CN117093888A - Component autonomous controllable degree identification method and system based on physical characteristics - Google Patents
Component autonomous controllable degree identification method and system based on physical characteristics Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000007689 inspection Methods 0.000 claims abstract description 159
- 238000004806 packaging method and process Methods 0.000 claims abstract description 42
- 238000001514 detection method Methods 0.000 claims abstract description 21
- 239000002904 solvent Substances 0.000 claims description 26
- 230000004807 localization Effects 0.000 claims description 18
- 238000012360 testing method Methods 0.000 claims description 15
- 238000004621 scanning probe microscopy Methods 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 5
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Abstract
The application belongs to the technical field of component identification, and particularly discloses a component autonomous controllable degree identification method and system based on physical characteristics. The method comprises the following steps: determining corresponding physical characteristic inspection items according to the packaging types of the components to be inspected; the method comprises the steps that components to be detected are detected item by item according to physical characteristic detection items, and corresponding physical characteristic information is extracted when each physical characteristic detection item is detected; and identifying the components to be detected as domestic components or pseudo-empty package components based on the physical characteristic information. The technical problem that the independent controllable degree of the components cannot be judged based on the traditional GJB548B component inspection criteria is solved.
Description
Technical Field
The application belongs to the technical field of component identification, and particularly relates to a component autonomous controllable degree identification method and system based on physical characteristics.
Background
At present, the military industry develops a great deal of researches on an independent controllable evaluation method of components based on a reliability structure, and a main identification method is based on a GJB548B component inspection criterion, but only can judge whether the component process is qualified or not in the actual execution process, and misjudgment and missed judgment occur, so that the independent controllable degree of the components cannot be judged.
Disclosure of Invention
The application aims to provide a component autonomous controllable degree identification method and system based on physical characteristics, which are used for solving the technical problem that the conventional GJB 548B-based component inspection criterion cannot judge the autonomous controllable degree of a component.
In order to achieve the above purpose, the application adopts the following technical scheme:
a component autonomous controllable degree identification method based on physical characteristics comprises the steps of determining corresponding physical characteristic inspection items according to the packaging type of a component to be inspected; the components to be inspected are inspected item by item according to the physical characteristic inspection items, and corresponding physical characteristic information is extracted when each physical characteristic inspection item is inspected; and identifying the components to be detected as domestic components or pseudo-empty package components based on the physical characteristic information.
Optionally, determining the corresponding physical feature inspection item according to the package type of the component to be inspected includes: when the packaging type of the component to be inspected is plastic packaging, the corresponding physical characteristic inspection items comprise appearance inspection, solvent resistance inspection, X-ray inspection, acoustic scanning microscopy and internal inspection.
Optionally, determining the corresponding physical feature inspection item according to the package type of the component to be inspected includes: when the packaging type of the component to be inspected is encapsulation or ceramic packaging, the corresponding physical characteristic inspection items comprise appearance inspection, solvent resistance inspection, X-ray inspection and internal inspection.
Optionally, the step of inspecting the component to be inspected item by item according to the physical feature inspection item includes: the appearance inspection comprises the inspection of the device model identification, the batch number, the pin plating layers and the packaging tube shell of the to-be-inspected device.
Optionally, the step of inspecting the component to be inspected item by item according to the physical feature inspection item includes: the solvent resistance check includes checking whether the device identification of the device under test passes a dip-brush test with a solvent.
Optionally, the step of inspecting the component to be inspected item by item according to the physical feature inspection item includes: the X-ray inspection includes inspecting the bonding portion inside the device of the component to be inspected, and mounting the chip on the substrate.
Optionally, the step of inspecting the component to be inspected item by item according to the physical feature inspection item includes: the acoustic scanning microscopy comprises checking the thickness of the plastic package device and the internal package structure of the component to be checked.
Optionally, the step of inspecting the component to be inspected item by item according to the physical feature inspection item includes: the internal inspection comprises the inspection of the surface identification, manufacturer information, chip layout and internal structure of the device chip of the to-be-inspected device.
