CN104588810B - The welding method of aluminium target material assembly - Google Patents
The welding method of aluminium target material assembly Download PDFInfo
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- CN104588810B CN104588810B CN201310529667.6A CN201310529667A CN104588810B CN 104588810 B CN104588810 B CN 104588810B CN 201310529667 A CN201310529667 A CN 201310529667A CN 104588810 B CN104588810 B CN 104588810B
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- Prior art keywords
- aluminium
- solder
- target
- welded
- backboard
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/021—Isostatic pressure welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
- B23K20/026—Thermo-compression bonding with diffusion of soldering material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/14—Preventing or minimising gas access, or using protective gases or vacuum during welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
- B23K20/2336—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer both layers being aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/24—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The present invention provides the welding method of a kind of aluminium target material assembly, including: aluminium target, aluminium backboard are provided；The junction to be welded of aluminium target is formed solder soakage layer or in the junction to be welded of aluminium backboard, forms solder soakage layer；Aluminium backboard, the aluminium target that is formed with solder soakage layer are placed in vacuum canning, the junction to be welded of aluminium backboard contacts with solder soakage layer, or, aluminium target, the aluminium backboard that is formed with solder soakage layer are placed in vacuum canning, the junction to be welded of aluminium target contacts with solder soakage layer；Heat and other static pressuring processes is utilized to weld together to form aluminium target material assembly by aluminium target, solder soakage layer, aluminium backboard；After having welded, vacuum canning is cooled down, remove vacuum canning to obtain aluminium target material assembly.By the welding method of the present invention, it is possible to achieve welding between aluminium target with aluminium backboard, and welding efficiency is higher, the weld strength of the aluminium target material assembly of formation compared with high, deflection is little, it is possible to meet the steady in a long-term needs produced and use target.
Description
Technical field
The present invention relates to semiconductor sputtering target material and manufacture field, particularly relate to the welding of a kind of aluminium target material assembly
Method.
Background technology
In the semiconductor industry, target material assembly is the back of the body being combined with target by the target meeting sputtering performance
Plate is constituted.Backboard plays a supportive role in target material assembly, and has effect of conduction heat.
In sputter procedure, the working environment residing for target material assembly is more severe.Particularly as follows: target material assembly
Residing environment temperature is higher, such as 300 DEG C to 600 DEG C；It addition, a side blow of target material assembly is with cooling
Water is the coldest, and opposite side is then in 10-9Under the high vacuum environment of Pa, therefore at relative the two of target material assembly
Side forms huge pressure differential；Furthermore, target material assembly is in high voltage electric field, magnetic field, can be by various
The bombardment of particle.Under such rugged environment, if welding between target with backboard in target material assembly
Intensity is poor, target will be caused to deform under heating condition, ftracture, makes sputtering be unable to reach sputtering all
Even effect, time serious, target can come off, in backboard, sputtering base station be caused damage.
For the target material assembly being made up of aluminium target and aluminium backboard, in prior art, conventional solderer
Skill realizes welding of aluminium target and aluminium backboard, but even if aluminium target and aluminium backboard are the most easily sent out at normal temperature
Raw oxidation, can form the pellumina of densification on the surface of aluminium target and aluminium backboard.With existing welding side
When method welds above-mentioned aluminium target and aluminium backboard formation target material assembly, welding efficiency is low, the target group of formation
The weld strength of part is low, deflection is big.If aluminium target and the oxidation of aluminium backboard are serious, even cannot be real
Now weld, therefore can not meet the needs produced and use aluminium target material assembly steady in a long-term.
Summary of the invention
When the technical problem to be solved in the present invention is with existing welding method welding aluminium target and aluminium backboard,
Welding efficiency is low, and the weld strength of the target material assembly of formation is low, deflection big, even cannot realize weldering
Connect, therefore can not meet the needs produced and use aluminium target material assembly steady in a long-term.
For solve above-mentioned technical problem, the present invention provides the welding method of a kind of aluminium target material assembly, including with
Lower method step:
Aluminium target, aluminium backboard are provided；
The junction to be welded of described aluminium target is formed solder soakage layer or to be welded at described aluminium backboard
Solder soakage layer is formed on face；
Aluminium backboard, the aluminium target that is formed with solder soakage layer are placed in vacuum canning, treating of described aluminium backboard
Solder side contacts with described solder soakage layer, or,
Aluminium target, the aluminium backboard that is formed with solder soakage layer are placed in vacuum canning, treating of described aluminium target
Solder side contacts with described solder soakage layer；
Heat and other static pressuring processes is utilized to weld together to be formed by described aluminium target, solder soakage layer, aluminium backboard
Aluminium target material assembly；
After having welded, described vacuum canning is cooled down, remove described vacuum canning to obtain described aluminium
Target material assembly.
Optionally, described solder is containing tin solder.
Optionally, by described aluminium backboard, it is formed before the aluminium target of solder soakage layer is placed in vacuum canning
Further comprising the steps of:
The method using machining carries out patterned process to the junction to be welded of described aluminium backboard and forms projection
Structure.
Optionally, it is formed in the aluminium target of solder soakage layer described in the insertion of described bulge-structure.
Optionally, the thickness of described solder soakage layer is more than 0 micron and less than or equal to 10 microns.
Optionally, described heat and other static pressuring processes is utilized aluminium target, solder soakage layer, aluminium backboard to be welded on
Step together includes:
Make to be internally provided with the external environment condition temperature of the vacuum canning of described aluminium target, solder soakage layer, aluminium backboard
Degree is 200 DEG C～300 DEG C, external environment condition pressure is for more than or equal to 100Mpa；
The described vacuum canning being pointed under described environment temperature, environmental stress carries out being incubated, pressurize 2～5 is little
Time, so that described aluminium target, solder soakage layer, aluminium backboard are welded together.
