CN104597389B - Plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions - Google Patents
Plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions Download PDFInfo
- Publication number
- CN104597389B CN104597389B CN201410812343.8A CN201410812343A CN104597389B CN 104597389 B CN104597389 B CN 104597389B CN 201410812343 A CN201410812343 A CN 201410812343A CN 104597389 B CN104597389 B CN 104597389B
- Authority
- CN
- China
- Prior art keywords
- sample
- integrated circuit
- packaged integrated
- plastic packaged
- apply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The present invention relates to plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions, methods described includes：Apply voltage stress to the sample, apply temperature stress, apply steam, apply atmospheric pressure, internal flaw inspection is carried out to the sample by X-ray radiography, the sample is tested, judges whether to meet properties of product, functional parameter requirement.High temperature, high pressure, high humidity experimental condition of the invention by applying simulating ocean environment, accelerates the drenched rate of capsulation material, accelerates the degeneration of organic material performance, and the marine environmental conditions evaluation test of 2 months need to be spent to foreshorten to original only needs to complete for 1~2 day.The present invention considers the deterioration influence of the synthetic chemistry laboratory factor pair plastic packaged integrated circuits such as humidity, temperature, pressure, biasing electric stress, and using the defect inside powerful cryptoscopy encapsulating material, integrality, the accuracy of evaluation test is greatly improved.
Description
Technical field
Can the present invention relates to plastic packaged integrated circuit under IC reliability field, more particularly to a kind of marine environmental conditions
By property fast appraisement method.
Background technology
Foreign study statistical report shows that environmental stress is caused in the ratio of IC products failure, salt fog accounts for 4%,
Sand and dust account for 6%, vibration and account for 28%, humiture and be up to 60%, so humiture is particularly significant for the influence of IC products.
Marine environment is mainly hyperpyrexia and high humidity environment, and this environment is very harsh for plastic packaged integrated circuit, if plastic packaging collection
Into the bad of circuit package, moisture can penetrate into the chip of encapsulation along the gap between person's capsulation material and wire, cause plastic packaging
There is short circuit that pollution is caused between popcorn effect, metallized area corrosion open circuit, pin etc. in integrated circuit, has a strong impact on naval vessel
The service ability and long-term use reliability of equipment.
At present, plastic packaged integrated circuit reliability assessment mainly uses high temperature and humidity test, sample is placed in into various temperature, wet
Under the conditions of degree, plastic packaged integrated circuit temperature-resistant wet ability is tested.Existing high temperature and humidity test is (such as：40 DEG C/90%
R.H., 85 DEG C/85%R.H., 60 DEG C/95%R.H.) be used to evaluating that IC reliability under marine environmental conditions to be present asks
Topic is that the required time is longer, it usually needs more than 1000h is examined, and is difficult to find that plastic packaged integrated circuit is hot and humid
Under the conditions of some specific failures.
The content of the invention
For the above-mentioned problems in the prior art, the present invention provides plastic packaged integrated circuit under a kind of marine environmental conditions
Method for quickly evaluating reliability.Methods described is improved by improving the temperature, humidity and atmospheric pressure of experimental enviroment, improves sample
The hydroscopicity of closed material, so as to accelerate its speed broken down, shortens evaluation time.
In order to achieve the above object, the present invention uses following technical scheme：
Plastic packaged integrated circuit method for quickly evaluating reliability, comprises the following steps under a kind of marine environmental conditions：To described
Sample applies voltage stress, applies temperature stress, apply steam, apply atmospheric pressure, and the sample is entered by X-ray radiography
Row internal flaw is checked, the sample is tested, judges whether to meet properties of product, functional parameter requirement.
Further, also need to screen plastic packaged integrated circuit before being tested, performance function is chosen by testing
Qualified integrated circuit is used as plastic packaged integrated circuit sample to be evaluated.
Further, also need to clean the sample surfaces before being tested, remove surface and oil contaminant, it is ensured that described
Sample surfaces are without breakage, without crack, without deformation, lead not damaged.
Further, also need to carry out following preparation before being tested：Make aluminium oxide ceramic substrate or high temperature resistant
The organic plates of high humidity, conducting wiring line width is more than 3mm；Plastic packaged integrated circuit is fixed on substrate or organic plates by socket,
By applying bias voltage stress, the leakage current of plastic packaged integrated circuit is tested, leakage current cannot be greater than 10mA；Will be described
Substrate or organic plates are placed in experimental rig cavity.
Further, it is to the method that the sample applies voltage stress：Power end, I/O ends to the sample apply
5v voltage stress, other lead legs of the sample are grounded, and are then drawn two end lines and are carried out leakage current monitoring, tester essence
Degree is higher than 1mA.