Optionally, the identifying the component to be inspected as a localization component or a pseudo-empty package component based on the physical feature information includes: the physical characteristic information is matched with the pseudo-empty package component, and the component to be detected is identified as the pseudo-empty package component; and all the physical characteristic information is matched with the localization component, and the component to be detected is identified as the localization component.
The component autonomous controllable degree identification system based on the physical characteristics comprises a project determining module, a program judging module and a program judging module, wherein the project determining module is used for determining corresponding physical characteristic inspection projects according to the packaging type of the component to be inspected; the inspection feature module is used for inspecting the components to be inspected item by item according to the physical feature inspection items and extracting corresponding physical feature information when each physical feature inspection item is carried out; and the identification module is used for identifying the components to be detected as domestic components or pseudo-empty package components based on the physical characteristic information.
A computer readable storage medium having a computer program stored therein, wherein the computer program is configured to perform the above-described method of component autonomous controllable degree recognition based on physical characteristics when run.
An electronic device comprising a memory and a processor, said memory having stored therein a computer program, said processor being arranged to execute the above-mentioned method of identifying the degree of autonomous controllability of a component based on physical characteristics by means of said computer program.
According to the application, corresponding physical characteristic inspection items are determined according to the packaging type of the components to be inspected; the method comprises the steps that components to be detected are detected item by item according to physical characteristic detection items, and corresponding physical characteristic information is extracted when each physical characteristic detection item is detected; the components to be detected are identified as domestic components or pseudo-empty package components based on the physical characteristic information, so that the independent controllable degree criterion of the components is increased by adopting the internal and external physical characteristic identification of the components, the identification of whether the components are domestic components or pseudo-empty package components is realized based on the physical characteristic information extracted by the physical characteristic inspection of the components, the misjudgment and missed judgment of the independent controllable degree identification process based on the traditional component inspection criterion are avoided, the technical problem that the independent controllable degree of the components cannot be judged based on the traditional GJB548B component inspection criterion is solved, and the technical effect of accurately judging the independent controllable degree of the components is achieved.
Drawings
FIG. 1 is a schematic flow chart of a method for identifying the degree of autonomous control of components based on physical characteristics in an embodiment of the application;
fig. 2 is a schematic structural diagram of an autonomous controllable degree recognition system for components based on physical characteristics in an embodiment of the application.
Detailed Description
The advantages and features of the present application will become more fully apparent from the following description and appended claims, taken in conjunction with the accompanying drawings and detailed description. It should be noted that the drawings are in a very simplified form and are adapted to non-precise proportions, merely for the purpose of facilitating and clearly aiding in the description of embodiments of the application.
It should be noted that, in order to clearly illustrate the present application, various embodiments of the present application are specifically illustrated by the present embodiments to further illustrate different implementations of the present application, where the various embodiments are listed and not exhaustive. Furthermore, for simplicity of explanation, what has been mentioned in the previous embodiment is often omitted in the latter embodiment, and therefore, what has not been mentioned in the latter embodiment can be referred to the previous embodiment accordingly.
Example 1
A component autonomous controllable degree identification method based on physical characteristics is shown in figure 1, and comprises the following steps:
s102, determining corresponding physical characteristic inspection items according to the packaging type of the components to be inspected;
s104, checking the components to be checked item by item according to the physical characteristic checking items, and extracting corresponding physical characteristic information when each physical characteristic checking item;
s106, identifying the components to be inspected as domestic components or pseudo-empty package components based on the physical characteristic information.
The corresponding physical feature inspection items determined according to the packaging types are not limited to multiple items, the multiple items of physical feature inspection items are not limited to item ordering according to the first-outside-then-inside-first-lossless-then-lossy, when the components to be inspected are inspected according to the physical feature inspection items, the components to be inspected are inspected item by item according to the item ordering, and corresponding physical feature information is extracted during each inspection. And comparing the extracted physical characteristic information with preset standard content to determine whether the component to be detected is a domestic component or a pseudo-empty package component. The pseudo-blank package components are not limited to include pseudo-home-made components, hollow home-made components, and packaging home-made components.
The autonomous controllable degree of the components is not limited to include localization, pseudo localization, hollow localization and packaging localization. Pseudo-localization, hollow localization and packaging localization are not limited to the general term pseudo-blank, and indicate that the degree of autonomous control of the components is non-localization.
In the embodiment of the application, the internal and external physical characteristic identification of the component is adopted, the independent controllable degree criterion of the component is increased, the identification of the component which is a domestic component or a pseudo-empty package component is realized based on the physical characteristic information extracted by the physical characteristic inspection of the component, the occurrence of misjudgment and missed judgment in the independent controllable degree identification process based on the traditional component inspection criterion is avoided, the technical problem that the independent controllable degree of the component cannot be judged based on the traditional GJB548B component inspection criterion is solved, and the technical effect of accurately judging the independent controllable degree of the component is achieved.
Alternatively, the package type is not limited to include plastic packaging, potting, and ceramic packaging. Each packaging type corresponds to different physical feature inspection items, so that under the packaged type of the component, the component is subjected to physical feature inspection and physical feature information extraction, and the component is further convenient to unpack according to corresponding means before internal inspection based on the packaging type.
As an optional implementation manner, determining a corresponding physical feature inspection item according to a package type of a component to be inspected includes: when the packaging type of the component to be inspected is plastic packaging, the corresponding physical characteristic inspection items comprise appearance inspection, solvent resistance inspection, X-ray inspection, acoustic scanning microscopy and internal inspection.
As an optional implementation manner, determining a corresponding physical feature inspection item according to a package type of a component to be inspected includes: when the packaging type of the component to be inspected is encapsulation or ceramic packaging, the corresponding physical characteristic inspection items include appearance inspection, solvent resistance inspection, X-ray inspection and internal inspection.
For the plastic packaged components, the physical characteristic inspection items are sequentially: appearance inspection, solvent resistance inspection, X-ray inspection, acoustic scanning microscopy, and interior inspection. For the encapsulated and ceramic-encapsulated components, the physical feature inspection items are in order: appearance inspection, solvent resistance inspection, X-ray inspection, and interior inspection.
As an optional implementation manner, the inspecting the component to be inspected item by item according to the physical feature inspection item includes: appearance inspection includes inspecting device model identification, lot number, pin plating and package envelope of the component to be inspected.
As an optional implementation manner, the inspecting the component to be inspected item by item according to the physical feature inspection item includes: the solvent resistance check includes checking whether the device identification of the device under test passes a dip-brush test with the solvent.
As an alternative implementation manner, the components to be inspected are inspected item by item according to physical feature inspection items, including X-ray inspection including inspecting the internal bonding parts of the components to be inspected and the chip mounting base plate.
As an optional implementation manner, the inspecting the component to be inspected item by item according to the physical feature inspection item includes: the acoustic scanning microscopy includes inspecting the thickness of the plastic encapsulated device and the internal packaging structure of the component under inspection.
As an optional implementation manner, the inspecting the component to be inspected item by item according to the physical feature inspection item includes: the internal inspection comprises the inspection of the surface identification, manufacturer information, chip layout and internal structure of the device chip of the component to be inspected.
The appearance inspection comprises inspecting the model identification, batch number, pin coating and packaging tube shell of the component, the solvent resistance inspection comprises inspecting whether the component identification can pass the dip brush test by configuring a solvent, the X-ray inspection comprises inspecting the internal bonding part and the chip mounting bottom plate of the component, the acoustic scanning microscope inspection comprises inspecting the thickness and the internal packaging of the plastic packaging component, and the internal inspection comprises inspecting the surface identification, the manufacturer information, the chip layout and the internal structure of the component.
Alternatively, each physical feature inspection item is not limited to one-by-one inspection according to the inspection standard requirements, and each physical feature inspection is not limited to extracting and storing corresponding physical feature information. Further, the method is not limited to photographing and storing physical characteristic information meeting the inspection standard in the inspection process.
As an optional implementation manner, identifying the component to be inspected as a localization component or a pseudo-empty package component based on the physical characteristic information includes:
s106-2, matching any piece of physical characteristic information with the pseudo-empty package component, and identifying the component to be detected as the pseudo-empty package component;
s106-4, when all the physical characteristic information is matched with the localization component, identifying the component to be detected as the localization component.