Optionally, described vacuum canning is to be formed by the aluminum welding that thickness is 1.0mm～3.0mm；
After described aluminium target, solder soakage layer, aluminium backboard are placed in vacuum canning, by described vacuum canning
It is evacuated to vacuum and is at least 10-3Pa, more described vacuum canning is sealed.
Optionally, after forming described bulge-structure, by described aluminium backboard, the aluminium that is formed with solder soakage layer
Before target is placed in vacuum canning, it is carried out processing to the junction to be welded of described aluminium backboard.
Compared with prior art, the advantage of technical scheme is:
By the setting of vacuum canning so that whole welding process is carried out under vacuum conditions, thus anti-
Only the surface of aluminium target and aluminium backboard is oxidized, and, in welding process, in the junction to be welded of aluminium target
Upper formation solder soakage layer or form solder soakage layer in the junction to be welded of described backboard, it is easy to real
The junction to be welded of existing aluminium target or the wetting of aluminium backboard junction to be welded such that it is able to realize aluminium atom former with aluminium
The diffusion of son.Therefore, technical scheme can not only realize welding of aluminium target and aluminium backboard,
And welding efficiency is higher, the aluminium target material assembly that welding is formed has higher weld strength；It addition, pricker
Material soakage layer can also be avoided or reduce welding stress, makes the aluminium target material assembly of formation be unlikely to deform and can expire
Foot length phase steady production and the needs of use aluminium target material assembly.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the welding method of the aluminium target material assembly of the specific embodiment of the invention；
Fig. 2 is the structural representation of the aluminium target material assembly part of embodiments of the invention one；
Fig. 3 is that the plane of the thread pattern of the junction to be welded formation of the aluminium backboard of the embodiment of the present invention one is amplified
Schematic diagram；
Fig. 4 is the Fig. 3 cross section enlarged diagram along AA direction；
Fig. 5 is to carry out heat and other static pressuring processes in the aluminium target material assembly of the embodiment of the present invention one is placed in vacuum canning
Schematic diagram.
Detailed description of the invention
When the technical problem to be solved in the present invention is with existing welding method welding aluminium target and aluminium backboard,
Welding efficiency is low, and the weld strength of the target material assembly of formation is low, deflection big, even cannot realize weldering
Connect, therefore can not meet the needs produced and use aluminium target material assembly steady in a long-term.
Present invention obtains the welding method of a kind of aluminium target material assembly, above-mentioned technical problem can be avoided.
Below in conjunction with the accompanying drawings the detailed description of the invention of the present invention is described in detail.In the following description
Elaborate a lot of detail so that fully understanding the present invention, but the present invention can also use other not
Being same as alternate manner described here to implement, therefore the present invention is not by following public specific embodiment
Limit.
Embodiment one
Fig. 1 is the schematic flow sheet of the welding method of the aluminium target material assembly of the specific embodiment of the invention.Including
Following steps:
Perform step S11, it is provided that aluminium target, aluminium backboard；
Perform step S12, the junction to be welded of described aluminium target forms solder soakage layer or at the described back of the body
Solder soakage layer is formed in the junction to be welded of plate；
Perform step S13, aluminium backboard, the aluminium target that is formed with solder soakage layer be placed in vacuum canning,
The junction to be welded of described aluminium backboard contacts with described solder soakage layer, or, by aluminium target, it is formed with pricker
The aluminium backboard of material soakage layer is placed in vacuum canning, and the junction to be welded of described aluminium target infiltrates with described solder
Layer contact；
Perform step S14, utilize heat and other static pressuring processes by described aluminium target, solder soakage layer, the weldering of aluminium backboard
It is connected together to form aluminium target material assembly；
Perform step S15, after having welded, described vacuum canning is cooled down, remove described vacuum packet
Set is to obtain described aluminium target material assembly.
With reference to Fig. 2, first, step S11 is performed, it is provided that aluminium target 11, aluminium backboard 12.
In the present embodiment, the purity of aluminium target 11 is at least 99.9995%.According to applied environment, sputtering equipment
Actual requirement, the shape of aluminium target 11 can be cylinder, cuboid, square, cone, cross section
For any one in annular, triangle or other analogous shapes (include regular shape and irregularly shaped)
Cylinder.Aluminium target 11 in the present embodiment is cylinder.The diameter dimension of aluminium target is in design size
On add the allowance of 2mm～5mm, gauge is the processing adding 1mm～3mm in design size
Surplus.The purpose arranging allowance is to provide well-to-do for aluminium target 11 in follow-up machining
Processing space to obtain satisfactory aluminium target material assembly.
In the present embodiment, the material of aluminium backboard 12 is aluminium alloy.Such as, be 6061 aluminium alloys, 5083
Aluminium alloy or 2a14 aluminium alloy.Why use above-mentioned aluminium alloy as backboard, be because above-mentioned aluminium alloy
There is enough hardness, intensity, and heat conduction, electric conductivity are the highest, the aluminium target group formed with aluminium target
The better performances of part, otherwise affects sputter rate.According to applied environment, the actual requirement of sputtering equipment,
The shape of described aluminium backboard 12 can be cylinder, cuboid, square, and cross section is annular, triangle
Or the cylinder of any one in other analogous shapes (include regular shape and irregularly shaped).This enforcement
In example, aluminium backboard 12 be shaped as cylinder.Aluminium backboard 12 has the groove 121 accommodating aluminium target 11,
The maximum gauge of aluminium backboard 12 is 2～4 times of aluminium its thickness, if aluminium backboard 12 is the thinnest, does not reaches
Support strength；If aluminium backboard 12 is the thickest, it is not easy to be installed to sputter on base station.The diameter of backboard can be
Adding the surplus of 2mm～5mm in design size, thickness is the surplus adding 1mm～3mm in target size.
The purpose increasing surplus is to provide well-to-do adding to the procedure of processing after being subsequently formed aluminium target material assembly
Work space.
Then, perform step S12, in the junction to be welded of described aluminium target formed solder soakage layer or
Solder soakage layer is formed in the junction to be welded of described backboard.
With continued reference to Fig. 2, described aluminium target 11 includes junction I to be welded, sputter face III and side IV.Institute
Stating junction I to be welded is the face that aluminium target 11 will weld with aluminium backboard 12, and sputter face III is with to be welded
The face that face I is relative, side IV is the surface between junction I to be welded and sputter face III.
Before the junction to be welded of aluminium target 11 forms solder soakage layer, need to use cleaning procedure to institute
Junction I to be welded stating aluminium target 11 is cleaned, and is conducive to being formed in junction I to be welded of aluminium target 11
Solder soakage layer, otherwise solder can conglobulate in the junction to be welded of aluminium target 11 and be difficult to sprawl and come.
The concrete steps being cleaned junction I to be welded of aluminium target 11 include: to be welded to aluminium target 11
Junction I carries out grinding process, for removing the oxide layer of junction I to be welded of aluminium target 11, and makes aluminium
Junction I to be welded of target 11 has certain roughness.Junction I to be welded why making aluminium target 11 has
The reason having certain roughness is as follows: in subsequent technique, can smear at the junction to be welded of aluminium target 11
One layer of solder, solder can melt through heating, and the solder of fusing is sucked in aluminium target 11 by capillarity,
The solder of fusing mutually soaks at junction to be welded with aluminium target 11, forms solder soakage layer.Coarse treats
Solder side I can increase capillarity so that aluminium target 11 strengthens with the wetting effect of solder, can improve
The efficiency of subsequent soldering processes, solder bond intensity.Specifically can first with 80 mesh sand paper to aluminium target 11
Junction I to be welded slightly polish, then use the sand paper of 800 mesh that the junction to be welded of aluminium target 11 is entered
Row is the most carefully polished, and finally, uses the sand paper of 1000 molybdenums carefully to polish the junction to be welded of aluminium target 11.
The all surface of aluminium target 11 can also be polished by bruting process.Then aluminium target 11 is cleaned
Junction I to be welded, the present embodiment uses isopropanol IPA.Scavenging period is 50min～70min, is used for removing
The pollutant formed during polishing.Put into vacuum drying chamber after cleaning and be dried 15min.
With continued reference to Fig. 2, junction I to be welded of aluminium target 11 is coated with solder and forms solder soakage layer 110.
Specific as follows:
Solder is placed in junction I to be welded of aluminium target 11, then aluminium target 11 is heated, relatively
Good temperature is 100 DEG C～300 DEG C.Heating-up temperature is higher than the fusing point of solder, and solder can melt, and capillarity will
The solder of fusing sucks in aluminium target 11, and the solder of fusing mutually moistens at junction to be welded with aluminium target 11
Wet, form solder soakage layer 110.When heating-up temperature is more than 300 DEG C, the wetting effect of the solder of fusing
Very good easily causing brazing filler metal erosion on the contrary, junction I to be welded at aluminium target 11 produces corrode phenomenon.
Directly aluminium target 11 can be put on heating pallet, the shape of heating pallet and aluminium target 11 phase
With, it being dimensioned slightly smaller than aluminium target 11, heating pallet contacts with sputter face III of aluminium target 11.Other are real
Execute in example to put on the pallet adding in hot tank by aluminium target, the shape and size of pallet now with
Heating pallet is identical, the function simply not heated.Described pallet is Steel material, such as mould steel.
Adding solder in junction I to be welded of aluminium target 11, brazing filler metal melts becomes liquid, and the solder of liquid is also
Can flow down from junction I to be welded, the side IV of aluminium coating target 11, equally at the side IV of aluminium target 11
Formed and be coated with the thinnest one layer liquid solder.When the solder flowed down from junction I to be welded soon can not aluminium coating
During the side IV of target 11, need to continue to add solder in junction I to be welded, make the solder of liquid not stop
Flow down from junction I to be welded, it is possible to continue aluminium coating target 11 side IV, prevent aluminium target 11 table
Face is oxidized.
Keep aluminium target 11 heating temperature be 100 DEG C～300 DEG C, with steel brush friction aluminium target 11 to be welded
Liquid solder layer 3 in junction I～4 times, can strengthen capillarity, thus improve treating of aluminium target 11
Form the speed of solder soakage layer 110 on solder side I, and the solder soakage layer 110 of formation can be made even
Continue, smooth surface, thickness are uniform and internal organizational structure is uniform.Specifically, keep adding of aluminium target 11
Hot temperature is 100 DEG C～300 DEG C, the liquid solder layer now contacted with junction I to be welded of aluminium target 11
Bottom surface temperature is the highest, when using steel brush friction liquid solder layer, contacts with junction I to be welded of aluminium target 11
The bottom surface of liquid solder layer dug and be transferred to other position of junction I to be welded, thus heat is passed to
Other position of liquid solder layer, therefore the effect of stirring liquid solder layer is played in steel brush friction, can make
Solder is fused into liquid, and the homogeneous temperature of wholly liquid state solder layer as early as possible, is conducive to strengthening capillary and makees
With, form internal organizational structure uniform solder soakage layer 110.The thickness of described solder soakage layer is for being more than
0 micron and less than or equal to 10 microns.If solder soakage layer is the thickest, unnecessary solder is in follow-up welding
Technique easily flows in jacket, form aluminium target, welding between aluminium backboard and jacket.Solder infiltrates
If layer is the thinnest, the weld strength of the aluminium target material assembly being subsequently formed is the highest.It addition, in the present embodiment,
The method of formation solder soakage layer, relative to conventional soldering, can save the consumption of solder.
