CN117491814A - Method for evaluating insulation reliability of plastic package interface - Google Patents
Method for evaluating insulation reliability of plastic package interface Download PDFInfo
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- CN117491814A CN117491814A CN202311440102.0A CN202311440102A CN117491814A CN 117491814 A CN117491814 A CN 117491814A CN 202311440102 A CN202311440102 A CN 202311440102A CN 117491814 A CN117491814 A CN 117491814A
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- 238000009413 insulation Methods 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000012360 testing method Methods 0.000 claims abstract description 139
- 230000015556 catabolic process Effects 0.000 claims abstract description 28
- 230000007613 environmental effect Effects 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims description 142
- 229910052751 metal Inorganic materials 0.000 claims description 142
- 239000000758 substrate Substances 0.000 claims description 38
- 238000004806 packaging method and process Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 12
- 239000005022 packaging material Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 230000000052 comparative effect Effects 0.000 claims description 8
- 230000005684 electric field Effects 0.000 claims description 8
- 208000033830 Hot Flashes Diseases 0.000 claims description 4
- 206010060800 Hot flush Diseases 0.000 claims description 4
- 230000001351 cycling effect Effects 0.000 claims description 3
- 238000011156 evaluation Methods 0.000 abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 41
- 229910052802 copper Inorganic materials 0.000 description 41
- 239000010949 copper Substances 0.000 description 41
- 239000011888 foil Substances 0.000 description 11
- 230000035882 stress Effects 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 230000006353 environmental stress Effects 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229940125810 compound 20 Drugs 0.000 description 2
- 229920006336 epoxy molding compound Polymers 0.000 description 2
- JAXFJECJQZDFJS-XHEPKHHKSA-N gtpl8555 Chemical compound OC(=O)C[C@H](N)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1CCC[C@@H]1C(=O)N[C@H](B1O[C@@]2(C)[C@H]3C[C@H](C3(C)C)C[C@H]2O1)CCC1=CC=C(F)C=C1 JAXFJECJQZDFJS-XHEPKHHKSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
- G01R31/1263—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a method for evaluating insulation reliability of a plastic package interface, and belongs to the technical field of reliability tests. The method comprises the following steps: carrying out an environmental test on a sample for evaluating insulation reliability of a plastic package interface, obtaining interface resistance and interface breakdown strength of the plastic package interface to be tested before the test, and obtaining interface resistance and interface breakdown strength of the plastic package interface after the test; the insulation reliability coefficient is calculated according to the following formula:the method is simple to operate, can be based on the existing environment test equipment and insulation test equipment, has the advantages of practicality and low cost, and meets the evaluation requirement on the insulation reliability of the plastic package interface.
Description
Technical Field
The invention relates to the technical field of reliability tests, in particular to a method for evaluating insulation reliability of a plastic package interface.
Background
In integrated circuit manufacturing, plastic packaging refers to a process of covering a chip or a device with a plastic packaging material (usually an epoxy plastic packaging material), so that the chip or the device is not affected by external environment (such as water vapor, temperature, pollution, etc.), and the composite functions of heat conduction, insulation, moisture resistance, pressure resistance, support, etc. are realized, and the plastic packaging process is widely applied to the power electronic industry.
In the process of analyzing the packaging structure with insulation failure, we find that insulation failure of most packaging structures occurs at the contact interface between the plastic packaging material and the chip, device, substrate and other structures, that is, compared with the plastic packaging material body, the plastic packaging interface is the area with lower insulation reliability and higher failure risk.
However, there are few reports on the insulation reliability of the plastic package interface, so a reliable and effective method for evaluating the reliability of the plastic package structure is needed.
In view of this, the present invention has been made.
Disclosure of Invention
The invention aims to provide a method for evaluating insulation reliability of a plastic package interface so as to solve the technical problems.