Further, it is 100 DEG C~135 DEG C to the temperature that the sample applies.
Further, it is to the method that the sample applies steam：By evaporating deionized water adjusting ambient temperature, humidity
Range regulation is 50%~100%.
Further, it is 1~3 atmospheric pressure to apply the scope of atmospheric pressure to the sample.
Further, to the sample apply temperature it is every 10 DEG C improve 1 times, to the sample apply steam acceleration because
Son improves 1 times for every 10%, and apply the accelerated factor of atmospheric pressure to the sample improves 1 times for every 0.5 atmospheric pressure.
Further, X-ray radiography is used to carry out the content of internal flaw inspection to the sample for the presence or absence of burn into
Ion transfer, crack, layering, chip lead come off.
Compared with prior art, to invent with advantages below：
(1) high temperature, high pressure, the high humidity experimental condition of the invention by applying simulating ocean environment, accelerates capsulation material
Drenched rate, accelerates the degeneration of organic material performance, and the marine environmental conditions evaluation test of 2 months need to be spent to foreshorten to original only needs
It can complete within 1~2 day；
(2) to consider humidity, temperature, pressure, the biasing synthetic chemistry laboratory factor pair plastic packaging such as electric stress integrated by the present invention
The deterioration influence of circuit, and using the defect inside powerful cryptoscopy encapsulating material, evaluation is greatly improved
Integrality, the accuracy of experiment.Early stage multiple authentication result of implementation shows, the product defects pattern that is found in test evaluation and therefore
Barrier test coverage reaches more than 98%.
Brief description of the drawings
Fig. 1 is the flow chart of the method for the invention.
Embodiment
With reference to the accompanying drawings and examples, the embodiment to the present invention is described in further detail.Implement below
Example is used to illustrate the present invention, but is not limited to the scope of the present invention.
The method flow diagram that embodiment is used is as shown in figure 1, comprise the following steps：
Step 1, preparation of samples before testing.
Choose the qualified sample of performance function.Clean plastic packaged integrated circuit sample surfaces and remove surface and oil contaminant, it is ensured that choosing
The sample surfaces taken are without breakage, without crack, without deformation, lead not damaged.
Step 2, test prepares before testing.
The organic plates of aluminium oxide ceramic substrate or high-temp resisting high-humidity resisting are made, conducting wiring line width needs to be more than 3mm, by plastic packaging
Integrated circuit is fixed on substrate by socket, by applying bias voltage stress, and the leakage current of plastic packaged integrated circuit is carried out
Test, leakage current cannot be greater than 10mA, can carry out follow-up test.
Step 3, voltage stress is applied to sample.
Apply 5v voltage stress, other lead leg ground connection to plastic packaged integrated circuit power end, I/O ends.By two end lines draw into
Row leakage current monitoring, tester choice accuracy needs to be higher than 1mA.
It is biased and easily finds because outer ion pollutes the problem of chip surface causes, such as：Cause sheath pin hole, split
The corrosion and leakage current etc. such as wound, coated bad place.
Step 4, temperature stress is applied to sample.
Plastic packaged integrated circuit and substrate are placed in experimental rig cavity, applies 100 DEG C to 135 DEG C of temperature, utilizes liter
High environment temperature accelerates failure phenomenon, using [10 DEG C of θ] rule, and every 10 DEG C of accelerated factor improves 1 times.
Step 5, steam is applied to sample.
By evaporating deionized water, the simulating ocean environment moist conditions in test cavity body, humidity range regulation selection
50%-100%, accelerated factor every 10% improves 1 times.
When humidity is in 50%-100%, steam will be penetrated into by epoxy resin, be higher than when absorbing moisture content
When 0.17%, aluminum metal wire can be caused to produce electrochemical corrosion and then open circuit and migration growth phenomenon is produced, meanwhile, steam
Trigger polymeric material depolymerization, polymer binding ability to decline, burn into cavity, wire bonding point are disengaged, electric leakage between lead, chip with
Short-circuit between conductors that chip bonding die layer is disengaged, pad burn into metallizes or drawn.
Step 6, atmospheric pressure is applied to sample.
The substrate of fixed sample is placed in experimental rig cavity, applies 1 atmospheric pressure of high-pressure to 3 air
Pressure.
Under high pressure plastic packaged integrated circuit surface be in condense, in high humidity environment so that steam enter packaging body in,
Expose the weakness in encapsulation, such as layering and the corrosion of metal layer.It can accelerate steam infiltrating through plastic packaging collection by pressurization
Into in circuit shell.Every 0.5 atmospheric pressure of accelerated factor improves 1 times.
