CN113064001B - Method for evaluating welding heat resistance of plastic package component - Google Patents
Method for evaluating welding heat resistance of plastic package component Download PDFInfo
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- 238000003466 welding Methods 0.000 title claims abstract description 136
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000012360 testing method Methods 0.000 claims abstract description 171
- 238000007689 inspection Methods 0.000 claims abstract description 76
- 238000011156 evaluation Methods 0.000 claims abstract description 54
- 238000012952 Resampling Methods 0.000 claims abstract description 19
- 238000005070 sampling Methods 0.000 claims abstract description 16
- 238000011179 visual inspection Methods 0.000 claims description 21
- 102000005717 Myeloma Proteins Human genes 0.000 claims description 12
- 108010045503 Myeloma Proteins Proteins 0.000 claims description 12
- 238000004621 scanning probe microscopy Methods 0.000 claims description 9
- 238000004458 analytical method Methods 0.000 claims description 5
- 239000010953 base metal Substances 0.000 claims description 4
- 230000008569 process Effects 0.000 description 13
- 238000005476 soldering Methods 0.000 description 11
- 238000004806 packaging method and process Methods 0.000 description 5
- 238000010008 shearing Methods 0.000 description 5
- 238000010998 test method Methods 0.000 description 5
- 238000004377 microelectronic Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000011800 void material Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000032798 delamination Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000010183 spectrum analysis Methods 0.000 description 2
- 238000010561 standard procedure Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
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- 238000005260 corrosion Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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Abstract
An embodiment of the application discloses a method for evaluating welding heat resistance of a plastic package component, which comprises the following steps: s10, sampling N components to be tested to obtain M sampled components; s20, performing first performance state inspection, judging whether unqualified components exist, and if yes, executing S30; if not, executing S40; s30, removing unqualified components, resampling, performing first performance state inspection on the components obtained by resampling until the first performance state inspection of all the sampled components is qualified, and executing S40; s40, performing a simulated welding test to obtain M simulated welding components; s50, performing second performance state inspection, judging whether unqualified components exist, if yes, judging that the welding heat resistance evaluation test is unqualified, and if not, executing S60; s60, performing welding heat influence evaluation, and if all the welding heat resistance evaluation tests are qualified, judging that the welding heat resistance evaluation tests are qualified; if not, judging that the welding heat resistance evaluation test is not qualified.
Description
Technical Field
The invention relates to the technical field of reliability of military components. More particularly, relates to a method for evaluating welding heat resistance of plastic package components.
Background
The electronic components serve as the core and the foundation of the equipment, and the quality of the electronic components directly influences the reliability of the equipment system. The plastic package device has high reliability and high price, and is generally applied to the field of military high reliability. With the increasing demands for miniaturization and high integration of plastic packaging devices, the size of the plastic packaging devices is smaller and the leads are denser. In the process of component assembly, the components with small size and dense leads are more easily affected by welding heat, so that the plastic package component leaks air, the internal welding part is remelted, and the reliability of the component is reduced or even fails.
In the conventional evaluation test of the welding heat resistance of the terms of the national military standard GJB360B-2009 method 210, the problems of package form, lead existence and non-lead of pins, heavy melting of internal solder and the like of the components are not considered in the test method of the components, the test conditions are not refined enough, and the conventional standard method is more and more difficult to comprehensively and accurately evaluate the welding heat resistance of the plastic packaged components at the present stage along with the technical development of the plastic packaged components and the expansion of the domestic requirements of the military components.
Disclosure of Invention
The application provides a method for evaluating welding heat resistance of a plastic package component, which solves at least one of the problems mentioned in the background art section.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the application provides a method for evaluating welding heat resistance of a plastic package component, which comprises the following steps:
s10, sampling N components to be tested according to a worst condition principle to obtain M sampled components, wherein M is a natural number which is more than or equal to 2 and less than or equal to N;
s20, performing first performance state inspection on the M sampling components, judging whether unqualified components exist in the M sampling components, and if yes, executing S30; if not, executing S40;
s30, removing unqualified components, resampling, and performing first performance state inspection on the components obtained by resampling until all the first performance state inspection of the sampled components are qualified, obtaining M components with qualified first performance state inspection, and executing S40, wherein the number of the components obtained by resampling is equal to the number of the unqualified components;
s40, performing a simulated welding test on the M components which are qualified in the first performance state inspection to obtain M simulated welding components;
s50, performing second performance state inspection on the M simulated welding components, judging whether unqualified components exist in the M simulated welding components, if so, judging that the welding heat resistance evaluation test of the N components to be tested is unqualified, if not, obtaining M components with qualified second performance state inspection, and executing S60;
s60, performing welding heat influence evaluation on the components with the qualified M second performance states, and if all the welding heat influence evaluations of the components with the qualified M second performance states are qualified, judging that the welding heat resistance evaluation tests of the N components to be tested are qualified; if not, judging that the welding heat resistance evaluation test of the N components to be tested is not qualified.