Optionally, when the physical feature inspection is performed according to the item sequence, the inspection is stopped and the component to be inspected is identified as the pseudo-empty package component when any item of physical feature information indicates that the component to be inspected is non-domestic. And when the component to be detected is identified as the pseudo-empty package component, one or more physical feature detection items are continued or until the external physical feature detection items are completed or until all the physical feature detection items are completed, so as to verify the identification conclusion and avoid erroneous judgment. External physical feature inspection items include nondestructive inspection such as visual inspection, acoustic scanning microscopy, and X-ray inspection.
Specifically, the physical feature inspection in the component autonomous controllable degree identification based on the physical features is not limited to the steps of:
s1, performing external physical feature inspection on the components to be inspected, including but not limited to nondestructive inspection such as appearance inspection, acoustic scanning microscopy inspection, X-ray inspection and the like. Extracting device identification, production place, model, pin plating, packaging information and internal structure information, and comparing the extracted physical characteristic information with standard criteria one by one;
s2, performing solvent resistance inspection on the plastic package components identified as pseudo-empty packages in the process of inspecting the external physical characteristics. If the solvent resistance inspection causes the component mark to be seriously fallen off and blurred, judging that the component is a pseudo domestic component for realizing mark tampering through plating;
s3, unsealing the component if the external physical characteristic inspection is abnormal, performing internal inspection, and extracting the internal physical characteristic information of the component, wherein the method specifically comprises the following steps: core product identification, chip model, manufacturer LOGO and chip layout.
S4, stopping subsequent inspection when any characteristic information abnormality occurs to the internal physical characteristic information, judging that the chip is a packaging domestic component under the condition that foreign manufacturer identification information exists on the surface of the chip, and judging that the chip is a hollow domestic component under the condition that the chip layout is consistent with the imported chip layout of the same type.
In the embodiment of the application, compared with the GJB548B physical characteristic identification criterion, the device autonomous controllable degree identification is more accurate by simple and easily mastered operation.
Specifically, the component autonomous controllable degree identification method based on the physical characteristics is not limited to the following steps when applied:
s1, determining physical characteristic inspection items, such as appearance inspection, solvent resistance, X-ray inspection, acoustic scanning microscopy and internal inspection, of the components to be inspected according to the packaging structure.
S2, the appearance inspection is not limited to 3-10 times of amplification by using a microscope, and the plastic package device pin plating, the model identification and the plating layer are inspected. If the physical characteristic information such as secondary coating and old identification information exists on the surface of the device, stopping checking, and judging that the device is a pseudo-empty-package device;
s3, solvent resistance inspection is not limited to configuring three solvents according to a GJB548B method 2015.1, the components to be inspected in the same batch are divided into three groups, the three groups of components are respectively subjected to a dipping and brushing test under the three solvents, and the components are dried after the test to inspect the surface marks of the sample. If the characteristics of the mark falling off, the blurring and the like which accord with the criteria appear, stopping checking, and judging that the component is a pseudo-empty package component;
s4, X-ray inspection is not limited to the inspection of bonding parts and rib connecting parts inside the device by using an X-ray detection system. If physical characteristic information such as the structure size and the structure inconsistency of the lead frame in the devices in the same batch, the structure inconsistency of the connecting ribs of the devices in the same batch, the structure inconsistency of the chip bonding substrate and the like appears, judging that the components are pseudo-blank components;
s5, the acoustic scanning microscopy is not limited to checking whether the thickness of the device and the internal packaging structure are consistent through the SAM300 ultrasonic scanning microscopy. If the encapsulation thickness of the device and the internal structure are inconsistent, judging that the component is a pseudo-empty package component;
s6, internal inspection is not limited to acid-oriented corrosion unsealing of the to-be-inspected component, and the unsealed to-be-inspected component is placed under a metallographic microscope to inspect physical characteristic information such as the surface identification, manufacturer, layout and the like of the component chip. If the imported manufacturer identification or the chip surface domestic identification exists on the chip but the layout is the same as that of the imported manufacturer, the chip is judged to be a pseudo-blank device;
s7, judging that all the physical characteristic information does not appear components to be detected which meet the criterion as domestic components.
