosses herein
Cheng Zhong, can by program can air control valve 9 adjust sealing ventilation chamber 7 in air pressure, and then control air bag to be measured on test fixture 4
The pressure of sensor, specific pressure value can be read by precision pressure gauge 10.
On the basis of embodiment 1, embodiment 2 discloses a kind of film tactile sensing chip test system, mainly wraps
It includes film tactile sensing apparatus for testing chip described in embodiment 1 and communicates with the end PC of connection, wherein the end PC is equipped with can
Realize the test software of air inlet control function and data acquisition process function.
The air inlet control function that the end PC test software has, can with setting program can air control valve 9 switch degree and switch
Time between accurate control is timely to air bag charge and discharge tolerance, therefore can form the pressure model of horizontal axis time and longitudinal axis pressure.It can
A variety of pressure models are preset in the test software of the end PC, for example, first continuous voltage rise is persistently depressured again, transition formula rapid pressure
Decompression etc., different types of pressure model are respectively used to the measurement model of film touch sensor to be measured (sensor referred to as to be measured)
It encloses, sensitivity, repeatability, signal hysteresis loop line, signal drift etc..The data acquisition process that the end PC test software has the function of can
Sensor electric signal output valve (capacitor or resistance) to be measured is drawn automatically with the relation curve of change in pressure in real time, and can
To show multiple sensor test real-time curves to be measured simultaneously, while all data can export automatically and be stored for subsequent analysis
Processing.
When specifically used, after the assembly for completing film touch sensor test device to be measured, the test for opening the end PC is soft
Part completes the connection communication with film touch sensor test device.Then the pressure model needed is selected in test software,
For example, the repeated model of film touch sensor to be tested, Hysteresis Model etc., it is of course also possible to the various pressures of manual setting
Power model.
The repetitive pressure test model as shown in Fig. 7 (a), top half is real time output, lower half portion in figure
It is corresponding application pressure model, specifically, abscissa is time (unit: s), top half ordinate indicates output letter in real time
Number (unit: rms), lower half portion ordinate indicate input pressure (unit: mmHg).Air bag ventilating control is by pressure model pair
Program can air control valve into discharge quantity control realize, such as Fig. 7 (a) pressure the model longitudinal axis be from 0 to 200, every 25 1 ranks
Ladder, the realization for the model that presses be by control program can air control valve completes into deflation size and time, and by calibrating, gas
Intracapsular pressure show value is consistent with pressure model value, and the pressure gauge unit of display is mmHg.When the gas with sensor contacts to be measured
Capsule forms expansion by pressure model and shrinks, and the output of the capacitor or resistance of sensor to be measured can increase or decrease therewith, capacitor or
Resistance output is through Bluetooth transmission to the end PC test software after testing processing of circuit, and finally output saves in digital form.
The same pressure model is repeated several times, available same pressure is repeatedly exported and compared, to complete repeated assessment.
The sluggishness Load Test Model as shown in Fig. 7 (b), top half is real time output in figure, and lower half portion is
Corresponding application pressure model, specifically, abscissa is time (unit: s), top half ordinate indicates output letter in real time
Number (unit: rms), lower half portion ordinate indicate input pressure (unit: mmHg).Similarly, when pressure model is passed according to pressure
Increasing successively decreases continuous action in sensor to be measured, can exactly evaluate sensor mechanism resilience performance to be measured to output signal shadow
It rings, and then makes sluggish assessment.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of device for film tactile sensing chip testing characterized by comprising
Air bag pressure unit, has the sealing ventilation chamber for being used to form airbag structure, and the air bag senses core to side in test
The sensing unit of piece provides the pressure uniformly directly contacted；
Pressure control portion comprising air intake control valve and pressure-detecting device, the sealing ventilation chamber by air intake control valve with
Gas source connection, the pressure-detecting device is for detecting the intracavitary air pressure of sealing ventilation；
Sensor supporting part comprising the loading plate with multiple load bearing units, the load bearing unit are visited configured with one group of metal
Needle, described metal probe one end are configured to connect with the test lead of sensing chip to be measured, and the other end is configured to and test electricity
The connection of road portion；
Test circuit portion comprising the multichannel for being handled the signal of the sensing chip test lead output to be measured is believed
Number conditioning circuit；
When sensing chip to be measured is placed on the load bearing unit and does not start test, the air bag pressure unit is to sensing core to be measured
Piece does not generate pressure；When test, after gas enters sealing ventilation chamber, the air bag pressure unit forms airbag structure, and to be measured
The sensing unit of sensing chip presses.
2. device as described in claim 1, which is characterized in that the air bag pressure unit includes the hard with top surface and side wall
Lid and the elastic film being connect with hard lid bottom surface；The sealing ventilation chamber is configured to by the caping of hard lid
It is enclosed with side wall and elastic film, the hard lid is equipped with ventilation interface.
3. device as claimed in claim 2, which is characterized in that further include for the elastic film to be fixed on hard lid
The film fixed frame of bottom surface, can accommodate the loading plate in the frame of the film fixed frame, and when test, the loading plate is placed in institute
It states in the fixed circle of film and adjacent with the elastic film.