The application can be realized as follows:
the application provides a method for evaluating insulation reliability of a plastic package interface, which comprises the following steps: carrying out an environmental test on a sample for evaluating insulation reliability of a plastic package interface, obtaining interface resistance and interface breakdown strength of the plastic package interface to be tested before the test, and obtaining interface resistance and interface breakdown strength of the plastic package interface after the test;
the insulation reliability coefficient is calculated according to the following formula:
wherein α represents an insulation reliability coefficient; r is R After the test The interface resistance of the plastic package interface after the test is shown in omega; r is R Before the test The interface resistance of the plastic package interface before the test is expressed in omega; CTI (comparative tracking index) After the test The interface breakdown strength of the plastic package interface after the test is expressed in kV/mm; CTI (comparative tracking index) Before the test The unit of the breakdown strength of the interface before the test of the plastic package interface is kV/mm;
the test sample comprises an insulating substrate, a plastic package material, a first power-up metal and a second power-up metal; the first power-on metal comprises a first metal column and a first metal sheet, wherein the first metal sheet is attached to the upper surface of the insulating substrate, and the first metal column is connected with the first metal sheet and is conducted in the test process; the second power-on metal comprises a second metal column and a second metal sheet, the second metal sheet is attached to the upper surface of the insulating substrate, and the second metal column is connected with the second metal sheet and is conducted in the test process;
the plastic packaging material is used for plastic packaging the upper surface of the insulating substrate, the first power-on metal and the second power-on metal, and the upper surface of the first metal column and the upper surface of the second metal column are exposed; the plastic package interface is a contact interface between the first metal sheet and the second metal sheet and between the insulating substrate and the plastic package material;
the interface resistance of the plastic package interface is the resistance between the first metal column and the second metal column, and the interface breakdown strength of the plastic package interface is the breakdown strength between the first metal column and the second metal column.
In an alternative embodiment, the first foil and the second foil are placed in parallel alignment.
In an alternative embodiment, the spacing between the first foil and the second foil is 1.0mm to 5.0mm.
In an alternative embodiment, the distance between the first metal post and the second metal post is greater than the distance between the first metal foil and the second metal foil.
In an alternative embodiment, the first metal posts and the second metal posts are disposed diagonally outside the first metal sheet and the second metal sheet, respectively, away from each other.
In alternative embodiments, the insulating substrate comprises a bare chip, a package substrate for a chip, or a PCB board carrying the device.
In an alternative embodiment, the sample further comprises a first wire and a second wire, wherein one end of the first wire is welded to the upper surface of the first metal column, and one end of the second wire is welded to the upper surface of the second metal column; the other end of the first wire and the other end of the second wire are connected with a power supply, so that the first metal sheet and the second metal sheet apply continuously existing electric field stress to a plastic package interface between the first metal sheet and the second metal sheet in an electrified state.
In an alternative embodiment, the test sample is placed in a test device required for environmental testing at the time of testing.
In alternative embodiments, the environmental test includes any one of a high temperature test, a low temperature test, a hot flash test, and a temperature cycling test.
In an alternative embodiment, R After the test 、R Before the test 、CTI After the test And CTI Before the test The values are average values of corresponding parameters after multiple tests.
The beneficial effects of this application include:
according to the evaluation method, the pair of thin metal sheets are arranged on the contact interface between the plastic packaging material and the insulating substrate, the continuous electric field stress is applied to the plastic packaging interface between the two metal sheets through the metal sheets, the environment stress is synchronously applied to the plastic packaging interface by using the conventional environment test device, and then the insulation reliability of the plastic packaging interface is evaluated by comparing the resistance value of the plastic packaging interface with the change degree of the breakdown strength of the plastic packaging interface before and after the environment test. The method is based on the existing environment test equipment and insulation test equipment, has the advantages of being practical and low in cost, meets the evaluation requirement on insulation reliability of the plastic package interface, and fills the blank of the related technology.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a side view of a test specimen for insulation reliability evaluation of a molding interface provided in example 1;
fig. 2 is a top view of a test specimen for insulation reliability evaluation of a plastic package interface provided in example 1 before plastic package;
fig. 3 is a top view of the test specimen for insulation reliability evaluation of the plastic package interface provided in example 1 after plastic package.
Icon: 10-a PCB substrate; 20-epoxy plastic packaging material; 31-a first copper pillar; 32-a first copper sheet; 41-a second copper pillar; 42-a second copper sheet.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below. The specific conditions are not noted in the examples and are carried out according to conventional conditions or conditions recommended by the manufacturer. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
The method for evaluating insulation reliability of the plastic package interface provided by the application is specifically described below.
As used herein, "reliability" refers to the ability of a product to perform a specified function under specified conditions and within specified time, and is a core indicator that reflects the quality level of the product throughout the development, design, manufacturing, and use of the product.
The term "plastic package interface" refers to a contact interface between a plastic package material and a chip, a substrate or a device after the chip, the substrate or the device are packaged by the plastic package material.
The term "insulation reliability of a plastic package interface" refers to the capability of the plastic package interface to maintain insulation performance for a long time under the condition that an electric field continuously exists, and complete an insulation function.