Example 2
An autonomous controllable degree recognition system for components based on physical characteristics, as shown in fig. 2, comprises:
the item determining module 202 is configured to determine a corresponding physical feature inspection item according to a package type of the component to be inspected;
the inspection feature module 204 is configured to inspect the component to be inspected item by item according to the physical feature inspection items, and extract corresponding physical feature information when each physical feature inspection item is inspected;
the identifying module 206 is configured to identify the component to be inspected as a domestic component or a pseudo-empty package component based on the physical characteristic information.
Optionally, the item determining module 202 includes: when the packaging type of the component to be inspected is plastic packaging, the corresponding physical characteristic inspection items comprise appearance inspection, solvent resistance inspection, X-ray inspection, acoustic scanning microscopy and internal inspection.
Optionally, the item determining module 202 includes: when the packaging type of the component to be inspected is encapsulation or ceramic packaging, the corresponding physical characteristic inspection items include appearance inspection, solvent resistance inspection, X-ray inspection and internal inspection.
Optionally, the inspecting feature module 204 inspects the component to be inspected item by item according to the physical feature inspection item, including: appearance inspection includes inspecting device model identification, lot number, pin plating and package envelope of the component to be inspected.
Optionally, the inspecting feature module 204 inspects the component to be inspected item by item according to the physical feature inspection item, including: the solvent resistance check includes checking whether the device identification of the device under test passes a dip-brush test with the solvent.
Optionally, the inspecting feature module 204 inspects the component to be inspected item by item according to the physical feature inspection item, including: the X-ray inspection includes inspecting the bonding portion inside the device of the component to be inspected, and the chip mounting board.
Optionally, the inspecting feature module 204 inspects the component to be inspected item by item according to the physical feature inspection item, including: the acoustic scanning microscopy includes inspecting the thickness of the plastic encapsulated device and the internal packaging structure of the component under inspection.
Optionally, the inspecting feature module 204 inspects the component to be inspected item by item according to the physical feature inspection item, including: the internal inspection comprises the inspection of the surface identification, manufacturer information, chip layout and internal structure of the device chip of the component to be inspected.
Optionally, the identifying module 206 identifies the component to be inspected as a domestic component or a pseudo-empty package component based on the physical feature information, including: any piece of physical characteristic information is matched with the pseudo-empty package component, and the component to be detected is identified as the pseudo-empty package component; and (3) matching all the physical characteristic information with the localization components, and identifying the components to be detected as localization components.
In the embodiment of the application, corresponding physical characteristic inspection items are determined according to the packaging type of the component to be inspected; the method comprises the steps that components to be detected are detected item by item according to physical characteristic detection items, and corresponding physical characteristic information is extracted when each physical characteristic detection item is detected; the components to be detected are identified as domestic components or pseudo-empty package components based on the physical characteristic information, so that the independent controllable degree criterion of the components is increased by adopting the internal and external physical characteristic identification of the components, the identification of whether the components are domestic components or pseudo-empty package components is realized based on the physical characteristic information extracted by the physical characteristic inspection of the components, the misjudgment and missed judgment of the independent controllable degree identification process based on the traditional component inspection criterion are avoided, the technical problem that the independent controllable degree of the components cannot be judged based on the traditional GJB548B component inspection criterion is solved, and the technical effect of accurately judging the independent controllable degree of the components is achieved.
Example 3
In still another aspect of the embodiments of the present application, there is further provided an electronic device for implementing the above method for identifying an autonomous controllable degree of a component based on a physical feature, where the electronic device is not limited to a terminal device or a server in a radar system. The electronic device is not limited to comprising a memory in which a computer program is stored, and a processor arranged to perform the steps of any of the method embodiments described above by means of the computer program.
Example 4
In yet another aspect of embodiments of the present application, a computer program product or computer program is provided, the computer program product or computer program comprising computer instructions stored in a computer readable storage medium. The processor of the computer device reads the computer instructions from the computer-readable storage medium and executes the computer instructions to cause the computer device to perform the method provided in various alternative embodiments of the above-described method for identifying the degree of autonomous controllability of a component based on physical characteristics. Wherein the computer program is arranged to perform the steps of any of the method embodiments described above when run.