In the present embodiment, after junction I to be welded of aluminium target 11 forms solder soakage layer 110, by aluminium target
The solder that material 11 side IV covers strikes off.Reason is as follows: if not by this position solder strike off,
The solder amount welded with aluminium backboard for aluminium target can be had more than needed, and this solder more than needed is in follow-up welding procedure
In easily aluminium target, aluminium backboard are welded with jacket.
With continued reference to Fig. 2, junction II to be welded of aluminium backboard 12 is the bottom of aluminium backboard 12 groove 121,
Also will the surface welded of junction I to be welded with aluminium target 11.
Then, the junction to be welded of aluminium backboard 12 is cleaned.Concrete steps include:
Junction II to be welded of aluminium backboard 12 is carried out grinding process, is used for removing aluminium backboard 12 junction to be welded
The oxide layer of II, and make aluminium backboard 12 junction II to be welded have certain roughness.Make aluminium backboard 12
Junction II to be welded there is the reason of certain roughness have one with junction I to be welded making aluminium target 11
The reason determining roughness is identical.The method being specifically referred to the polishing of the junction to be welded to aluminium target 11.Beat
After mill, then clean junction II to be welded of aluminium backboard 12 with alcohol or isopropanol, clean 50min～70min,
The pollutant formed during for removing polishing, puts into vacuum drying chamber and is dried 15min after cleaning.
In other embodiments, can be at the junction II to be welded formation solder soakage layer of aluminium backboard 12, now,
Junction I to be welded of aluminium target 11 need not form solder soakage layer.Concrete forming process is as follows:
Solder is placed in junction II to be welded of aluminium backboard 12, then aluminium backboard 12 is heated, will
Brazing filler metal melts makes solder form equally distributed solder soakage layer in junction II to be welded of aluminium backboard 12.
Aluminium backboard 12 is carried out heating to carry out in ultrasonic welding machine, in using ultrasonic welding machine
Aluminium backboard 12 is heated by heater or the external heater put.Temperature is 100 DEG C～300
℃.Heating-up temperature is higher than the fusing point of solder, and solder can melt, and the solder of fusing is sucked aluminium by capillarity
In backboard 12, the solder of fusing mutually soaks at junction to be welded with aluminium backboard 12, forms solder infiltration
Layer.When heating-up temperature is more than 300 DEG C, the wetting effect of the solder of fusing is very good easily causes solder on the contrary
Running off, junction II to be welded at aluminium backboard 12 produces corrode phenomenon.
The solder of fusing is swept in junction II to be welded of aluminium backboard 12 by the probe of ultrasonic welding machine
Retouch, described scanning sequency can from top to bottom, left and right back and forth to cover the solder of whole fusing, thus
Form uniform solder soakage layer.Scanning sequency in the present embodiment is not limited to above-mentioned scanning sequency, at it
Its embodiment can also use from top to bottom, left and right order back and forth or other order, be not repeated herein,
As long as it is the most permissible to form uniform solder soakage layer.
Ultrasonic wave produces dither wave loops junction II to be welded to the aluminium backboard 12 adding solder, solder
Big with the junction acoustic resistance of aluminium backboard 12, localized hyperthermia can be produced, and can not distribute in time, add
In the case of pressure, liquid solder immerses the junction to be welded of aluminium backboard 12, after ultrasonic wave fails,
Pressure continues several seconds, makes the solder coagulation forming of entrance aluminium backboard 12, thus at aluminium backboard 12
Junction II to be welded formed solder soakage layer.In the present embodiment, can be by the ultrasonic wave of ultrasonic welding machine
The power output of oscillator is arranged on 26KHz to 34KHz, and ultrasonic treatment time is 20min～30min,
Liquid solder can more rapid and more effective immersion in aluminium backboard 12, in the junction to be welded of aluminium backboard 12
The performance of the solder soakage layer that II is formed is good.
In prior art, even if the surface of aluminium target, aluminium backboard is the most also susceptible to oxidation, because of
This, when directly using the method for soldering to be welded with aluminium backboard by aluminium target, it is impossible to produce capillarity,
So that liquid solder is difficult to mutually soak with aluminium target, aluminium backboard, therefore use the side of prior art
The weld strength of the aluminium target material assembly that method is formed is low, time serious, it is impossible to aluminium target is carried out with aluminium backboard
Welding.And in technical scheme, to be welded at junction I to be welded of aluminium target 11 or aluminium backboard 12
Solder soakage layer is formed in junction II.In follow-up welding procedure, the solder in solder soakage layer can
Well wetting aluminium target 11, the junction to be welded of aluminium backboard 12, substantially reduces the difficulty of welding procedure,
Shorten weld interval, thus improve welding efficiency.Solder soakage layer can be fine and close fill up aluminium target
11, at the welding gap between the junction to be welded of aluminium backboard 12, solder, aluminium target 11, aluminium backboard are made
Can carry out physically better, chemical reaction between 12, thus realize the tight of aluminium target 11 and aluminium backboard
In conjunction with.Thus improve solder bond intensity.
In the present embodiment, according to aluminium target 11 and the material behavior of aluminium backboard 12 and follow-up welding procedure
Condition, through performing creative labour, selected solder can be purity be 89～91% containing tin solder.This
In embodiment, preferably Sn-Zn brazing filler metal, this solder can not only reduce aluminium target 11 or aluminium in the liquid state
The surface tension of backboard 12, and aluminium target 11 and the interfacial tension of aluminium backboard 12 can be reduced, to aluminium
Target, aluminium backboard have good wetability, can reduce the difficulty of welding of aluminium target and aluminium backboard, and
And may also speed up the speed of welding of subsequent soldering processes.This solder has good mobility, it is possible to
The welding procedure of the present embodiment adequately fills up between the weld seam between aluminium target and the junction to be welded of aluminium backboard
Gap.When using this solder to weld, it is not easy to produce pore or hole in the commissure of aluminium target material assembly,
The weld seam of the aluminium target material assembly being subsequently formed has good spy corrosion-resistant, high temperature resistant, excellent in cushion effect
Property.Such as will not produce blackspot or stain at face of weld.Exception, the Sn-Zn brazing filler metal of the present embodiment
Nontoxic, maximized reduction potential safety hazard.
In the present embodiment, in order to improve aluminium target 11, the speed of welding of aluminium backboard 12 further, increase aluminium
Target 11, the solder bond intensity of aluminium backboard 12, can use the method for machining to aluminium backboard 12
Junction II to be welded carry out patterned process, described pattern be aluminium backboard 12 junction II to be welded formed energy
Enough insert the bulge-structure of aluminium target 11, the cross section of this bulge-structure can in tip-angled shape, needle-like or boss
Shape.Junction II to be welded of aluminium backboard 12 is carried out patterned process, in subsequent technique, due to aluminium target 11
Quality softer than aluminium backboard 12, the above-mentioned bulge-structure of aluminium backboard 12 can be inserted directly into aluminium target 11,
And junction I to be welded of junction II to be welded of aluminium backboard 12, aluminium target 11 is fitted with solder soakage layer respectively,
Realize the maximized void-free contact between aluminium backboard 12, aluminium target 11 and solder soakage layer.This reality
Execute the maximized void-free contact between aluminium backboard 12 in example, aluminium target 11 and solder soakage layer, for rear
In continuous welding procedure, can produce as soon as possible between aluminium atom and solder atom, aluminium atom and aluminium atom
Gravitational force between atoms, so that carrying out phase counterdiffusion between aluminium atom with solder atom, aluminium atom and aluminium atom.
Therefore, junction II to be welded of aluminium backboard 12 carries out above-mentioned patterned process, aluminium target can not only be improved
Material 11 and the speed of welding of aluminium backboard 12, and the welding that bond strength is high can also be realized.
Again pass by performing creative labour, find in junction II to be welded of aluminium backboard 12, carry out machining
Forming following thread pattern, the solder bond that aluminium backboard 12 welds the aluminium target material assembly formed with aluminium target is strong
Spending the highest, welding efficiency is the highest.
Fig. 3 is the plane enlarged diagram of the thread pattern of the junction II to be welded formation of aluminium backboard 12.Fig. 4
It it is the Fig. 3 cross section enlarged diagram along AA direction.Incorporated by reference to reference to Fig. 3 and Fig. 4, thread pattern is protruding
Cross sectional shape be multiple base angle be connected isosceles triangle, each triangular form is referred to as tooth form, thread pattern
Thread height H1 be that 0.19mm～0.43mm(includes end points), distance W1 on tooth form base is
0.44mm～0.7mm(includes end points).Angle between adjacent two tooth form sidewalls is that thread form angle α 1 is equal to 60
Degree, is the groove part of thread pattern between adjacent two tooth forms, and the distance between adjacent two tooth forms is spiral shell
End points is included equal to 0.44mm～0.7mm() away from L1.
Then clean junction II to be welded of aluminium backboard 12, use the sodium hydroxide solution of 0.1mol/L that aluminium is carried on the back
Plate 12 is carried out.Scavenging period is 10min～30min, the pollution formed during for removing machining
Thing, and junction II to be welded of aluminium backboard 12 is cleaned, prepare for follow-up welding procedure.Clean
After dry up.
It should be noted that in (1) the present embodiment, if carried out in junction II to be welded of aluminium backboard 12
Patterned process, then need not be formed solder soakage layer in junction II to be welded of aluminium backboard 12.Because,
Pattern can make liquid solder the best to the wetting effect of junction II to be welded of aluminium backboard 12.
(2) why selecting to carry out machining on aluminium backboard 12, reason is as follows: aluminium target 11
Purity is high, and quality is softer.The aluminium back of the body being fabricated to by specific alloy material accordingly, with respect to aluminium target 11
Plate 12 has higher hardness, and the bulge-structure formed in the junction to be welded of aluminium backboard 12 is inserted into
In aluminium target 11.
In other embodiments, the thread height of the thread pattern of aluminium backboard is less than 0.19mm, treating of aluminium target
First junction to be welded of solder side and titanium, directly against conjunction, falls within protection scope of the present invention.
In other embodiments, the junction to be welded of aluminium backboard does not carry out patterned process and forms bulge-structure
Directly carry out fitting by the junction to be welded of the junction to be welded of aluminium target Yu aluminium backboard and fall within the protection of the present invention
Scope.
Then, refer to Fig. 5, perform step S13, by aluminium backboard 12, the aluminium that is formed with solder soakage layer
Target 11 is placed in vacuum canning 14, junction II to be welded of described aluminium backboard 12 and described solder soakage layer
Contact, or, aluminium target 11, the aluminium backboard 12 that is formed with solder soakage layer are placed in vacuum canning 14
In, junction I to be welded of described aluminium target 11 contacts with described solder soakage layer.
Specifically, in the present embodiment, the bulge-structure in junction II to be welded of aluminium backboard 12 is inserted and is formed
Have in the aluminium target 11 of solder soakage layer, and aluminium target 11 side IV laminating aluminium backboard 12 recessed
Groove side, junction II to be welded of described aluminium backboard 12 contact with described solder soakage layer, form aluminium target and treat
Weld assembly.
Screw thread in the above-mentioned thread pattern of aluminium backboard 12 inserts the aluminium target 11 being formed with solder soakage layer
In.And junction II to be welded of aluminium backboard 12 contacts with described solder soakage layer so that aluminium backboard 12,
Solder and the maximized void-free contact of aluminium target 11.So, junction II to be welded of aluminium backboard 12 is by pricker
On the premise of material wetting, between aluminium atom and aluminium atom, can quickly produce gravitational force between atoms, so that
Aluminium atom and aluminium atom can be very easy to and be rapidly performed by very much phase counterdiffusion.Therefore, by such
Aluminium target assembly to be welded welds, can maximized raising speed of welding, the aluminium target group of formation
The solder bond intensity of part is the highest.
After forming aluminium target assembly to be welded, this assembly to be welded is placed in vacuum canning 14.Vacuum packet
Set 14 act as prevent assembly to be welded from aoxidizing in case of heating.It should be noted that it is true
The material of empty jacket 14 selects to meet two conditions, and first condition is: the fusing point of vacuum canning 14
Higher than the temperature during subsequent heat, otherwise vacuum canning 14 can melt during subsequent heat；The
Two conditions are: in the follow-up aluminium target welding process with aluminium backboard, the material of vacuum canning can be real
The most preferably pressure conduction, otherwise affects the welding quality of follow-up aluminium target and aluminium backboard, such as aluminium target
Material 11 is the best with the solder bond power of aluminium backboard 12, and weld strength is the best.In the present embodiment preferably
Use aluminium jacket.Why aluminium jacket, is because, for aluminium target with aluminium backboard, and aluminium jacket
Heat and the conducting effect of pressure best.The thickness of vacuum canning 14 is 1.0mm～3.0mm.If vacuum
Jacket 14 is the thinnest, and follow-up aluminium target is easy with the weld of vacuum canning 14 in the welding process of aluminium backboard
Split, cause the phenomenon that assembly to be welded exposes and leaks gas；If vacuum canning 14 is the thickest, follow-up aluminium target
It is not easily accomplished pressure conduction with vacuum canning 14 in the welding process of aluminium backboard.
Vacuum canning 14 can pass through Machine Design, such as CAD so that it is shape meets assembly to be welded
Shape, afterwards by seamless tubular goods or sheet material through splicing formation welded together, therefore, vacuum canning 14 can be tight
Target material assembly to be welded that closely connected conjunction is built-in and not by the size limitation of assembly to be welded, can weld
The welding of large-size target.As it is shown in figure 5, typically leave a hole 15 on this vacuum canning 14, permissible
For drawing deaeration pipe on described vacuum canning 14, this deaeration pipe is connected with vaccum-pumping equipment.
Then, seal vacuum canning 14 and stay deaeration pipe.The technique sealed can be realized by argon arc welding,
Vacuum step is completed by deaeration pipe.
Being put in heating furnace by vacuum canning 14 and preheat, temperature is 100 DEG C～200 DEG C (including end points),
Then start limit heating edge to vacuumize, then carry out being incubated 1h～3h(and include end points).Protect in described heating
During temperature, need vacuum canning 14 is persistently vacuumized, make the vacuum in vacuum canning 14 at least
Reach 10-3Pa.Inventor finds, target material assembly to be welded to aluminium target preheats, and is conducive to preferably
Carry out vacuumizing process so that aluminium target 11 cannot be oxidized with aluminium backboard 12, thus improve follow-up weldering
Connect the weld strength of technique.If heating-up temperature is too low, component to be welded be heated insufficient be unfavorable for follow-up
Welding operation nor be beneficial to the carrying out vacuumized；Heating-up temperature is too high, and the crystal grain of aluminium target is easy
Growing up, crystallite dimension meeting over range, so that the aluminium target material assembly formed does not meets wanting of sputtering technology
Ask.Insulation 1h～3h can realize the internal temperature of whole aluminium target target material assembly to be welded and reach uniformly
Design temperature, if temperature retention time is too short, aluminium target target material assembly to be welded internal temperature can not uniformly be subject to
Heat, impact is subsequently formed solder bond intensity；If temperature retention time is long, the crystal grain of aluminium target is the longest
Greatly, crystallite dimension meeting over range, the aluminium target material assembly of formation does not meets the requirement of sputtering technology.Vacuum packet
Vacuum in set 14 is if greater than 10-3Pa, the aluminium target target material assembly to be welded in vacuum canning is rear
Continuous welding procedure is oxidized easily；Vacuum in vacuum canning is the smaller the better.In the present embodiment
Vacuum is the absolute pressure in given space, different with the concept of the conventional vacuum understood.
Then, when continuing to keep vacuum canning 14 inner vacuum, vacuum canning 14 is closed
Gas technique, will close by deaeration pipe, makes vacuum canning be internally formed an airtight vacuum environment.Described
Technique of holding one's breath is to be realized by machining and welding, in the present embodiment, and can be with iron hammer by vacuum canning
The afterbody of deaeration pipe is pounded and flat is then sealed with argon arc welding.After technique of holding one's breath, the vacuum of described vacuum canning
At least 10-3Pa。
The purpose that limit heating edge persistently vacuumizes is, on the one hand can increase the easness persistently vacuumized,
Improve the efficiency vacuumized；On the other hand, carry out holding one's breath under conditions of heating and thermal insulation technique time, degassing
Pipe meeting deliquescing, it is easier to the afterbody of deaeration pipe is shut.
Then to carry out welding procedure in vacuum canning 14 being placed in static pressure stove.