Based on the fact that no method capable of effectively evaluating the reliability of the plastic package structure is currently seen, the method creatively solves the problems, and specifically, the method for evaluating the insulation reliability of the plastic package interface comprises the following steps: carrying out an environmental test on a sample for evaluating insulation reliability of a plastic package interface, obtaining interface resistance and interface breakdown strength of the plastic package interface to be tested before the test, and obtaining interface resistance and interface breakdown strength of the plastic package interface after the test;
the insulation reliability coefficient is calculated according to the following formula:
wherein α represents an insulation reliability coefficient; r is R After the test The interface resistance of the plastic package interface after the test is shown in omega; r is R Before the test The interface resistance of the plastic package interface before the test is expressed in omega; CTI (comparative tracking index) After the test The interface breakdown strength of the plastic package interface after the test is expressed in kV/mm; CTI (comparative tracking index) Before the test The unit of the interface breakdown strength of the plastic package interface before the test is kV/mm.
The insulation property of the plastic package interface can be evaluated by the alpha, and the larger the alpha is, the better the insulation property of the plastic package interface is.
In this application, the sample includes insulating substrate, plastic molding compound, first power-up metal and second power-up metal. The first power-on metal comprises a first metal column and a first metal sheet, wherein the first metal sheet is attached to the upper surface of the insulating substrate, and the first metal column is connected with the first metal sheet and is conducted in the test process; the second power-on metal comprises a second metal column and a second metal sheet, the second metal sheet is attached to the upper surface of the insulating substrate, and the second metal column is connected with the second metal sheet and conducted in the test process.
The plastic packaging material is used for plastic packaging the upper surface of the insulating substrate, the first power-on metal and the second power-on metal, and the upper surface of the first metal column and the upper surface of the second metal column are exposed; the plastic package interface is a contact interface between the first metal sheet and the second metal sheet, and between the insulating substrate and the plastic package material.
The interface resistance of the plastic package interface is the resistance between the first metal column and the second metal column, and the interface breakdown strength of the plastic package interface is the breakdown strength between the first metal column and the second metal column.
For reference, the plastic package referred to in this application mainly refers to an epoxy plastic package. The plastic packaging material is used for plastic packaging of the insulating substrate with the metal sheets and the metal columns manufactured, and the plastic packaging material and the plastic packaging process are the same as those of actual products or materials or processes to be evaluated.
The insulating substrate comprises a bare chip, a packaging substrate of the chip or a PCB board bearing the device.
For reference, the insulating substrate may be a sheet, and the size thereof may be 10mm×10mm×2.5mm, for example. It should be noted that the insulating substrate used in the test is the same as the actual product or the product to be evaluated.
In some embodiments, the first metal pillar and the second metal pillar may have a square pillar shape. In other embodiments, the first and second metal posts may take other shapes.
For reference, the first and second metal posts may each be copper posts, which may be, by way of example and not limitation, 2mm by 2.6mm in size.
In some embodiments, the first metal sheet and the second metal sheet may be elongated. In other embodiments, the first and second metal sheets may take other shapes.
For reference, the first metal sheet and the second metal sheet may each be a copper sheet, which may be 6.5mm×1mm×0.35 μm in size by way of example and not limitation.
In some preferred embodiments, a copper-clad plate may be etched to form a metal sheet on the insulating substrate, and then a copper pillar may be grown.
When set, the first and second foils are placed in parallel alignment.
The spacing between the first foil and the second foil may be 1.0mm to 5.0mm, such as 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm or 5mm, etc., or any other value in the range of 1.0mm to 5.0mm.
In this application, the distance between first metal column and the second metal column is greater than the distance between first foil and the second foil to avoid the possibility that other breakdown modes appear in the environmental test process, factor of safety is higher.
In some preferred embodiments, the first metal posts and the second metal posts are disposed diagonally outside the first metal sheet and the second metal sheet, respectively, away from each other. In this way the possibility of other breakdown modes during the environmental test is further avoided.
In the application, the sample further comprises a first wire and a second wire, one end of the first wire is welded on the upper surface of the first metal column, and one end of the second wire is welded on the upper surface of the second metal column; the other end of the first wire and the other end of the second wire are connected with a power supply, so that the first metal sheet and the second metal sheet apply continuously existing electric field stress to a plastic package interface between the first metal sheet and the second metal sheet in an electrified state.
In the test, the sample is placed in a test apparatus required for the environmental test.
For reference, the above-described environmental test may include, by way of example and not limitation, any one of a high temperature test, a low temperature test, a hot flash test, and a temperature cycling test.
And applying continuously existing electric field stress to the plastic package interface between the two metal sheets through the metal sheets, synchronously applying environmental stress such as temperature, humidity and the like to the plastic package interface by utilizing a conventional environmental test device, and evaluating the insulation reliability of the plastic package interface by comparing the resistance value of the plastic package interface with the variation degree of breakdown strength before and after the environmental test.