Step 7, X-ray internal flaw is checked：The structure inside plastic packaged integrated circuit is taken a picture using X-ray, examined
Look into and the physical imperfection such as come off with the presence or absence of burn into Ion transfer, crack, layering, chip lead.
Step 8, to properties of sample functional test.
Plastic packaged integrated circuit on substrate is tested, judges whether to meet properties of product, functional parameter requirement.
Evaluation test is carried out using the method for the invention, accelerated factor can reach more than 100 times：The present invention 12~96
Hour evaluation test, equivalent to traditional damp heat test 1000~4000 hours.And the result of test of many times shows that experiment is commented
The product defects pattern and fault test coverage rate found in valency reaches more than 98%.
The those of ordinary skill in field should be understood：It can still enter to the technical scheme described in foregoing embodiments
Row modification, or equivalent substitution is carried out to which part or all technical characteristic；And these modifications or replacement, do not make phase
The essence of technical scheme is answered to depart from the scope of the claims in the present invention.
Claims (6)
1. plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions, it is characterised in that tried by improving
Temperature, humidity, atmospheric pressure and the bias voltage for testing environment improve the moisture absorption of plastic packaged integrated circuit sample encapsulating material to be evaluated
Rate, so as to improve evaluation speed；
Methods described includes：Apply voltage stress to the sample, apply temperature stress, apply steam, apply atmospheric pressure；
Wherein, it is to the method that the sample applies voltage stress：Power end, I/O ends to the sample apply 5v voltages should
Power, other lead legs of the sample are grounded, and are then drawn 5V voltages line and ground wire and are carried out leakage current monitoring, tester
Precision is higher than 1mA；
Wherein, it is 100 DEG C~135 DEG C to the temperature that the sample applies when applying temperature stress to the sample；
Wherein, when applying steam to the sample, by evaporating deionized water adjusting ambient temperature, humidity range is adjusted to 50%
~100%；
Wherein, when applying atmospheric pressure to the sample, the scope of atmospheric pressure is 1~3 atmospheric pressure；
Internal flaw inspection is carried out to the sample by X-ray radiography, the sample is tested, judges whether to meet production
Moral character energy, functional parameter requirement.
2. plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions according to claim 1, its
It is characterised by, also needs to screen plastic packaged integrated circuit before being tested, the qualified collection of performance function is chosen by testing
Plastic packaged integrated circuit sample to be evaluated is used as into circuit.
3. plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions according to claim 1, its
It is characterised by, also needs to clean the sample surfaces before being tested, removes surface and oil contaminant, it is ensured that the sample surfaces
Without breakage, without crack, without deformation, lead not damaged.
4. plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions according to claim 1, its
It is characterised by, also needs to carry out following steps before being tested：
The organic plates of aluminium oxide ceramic substrate or high-temp resisting high-humidity resisting are made, conducting wiring line width is more than 3mm；By plastic packaged integrated circuit
It is fixed on substrate or organic plates, by applying bias voltage stress, the leakage current of plastic packaged integrated circuit is carried out by socket
Test, leakage current cannot be greater than 10mA；The substrate or organic plates are placed in experimental rig cavity.
5. plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions according to claim 1, its
It is characterised by, apply the accelerated factor of temperature to the sample improves 1 times for every 10 DEG C, applies the acceleration of steam to the sample
The factor is every 10% 1 times of raising, and apply the accelerated factor of atmospheric pressure to the sample improves 1 times for every 0.5 atmospheric pressure.