Then, with continued reference to Fig. 5, perform step S14, utilize heat and other static pressuring processes by aluminium target 11, pricker
Material soakage layer, aluminium backboard 12 weld together to form aluminium target material assembly.So-called high temperature insostatic pressing (HIP) (hot
Isostatic pressing, HIP) it is that target material assembly to be welded for aluminium target is placed in vacuum-packed vacuum canning
In, utilize highly pressurised liquid or gases at high pressure that vacuum canning is applied the most under the high temperature conditions each to impartial
Pressure, makes vacuum canning keep a period of time to be welded by material tight to be welded in this high temperature and high pressure environment
It is connected together.
Now, inside is provided with aluminium target 11, solder soakage layer, the vacuum canning 14 of aluminium backboard 12 are in
In high temperature and high pressure environment.By aluminium target in the target material assembly after selecting suitable technological parameter can make welding
11 have higher weld strength with aluminium backboard 12, and concrete, inventor finds to use following technological parameter
It is achieved that the ambient temperature residing for vacuum canning 14 is 200 DEG C～300 DEG C, utilize highly pressurised liquid
Or gases at high pressure make the external environment condition pressure residing for vacuum canning 14 be more than or equal to 100Mpa, and,
Vacuum canning 14 keeps 2～5 hours in this high temperature and high pressure environment.
The very thin thickness of vacuum canning 14, under the effect of outside environmental stress, vacuum canning 14 is permissible
Realize good pressure conduction so that the junction each to be welded of aluminium target 11, aluminium backboard 12 forms pressure, simultaneously
Owing to vacuum canning 14 is positioned in hot environment for a long time, aluminium target 11, aluminium backboard 12 each to be welded
Face can be plastically deformed and high-temerature creep and realize between the aluminium target 11 of little area and aluminium backboard 12
Under crystal grain contact, continuous effect, crystal grain contact area gradually expands, and finally reaching place to be welded can
Realize crystal grain contact, so that form gravitational force between atoms between aluminium atom and aluminium atom.
Then there is the phase counterdiffusion between aluminium atom and aluminium atom at place to be welded, due to the aluminium at place to be welded
The lasting diffusion of atom and make many spaces at place to be welded disappear, meanwhile, the crystal boundary migration at place to be welded
Have left home position, even if reaching poised state, still having many little spaces to be retained in place to be welded, drawing
Play the various crystal defect bulk depositions such as distortion of lattice, dislocation, room, the junction each to be welded at place to be welded
Energy significantly increases, and aluminium atom is in high level activation state, and then, aluminium atom moves with the diffusion of aluminium atom
Moving very rapid, quickly the tiny area at place to be welded is formed with aluminium-aluminum metal key is main type of attachment
Joint, but the metallic bond at place to be welded reaches far away homogenization degree, weld strength is the highest.
So needing target material assembly to be welded for aluminium target in ambient temperature is 200 DEG C～300 DEG C, outside
Environmental stress for more than or equal to carrying out under conditions of 100Mpa being incubated, pressurize 2～5 hours so that waiting
The left space of assembly is wholly absent, and makes place to be welded all form metallic bond, i.e. realizes the equal of metallic bond
Homogenize, increase the weld strength treating aluminium weld assembly.Insulation, the dwell time if less than 2 hours, no
The diffusion of the metallic bond enabling to aluminium target target material assembly to be welded is more uniform, if temperature retention time is big
In 5 hours, aluminium target crystalline grains can be caused to grow up, the weld strength of metallic bond can be reduced on the contrary.
If ambient temperature is less than 200 DEG C, aluminium atoms permeating can not be activated；If ambient temperature is high
In 300 DEG C, cause the waste of cost, it addition, the crystal grain of aluminium target 11 can be made to grow up, do not meet and spatter
Penetrate the requirement of technique.If temperature continues to raise, aluminium target 11 can be made to melt with aluminium backboard 12.Outside
If environmental stress is less than 100Mpa, aluminium atoms permeating can not be activated equally；At the model that welding equipment fortune allows
In enclosing, pressure is the biggest more is conducive to the phase counterdiffusion between aluminium atom with titanium atom, aluminium atom and aluminium atom,
And then be more conducive to the carrying out of welding procedure.
Further, since vacuum canning 14 is not limited by target size and backboard size etc., can will be equipped with big
The vacuum canning 14 of size assembly to be welded is put in high temperature insostatic pressing (HIP) stove, uses the welding procedure of high temperature insostatic pressing (HIP)
I.e. under high temperature, condition of high voltage, vacuum canning 14 is applied each to equalization pressure to realize uniform large area
Welding, forms large-sized target material assembly.The weld welding rate of described large-sized target material assembly is high,
Weld strength is relatively big and is unlikely to deform.
Then, perform step S15, after having welded, vacuum canning is cooled down, remove vacuum canning
To obtain aluminium target material assembly.After having welded, vacuum canning 14 can be made to cool down in atmosphere, be cooled to 200
Below DEG C, then by chemically or mechanically removing vacuum canning 14 to obtain target material assembly, example
As, it is possible to use vacuum canning 14 is removed by turning process, the most again through turning or line cutting etc.
Method, thus prepare the target material assembly of final size.
Finally, the welding situation of the present embodiment aluminium target material assembly is detected:
Utilize C-SCAN(Water Immersion Ultrasonic C-scan system) detection solder bond rate, should by aluminium target with
Its solder bond rate scope more than 95% of the target material assembly that aluminium backboard is formed.Employing tensile testing machine is tested
Its hot strength, can reach the fracture strength (more than 100MPa) of aluminium, i.e. in tension test, only aluminium
The fracture of material just can make the weld of aluminium target material assembly rupture.Result shows, uses in the present invention and welds
The welding performance of the target material assembly that method is obtained is the most reliable.