Claims (10)
1. The component autonomous controllable degree identification method based on the physical characteristics is characterized by comprising the following steps of:
determining corresponding physical characteristic inspection items according to the packaging types of the components to be inspected;
the components to be inspected are inspected item by item according to the physical characteristic inspection items, and corresponding physical characteristic information is extracted when each physical characteristic inspection item is inspected;
and identifying the component to be detected as a domestic component or a pseudo-blank component based on the physical characteristic information.
2. The method for identifying the autonomous controllable degree of a component based on physical characteristics according to claim 1, wherein the determining the corresponding physical characteristic inspection item according to the package type of the component to be inspected comprises:
when the packaging type of the component to be detected is plastic packaging, the corresponding physical characteristic detection items comprise appearance detection, solvent resistance detection, X-ray detection, acoustic scanning microscopy detection and internal detection.
3. The method for identifying the autonomous controllable degree of a component based on physical characteristics according to claim 1, wherein the determining the corresponding physical characteristic inspection item according to the package type of the component to be inspected comprises:
when the packaging type of the component to be detected is encapsulation or ceramic packaging, the corresponding physical characteristic detection items comprise appearance detection, solvent resistance detection, X-ray detection and internal detection.
4. A method for identifying the degree of autonomous controllability of a component based on physical characteristics as claimed in claim 2 or 3, wherein the step of inspecting the component to be inspected item by item according to the physical characteristic inspection item comprises the steps of:
the appearance inspection comprises inspection of device model identification, batch number, pin plating layers and package tube shells of the components to be inspected.
5. A method for identifying the degree of autonomous controllability of a component based on physical characteristics as claimed in claim 2 or 3, wherein the step of inspecting the component to be inspected item by item according to the physical characteristic inspection item comprises the steps of:
the solvent resistance check includes checking whether a device identification of the device under test passes a dip-brush test with a solvent.
6. A method for identifying the degree of autonomous controllability of a component based on physical characteristics as claimed in claim 2 or 3, wherein the step of inspecting the component to be inspected item by item according to the physical characteristic inspection item comprises the steps of:
the X-ray inspection comprises the step of inspecting the bonding part inside the device of the component to be inspected and the chip mounting bottom plate.
7. The method for identifying the autonomous controllable degree of the components based on the physical characteristics according to claim 2, wherein the step of checking the components to be checked item by item according to the physical characteristic checking item comprises the following steps:
the acoustic scanning microscopy comprises checking the thickness of the plastic package device and the internal package structure of the component to be checked.
8. A method for identifying the degree of autonomous controllability of a component based on physical characteristics as claimed in claim 2 or 3, wherein the step of inspecting the component to be inspected item by item according to the physical characteristic inspection item comprises the steps of:
the internal inspection comprises the inspection of the device chip surface identification, manufacturer information, chip layout and internal structure of the to-be-inspected device.
9. The method for identifying the autonomous controllable degree of the component based on the physical characteristics according to claim 1, wherein the identifying the component to be inspected as a localization component or a pseudo-empty package component based on the physical characteristic information comprises:
the physical characteristic information is matched with the pseudo-empty package component, and the component to be detected is identified as the pseudo-empty package component;
and all the physical characteristic information is matched with the localization component, and the component to be detected is identified as the localization component.
10. An autonomous controllable degree recognition system for components based on physical characteristics, which is characterized by comprising:
the item determining module is used for determining a corresponding physical characteristic inspection item according to the packaging type of the component to be inspected;
the test feature module is used for testing the components to be tested item by item according to the physical feature test items and extracting corresponding physical feature information when each physical feature test item is used;
and the identification module is used for identifying the component to be detected as a domestic component or a pseudo-blank component based on the physical characteristic information.
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| CN202310768504.7A CN117093888A (en) | 2023-06-27 | 2023-06-27 | Component autonomous controllable degree identification method and system based on physical characteristics |
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| CN202310768504.7A CN117093888A (en) | 2023-06-27 | 2023-06-27 | Component autonomous controllable degree identification method and system based on physical characteristics |
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