CN112858809A - Method for evaluating reliability of label-modified plastic package component - Google Patents

Method for evaluating reliability of label-modified plastic package component Download PDF

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CN112858809A
CN112858809A CN202110007276.2A CN202110007276A CN112858809A CN 112858809 A CN112858809 A CN 112858809A CN 202110007276 A CN202110007276 A CN 202110007276A CN 112858809 A CN112858809 A CN 112858809A
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unqualified
test
components
standard
qualified
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邝栗山
刘莉
曹庆
吴中祥
张昊
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CASIC Space Engineering Development Co Ltd
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CASIC Space Engineering Development Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/003—Environmental or reliability tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0654—Imaging
    • G01N29/0681—Imaging by acoustic microscopy, e.g. scanning acoustic microscopy
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/20—Investigating strength properties of solid materials by application of mechanical stress by applying steady bending forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/24—Investigating strength properties of solid materials by application of mechanical stress by applying steady shearing forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/20—Metals
    • G01N33/207—Welded or soldered joints; Solderability
    • G—PHYSICS
    • G01—MEASURING; TESTING
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    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014—Type of force applied
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014—Type of force applied
    • G01N2203/0025—Shearing
    • G—PHYSICS
    • G01—MEASURING; TESTING
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    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/03—Investigating materials by wave or particle radiation by transmission
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/10—Different kinds of radiation or particles
    • G01N2223/101—Different kinds of radiation or particles electromagnetic radiation
    • G01N2223/1016—X-ray
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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Abstract

An embodiment of the application discloses a method for evaluating reliability of a label-modified plastic package component, which comprises the following steps: s10, performing quality consistency inspection on the components to be tested, and eliminating unqualified components, wherein the number of the components to be tested is N, and the number of the unqualified components is M; s20, judging whether the PDA value of the quality consistency test is less than 30%, if yes, executing S30; if not, the qualified device is not available, and the reliability evaluation test is not carried out, wherein the PDA is M/N; and S30, carrying out reliability evaluation test on the qualified components, and evaluating the reliability according to a preset standard. According to the technical scheme, whether the package, the pins, the bonding and the chip of the plastic package device are damaged or not in the label changing process can be evaluated, quality consistency and reliability conclusion of the device can be obtained, and support is provided for decision making of a user.

Description

Method for evaluating reliability of label-modified plastic package component
Technical Field
The application relates to the technical field of military component reliability analysis. And more particularly, to a method for evaluating reliability of a label-modified plastic package component.
Background
The electronic components are used as the core and the foundation of the equipment, and the quality of the electronic components directly influences the reliability of the equipment system. Compared with the foreign countries, certain differences exist in the aspects of component design, production and process level in China, so that high-end core components such as DSP (digital signal processor), FPGA (field programmable gate array) and the like still depend on the foreign imports. Because military equipment has high requirements on quality consistency and stability, when purchasing components of the same type, the production batches of the components are also the same. However, import devices are affected by production stoppage, gear breakage, forbidden operation and the like, and a large number of devices of the same model and the same batch are difficult to purchase. Driven by the great economic benefit, some suppliers change the same model and different production lots of components into the same lot (as shown in fig. 1) by using a method of changing the appearance identifiers of the components, and then supply the components to military equipment development units.
For plastic package devices, the procedure of changing the appearance mark is generally to polish the mark of the original factory, then to spray paint and coat the polished surface, then to spray print a new mark, and finally to finish and clean. In the process, damage or cracking of the external package of the component, damage of the lead, damage of the plastic package area, bonding, damage of the chip and the like can be caused, and the reliability of the component is influenced. At present, a user side, particularly a military equipment developer, directly requires prohibition of use and has to return goods to a supplier, but because the availability of part of imported components is difficult, the quality consistency and reliability of the improved components can be evaluated by performing a series of reliability tests, so that reference is provided for the decision of the user.
Disclosure of Invention
The application provides a method for evaluating the reliability of a re-labeled plastic package component to solve at least one of the problems mentioned in the background art.