4. device as claimed in claim 2, which is characterized in that the elastic film is TPU film, silica gel thin film or latex
Material film.
5. device as described in claim 1, which is characterized in that further include for accommodating pressure control portion and test circuit portion
Cabinet.
6. device as claimed in claim 5, which is characterized in that it further include the support plate for fixing the loading plate, it is described
Support plate is fixed on the cabinet；The metal probe pass through after the test board and support plate with the intracorporal signal condition of case
Circuit is electrically connected.
7. device as described in claim 1, which is characterized in that the load bearing unit is also configured with gas vent, for having sky
The exhaust of the sensing chip to be measured of cavity configuration.
8. device as described in claim 1, which is characterized in that the signal conditioning circuit includes sequentially connected amplifier electricity
Road, MCU processor and first communication module, and for powering for amplifier sub-circuit, MCU processor and first communication module
Power module.
9. a kind of system for film tactile sensing chip testing, which is characterized in that it includes user terminal and such as right
It is required that being used for the device of film tactile sensing chip testing described in 1 to 8 any one；The user terminal include processor,
Memory, second communication module and display module, the memory are stored with the film tactile sensing comprising multiple pressure models
Chip testing software；The pressure model, which is used to react, applies pressure and the relationship for the time that presses to realize film tactile sensing core
The test of piece different performance；The film tactile sensing chip testing software is executed when being run by processor to give an order:
The pressure model that user selectes is responded, the switch degree of air intake control valve and switch time in control pressure control unit, with
Corresponding pressure is applied to film tactile sensing chip to be measured in sensor supporting part by the air bag that sealing ventilation chamber is formed；
Receive test circuit portion output exported after air bag by film tactile sensing chip stress to be measured electric signal conversion and
The digital signal come；
The electric signal output valve of film tactile sensing chip to be measured is drawn automatically according to the digital signal with application pressure change
And the relation curve changed；
It stores and shows the relation curve, complete film tactile sensing chip correlated performance test to be measured.
10. system as claimed in claim 9, which is characterized in that the pressure model includes to film tactile sensing core to be measured
The measurement range of piece, sensitivity, the test of repeatability, signal hysteresis loop line, signal drift performance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910131116.1A CN109708810A (en) | 2019-02-21 | 2019-02-21 | A kind of apparatus and system for film tactile sensing chip testing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910131116.1A CN109708810A (en) | 2019-02-21 | 2019-02-21 | A kind of apparatus and system for film tactile sensing chip testing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109708810A true CN109708810A (en) | 2019-05-03 |
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| CN111281383A (en) * | 2020-03-07 | 2020-06-16 | 北京理工大学 | Array type piezoelectric bimorph stimulation system |
| CN112857627A (en) * | 2021-02-03 | 2021-05-28 | 江苏大学 | Ceramic capacitive pressure sensor pressure detection system and test method thereof |
| CN113188717A (en) * | 2021-04-30 | 2021-07-30 | 武汉飞恩微电子有限公司 | Conditioning test mechanism |
| CN113267292A (en) * | 2021-06-25 | 2021-08-17 | 中国科学院重庆绿色智能技术研究院 | Sliding sense sensing characteristic testing method and device based on magnetic effect |
| CN113433062A (en) * | 2021-06-15 | 2021-09-24 | 清华大学 | Method and device for testing joint force between stamp unit and sample |
| CN113654720A (en) * | 2021-09-02 | 2021-11-16 | 安徽中科本元信息科技有限公司 | Air pressure type flexible force-sensitive sensor calibration device and calibration method |
| CN113866603A (en) * | 2021-09-26 | 2021-12-31 | 安徽芯动联科微系统股份有限公司 | Wafer level testing device and testing method for MEMS pressure sensor chip |
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| CN111281383A (en) * | 2020-03-07 | 2020-06-16 | 北京理工大学 | Array type piezoelectric bimorph stimulation system |
| CN112857627A (en) * | 2021-02-03 | 2021-05-28 | 江苏大学 | Ceramic capacitive pressure sensor pressure detection system and test method thereof |
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| CN113433062A (en) * | 2021-06-15 | 2021-09-24 | 清华大学 | Method and device for testing joint force between stamp unit and sample |
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| CN113654720A (en) * | 2021-09-02 | 2021-11-16 | 安徽中科本元信息科技有限公司 | Air pressure type flexible force-sensitive sensor calibration device and calibration method |
| CN113654720B (en) * | 2021-09-02 | 2023-11-17 | 安徽中科本元信息科技有限公司 | Pneumatic flexible force sensor calibration device and calibration method |
| CN113866603A (en) * | 2021-09-26 | 2021-12-31 | 安徽芯动联科微系统股份有限公司 | Wafer level testing device and testing method for MEMS pressure sensor chip |
| CN113866603B (en) * | 2021-09-26 | 2024-01-30 | 安徽芯动联科微系统股份有限公司 | Wafer level testing device and method for MEMS pressure sensor chip |
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