In a specific embodiment, the first performance status check includes: a first visual inspection, a first electrical test, and a first acoustic scanning microscopy.
In a specific embodiment, the step S20 includes:
s200, first appearance inspection, which is used for inspecting whether the leads of the M sampling components meet a first preset disqualification standard or not, if yes, S30 is executed; if not, executing S202;
s202, a first electric test, which is used for checking whether the electric function of the components qualified by the first appearance check is good, if yes, executing S204; if not, executing S30;
s204, checking by a first acoustic scanning microscope, wherein the checking is used for checking whether the interior of the components which are qualified by the first appearance check and the first electric test meets a second preset disqualification standard, and if so, executing S30; if not, S40 is performed.
In one embodiment, the simulated welding test includes a lead-based simulated welding test and a lead-free simulated welding test; the simulated welding components comprise lead-containing simulated welding components and leadless simulated welding components.
In a specific embodiment, the step S40 includes:
s400, conducting lead component analysis on the components which are qualified in the M first performance states, judging whether the components contain lead, and if yes, judging that the components contain lead; if not, judging that the lead-free component is a lead-free component;
s402, carrying out the leaded simulated welding test on the leaded component to obtain the leaded simulated welding component; and carrying out the lead-free simulated welding test on the lead-free components to obtain the lead-free simulated welding components, wherein the sum of the number of the lead-free simulated welding components and the number of the lead-free simulated welding components is M.
In a specific embodiment, the second performance status check includes: second appearance inspection, second electrical test, and second acoustic scanning microscopy.
In a specific embodiment, the S50 includes:
s500, second appearance inspection, which is used for inspecting whether the leads of the M simulated welding components meet a first preset disqualification standard or not, if so, judging that the welding heat resistance evaluation test of the N components to be tested is disqualified; if not, executing S502;
s502, a second electric test, which is used for checking whether the electric function of the component qualified by the second appearance check is good, if yes, executing S504; if not, judging that the welding heat resistance evaluation test of the N components to be tested is not qualified;
s504, second acoustic scanning microscope inspection, which is used for inspecting whether the components qualified by the second appearance inspection and the second electrical test meet a second preset failure standard or not, if so, judging that the welding heat resistance evaluation tests of the N components to be tested are failed; if not, S60 is performed.
In a specific embodiment, the first preset failure criterion is any one of a first case, a second case, a third case and a fourth case, where the first case is a wire breakage of a component; the second condition is that a gap is formed between the root of the lead of the component and the plastic package shell; the third condition is that the diameter of a pit or the width of a recess on a lead of the component exceeds 25% of the width of the lead, and the depth of the recess is greater than 50% of the thickness; the fourth case is that scratches on the component lead expose a base metal area greater than 5% of the lead surface area;
the second preset reject standard is any one of a fifth case, a sixth case and a seventh case, wherein the fifth case is that cracks exist in the plastic package shell; the sixth condition is that cracks or hollows exist near the bonding wire; and in the seventh case, layering exists between the plastic package shell and the chip and between the plastic package shell and the lead.
In a specific embodiment, the weld heat impact assessment includes: internal visual inspection test, bond strength test, and shear strength test.
In a specific embodiment, the step S60 includes:
s600, an internal visual inspection test, which is used for checking whether the internal structure of any M components with qualified second performance states accords with a third preset unqualified standard, if so, judging that the welding heat resistance evaluation test of the N components to be tested is unqualified; if not, execute 602;
s602, a bonding strength test, which is used for checking whether bonding strength of any component qualified by an internal visual inspection test meets a fourth preset disqualification standard, and if so, judging that the welding heat resistance evaluation test of the N components to be tested is disqualified; if not, executing S604;
s604, a shear strength test, which is used for checking whether the internal chip bonding strength of any component qualified by an internal visual inspection test and a bonding strength test meets a fifth preset unqualified standard, and if so, judging that the welding heat resistance evaluation test of the N components to be tested is unqualified; and if not, judging that the welding heat resistance evaluation test of the N components to be tested is qualified.