In some embodiments, R After the test 、R Before the test 、CTI After the test And CTI Before the test Can be taken for 1 time onlyTest value after test. In some preferred embodiments, R After the test 、R Before the test 、CTI After the test And CTI Before the test The values are average values of corresponding parameters after multiple tests, so that the results are more accurate.
On the premise of bearing, the evaluation method provided by the application is that a pair of parallel thin metal sheets are arranged on a contact interface of a plastic package material and an insulating substrate, electric field stress which exists continuously is applied to the plastic package interface between the two metal sheets through the metal sheets, then environment stress such as temperature, humidity and the like is synchronously applied to the plastic package interface by using a conventional environment test device, and then the insulation reliability of the plastic package interface is evaluated by comparing the change degree of the resistance value and the breakdown strength of the plastic package interface before and after the environment test. The method is based on the existing environment test equipment and insulation test equipment, has the advantages of being practical and low in cost, meets the evaluation requirement on insulation reliability of the plastic package interface, and fills the blank of the related technology.
The features and capabilities of the present invention are described in further detail below in connection with the examples.
Example 1
The present embodiment provides a test sample for evaluating insulation reliability of a plastic package interface, and referring to fig. 1 to 3, the test sample includes a PCB substrate 10, an epoxy molding compound 20, a first power-up metal, a second power-up metal, a first wire (not shown), a second wire (not shown), and a power source (not shown).
The dimensions of the PCB substrate 10 are 10mm×10mm×2.5mm.
The first power-on metal comprises a first copper column 31 and a first copper sheet 32, the first copper sheet 32 is attached to the upper surface of the PCB substrate 10, and the first copper column 31 is connected with the first copper sheet 32 and is conducted in the test process; the second power-on metal comprises a second copper column 41 and a second copper sheet 42, the second copper sheet 42 is attached to the upper surface of the PCB substrate 10, and the second copper column 41 is connected with the second copper sheet 42 and is conducted in the test process.
The dimensions of the first copper pillar 31 and the second copper pillar 41 are 2mm×2mm×2.6mm, and the dimensions of the first copper sheet 32 and the second copper sheet 42 are 6.5mm×1mm×0.35 μm. The first copper sheet 32 and the second copper sheet 42 are placed in parallel alignment with a spacing of 2.0mm between the first copper sheet 32 and the second copper sheet 42. The first and second copper pillars 31 and 41 are disposed at outer sides of the first and second copper sheets 32 and 42, respectively, which are apart from each other, in a diagonal form.
The epoxy molding compound 20 molds the upper surface of the PCB substrate 10, the first power-up metal and the second power-up metal and exposes the upper surface of the first copper pillar 31 and the upper surface of the second copper pillar 41; the plastic package interface is a contact interface between the first copper sheet 32 and the copper sheet, and between the PCB substrate 10 and the epoxy plastic package 20.
One end of the first wire is welded to the upper surface of the first copper pillar 31, and one end of the second wire is welded to the upper surface of the second copper pillar 41; the other end of the first wire and the other end of the second wire are both connected to a power source so that the first copper sheet 32 and the second copper sheet 42 apply a continuously existing electric field stress to the plastic package interface between the first copper sheet 32 and the second copper sheet 42 in an energized state.
Example 2
The embodiment provides a method for evaluating insulation reliability of a plastic package interface, which comprises the following steps:
1) Sample preparation: copper sheets and copper columns were fabricated on a PCB substrate, then plastic-encapsulated, and then wire soldered to the upper surface of the test specimen copper column, as in the structure of example 1.
2) Environmental test: the test piece of 1) was placed in a hot-tidal environment test box and the wire was connected to a 400V ac power supply. The hot flash test conditions were set at 85 ℃,85% rh, and a 1000h multi-stress environmental test was started.
3) And (3) testing key technical indexes: after the multi-stress environment test is finished, taking out a test sample subjected to the environment test, taking a sample which is not subjected to the environment test as an initial sample, and placing the test sample and the initial sample in a standard environment of 23 ℃ and 55%RH for 2 hours. Then, the resistance and breakdown strength between the two copper columns of the test sample and the initial sample are tested, and the insulation reliability coefficient is calculated according to the following formula:
wherein α represents an insulation reliability coefficient; r is R After the test The interface resistance of the plastic package interface after the test is shown in omega; r is R Before the test The interface resistance of the plastic package interface before the test is expressed in omega; CTI (comparative tracking index) After the test The interface breakdown strength of the plastic package interface after the test is expressed in kV/mm; CTI (comparative tracking index) Before the test The unit of the interface breakdown strength of the plastic package interface before the test is kV/mm.