In order to achieve the purpose, the following technical scheme is adopted in the application:
the application provides a method for evaluating the reliability of a label-modified plastic package component, which comprises the following steps:
s10, performing quality consistency inspection on the components to be tested, and eliminating unqualified components, wherein the number of the components to be tested is N, and the number of the unqualified components is M;
s20, judging whether the PDA value of the quality consistency test is less than 30%, if yes, executing S30; if not, the qualified device is not available, and the reliability evaluation test is not carried out, wherein the PDA is M/N;
and S30, carrying out reliability evaluation test on the qualified components, and evaluating the reliability according to a preset standard.
In a specific embodiment, the S10 includes:
s100, appearance inspection is carried out, whether the appearance of the to-be-detected component meets a first preset unqualified standard is checked, and if yes, the first unqualified component is removed; if not, executing S102;
s102, X-ray inspection is carried out, whether the remaining components qualified in appearance inspection meet a second preset unqualified standard is checked, and if yes, second unqualified components are removed; if not, executing S104;
s104, performing electrical test for verifying whether the functions of the components qualified by the residual X-ray inspection are intact, and if so, executing S106; if not, rejecting a third unqualified component;
s106, scanning acoustic microscopy for checking whether the components qualified in the residual electric test meet a third preset unqualified standard or not, and if yes, rejecting a fourth unqualified component; if not, the quality consistency check is completed,
the sum of the number of the first unqualified component, the second unqualified component, the third unqualified component and the fourth unqualified component is M, and the number of the qualified components is N-M.
In one embodiment, the first predetermined disqualification criteria is any one of the conditions of clauses 3.3.2-3.3.7 of the national military standard 548B-2005 method 2009.1;
the second predetermined disqualification criteria is any of the conditions of clauses 3.10.2.2 or 3.11.2.2 of the national military standard 548B-2005 method 2012.1;
the third predetermined disqualification criteria is any of the national military standards 4027A-2006 work item 1103 clauses 2.4.4.
In a specific embodiment, the S30 includes:
s300, selecting 4 devices with relatively poor quality to averagely divide the devices into a first group and a second group according to the principle of 'worst case conditions', wherein the number of each group is 2, and performing a reliability evaluation test;
s302, performing solderability test, internal visual inspection and passivation layer integrity inspection on the first packet;
s304, conducting lead firmness inspection, internal visual inspection, bonding strength test and shear strength test on the second grouping;
s306, judging whether the tests of the first grouping and the second grouping are all qualified, if so, judging that the reliability evaluation test is qualified; if not, the reliability evaluation test is unqualified.
In a specific embodiment, the S302 includes:
s3020, performing a solderability test, namely checking whether the surface topography of the pin of any device in the first group is covered with a continuous new solder layer in an area of more than 95%, if so, determining that the solderability test is qualified, and executing S3022; otherwise, the weldability test is unqualified, the character and image records are reserved, and the subsequent evaluation test is not carried out any more;
s3022, internal visual inspection, which is used for checking whether the internal bonding of the components and the chip structure meet a fifth preset unqualified standard in the label changing process, if so, judging that the internal visual inspection is unqualified, and after character and image records are reserved, the subsequent evaluation test is not carried out any more; if not, executing S3024;
and S3024, integrity inspection of the passivation layer is used for inspecting whether the device which is qualified through internal visual inspection meets a sixth preset unqualified standard, if so, the integrity test of the passivation layer is unqualified, and character and image records are reserved.
In a specific embodiment, the S304 includes:
s3040, checking lead firmness, configured to check whether pins of any component in the second group meet a fourth predetermined unqualified standard, and if at least one pin does not meet the fourth predetermined unqualified standard, executing S3042; otherwise, judging that the lead firmness inspection is unqualified, keeping character and image records, and not performing subsequent operation;
s3042, internal visual inspection, which is used for inspecting whether the internal bonding of the components and the chip structure meet the fifth preset unqualified standard in the label changing process, if so, judging that the internal visual inspection is unqualified, and after character and image records are reserved, the subsequent evaluation test is not carried out any more; if not, executing S3044;
s3044, a bonding strength test is carried out, wherein the bonding strength test is used for checking whether the bonding strength inside the device meets a seventh preset unqualified standard, if yes, test data and image records are reserved, and a subsequent evaluation test is not carried out any more; if not, executing S3046;
s3046, a shear strength test is carried out, and the shear strength test is used for checking whether the bonding strength of the chip in the device after the bonding strength test meets the eighth preset unqualified standard, if so, the test data and the image record are reserved, and the subsequent evaluation test is not carried out any more.
In a specific embodiment, when the plastic package device to be tested is a device with a lead, the lead firmness can be checked; if the device is a leadless device, S3040 is not performed.
In one embodiment, the fourth predetermined disqualification criterion is any of GJB 548B-2005 method 2004.2; the fifth predetermined unqualified standard is any one of GJB 548B-2005 method 2020.1; the sixth predetermined disqualification standard is any of the GJB 548B-2005 method 2021.
In one embodiment, the seventh predetermined disqualification criterion is any of GJB 548B-2005 method 2011.1.
In one embodiment, the eighth predetermined disqualification criterion is any of GJB 548B-2005 method 2019.2.
The beneficial effect of this application is as follows:
at present, a user side, particularly a military equipment development side, directly requires forbidding use and has to return goods to a supplier, and the technical scheme can evaluate whether the package, the pin, the bonding and the chip of the plastic package device are damaged in the label changing process, obtain the quality consistency and the reliability conclusion of the device and provide support for the decision of the user.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 shows a schematic diagram of a device topography for changing appearance marks.
Fig. 2 is a schematic flow chart of a method for evaluating reliability of a modified plastic package component according to an embodiment of the present application.
Fig. 3 is a detailed flowchart illustrating a method for evaluating reliability of a modified plastic package component according to an embodiment of the present application.
Detailed Description
In order to make the technical solutions and advantages of the present application clearer, the following will describe the embodiments of the present application in further detail with reference to the accompanying drawings.
In order to solve the technical problems, the technical scheme of the application is that firstly, quality consistency inspection is carried out on all samples, the main inspection comprises appearance inspection, X-ray inspection, electrical test and plastic package inspection, the tests are non-destructive tests, unqualified plastic package devices and plastic package devices with poor quality consistency can be removed, then reliability evaluation tests are carried out on the plastic package devices with qualified quality consistency inspection, the tests are divided into two groups, each group of tests selects 2 devices, and the devices are generally samples with relatively poor quality in the samples with qualified quality consistency inspection; one group is subjected to lead firmness inspection, plastic packaging inspection, internal visual inspection and passivation layer integrity inspection; the other group was subjected to solderability testing, internal visual inspection, bond and shear strength testing, and passivation layer integrity inspection.
As shown in fig. 2, the present application provides a method for evaluating quality consistency of plastic packaged devices in different batches, and in particular, relates to a method for evaluating quality consistency of components after changing production batches of plastic packaged devices, the method including:
s10, performing quality consistency inspection on the components to be tested, and eliminating unqualified components, wherein the number of the components to be tested is N, and the number of the unqualified components is M;
in a specific example, as shown in fig. 3, the quality consistency check of the device to be tested includes:
visual inspection
And (3) inspecting all plastic packaged devices with inspection by using a magnifying glass or a microscope within the range of 1.5-100 times. When foreign objects are present or suspected, the device is blown off by a filtered, clean gas stream (vacuum drawn or blown) at a pressure of about 137 kPa.
When the appearance of the plastic package device is checked, the device is regarded as unqualified and removed under any condition of the terms 3.3.2-3.3.7 of the GJB 548B-2005 method 2009.1.
X-ray examination
And inspecting the internal structure of the plastic packaged device by using a micro-focus X-ray detection device (the resolution of the main dimension is 25.4 mu m, and the distortion is less than 10%), and respectively performing penetration inspection on the device in X, Y directions and Z directions by using X rays during inspection. When the situation of GJB 548B-2005 method 2012.1 clause 3.10.2.2 or 3.11.2.2 appears in the X-ray inspection process of the plastic packaged device, the device is regarded as unqualified and is rejected.
Electrical test
And (4) performing electrical test on the devices qualified by the X-ray inspection according to a device manual, and verifying whether the functions of the devices are intact. And rejecting the devices which fail the electrical test.
Scanning acoustic microscopy
And (4) carrying out scanning acoustic microscope inspection on the devices qualified in the electrical test by using an ultrasonic scanning microscope, and observing whether a sealing body of the plastic package device has a cavity or cracks and whether layering exists among the internal lead frame, the bonding and the chip. When the situation of any one of GJB 4027A-2006 work items 1103 clause 2.4.4 appears in the scanning acoustic microscopy process of the plastic package device, the device is regarded as unqualified and is removed.
S20, judging whether the PDA value of the quality consistency test is less than 30%, if yes, executing S30; if not, the qualified device is not available, and the reliability evaluation test is not carried out, wherein the PDA is M/N;
in a specific example, after the quality consistency test is completed on the component to be tested, the total number of unqualified components removed from all test items in the quality consistency test process is counted, and is divided by the total number of the components to obtain a PDA value of the quality consistency test, and if the PDA is less than 30%, the qualified plastic package components can be subjected to a subsequent reliability evaluation test; otherwise, all devices are directly judged to be unavailable, and subsequent evaluation tests are not carried out.
And S30, carrying out reliability evaluation test on the qualified components, and evaluating the reliability according to a preset standard.
In one specific example, the reliability evaluation test further comprises:
s300, selecting 4 devices with relatively poor quality to averagely divide the devices into a first group and a second group according to the principle of 'worst case conditions', wherein the number of each group is 2, and performing a reliability evaluation test;
s302, conducting lead firmness inspection, plastic package inspection, internal visual inspection and passivation layer integrity inspection on the first packet;
specifically, as shown in fig. 3, the S302 includes:
weldability test
And performing a solderability test on 2 devices in 2 groups by adopting an immersion method, performing water vapor aging for 8 hours at 90 ℃ before the test, and naturally drying for 20min at room temperature and then performing the solderability test. Observing the surface appearance of the pin of the device by using a microscope after the solderability test, and if more than 95% of the surface area of the pin is covered with a continuous new solder layer, the solderability test is qualified; otherwise, the test fails. If the unqualified condition occurs, the next test is carried out after the characters and the image are kept.
If 1 unqualified weldability test appears, 1 more times can be extracted for testing. If the test of the 1 added and extracted device is qualified, the whole test is qualified; if the 1 extracted device is not qualified, the whole test is not qualified. If the test is unqualified, the records of characters and images are reserved, and the subsequent evaluation test is not carried out any more.
Visual inspection of interior
And unsealing the device subjected to the lead firmness test to expose the internal chip and the bonding structure. And observing by using a body type microscope and a metallographic microscope within a range of 50-1000 times, and checking whether the internal bonding and the chip structure of the plastic package device are damaged in the label changing process. The reject criterion is referenced to GJB 548B-2005 method 2020.1. If the unqualified condition occurs, the next test is carried out after the characters and the image are kept.
Passivation layer integrity
The surface of the chip inside the plastic package device generally has a passivation layer for protecting the chip from external factors. And carrying out passivation layer integrity check on the device subjected to internal visual inspection, and judging whether the device damages the passivation layer on the surface of the chip in the label changing process.
The test method is carried out according to the GJB 548B-2005 method 2021, and the metallographic phase of the device chip is observed by using a body type microscope and a metallographic phase microscope after the test is finished. If corrosion of the aluminum layer occurs anywhere except at the edge of the area (such as a bonding area, a chip edge, a scribing groove and the like) which is not used as the passivation layer intentionally, the integrity test of the passivation layer is unqualified, and the character and image records are reserved.
S304, performing solderability test, internal visual inspection, bonding strength test, shear strength test and passivation layer integrity check on the second group;
specifically, as shown in fig. 3, the S304 includes:
lead integrity inspection
When the plastic package device to be tested is a device with a lead, the lead firmness can be checked; if the device is a leadless device, the test is not performed. In the test, a clamp is used for applying bending stress to the pins of the device according to a specified angle, and whether the pins of the plastic package device are damaged or not in the label changing process is checked. The test method and the unqualified criterion refer to GJB 548B-2005 method 2004.2.