6. plastic packaged integrated circuit reliability is fast under a kind of marine environmental conditions according to any one in Claims 1 to 5
Fast evaluation method, it is characterised in that use X-ray radiography to the sample carry out internal flaw inspection content for the presence or absence of
Burn into Ion transfer, crack, layering, chip lead come off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410812343.8A CN104597389B (en) | 2014-12-23 | 2014-12-23 | Plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410812343.8A CN104597389B (en) | 2014-12-23 | 2014-12-23 | Plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104597389A CN104597389A (en) | 2015-05-06 |
| CN104597389B true CN104597389B (en) | 2017-11-03 |
Family
ID=53123298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410812343.8A Expired - Fee Related CN104597389B (en) | 2014-12-23 | 2014-12-23 | Plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104597389B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107505525B (en) * | 2017-09-12 | 2020-10-20 | 浙江大学 | Reliability on-line monitoring system |
| CN108169651B (en) * | 2017-11-22 | 2021-05-11 | 北京无线电计量测试研究所 | Clock crystal oscillator detection method |
| CN110426570B (en) * | 2019-07-15 | 2021-10-26 | 北京遥感设备研究所 | Rapid quality consistency inspection method for plastic package SoC device |
| CN112858872A (en) * | 2020-12-31 | 2021-05-28 | 华中光电技术研究所（中国船舶重工集团公司第七一七研究所） | Circuit board health management circuit, device, control method and circuit board health manager |
| CN114441515B (en) * | 2021-12-15 | 2023-12-05 | 航天科工防御技术研究试验中心 | Device and method for detecting moisture of plastic package device |
| CN114323427A (en) * | 2021-12-24 | 2022-04-12 | 中国电子科技集团公司第四十九研究所 | Multi-stress accelerated storage test method based on pressure sensor |
| CN114459544B (en) * | 2022-02-17 | 2023-09-12 | 中国电子科技集团公司第五十八研究所 | Comprehensive stress sand dust test evaluation method for electronic product |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1858604A (en) * | 2005-04-30 | 2006-11-08 | 中国科学院空间科学与应用研究中心 | Screening method for commercial plastic packaging device space application |
| CN101813954A (en) * | 2010-04-28 | 2010-08-25 | 中国人民解放军国防科学技术大学 | High-temperature variability temperature and humidity environmental test control method and device |
| CN102494695A (en) * | 2011-11-04 | 2012-06-13 | 中国船舶重工集团公司第七0七研究所 | High-efficiency MTBF (Mean Time Between Failures) proof test method applied to ship navigation product |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05302949A (en) * | 1992-04-28 | 1993-11-16 | Hitachi Ltd | Evaluation apparatus of durable lift of electric component |
-
2014
- 2014-12-23 CN CN201410812343.8A patent/CN104597389B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1858604A (en) * | 2005-04-30 | 2006-11-08 | 中国科学院空间科学与应用研究中心 | Screening method for commercial plastic packaging device space application |
| CN101813954A (en) * | 2010-04-28 | 2010-08-25 | 中国人民解放军国防科学技术大学 | High-temperature variability temperature and humidity environmental test control method and device |
| CN102494695A (en) * | 2011-11-04 | 2012-06-13 | 中国船舶重工集团公司第七0七研究所 | High-efficiency MTBF (Mean Time Between Failures) proof test method applied to ship navigation product |
Non-Patent Citations (1)
| Title |
|---|
| 大规模集成电路相关测试标准的剖析;杜社会等;《半导体技术》;20070930;第32卷(第9期);第737-741页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104597389A (en) | 2015-05-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104597389B (en) | Plastic packaged integrated circuit method for quickly evaluating reliability under a kind of marine environmental conditions | |
| Gubanski et al. | Diagnostic methods for outdoor polymeric insulators | |
| Zorn et al. | Temperature–humidity–bias testing on insulated‐gate bipolartransistor modules–failure modes and acceleration due to high voltage | |
| CN103839771A (en) | Semiconductor device failure analysis sample production method and analysis method | |
| CN107797036B (en) | Method for evaluating composite insulator interface performance based on high voltage and salt solution | |
| Neto et al. | Artificial neural networks used for ZnO arresters diagnosis | |
| Liu et al. | Effects of accelerated repetitive impulse voltage aging on performance of model stator insulation of wind turbine generator | |
| CN103941171B (en) | Semiconductor test structure and test method | |
| CN103852411A (en) | Method for evaluating running aging of thermal shrinkage insulating material | |
| CN108037476A (en) | A kind of method of intelligent electric energy meter failure analysis | |
| CN104345276A (en) | Method for testing attenuation of photovoltaic assembly | |
| Sood | Root-Cause Failure Analysis of Electronics | |
| CN107102013A (en) | A kind of method for testing and analyzing of semiconductor device characteristic | |
| Ingman et al. | Detection of Corrosion in Thick Film Resistors by X-Ray Imaging | |
| KR20100083382A (en) | A repair method of pattern parts | |
| CN110361601A (en) | A kind of LCD device pin Electrical Indexes method for rapidly testing | |
| CN102495780A (en) | Computer mainboard failure analysis method | |
| Chen et al. | An identification method of counterfeit components based on physical analysis test technology | |
| Hussain et al. | Review of third harmonic current characteristic based diagnostic methods of medium voltage power cable insulation | |
| Shuai et al. | Destructive Physical Analysis Methods of Flip Chip Packaging Devices for High Reliability | |
| CN103904058A (en) | Gate-oxide medium testing structure | |
| Keenan et al. | Terahertz and laser imaging for printed circuit board failure detection | |
| Zhan et al. | Dendritic growth on the die under hermetic high temperature operation | |
| TWI461711B (en) | Device and method of determing properties of an electrical device | |
| Gierth et al. | Measurement Methods for Water Uptake of Encapsulation Materials in Power Electronics |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171103 Termination date: 20201223 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |