CN104540327A - Computer circuit board manufacturing method - Google Patents
Computer circuit board manufacturing method Download PDFInfo
- Publication number
- CN104540327A CN104540327A CN201510003213.4A CN201510003213A CN104540327A CN 104540327 A CN104540327 A CN 104540327A CN 201510003213 A CN201510003213 A CN 201510003213A CN 104540327 A CN104540327 A CN 104540327A
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- CN
- China
- Prior art keywords
- circuit board
- computer circuit
- computer
- plate
- manufacture method
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a computer circuit board manufacturing method and relates to the field of circuit board manufacturing. A drilled substrate is preprocessed so that impurities produced after drilling can be removed; loosening liquid enables residual resin in a drilled hole to be loosened, so that removing is easy, and elements in a computer are conducted conveniently and rapidly; the activated solution is a colloid pd activating solution, and metal particles with the catalysis ability can be adsorbed on an insulation hole matrix by controlling the activation temperature and time, so that electroless copper plating, and microetching temperature and time control are facilitated. A computer circuit board manufactured based on the method has the advantages that the board edge has no gap, no cooper or nickel is exposed, the wiring and assembling errors in a computer are greatly reduced, the computer size is reduced, the computer using performance is improved, and the market prospect is wide.
Description
Technical field
The invention belongs to computer circuit board and manufacture field, more particularly, the present invention relates to a kind of manufacture method of computer circuit board.
Background technology
Printed circuit board (PCB) English abbreviation PCB (printed circuit board), be be base material with insulation board, surface is provided with conductive pattern, and cloth porose (components and parts hole, plated-through hole etc.), realize being connected to each other between electronic devices and components, as the supporter of electronic devices and components.Compared with ordinary printed circuit board, the base material of computer circuit board mainly adopts polytetrafluoroethylene (PTFE) or enhanced polytetrafluoroethylene.This kind of material has lower dielectric loss, be widely used at microwave and even millimeter wave frequency band Related product, the motherboard of PC just includes several microwave printed circuit board (PCB)s, adopt the major advantage of circuit board to be the mistake greatly reducing wiring and assembling, decrease the volume of computer and improve the serviceability of computer.
Summary of the invention
Problem to be solved by this invention is to provide the manufacture method of the computer circuit board that a kind of hot strength is high, surface tension is large, sheet resistance is little.
To achieve these goals, the technical scheme that the present invention takes is:
A manufacture method for computer circuit board, comprises the steps:
(1) hole
Select polytetrafluoroethylmaterial material plate as substrate, papery plate is as backing plate, and holed to substrate by drilling machine in boring room, the rotating speed of drill bit is 170-180m/min, and the temperature of boring room controls at 18-22 DEG C;
(2) hole metallization
By the substrate after boring after preliminary treatment, carry out electroless copper at hole surface, temperature during copper facing is 20-40 DEG C, the thickness of chemical plating copper layer is 0.5um-2um, is then immersed in sulfuric acid solution by copper facing plate, and soak time is 1-2min, finally with circulating water cleaning, the time is 2-4min;
(3) graphic making
Dry film is pressed onto on copper facing plate by film laminator, line film and the dry film plate pressed is exposed being placed on exposure machine behind good position, then developing with developing machine, form line pattern;
(4) plating is coated with
Chemical nickel plating is carried out on the plate surface forming line pattern, and chemical nickel plating layer thickness is 5-7um, and then carry out plating gold-plated, gold plating thickness is 1-4um, finally forms computer circuit board;
(5) sharp processing
Computer circuit board carried out milling deburring and go crimping process, milling speed is 0.6-1.0m/min;
(6) product inspection
Under 10-100 power microscope, micro-visual inspection is carried out to the computer circuit board carried out after sharp processing, by the packing of product of passed examination, dispatches from the factory.
Preferably, in described step (2) preliminary treatment be that bulk liquid is bulk, oil removing, microetch, preimpregnation and activation.
Preferably, described bulk liquid is butyl carbitol, the NaOH of 10-20%, the water of 20-40% of 50-60%.
Preferably, the temperature of described microetch is 18-22 DEG C, and the time is 2-3min.
Preferably, the solution of described activation is colloidal pd activation solution, and the temperature of activation is 20-24 DEG C, the time is 10-20min.
Preferably, in described step (5), after sharp processing, thickness and precision error is 0-0.1mm.
Beneficial effect: the manufacture method that the invention provides a kind of computer circuit board, preliminary treatment is carried out to the substrate after boring, the impurity after boring can be removed, bulk liquid can make the cull in boring swelling lax, thus easily removing makes the guiding path of components and parts in computer convenient, the solution of described activation is colloidal pd activation solution, the control of the temperature and time of activation, can make insulated hole matrix to adsorb the metallic particles that one deck has catalytic capability, thus be conducive to electroless copper, the control of microetch temperature and time, copper foil surface can be made coarse, to strengthen the adhesion of Copper Foil and chemical copper, be conducive to copper-plated operation, type quality standard is met after sharp processing, thus be adapted to be installed on computer-internal.The computer circuit board adopting this kind of method to produce has edges of boards and does not occur breach, do not reveal the advantage of copper and dew nickel, greatly reduce the mistake of wiring and assembling in computer, reduce the volume of computer and improve the serviceability of computer, there are wide market prospects.
Below in conjunction with specific embodiment, the invention will be further described.
Embodiment
The technological means realized for making the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with embodiment, setting forth the present invention further.
embodiment 1:
A manufacture method for computer circuit board, comprises the steps:
(1) hole
Select polytetrafluoroethylmaterial material plate as substrate, papery plate is as backing plate, and holed to substrate by drilling machine in boring room, the rotating speed of drill bit is 170m/min, and the temperature of boring room controls at 18 DEG C;
(2) hole metallization
By bulk through bulk liquid for the substrate after boring, bulk liquid is butyl carbitol, the NaOH of 10%, the water of 40% of 50%, oil removing, microetch, the temperature of microetch is 18 DEG C, time is 2min, preimpregnation and activation, the solution of activation is colloidal pd activation solution, and the temperature of activation is 20 DEG C, the time is 10min, carries out electroless copper at hole surface, temperature during copper facing is 20 DEG C, the thickness of chemical plating copper layer is 0.5um, is then immersed in sulfuric acid solution by copper facing plate, and soak time is 1min, finally with circulating water cleaning, the time is 2min;
(3) graphic making
Dry film is pressed onto on copper facing plate by film laminator, line film and the dry film plate pressed is exposed being placed on exposure machine behind good position, then developing with developing machine, form line pattern;
(4) plating is coated with
Chemical nickel plating is carried out on the plate surface forming line pattern, and chemical nickel plating layer thickness is 5um, then carries out plating gold-plated, and gold plating thickness is 1um, forms computer circuit board;
(5) sharp processing
Computer circuit board carried out milling deburring and go crimping process, milling speed is 0.6m/min, and after sharp processing, trueness error is 0mm;
(6) product inspection
Under 10 power microscopes, micro-visual inspection is carried out to the computer circuit board carried out after sharp processing, by the packing of product of passed examination, dispatches from the factory.
embodiment 2:
A manufacture method for computer circuit board, comprises the steps:
(1) hole
Select polytetrafluoroethylmaterial material plate as substrate, papery plate is as backing plate, and holed to substrate by drilling machine in boring room, the rotating speed of drill bit is 175m/min, and the temperature of boring room controls at 20 DEG C;
(2) hole metallization
By bulk through bulk liquid for the substrate after boring, bulk liquid is butyl carbitol, the NaOH of 15%, the water of 30% of 55%, oil removing, microetch, the temperature of microetch is 20 DEG C, time is 2.5min, preimpregnation and activation, the solution of activation is colloidal pd activation solution, and the temperature of activation is 22 DEG C, the time is 15min, carries out electroless copper at hole surface, temperature during copper facing is 30 DEG C, the thickness of chemical plating copper layer is 1.2um, is then immersed in sulfuric acid solution by copper facing plate, and soak time is 1.5min, finally with circulating water cleaning, the time is 3min;
(3) graphic making
Dry film is pressed onto on copper facing plate by film laminator, line film and the dry film plate pressed is exposed being placed on exposure machine behind good position, then developing with developing machine, form line pattern;
(4) plating is coated with
Chemical nickel plating is carried out on the plate surface forming line pattern, and chemical nickel plating layer thickness is 6um, then carries out plating gold-plated, and gold plating thickness is 2.5um, forms computer circuit board;
(5) sharp processing
Computer circuit board carried out milling deburring and go crimping process, milling speed is 0.8m/min, and after sharp processing, trueness error is 0.05mm;
(6) product inspection
Under 40 power microscopes, micro-visual inspection is carried out to the computer circuit board carried out after sharp processing, by the packing of product of passed examination, dispatches from the factory.
embodiment 3:
A manufacture method for computer circuit board, comprises the steps:
(1) hole
Select polytetrafluoroethylmaterial material plate as substrate, papery plate is as backing plate, and holed to substrate by drilling machine in boring room, the rotating speed of drill bit is 180m/min, and the temperature of boring room controls at 22 DEG C;
(2) hole metallization
By bulk through bulk liquid for the substrate after boring, bulk liquid is butyl carbitol, the NaOH of 20%, the water of 20% of 60%, oil removing, microetch, the temperature of microetch is 22 DEG C, time is 3min, preimpregnation and activation, the solution of activation is colloidal pd activation solution, and the temperature of activation is 24 DEG C, the time is 20min, carries out electroless copper at hole surface, temperature during copper facing is 40 DEG C, the thickness of chemical plating copper layer is 2um, is then immersed in sulfuric acid solution by copper facing plate, and soak time is 2min, finally with circulating water cleaning, the time is 4min;
(3) graphic making
Dry film is pressed onto on copper facing plate by film laminator, line film and the dry film plate pressed is exposed being placed on exposure machine behind good position, then developing with developing machine, form line pattern;
(4) plating is coated with
Chemical nickel plating is carried out on the plate surface forming line pattern, and chemical nickel plating layer thickness is 7um, then carries out plating gold-plated, and gold plating thickness is 4um, forms computer circuit board;
(5) sharp processing
Computer circuit board carried out milling deburring and go crimping process, milling speed is 1.0m/min, and after sharp processing, trueness error is 0.1mm;
(6) product inspection
Under 100 power microscopes, micro-visual inspection is carried out to the computer circuit board carried out after sharp processing, by the packing of product of passed examination, dispatches from the factory.
After above PROCESS FOR TREATMENT, take out sample respectively, measurement result is as follows:
Can draw according to above table data, when embodiment 2 parameter, the computer circuit board produced has edges of boards and does not occur breach, do not reveal copper and dew nickel, and every one side is without scratching, without broken hole, without holes, the advantage that internal stress is little, is now more conducive to the manufacture of computer circuit board.
The invention provides a kind of manufacture method of computer circuit board, preliminary treatment is carried out to the substrate after boring, the impurity after boring can be removed, bulk liquid can make the cull in boring swelling lax, thus easily removing makes the guiding path of components and parts in computer convenient, the solution of described activation is colloidal pd activation solution, the control of the temperature and time of activation, can make insulated hole matrix to adsorb the metallic particles that one deck has catalytic capability, thus be conducive to electroless copper, the control of microetch temperature and time, copper foil surface can be made coarse, to strengthen the adhesion of Copper Foil and chemical copper, be conducive to copper-plated operation, type quality standard is met after sharp processing, thus be adapted to be installed on computer-internal.The computer circuit board adopting this kind of method to produce has edges of boards and does not occur breach, do not reveal the advantage of copper and dew nickel, greatly reduce the mistake of wiring and assembling in computer, reduce the volume of computer and improve the serviceability of computer, there are wide market prospects.
Above-described embodiment is only be described the preferred embodiment of the present invention; not scope of the present invention is limited; under not departing from the present invention and designing the prerequisite of spirit; the various distortion that those of ordinary skill in the art make technical scheme of the present invention and improvement, all should fall in protection range that claims of the present invention determines.
Claims (6)
1. a manufacture method for computer circuit board, is characterized in that, comprises the steps:
(1) hole
Select polytetrafluoroethylmaterial material plate as substrate, papery plate is as backing plate, and holed to substrate by drilling machine in boring room, the rotating speed of drill bit is 170-180m/min, and the temperature of boring room controls at 18-22 DEG C;
(2) hole metallization
By the substrate after boring after preliminary treatment, carry out electroless copper at hole surface, temperature during copper facing is 20-40 DEG C, the thickness of chemical plating copper layer is 0.5um-2um, is then immersed in sulfuric acid solution by copper facing plate, and soak time is 1-2min, finally with circulating water cleaning, the time is 2-4min;
(3) graphic making
Dry film is pressed onto on copper facing plate by film laminator, line film and the dry film plate pressed is exposed being placed on exposure machine behind good position, then developing with developing machine, form line pattern;
(4) plating is coated with
Chemical nickel plating is carried out on the plate surface forming line pattern, and chemical nickel plating layer thickness is 5-7um, and then carry out plating gold-plated, gold plating thickness is 1-4um, finally forms computer circuit board;
(5) sharp processing
Computer circuit board carried out milling deburring and go crimping process, milling speed is 0.6-1.0m/min;
(6) product inspection
Under 10-100 power microscope, micro-visual inspection is carried out to the computer circuit board carried out after sharp processing, by the packing of product of passed examination, dispatches from the factory.
2. the manufacture method of computer circuit board as claimed in claim 1, is characterized in that: in described step (2) preliminary treatment be that bulk liquid is bulk, oil removing, microetch, preimpregnation and activation.
3. the manufacture method of computer circuit board as claimed in claim 2, is characterized in that: described bulk liquid is butyl carbitol, the NaOH of 10-20%, the water of 20-40% of 50-60%.
4. the manufacture method of computer circuit board as claimed in claim 2, is characterized in that: the temperature of described microetch is 18-22 DEG C, and the time is 2-3min.
5. the manufacture method of computer circuit board as claimed in claim 2, is characterized in that: the solution of described activation is colloidal pd activation solution, the temperature of activation is 20-24 DEG C, the time is 10-20min.
6. the manufacture method of computer circuit board as claimed in claim 1, is characterized in that: in described step (5), after sharp processing, thickness and precision error is 0-0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510003213.4A CN104540327A (en) | 2015-01-06 | 2015-01-06 | Computer circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510003213.4A CN104540327A (en) | 2015-01-06 | 2015-01-06 | Computer circuit board manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104540327A true CN104540327A (en) | 2015-04-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510003213.4A Pending CN104540327A (en) | 2015-01-06 | 2015-01-06 | Computer circuit board manufacturing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN104540327A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107580423A (en) * | 2017-08-30 | 2018-01-12 | 奥士康精密电路（惠州）有限公司 | A kind of method of the residual copper of reduction PCB internal layers |
| CN108055784A (en) * | 2017-11-17 | 2018-05-18 | 江门崇达电路技术有限公司 | A kind of production method of wiring board |
| CN115003032A (en) * | 2022-06-21 | 2022-09-02 | 东莞市国盈电子有限公司 | Motor drive control circuit board and manufacturing process thereof |
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| EP0610694A1 (en) * | 1993-02-10 | 1994-08-17 | International Business Machines Corporation | Methyl chloroform-free desmear process in additive circuitization |
| CN101232782A (en) * | 2007-01-23 | 2008-07-30 | 李东明 | Printed circuit board mask hole electroplating molding process |
| CN101699940A (en) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | Manufacture method of golden finger printed board |
| CN103533760A (en) * | 2013-10-23 | 2014-01-22 | 广东生益科技股份有限公司 | Fabrication method of non-via holes in inner layer of multilayer PCB |
-
2015
- 2015-01-06 CN CN201510003213.4A patent/CN104540327A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0610694A1 (en) * | 1993-02-10 | 1994-08-17 | International Business Machines Corporation | Methyl chloroform-free desmear process in additive circuitization |
| CN101232782A (en) * | 2007-01-23 | 2008-07-30 | 李东明 | Printed circuit board mask hole electroplating molding process |
| CN101699940A (en) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | Manufacture method of golden finger printed board |
| CN103533760A (en) * | 2013-10-23 | 2014-01-22 | 广东生益科技股份有限公司 | Fabrication method of non-via holes in inner layer of multilayer PCB |
Non-Patent Citations (1)
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| 赵崇良: "双面印刷电路板孔化工艺和孔化废水量核算", 《北方环境》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107580423A (en) * | 2017-08-30 | 2018-01-12 | 奥士康精密电路（惠州）有限公司 | A kind of method of the residual copper of reduction PCB internal layers |
| CN108055784A (en) * | 2017-11-17 | 2018-05-18 | 江门崇达电路技术有限公司 | A kind of production method of wiring board |
| CN115003032A (en) * | 2022-06-21 | 2022-09-02 | 东莞市国盈电子有限公司 | Motor drive control circuit board and manufacturing process thereof |
| CN115003032B (en) * | 2022-06-21 | 2023-03-07 | 东莞市国盈电子有限公司 | Motor drive control circuit board and manufacturing process thereof |
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Application publication date: 20150422 |
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