If 1 unqualified product appears, 1 more product can be extracted for testing. If the test of the 1 added and extracted device is qualified, the whole test is qualified; if the 1 extracted device is not qualified, the whole test is not qualified. If the test is unqualified, the records of characters and images are reserved, and the subsequent evaluation test is not carried out any more.
Visual inspection of interior
And unsealing the device subjected to the solderability test to expose the internal chip and the bonding structure. And observing by using a body type microscope and a metallographic microscope within a range of 50-1000 times, and checking whether the internal bonding and the chip structure of the plastic package device are damaged in the label changing process. The reject criterion is referenced to GJB 548B-2005 method 2020.1. If the condition is unqualified, the records of the characters and the images are reserved, and the subsequent evaluation test is not carried out.
Bond Strength test
And (4) carrying out a bonding strength test on the device after internal visual inspection, and inspecting whether the bonding strength inside the plastic package device is damaged in the label changing process. The reject criterion is referenced to GJB 548B-2005 method 2011.1. If the unqualified condition occurs, the test data and the image record are reserved, and the subsequent evaluation test is not carried out any more.
Shear strength test
And carrying out a chip shear strength test on the device subjected to the bonding strength test, and checking whether the bonding strength of the chip in the plastic package device is damaged in the label changing process. The reject criterion is referenced to GJB 548B-2005 method 2019.2. If the unqualified condition occurs, the test data and the image record are reserved, and the subsequent evaluation test is not carried out any more.
S306, judging whether the tests of the first grouping and the second grouping are all qualified, if so, judging that the reliability evaluation test is qualified; if not, the reliability evaluation test is unqualified.
In a specific example, in the reliability evaluation test, only 2 groups of tests are all qualified, and the overall result of the reliability evaluation test is qualified; and if any test fails, the reliability evaluation test fails.
The reliability evaluation test is qualified, and the packaging, the structure and the performance of the residual plastic package devices passing the quality consistency test are not obviously damaged and influenced in the label changing process, so that the devices basically meet the expected reliability.
The quality consistency of all devices is checked through a non-destructive test, and unqualified devices are removed; and selecting a sample for qualified devices according to the principle of 'worst case conditions' to perform a reliability evaluation test, and judging whether the packaging, structure and performance of the plastic package device are obviously damaged and influenced or not in the label changing process according to the comprehensive test result, so that quality consistency and reliability conclusion of the device are obtained, and support is provided for user decision.
It should be noted that, in the design of the present application, the reliability evaluation method of the present application is not applicable to plastic package devices with labels of changed models, tailors, quality grades, or the like.
It is further noted that, in the description of the present application, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
It should be understood that the above-mentioned examples are given for the purpose of illustrating the present application clearly and not for the purpose of limiting the same, and that various other modifications and variations of the present invention may be made by those skilled in the art in light of the above teachings, and it is not intended to be exhaustive or to limit the invention to the precise form disclosed.

Claims (10)

1. A method for evaluating the reliability of a label-modified plastic package component is characterized by comprising the following steps:
s10, performing quality consistency inspection on the components to be tested, and eliminating unqualified components, wherein the number of the components to be tested is N, and the number of the unqualified components is M;
s20, judging whether the PDA value of the quality consistency test is less than 30%, if yes, executing S30; if not, the qualified device is not available, and the reliability evaluation test is not carried out, wherein the PDA is M/N;
and S30, carrying out reliability evaluation test on the qualified components, and evaluating the reliability according to a preset standard.
2. The method according to claim 1, wherein the S10 includes:
s100, appearance inspection is carried out, whether the appearance of the to-be-detected component meets a first preset unqualified standard is checked, and if yes, the first unqualified component is removed; if not, executing S102;
s102, X-ray inspection is carried out, whether the remaining components qualified in appearance inspection meet a second preset unqualified standard is checked, and if yes, second unqualified components are removed; if not, executing S104;
s104, performing electrical test for verifying whether the functions of the components qualified by the residual X-ray inspection are intact, and if so, executing S106; if not, rejecting a third unqualified component;
s106, scanning acoustic microscopy for checking whether the components qualified in the residual electric test meet a third preset unqualified standard or not, and if yes, rejecting a fourth unqualified component; if not, the quality consistency check is completed,
the sum of the number of the first unqualified component, the second unqualified component, the third unqualified component and the fourth unqualified component is M, and the number of the qualified components is N-M.