In a specific embodiment, the third preset failure criterion is any one of the state army mark GJB548B-2005 method 2020.1; the fourth preset unqualified standard is any one of the state army mark GJB548B-2005 method 2011.1; the fifth preset reject standard is any one of the state army standard GJB548B-2005 methods 2019.2.
The beneficial effects of the invention are as follows:
the method for evaluating the welding heat resistance of the plastic package component aims at the existing problems at present, and the welding heat resistance of the plastic package component can be accurately evaluated by comparing the external appearance, the electrical property, the internal structure and the like of the plastic package component before and after a welding test and checking the internal chip, the bonding strength, the shearing strength and the like of the plastic package component, so that the reliability of the welding heat on the plastic package component can be comprehensively analyzed, and the support can be provided for user decision.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flow chart of a method for evaluating soldering heat resistance of a plastic package component according to an embodiment of the present application.
Fig. 2 is a schematic flow chart of another method for evaluating soldering heat resistance of a plastic package component according to an embodiment of the application.
FIG. 3 illustrates a schematic diagram of welding conditions for a simulated welding test according to one embodiment of the present application.
FIG. 4 illustrates a schematic diagram of weld time versus weld temperature according to one embodiment of the present application.
Detailed Description
For a clearer description of the present application, the present application is further described below with reference to preferred embodiments and the accompanying drawings. Like parts in the drawings are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is intended to be illustrative, and not restrictive, and that this invention is not to be limited to the specific embodiments shown.
The electronic components serve as the core and the foundation of the equipment, and the quality of the electronic components directly influences the reliability of the equipment system. The plastic package device has high reliability and high price, and is generally applied to the field of military high reliability. With the increasing demands for miniaturization and high integration of plastic packaging devices, the size of the plastic packaging devices is smaller and the leads are denser. In the process of component assembly, the components with small size and dense leads are more easily affected by welding heat, so that the plastic package component leaks air, the internal welding part is remelted, and the reliability of the component is reduced or even fails.
In the conventional evaluation test of the welding heat resistance of the terms of the national military standard GJB360B-2009 method 210, the problems of package form, lead existence and non-lead of pins, heavy melting of internal solder and the like of the components are not considered in the test method of the components, the test conditions are not refined enough, and the conventional standard method is more and more difficult to comprehensively and accurately evaluate the welding heat resistance of the plastic packaged components at the present stage along with the technical development of the plastic packaged components and the expansion of the domestic requirements of the military components.
Therefore, in order to solve the above technical problems, the design concept of the technical solution described in the present application is as shown in fig. 1, M devices are randomly extracted from all samples, and appearance inspection, electrical inspection and acoustic scanning microscopy are first performed to determine the initial appearance, electrical performance and plastic package state of the test sample, and the test is qualified. Judging whether the component lead contains lead or not through the component surface mark or the related proving material, if not, carrying out energy spectrum analysis on the component lead to confirm whether the component lead contains lead or not, and then selecting lead-containing or lead-free conditions to carry out simulated welding test on M components. After the test, appearance inspection, electric test and acoustic scanning microscopy are carried out on the M devices again, whether the test result is qualified or not is confirmed, and the test result is compared with the initial state of the test result to observe the change trend. And finally, unsealing the M devices to expose the internal chip structure, then carrying out an internal visual inspection test to observe whether the internal welding part is remelted or not, carrying out a bonding strength test to check whether the bonding strength is qualified or not, and carrying out a shearing strength test to check whether the shearing strength of the chip is qualified or not.
Specifically, as shown in fig. 2, the application provides a method for evaluating welding heat resistance of a plastic package component with small size and dense leads, which comprises the following steps:
s10, sampling N components to be tested according to a worst condition principle to obtain M sampled components, wherein M is a natural number which is more than or equal to 2 and less than or equal to N;
the worst condition principle is that the least adverse values of the power supply voltage, the input signal, the load and the environmental condition (according to the functions of the components and the specified range) are added to the tested device at the same time, so that the worst condition is formed. The worst case when testing different parameters may be different, e.g. the minimum of the supply voltage, the input signal level and the ambient temperature and the maximum of the load may constitute the "worst case condition principle" for measuring the gate output voltage.