Although the present invention is open as above with preferred embodiment, but it is not for limiting the present invention, appoints
What those skilled in the art without departing from the spirit and scope of the present invention, may be by the disclosure above
Technical solution of the present invention is made possible variation and amendment by method and technology contents, therefore, every does not takes off
From the content of technical solution of the present invention, it is any that above example is made by the technical spirit of the foundation present invention
Simple modification, equivalent variations and modification, belong to the protection domain of technical solution of the present invention.
Claims (8)
1. the welding method of an aluminium target material assembly, it is characterised in that comprise the following steps:
Aluminium target, aluminium backboard are provided；
The junction to be welded of described aluminium target is formed solder soakage layer or to be welded at described aluminium backboard
Solder soakage layer is formed on face；
Aluminium backboard, the aluminium target that is formed with solder soakage layer are placed in vacuum canning, treating of described aluminium backboard
Solder side contacts with described solder soakage layer, or,
Aluminium target, the aluminium backboard that is formed with solder soakage layer are placed in vacuum canning, treating of described aluminium target
Solder side contacts with described solder soakage layer；
Heat and other static pressuring processes is utilized to weld together to be formed by described aluminium target, solder soakage layer, aluminium backboard
Aluminium target material assembly；
After having welded, described vacuum canning is cooled down, remove described vacuum canning to obtain described aluminium
Target material assembly；
Wherein, the step forming described solder soakage layer includes, is placed on by solder in junction to be welded, then
Treating solder side to carry out heating and make brazing filler metal melts, the solder of fusing mutually soaks at junction to be welded, is formed
Described solder soakage layer.
Method the most according to claim 1, it is characterised in that described solder is containing tin solder.
Method the most according to claim 1, it is characterised in that by described aluminium backboard, be formed with solder leaching
The aluminium target of profit layer is further comprising the steps of before being placed in vacuum canning:
The method using machining carries out patterned process to the junction to be welded of described aluminium backboard and forms projection
Structure.
Method the most according to claim 3, it is characterised in that be formed described in the insertion of described bulge-structure
In the aluminium target of solder soakage layer.
5. according to the method described in claim 3 or 4, it is characterised in that the thickness of described solder soakage layer is
More than 0 micron and less than or equal to 10 microns.
Method the most according to claim 1, it is characterised in that described utilize heat and other static pressuring processes by aluminium target
The step that material, solder soakage layer, aluminium backboard weld together includes:
Make to be internally provided with the external environment condition temperature of the vacuum canning of described aluminium target, solder soakage layer, aluminium backboard
Degree is 200 DEG C～300 DEG C, external environment condition pressure is for more than or equal to 100Mpa；
The described vacuum canning being pointed under described environment temperature, environmental stress carries out being incubated, pressurize 2～5 is little
Time, so that described aluminium target, solder soakage layer, aluminium backboard are welded together.
Method the most according to claim 1, it is characterised in that described vacuum canning is to be by thickness
The aluminum welding of 1.0mm～3.0mm is formed；
After described aluminium target, solder soakage layer, aluminium backboard are placed in vacuum canning, by described vacuum canning
It is evacuated to vacuum and is at least 10-3Pa, more described vacuum canning is sealed.
Method the most according to claim 3, it is characterised in that after forming described bulge-structure, by described
Aluminium backboard, it is formed before the aluminium target of solder soakage layer is placed in vacuum canning, described aluminium backboard is treated
Solder side is carried out processing.
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| CN107457495A (en) * | 2016-06-06 | 2017-12-12 | 宁波江丰电子材料股份有限公司 | The manufacture method of backboard and its manufacture method and target material assembly |
| CN107662045A (en) * | 2016-07-29 | 2018-02-06 | 宁波江丰电子材料股份有限公司 | The manufacture method of alloy product |
| CN108067723A (en) * | 2016-11-18 | 2018-05-25 | 宁波江丰电子材料股份有限公司 | The manufacturing method of target material assembly |
| CN107914075A (en) * | 2017-11-14 | 2018-04-17 | 宁波江丰电子材料股份有限公司 | Target material welding method |
| CN109759794A (en) * | 2019-02-26 | 2019-05-17 | 北京航空航天大学 | A kind of method of superalloy annular part connection Kufil |
| CN111515484B (en) * | 2020-05-11 | 2022-04-15 | 宁波江丰电子材料股份有限公司 | Welding method of high-purity aluminum target |
| CN111644738A (en) * | 2020-06-04 | 2020-09-11 | 宁波江丰电子材料股份有限公司 | Aluminum target material assembly and welding method for reducing deformation of back plate in aluminum target material assembly |
| US20220388090A1 (en) * | 2021-06-04 | 2022-12-08 | The Boeing Company | Fabrication of thick stock via diffusion bonding of titanium alloys |
| CN113458528A (en) * | 2021-07-12 | 2021-10-01 | 宁波江丰电子材料股份有限公司 | Target material assembly and welding method and application thereof |
| CN114406393A (en) * | 2022-01-24 | 2022-04-29 | 宁波江丰电子材料股份有限公司 | Aluminum pipe target welding base auxiliary device and using method thereof |
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| CN101564793A (en) * | 2009-04-17 | 2009-10-28 | 宁波江丰电子材料有限公司 | Welding method of aluminum target blank and aluminum alloy backboard |
| CN102133669A (en) * | 2011-01-26 | 2011-07-27 | 宁波江丰电子材料有限公司 | Welding method for target and back plate |
| CN102500908A (en) * | 2011-10-20 | 2012-06-20 | 宁波江丰电子材料有限公司 | Welding method of tungsten target assembly |
| CN102534517B (en) * | 2011-12-27 | 2014-04-09 | 余姚康富特电子材料有限公司 | Making method for target assembly |
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