3. The method of claim 2,
the first predetermined disqualification standard is any one of the conditions of clauses 3.3.2-3.3.7 of the State military Standard 548B-2005 method 2009.1;
the second predetermined disqualification criteria is any of the conditions of clauses 3.10.2.2 or 3.11.2.2 of the national military standard 548B-2005 method 2012.1;
the third predetermined disqualification criteria is any of the national military standards 4027A-2006 work item 1103 clauses 2.4.4.
4. The method according to claim 1, wherein the S30 includes:
s300, selecting 4 devices with relatively poor quality to averagely divide the devices into a first group and a second group according to the principle of 'worst case conditions', wherein the number of each group is 2, and performing a reliability evaluation test;
s302, performing solderability test, internal visual inspection and passivation layer integrity inspection on the first packet;
s304, conducting lead firmness inspection, internal visual inspection, bonding strength test and shear strength test on the second grouping;
s306, judging whether the tests of the first grouping and the second grouping are all qualified, if so, judging that the reliability evaluation test is qualified; if not, the reliability evaluation test is unqualified.
5. The method according to claim 4, wherein the S302 comprises:
s3020, performing a solderability test, namely checking whether the surface topography of the pin of any device in the first group is covered with a continuous new solder layer in an area of more than 95%, if so, determining that the solderability test is qualified, and executing S3022; otherwise, the weldability test is unqualified, the character and image records are reserved, and the subsequent evaluation test is not carried out any more;
s3022, internal visual inspection, which is used for checking whether the internal bonding of the components and the chip structure meet a fifth preset unqualified standard in the label changing process, if so, judging that the internal visual inspection is unqualified, and after character and image records are reserved, the subsequent evaluation test is not carried out any more; if not, executing S3024;
and S3024, integrity inspection of the passivation layer is used for inspecting whether the device which is qualified through internal visual inspection meets a sixth preset unqualified standard, if so, the integrity test of the passivation layer is unqualified, and character and image records are reserved.
6. The method according to claim 4, wherein the S304 comprises:
s3040, checking lead firmness, configured to check whether pins of any component in the second group meet a fourth predetermined unqualified standard, and if at least one pin does not meet the fourth predetermined unqualified standard, executing S3042; otherwise, judging that the lead firmness inspection is unqualified, keeping character and image records, and not performing subsequent operation;
s3042, internal visual inspection, which is used for inspecting whether the internal bonding of the components and the chip structure meet the fifth preset unqualified standard in the label changing process, if so, judging that the internal visual inspection is unqualified, and after character and image records are reserved, the subsequent evaluation test is not carried out any more; if not, executing S3044;
s3044, a bonding strength test is carried out, wherein the bonding strength test is used for checking whether the bonding strength inside the device meets a seventh preset unqualified standard, if yes, test data and image records are reserved, and a subsequent evaluation test is not carried out any more; if not, executing S3046;
s3046, a shear strength test is carried out, and the shear strength test is used for checking whether the bonding strength of the chip in the device after the bonding strength test meets the eighth preset unqualified standard, if so, the test data and the image record are reserved, and the subsequent evaluation test is not carried out any more.
7. The method according to claim 6, wherein when the plastic package device to be tested is a leaded device, a lead integrity check can be performed; if the device is a leadless device, S3040 is not performed.
8. The method of claim 5,
the fourth predetermined unqualified standard is any one of GJB 548B-2005 method 2004.2;
the fifth predetermined unqualified standard is any one of GJB 548B-2005 method 2020.1;
the sixth predetermined disqualification standard is any of the GJB 548B-2005 method 2021.
9. The method of claim 6, wherein the seventh predetermined disqualification criterion is any of GJB 548B-2005 methods 2011.1.
10. The method of claim 6, wherein the eighth predetermined disqualification criterion is any of GJB 548B-2005 methods 2019.2.
CN202110007276.2A 2021-01-05 2021-01-05 Method for evaluating reliability of label-modified plastic package component Pending CN112858809A (en)

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Application publication date: 20210528