In this example, N is set to 100, and m=2 is set for the purpose of reducing the test cost, that is, 2 components are randomly extracted according to the "worst case condition principle" among 100 component samples to be tested.
It should be noted that, the values of M or N are merely exemplary, and do not constitute undue limitation on the values of M or N.
S20, performing first performance state inspection on the M sampling components, judging whether unqualified components exist in the M sampling components, and if yes, executing S30; if not, executing S40;
s30, removing unqualified components, resampling, and performing first performance state inspection on the components obtained by resampling until all the first performance state inspection of the sampled components are qualified, obtaining M components with qualified first performance state inspection, and executing S40, wherein the number of the components obtained by resampling is equal to the number of the unqualified components;
taking m=2 and n=100 as an example for explanation, the first performance inspection, that is, the performance inspection before the test, is performed on the 2 components sampled in S10, where the first performance inspection includes: a first visual inspection, a first electrical test, and a first acoustic scanning microscopy.
In a specific example, the S20 includes:
s200, first appearance inspection, which is used for inspecting whether the leads of the M sampling components meet a first preset disqualification standard or not, if yes, S30 is executed; if not, executing S202;
in one specific example, the leads of 2 components are inspected under a magnifying glass or microscope in the range of 1 to 100 times. When the wire of the plastic package component is broken, gaps are formed between the root of the wire and the plastic package shell, the diameter of the pit or the width of the recess on the wire exceeds 25% of the width of the wire, the depth is greater than 50% of the thickness, and the scratch causes the exposed base metal area of the wire to be greater than any one of 5% of the surface area of the wire, the first appearance inspection is judged to be unqualified.
And removing the devices with unqualified appearance inspection, and sampling again to perform appearance inspection. It should be noted that, the number of the components obtained by resampling is equal to the number of the unqualified components, that is, if 1 component is unqualified, resampling is performed on the remaining components to be tested which are not sampled, and the number of the components obtained by resampling is 1; and if all 2 components are disqualified, resampling in the rest non-sampled components to be tested, wherein the number of the components obtained by resampling is 2, and executing S202 until the first appearance inspection of all the sampled components is qualified.
S202, a first electric test, which is used for checking whether the electric function of the components qualified by the first appearance check is good, if yes, executing S204; if not, executing S30;
and (5) carrying out electric tests on 2 qualified components of the first appearance inspection according to a device manual to verify whether the electric functions of the components are good. And similarly, removing the components with unqualified electrical tests, resampling, and performing first appearance inspection and first electrical tests on the components obtained by resampling until the first appearance inspection and the first electrical tests of all the sampled components are qualified, and executing S204.
S204, checking by a first acoustic scanning microscope, wherein the checking is used for checking whether the interior of the components which are qualified by the first appearance check and the first electric test meets a second preset disqualification standard, and if so, executing S30; if not, S40 is performed.
And carrying out first acoustic scanning microscopy on 2 components which are qualified in the first appearance inspection and the first electric test, and observing whether layering defects exist in the plastic package device.
In a specific example, the first acoustic scanning microscope inspection is determined to be failed when any one of a crack or void in the interior of the plastic package case, a crack or void in the vicinity of the bonding wire, or a delamination between the plastic package case and the chip, and the leads occurs in the plastic package component.
And removing unqualified devices of the first acoustic scanning microscope, re-sampling, and performing first appearance inspection, first electric test and first acoustic scanning microscope inspection on the re-sampled devices until all the first appearance inspection, the first electric test and the acoustic scanning microscope inspection of the sampled devices are qualified, and executing S40.
The GJB548B-2005 method is a GJB548B-2005 microelectronic test method and program of national military standard of the people's republic of China. The present standards specify environmental, mechanical, electrical test methods and procedures for military microelectronic devices, and control and limiting measures necessary to ensure that the microelectronic device meets the quality and reliability requirements for its intended use. The standard is applicable to microelectronic devices for military and space applications.
In a specific example, unqualified components are removed, sampling is carried out again, and the components obtained by resampling are subjected to first performance state inspection until all the first performance state inspection of the sampled components are qualified, so that 2 components with qualified first performance state inspection are obtained.
And S40, performing a simulated welding test on the M components which are qualified in the first performance state inspection to obtain M simulated welding components.
The simulated welding test comprises a lead simulated welding test and a leadless simulated welding test; the simulated welding components comprise lead-containing simulated welding components and leadless simulated welding components.
In a specific embodiment, the step S40 includes:
s400, conducting lead component analysis on the components which are qualified in the M first performance states, judging whether the components contain lead, and if yes, judging that the components contain lead; if not, judging that the lead-free component is a lead-free component;
the purpose of the component analysis of the leads is to judge whether the leads of the plastic package component contain lead or not, so that the simulation welding test can be carried out under different conditions. Judging whether the lead contains lead or not, wherein the lead is identified from the surface of a component packaging material, the surface of a physical object or a proving material, and the like, if the lead is marked with a word such as PBF, the lead of the component is not lead; and secondly, carrying out energy spectrum analysis on the lead wires of the components and judging whether the analysis result contains lead elements or not.
S402, carrying out the leaded simulated welding test on the leaded component to obtain the leaded simulated welding component; and carrying out the lead-free simulated welding test on the lead-free components to obtain the lead-free simulated welding components, wherein the sum of the number of the lead-free simulated welding components and the number of the lead-free simulated welding components is M.
In a specific example, according to whether the component leads contain lead, the thickness of the component or the packaging volume (obtained by measuring and calculating with a vernier caliper), a corresponding soldering condition shown in fig. 3 is selected to perform a lead-free simulated soldering test or a lead-free simulated soldering test, wherein the relation between soldering time and soldering temperature is shown in fig. 4, and those skilled in the art can understand with reference to fig. 3 and 4, and the specific process of the simulated soldering test is not repeated in the present application.
S50, performing second performance state inspection on the M simulated welding components, judging whether unqualified components exist in the M simulated welding components, if so, judging that the welding heat resistance evaluation test of the N components to be tested is unqualified, if not, obtaining M components with qualified second performance state inspection, and executing S60;
in one specific example, the simulated solder tested component is subjected to a second performance state inspection, i.e., a post-test performance inspection, wherein the second performance inspection includes a second appearance inspection, a second electrical test, and a second acoustic scanning microscope inspection. The S50 includes:
s500, second appearance inspection, which is used for inspecting whether the leads of the M simulated welding components meet a first preset disqualification standard or not, if so, judging that the welding heat resistance evaluation test of the N components to be tested is disqualified; if not, executing S502;
in one specific example, the leads of 2 components are inspected under a magnifying glass or microscope in the range of 1 to 100 times. And when the wire of the plastic package component is broken, gaps are formed between the root of the wire and the plastic package shell, the diameter of the pit or the width of the recess on the wire exceeds 25% of the width of the wire, the depth is greater than 50% of the thickness, and the scratch causes the exposed base metal area of the wire to be greater than any one of 5% of the surface area of the wire, the second appearance inspection is judged to be unqualified.
If unqualified components exist in the second appearance inspection, the fact that the welding heat resistance evaluation test of the batch of plastic package devices (namely N components to be tested) is unqualified is shown, and the subsequent test is stopped, namely the second electric test and the second acoustic scanning microscope inspection are not performed any more; if the components in the second appearance inspection are all qualified, S502 is executed.
S502, a second electric test, which is used for checking whether the electric function of the component qualified by the second appearance check is good, if yes, executing S504; if not, judging that the welding heat resistance evaluation test of the N components to be tested is not qualified;
and (5) carrying out electric tests on the 2 qualified components of the second appearance inspection according to a device manual to verify whether the electric functions of the components are good. If unqualified components exist in the second electrical test, the evaluation test of the heat resistance of the batch of plastic package devices is unqualified, and the subsequent test is stopped, namely, the second acoustic scanning microscope inspection is not performed any more; if the components in the second electrical test are all qualified, S504 is executed.
S504, second acoustic scanning microscope inspection, which is used for inspecting whether the components qualified by the second appearance inspection and the second electrical test meet a second preset failure standard or not, if so, judging that the welding heat resistance evaluation tests of the N components to be tested are failed; if not, S60 is performed.
And (3) performing second acoustic scanning microscopy on 2 components which are qualified in the second appearance inspection and the second electrical test, and observing whether layering defects exist in the plastic package device.
In a specific example, the second acoustic scanning microscope inspection is determined to be failed when any one of a crack or void in the interior of the plastic package case, a crack or void in the vicinity of the bonding wire, or a delamination between the plastic package case and the chip, and the lead occurs in the plastic package component.
If unqualified components exist in the second acoustic scanning microscope examination, the unqualified component is indicated that the welding heat resistance evaluation test of the batch of plastic package components is unqualified; if the components in the second acoustic scanning microscope inspection are all qualified, S60 is executed.
S60, performing welding heat influence evaluation on the components with the qualified M second performance states, and if all the welding heat influence evaluations of the components with the qualified M second performance states are qualified, judging that the welding heat resistance evaluation tests of the N components to be tested are qualified; if not, judging that the welding heat resistance evaluation test of the N components to be tested is not qualified.
It will be appreciated by those skilled in the art that the second performance inspection and qualification of the molded component after the completion of the simulated soldering process indicates that the thermal stress during the soldering process does not cause fatal defects or effects on the component, but may potentially damage the chip, bonding strength or shear strength inside the component, thereby reducing the reliability of the component, and further evaluation of the soldering thermal effect is required.
Wherein the welding heat impact assessment includes an internal visual inspection test, a bonding strength test, and a shear strength test.
In the test for evaluating the heat resistance of the plastic package component, only if all the tests in the evaluation of the heat resistance are qualified, the overall result of the test for evaluating the heat resistance is qualified; if any test fails, the heat resistance evaluation test fails.
In a specific example, the S60 includes:
s600, an internal visual inspection test is used for checking whether the internal structure of any component with the qualified second performance state meets a third preset unqualified standard, and if so, judging that the welding heat resistance evaluation test of the N components to be tested is unqualified; if not, execute 602;
in this example, the analog soldered device is unsealed, exposing the internal chip and the bonding structure. And observing within 50-1000 times by using a body microscope and a metallographic microscope, and checking whether the bonding and the chip structure inside the plastic package device are damaged in the simulated welding process. The unqualified criteria of the internal visual inspection test refer to the GJB548B-2005 method 2020.1 (i.e., the third preset unqualified criteria), and it should be noted that the damage in the internal visual inspection test does not include the damage caused by acid corrosion to the components in the unsealing process.
If the internal visual inspection test is failed, the welding heat resistance evaluation test of the batch of plastic package devices is failed, and the subsequent test is stopped, namely, the bonding strength test and the shearing strength test are not performed any more; if no failure occurs in the internal visual inspection test, S602 is executed.
S602, a bonding strength test, which is used for checking whether bonding strength of any component qualified by an internal visual inspection test meets a fourth preset disqualification standard, and if so, judging that the welding heat resistance evaluation test of the N components to be tested is disqualified; if not, executing S604;
in this example, a bonding strength test is performed on the device after internal visual inspection, and whether damage is caused to the bonding strength inside the plastic package device in the process of simulated welding is checked. Wherein the disqualification criteria for the bond strength test are referenced to the GJB548B-2005 method 2011.1 (i.e., the fourth preset disqualification criteria).
If the bonding strength test is failed, the welding heat resistance evaluation test of the batch of plastic package devices is failed, and the subsequent test is stopped, namely, the shear strength test is not performed any more; if no failure occurs in the bonding strength test, S604 is executed.
S604, a shear strength test, which is used for checking whether the internal chip bonding strength of any component qualified by an internal visual inspection test and a bonding strength test meets a fifth preset unqualified standard, and if so, judging that the welding heat resistance evaluation test of the N components to be tested is unqualified; and if not, judging that the welding heat resistance evaluation test of the N components to be tested is qualified.
And (3) carrying out a chip shear strength test on the device subjected to the bonding strength test, and checking whether the bonding strength of the chip inside the plastic package device is damaged in the simulated welding process. Wherein the failure criteria for the shear strength test are referenced to the GJB548B-2005 method 2019.2 (i.e., the fifth preset failure criteria).
If the failure condition occurs in the shear strength test, the batch of plastic package devices are failed in the welding heat resistance evaluation test; if no unqualified condition appears in the shear strength test, the test indicates that the welding heat resistance evaluation test of the batch of plastic package devices is qualified.
And the qualified evaluation test of the heat resistance of the welding shows that the materials, the structure, the electrical performance parameters and the reliability of the plastic package devices in the batch are not obviously damaged and influenced in the simulated welding process.
The method comprehensively evaluates the welding heat resistance of the plastic package component, particularly the plastic package component with small size and dense leads, compares the external appearance, the electrical property, the internal structure and the like before and after the test, checks the internal chip, the bonding shearing strength and the like of the component, comprehensively analyzes the influence of the welding heat on the reliability of the component, and can accurately evaluate the welding heat resistance of the plastic package component.
The method can analyze the problems of plastic package air leakage, internal solder heavy melting and the like caused by welding heat, and can solve the problem that the welding heat resistance of the plastic package device with small size and dense leads is not comprehensively evaluated by considering the difference of test conditions of lead-containing and lead-free plastic package devices, thereby promoting the improvement of the inherent reliability of the plastic package device.
It should be noted that in the description of the present application, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
It should be understood that the foregoing examples of the present invention are provided merely for clearly illustrating the present invention and are not intended to limit the embodiments of the present invention, and that various other changes and modifications may be made therein by one skilled in the art without departing from the spirit and scope of the present invention as defined by the appended claims.
Claims (9)
1. The method for evaluating the welding heat resistance of the plastic package component is characterized by comprising the following steps of:
s10, sampling N components to be tested according to a worst condition principle to obtain M sampled components, wherein M is a natural number which is more than or equal to 2 and less than or equal to N;
s20, performing first performance state inspection on the M sampling components, judging whether unqualified components exist in the M sampling components, and if yes, executing S30; if not, executing S40;
s30, removing unqualified components, resampling, and performing first performance state inspection on the components obtained by resampling until all the first performance state inspection of the sampled components are qualified, obtaining M components with qualified first performance state inspection, and executing S40, wherein the number of the components obtained by resampling is equal to the number of the unqualified components;
s40, performing a simulated welding test on the M components which are qualified in the first performance state inspection to obtain M simulated welding components;
s50, performing second performance state inspection on the M simulated welding components, judging whether unqualified components exist in the M simulated welding components, if so, judging that the welding heat resistance evaluation test of the N components to be tested is unqualified, if not, obtaining M components with qualified second performance state inspection, and executing S60;
s60, performing welding heat influence evaluation on the components with the qualified M second performance states, and if all the welding heat influence evaluations of the components with the qualified M second performance states are qualified, judging that the welding heat resistance evaluation tests of the N components to be tested are qualified; if not, judging that the welding heat resistance evaluation test of the N components to be tested is not qualified;
the first performance state check includes: a first visual inspection, a first electrical test, and a first acoustic scanning microscopy;
the second performance state check includes: second appearance inspection, second electrical test, and second acoustic scanning microscopy.
2. The method according to claim 1, wherein S20 comprises:
s200, first appearance inspection, which is used for inspecting whether the leads of the M sampling components meet a first preset disqualification standard or not, if yes, S30 is executed; if not, executing S202;
s202, a first electric test, which is used for checking whether the electric function of the components qualified by the first appearance check is good, if yes, executing S204; if not, executing S30;
s204, checking by a first acoustic scanning microscope, wherein the checking is used for checking whether the interior of the components which are qualified by the first appearance check and the first electric test meets a second preset disqualification standard, and if so, executing S30; if not, S40 is performed.
3. The method of claim 1, wherein the simulated welding test comprises a lead-based simulated welding test and a lead-free simulated welding test; the simulated welding components comprise lead-containing simulated welding components and leadless simulated welding components.
4. A method according to claim 3, wherein said S40 comprises:
s400, conducting lead component analysis on the components which are qualified in the M first performance states, judging whether the components contain lead, and if yes, judging that the components contain lead; if not, judging that the lead-free component is a lead-free component;
s402, carrying out the leaded simulated welding test on the leaded component to obtain the leaded simulated welding component; and carrying out the lead-free simulated welding test on the lead-free components to obtain the lead-free simulated welding components, wherein the sum of the number of the lead-free simulated welding components and the number of the lead-free simulated welding components is M.
5. The method according to claim 1, wherein said S50 comprises:
s500, second appearance inspection, which is used for inspecting whether the leads of the M simulated welding components meet a first preset disqualification standard or not, if so, judging that the welding heat resistance evaluation test of the N components to be tested is disqualified; if not, executing S502;
s502, a second electric test, which is used for checking whether the electric function of the component qualified by the second appearance check is good, if yes, executing S504; if not, judging that the welding heat resistance evaluation test of the N components to be tested is not qualified;
s504, second acoustic scanning microscope inspection, which is used for inspecting whether the components qualified by the second appearance inspection and the second electrical test meet a second preset failure standard or not, if so, judging that the welding heat resistance evaluation tests of the N components to be tested are failed; if not, S60 is performed.
6. The method according to claim 2 or 5, wherein,
the first preset unqualified standard is any one of a first condition, a second condition, a third condition and a fourth condition, wherein the first condition is wire breakage of a lead of a component; the second condition is that a gap is formed between the root of the lead of the component and the plastic package shell; the third condition is that the diameter of a pit or the width of a recess on a lead of the component exceeds 25% of the width of the lead, and the depth of the recess is greater than 50% of the thickness; the fourth case is that scratches on the component lead expose a base metal area greater than 5% of the lead surface area;
the second preset reject standard is any one of a fifth case, a sixth case and a seventh case, wherein the fifth case is that cracks exist in the plastic package shell; the sixth condition is that cracks or hollows exist near the bonding wire; and in the seventh case, layering exists between the plastic package shell and the chip and between the plastic package shell and the lead.
7. The method of claim 1, wherein the weld thermal impact assessment comprises: internal visual inspection test, bond strength test, and shear strength test.
8. The method of claim 7, wherein S60 comprises:
s600, an internal visual inspection test, which is used for checking whether the internal structure of any M components with qualified second performance states accords with a third preset unqualified standard, if so, judging that the welding heat resistance evaluation test of the N components to be tested is unqualified; if not, execute 602;
s602, a bonding strength test, which is used for checking whether bonding strength of any component qualified by an internal visual inspection test meets a fourth preset disqualification standard, and if so, judging that the welding heat resistance evaluation test of the N components to be tested is disqualified; if not, executing S604;
s604, a shear strength test, which is used for checking whether the internal chip bonding strength of any component qualified by an internal visual inspection test and a bonding strength test meets a fifth preset unqualified standard, and if so, judging that the welding heat resistance evaluation test of the N components to be tested is unqualified; and if not, judging that the welding heat resistance evaluation test of the N components to be tested is qualified.
9. The method of claim 8, wherein the step of determining the position of the first electrode is performed,
the third preset unqualified standard is any one of the state army mark GJB548B-2005 method 2020.1;
the fourth preset unqualified standard is any one of the state army mark GJB548B-2005 method 2011.1;
the fifth preset reject standard is any one of the state army standard GJB548B-2005 methods 2019.2.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1651915A (en) * | 2005-03-28 | 2005-08-10 | 北京航空航天大学 | Method of using unqualified article as destructive physical analyzing quality exaluation |
| CN104458753A (en) * | 2014-11-04 | 2015-03-25 | 航天科工防御技术研究试验中心 | Method for analyzing physical characteristics of semiconductor device |
| CN106872575A (en) * | 2017-01-05 | 2017-06-20 | 航天科工防御技术研究试验中心 | A kind of classification risk evaluating method of plastic device lamination defect |
| CN112033473A (en) * | 2020-09-15 | 2020-12-04 | 中车株洲电力机车研究所有限公司 | Combined evaluation test method for welding reliability of electronic component |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7191413B2 (en) * | 2004-01-28 | 2007-03-13 | Gradient Design Automation, Inc. | Method and apparatus for thermal testing of semiconductor chip designs |
-
2021
- 2021-03-16 CN CN202110279116.3A patent/CN113064001B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1651915A (en) * | 2005-03-28 | 2005-08-10 | 北京航空航天大学 | Method of using unqualified article as destructive physical analyzing quality exaluation |
| CN104458753A (en) * | 2014-11-04 | 2015-03-25 | 航天科工防御技术研究试验中心 | Method for analyzing physical characteristics of semiconductor device |
| CN106872575A (en) * | 2017-01-05 | 2017-06-20 | 航天科工防御技术研究试验中心 | A kind of classification risk evaluating method of plastic device lamination defect |
| CN112033473A (en) * | 2020-09-15 | 2020-12-04 | 中车株洲电力机车研究所有限公司 | Combined evaluation test method for welding reliability of electronic component |
Non-Patent Citations (1)
| Title |
|---|
| 塑封电子元器件破坏性物理分析方法;宋芳芳;塑封电子元器件破坏性物理分析方法(第5期);第52-55页 * |
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