The insulation performance test results are shown in tables 1-1 and 1-2, and the insulation reliability coefficient calculation results are shown in tables 1-3. Initial samples 1-3 were all identical and test samples 1-3 were all identical.
TABLE 1-1 insulating Property test results of initial sample
Table 1-2 insulating property test results of test specimens
TABLE 1-3 calculation results of insulation reliability coefficient of epoxy Plastic Package
In summary, the application provides a method for evaluating insulation reliability of a plastic package interface, which meets the evaluation requirement of insulation reliability of a high-risk plastic package interface in a plastic package structure, and fills up the blank of the related technology. The method has the advantages of practicality, very low cost and high safety coefficient, and is suitable for popularization and application.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The method for evaluating the insulation reliability of the plastic package interface is characterized by comprising the following steps of: carrying out an environmental test on a sample for evaluating insulation reliability of a plastic package interface, obtaining interface resistance and interface breakdown strength of the plastic package interface to be tested before the test, and obtaining interface resistance and interface breakdown strength of the plastic package interface after the test;
the insulation reliability coefficient is calculated according to the following formula:
wherein α represents an insulation reliability coefficient; r is R After the test The interface resistance of the plastic package interface after the test is shown in omega; r is R Before the test The interface resistance of the plastic package interface before the test is expressed in omega; CTI (comparative tracking index) After the test The interface breakdown strength of the plastic package interface after the test is expressed in kV/mm; CTI (comparative tracking index) Before the test The unit of the breakdown strength of the interface before the test of the plastic package interface is kV/mm;
the test sample comprises an insulating substrate, a plastic package material, a first electrifying metal and a second electrifying metal; the first power-on metal comprises a first metal column and a first metal sheet, the first metal sheet is attached to the upper surface of the insulating substrate, and the first metal column is connected with the first metal sheet and is conducted in the test process; the second power-on metal comprises a second metal column and a second metal sheet, the second metal sheet is attached to the upper surface of the insulating substrate, and the second metal column is connected with the second metal sheet and is conducted in the test process;
the plastic packaging material is used for plastic packaging the upper surface of the insulating substrate, the first power-on metal and the second power-on metal, and the upper surface of the first metal column and the upper surface of the second metal column are exposed; the plastic package interface is a contact interface between the first metal sheet and the second metal sheet, and between the insulating substrate and the plastic package material;
the interface resistance of the plastic package interface is the resistance between the first metal column and the second metal column, and the interface breakdown strength of the plastic package interface is the breakdown strength between the first metal column and the second metal column.
2. The method of evaluating insulation reliability of a plastic package interface of claim 1, wherein the first metal sheet and the second metal sheet are placed in parallel alignment.
3. The method of evaluating insulation reliability of a plastic package interface according to claim 2, wherein a spacing between the first metal sheet and the second metal sheet is 1.0mm to 5.0mm.
4. The method of evaluating insulation reliability of a plastic package interface of claim 2, wherein a distance between the first metal pillar and the second metal pillar is greater than a distance between the first metal sheet and the second metal sheet.
5. The method of evaluating insulation reliability of a plastic package interface according to claim 1, wherein the first metal pillar and the second metal pillar are disposed diagonally outside the first metal sheet and the second metal sheet, respectively, away from each other.
6. The method of any one of claims 1-5, wherein the insulating substrate comprises a bare chip, a package substrate for a chip, or a PCB board carrying a device.
7. The method of evaluating insulation reliability of a plastic package interface according to claim 1, wherein the test specimen further comprises a first wire and a second wire, wherein one end of the first wire is welded to an upper surface of the first metal pillar, and one end of the second wire is welded to an upper surface of the second metal pillar; the other end of the first wire and the other end of the second wire are connected with a power supply, so that the first metal sheet and the second metal sheet apply continuously existing electric field stress to the plastic package interface between the first metal sheet and the second metal sheet in the electrified state.
8. The method for evaluating insulation reliability of a plastic package interface according to claim 1, wherein the test sample is placed in a test device required for environmental test.
9. The method of evaluating insulation reliability of a plastic package interface according to claim 8, wherein the environmental test comprises any one of a high temperature test, a low temperature test, a hot flash test, and a temperature cycling test.
10. The method for evaluating insulation reliability of a plastic package interface according to claim 1, wherein R After the test 、R Before the test 、CTI After the test And CTI Before the test The values are average values of corresponding parameters after multiple tests.
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